Polishing device for tungsten filament mold machining

Abstract

The utility model discloses a polishing device for tungsten filament die processing, which comprises an end face polishing device, a circumferential surface polishing device and a base frame, the circumferential surface polishing device is connected to one end of the end face polishing device, and the end face polishing device and the circumferential surface polishing device are installed on the base frame; the end face polishing device comprises a front face polishing device, a back face polishing device and a turnover device, the turnover device is connected between the front face polishing device and the back face polishing device, and the front face polishing device and the back face polishing device each comprise a bottom plate, a directional rail, a lifting frame, a polishing motor, an air cylinder and a polishing wheel. The directional track is installed on the bottom plate, and the polishing motor and the air cylinder are installed on the lifting frame. The polishing device for tungsten filament die machining is simple in structure, convenient to use and practical, the two side faces of a wire drawing die are polished through the end face polishing device, meanwhile, the die is overturned through the overturning device, and the effect of rapidly polishing the two faces of the die is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wire drawing die polishing, and particularly relates to a polishing device for processing tungsten wire dies. Background Art

[0002] Wire drawing die polishing is an important process in die manufacturing, aiming to improve the surface finish and accuracy of the die to meet the requirements for manufacturing high-precision metal products; the main purpose of wire drawing die polishing is to remove rough parts, defects, scale, residual oil stains and dirt on the die surface, and further improve the surface quality of the die. Through polishing, the die surface can be made smoother, reducing friction with metal materials and improving drawing efficiency and product quality; among them, the wire drawing holes of wire drawing dies can be completed with polishing knives, and special-shaped wire drawing holes need to be polished manually; while the external shape polishing of wire drawing dies is generally carried out manually, mainly because the polishing speed is fast, but the fast polishing speed will cause more dust on the polishing wheel and cause greater harm to the employees' bodies. Summary of the Utility Model

[0003] The technical problem to be solved by the utility model is to provide a polishing device for processing tungsten wire dies, which has a simple structure, is convenient and practical, polishes both sides of the wire drawing die through an end face polishing device, and at the same time flips the die through a flipping device to achieve the effect of quickly polishing both sides of the die.

[0004] A polishing device for processing tungsten wire dies includes an end face polishing device, a circumferential surface polishing device and a base frame. The circumferential surface polishing device is connected to one end of the end face polishing device, and the end face polishing device and the circumferential surface polishing device are installed on the base frame; the end face polishing device includes a front polishing device, a reverse polishing device and a flipping device. The flipping device is connected between the front polishing device and the reverse polishing device. Both the front polishing device and the reverse polishing device include a bottom plate, a directional track, a lifting frame, a polishing motor, a cylinder and a polishing wheel. The directional track is installed on the bottom plate, the polishing motor and the cylinder are installed on the lifting frame, the movable rod of the cylinder is connected to the bottom plate, and the polishing wheel is connected to the power rod of the polishing motor and is located above the directional track.

[0005] Preferably, the flipping device includes a rotating column, bearings, a rotating ring, a transmission wheel, a driving wheel, a driving motor, a transmission belt and a connecting frame. The two bearings are sleeved at both ends of the rotating column, the rotating ring is sleeved on the bearings, the transmission wheel is sleeved on one end of the rotating column, the rotating ring is connected to the connecting frame, the driving motor is connected to the connecting frame and the power rod is connected to the driving wheel, the transmission wheel is in transmission connection with the driving wheel through the transmission belt, and a flipping hole is penetrated through the rotating column.

[0006] Preferably, the circumferential surface polishing device includes a C-shaped fixing frame, a motor, a polishing positioning device, and a polishing adjustment device. A plurality of the polishing positioning devices are installed on the C-shaped fixing frame. The motor is installed on the C-shaped fixing frame, and the power rod is drivingly connected to a polishing positioning device. The polishing adjustment device is connected to both ends of the C-shaped fixing frame and cooperates with the polishing positioning device, and adjacent polishing positioning devices are drivingly connected.

[0007] Preferably, the polishing positioning device includes an upper turntable, an upper rotating shaft, a transmission gear, a lifting cylinder, a lifting plate, a lower rotating shaft, and a lower turntable. The upper rotating shaft is movably connected to one end of the C-shaped fixing frame, and both ends are respectively connected to the upper turntable and the transmission gear. The lifting cylinder is connected to the lifting plate, and the piston rod is connected to the other end of the C-shaped fixing frame. A plurality of the lower rotating shafts are movably connected to the lifting plate, and one end thereof penetrates through one end of the C-shaped fixing frame and is connected to the lower turntable. The upper turntable is arranged directly below the lower turntable and coaxially. Two positioning rotating shafts are arranged on one side of the upper turntable away from the polishing adjustment device, and the positioning rotating shafts are movably connected to the C-shaped fixing frame.

[0008] Preferably, the polishing adjustment device includes a discard cylinder, a fixing plate, a displacement strip, and a polishing connection plate. The discard cylinder is installed on the fixing plate, and the piston rod is connected to the displacement strip. The fixing plate is connected to the C-shaped fixing frame. The polishing connection plate is slidably connected to the displacement strip, and a polishing plate and a fixing bolt are connected to the polishing connection plate.

[0009] Beneficial effects:

[0010] (1) For the polishing device for tungsten wire die processing of the present utility model, the structure is simple and convenient to use. The two side surfaces of the drawing die are polished by the end face polishing device, and at the same time, the die is turned over by the turning device, achieving the effect of quickly polishing both sides of the die.

[0011] (2) For the polishing device for tungsten wire die processing of the present utility model, the die is positioned by two positioning rotating shafts, and then the polishing positioning device clamps the die tightly, and the circumferential surface of the die is polished by the polishing adjustment device to realize rapid positioning polishing work. Description of the drawings

[0012] Figure 1 is a schematic structural diagram of the polishing device for processing;

[0013] Figure 2 is a schematic structural diagram of the end face polishing device;

[0014] Figure 3 is a schematic structural diagram of the circumferential surface polishing device;

[0015] Figure 4 is a schematic side structural diagram of the circumferential surface polishing device;

[0016] 1 - End face polishing device, 11 - Front polishing device, 12 - Reverse polishing device, 13 - Base plate, 14 - Orientation track, 15 - Lifting frame, 16 - Polishing motor, 17 - Cylinder, 18 - Rotating column, 19 - Flipping hole, 110 - Bearing, 111 - Rotating circle, 112 - Driving wheel, 113 - Driving power wheel, 114 - Driving power motor, 2 - Circumferential surface polishing device, 21 - C-shaped fixing frame, 22 - Motor, 23 - Upper turntable, 24 - Upper rotating shaft, 25 - Driving gear, 26 - Lifting cylinder, 27 - Lifting plate, 28 - Lower rotating shaft, 29 - Lower turntable, 210 - Positioning rotating shaft, 211 - Discarding cylinder, 212 - Fixing plate, 213 - Displacement bar, 214 - Polishing connecting plate; Specific embodiments

[0017] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0018] Embodiment 1

[0019] As Figure 1As shown in the figure; a polishing device for tungsten wire mold processing, including an end face polishing device 1, a circumferential surface polishing device 2 and a base frame. The circumferential surface polishing device 2 is connected to one end of the end face polishing device 1, and the end face polishing device 1 and the circumferential surface polishing device 2 are installed on the base frame. The end face polishing device 1 includes a front polishing device 11, a reverse polishing device 12 and a flipping device. The flipping device is connected between the front polishing device 11 and the reverse polishing device 12. Both the front polishing device 11 and the reverse polishing device 12 include a bottom plate 13, a directional track 14, a lifting frame 15, a polishing motor 16, a cylinder 17 and a polishing wheel. The directional track 14 is installed on the bottom plate 13. The polishing motor 16 and the cylinder 17 are installed on the lifting frame 15. The movable rod of the cylinder 17 is connected to the bottom plate 13. The polishing wheel is connected to the power rod of the polishing motor 16 and is located above the directional track 14. The flipping device includes a rotating column 18, bearings 110, a rotating ring 111, a transmission wheel 112, a driving wheel 113, a driving motor 114, a transmission belt and a connecting frame. The two bearings 110 are sleeved at both ends of the rotating column 18. The rotating ring 111 is sleeved on the bearings 110. The transmission wheel 112 is sleeved on one end of the rotating column 18. The rotating ring 111 is connected to the connecting frame. The driving motor 114 is connected to the connecting frame and the power rod is connected to the driving wheel 113. The transmission wheel 112 is in transmission connection with the driving wheel 113 through the transmission belt. A flipping hole 19 penetrates through the rotating column 18. The circumferential surface polishing device 2 includes a C-shaped fixing frame 21, a motor 22, a polishing positioning device and a polishing adjusting device. Several polishing positioning devices are installed on the C-shaped fixing frame 21. The motor 22 is installed on the C-shaped fixing frame 21 and the power rod is in transmission connection with a polishing positioning device. The polishing adjusting device is connected to both ends of the C-shaped fixing frame 21 and cooperates with the polishing positioning device. Adjacent polishing positioning devices are in transmission connection. The polishing positioning device includes an upper turntable 23, an upper rotating shaft 24, a transmission gear 25, a lifting cylinder 26, a lifting plate 27, a lower rotating shaft 28 and a lower turntable 29. The upper rotating shaft 24 is movably connected to one end of the C-shaped fixing frame 21 and is respectively connected to the upper turntable 23 and the transmission gear 25 at both ends. The lifting cylinder 26 is connected to the lifting plate 27 and the piston rod is connected to the other end of the C-shaped fixing frame 21. Several lower rotating shafts 28 are movably connected to the lifting plate 27 and one end penetrates through one end of the C-shaped fixing frame 21 and is connected to the lower turntable 29. The upper turntable 23 is arranged directly below the lower turntable 29 and coaxially. Two positioning rotating shafts 210 are arranged on the side of the upper turntable 23 away from the polishing adjusting device. The positioning rotating shafts 210 are movably connected to the C-shaped fixing frame 21;The polishing adjustment device includes a discard cylinder 211, a fixing plate 212, a displacement bar 213, and a polishing connection plate 214. The discard cylinder 211 is installed on the fixing plate 212 and its piston rod is connected to the displacement bar 213. The fixing plate 212 is connected to the C-shaped fixing bracket 21. The polishing connection plate 214 is slidably connected to the displacement bar 213. A polishing plate and a fixing bolt are connected to the polishing connection plate 214.;

[0020] First, place the wire drawing die in the directional track 14, and then push it through a cylinder. The die is pushed through the front polishing device 11 for front polishing. Then, the die is flipped by the flipping device and then polished on the reverse side by the reverse polishing device 12. Finally, it is pushed into the circumferential surface polishing device 2 for circumferential surface polishing and is pushed out of the circumferential surface polishing device 2 after polishing. When the end face polishing device 1 works, first turn on the polishing motor 16. The polishing motor 16 drives the polishing wheel to rotate. Then, the cylinder 17 drives the lifting frame 15 to descend, so that the polishing wheel contacts the die moving in the directional track 14 and polishes it. After the front polishing is completed, the die continues to move into the flipping hole 19. Then, the power motor 114 drives the power wheel 113 to rotate. The power wheel 113 drives the transmission wheel 112 to rotate through a transmission belt. The transmission wheel 112 drives the rotating column 18 to rotate 180 degrees, so that the die in the flipping hole 19 on the rotating column 18 rotates 180 degrees. After the die flipping is completed, the other side is polished by the reverse polishing device 12. When the circumferential surface polishing device 2 works, the die continues to be pushed into the C-shaped fixing bracket 21 to a specified position. Then, the discard cylinder 211 drives the displacement bar 213 and the polishing connection plate 214 to move. The polishing connection plate 214 pushes the die to be attached to the two positioning rotating shafts 210. Then, the discard cylinder 211 drives the polishing connection plate 214 to reset. After the die is positioned between the two positioning rotating shafts 210, the lifting cylinder 26 drives the lifting plate 27 to rise. The lifting plate 27 drives the lower rotating shaft 28 to rise to clamp the die between the lower rotating table 29 and the upper rotating table 23. Then, the motor 22 drives one upper rotating shaft 24 to rotate. The adjacent rotating shafts 24 drive the rotation through the transmission gears 25. The rotating shaft 24 drives the upper rotating table 23 to rotate. The upper rotating table 23 drives the clamped die to rotate at a high speed. Then, the discard cylinder 211 drives the displacement bar 213 and the polishing connection plate 214 to move, so that the polishing plate on the polishing connection plate 214 approaches the circumferential surface of the die and polishes the circumferential surface of the high-speed rotating die. The polishing connection plate 214 is fixed to the displacement bar 213 by the fixing bolt to prevent movement during the polishing work.

[0021] The specific embodiments of the present utility model have been described in detail above. However, they are only examples, and the present utility model is not limited to the specific embodiments described above. For those skilled in the art, any equivalent modifications and substitutions to the present utility model are also within the scope of the present utility model. Therefore, all equivalent transformations and modifications made without departing from the spirit and scope of the present utility model are covered within the scope of the present utility model.

Claims

1. A polishing device for tungsten wire mold processing, characterized in that: The invention comprises an end face polishing device (1), a circumferential surface polishing device (2) and a base frame, wherein the circumferential surface polishing device (2) is connected to one end of the end face polishing device (1), and the end face polishing device (1) and the circumferential surface polishing device (2) are installed on the base frame; the end face polishing device (1) comprises a front face polishing device (11), a back face polishing device (12) and a flipping device, wherein the flipping device is connected between the front face polishing device (11) and the back face polishing device (12), and the front face polishing device (11) is connected to the back face polishing device (12). 1) and the reverse surface polishing device (12) both comprise a base plate (13), a directional track (14), a lifting frame (15), a polishing motor (16), a cylinder (17) and a polishing wheel, wherein the directional track (14) is mounted on the base plate (13), the polishing motor (16) and the cylinder (17) are mounted on the lifting frame (15), the movable rod of the cylinder (17) is connected to the base plate (13), and the polishing wheel is connected to the power rod of the polishing motor (16) and is located above the directional track (14).

2. A tungsten wire mold processing polishing device as claimed in claim 1, characterized in that: The flipping device comprises a rotating column (18), a bearing (110), a rotating circle (111), a transmission wheel (112), a power wheel (113), a power motor (114), a transmission belt and a connecting frame. The two bearings (110) are sleeved at two ends of the rotating column (18), the rotating circle (111) is sleeved on the bearing (110), the transmission wheel (112) is sleeved on one end of the rotating column (18), the rotating circle (111) is connected to the connecting frame, the power motor (114) is connected to the connecting frame and the power rod is connected to the power wheel (113), the transmission wheel (112) is connected to the power wheel (113) through the transmission belt, and a flipping hole (19) is passed through the rotating column (18).

3. A tungsten wire mold processing polishing device as claimed in claim 2, characterized in that: The circumferential surface polishing device (2) comprises a C-shaped fixing frame (21), a motor (22), a polishing positioning device and a polishing adjustment device, wherein a plurality of the polishing positioning devices are mounted on the C-shaped fixing frame (21), the motor (22) is mounted on the C-shaped fixing frame (21) and the power rod is transmission-connected to a polishing positioning device, the polishing adjustment device is connected to both ends of the C-shaped fixing frame (21) and cooperates with the polishing positioning device, and adjacent polishing positioning devices are transmission-connected.

4. A tungsten wire mold processing polishing device as claimed in claim 3, characterized in that: The polishing positioning device comprises an upper turntable (23), an upper rotating shaft (24), a transmission gear (25), a lifting cylinder (26), a lifting plate (27), a lower rotating shaft (28) and a lower turntable (29); the upper rotating shaft (24) is movably connected to one end of a C-shaped fixed frame (21) and its two ends are respectively connected to the upper turntable (23) and the transmission gear (25); the lifting cylinder (26) is connected to the lifting plate (27) and its piston rod is connected to the C-shaped fixed frame. (21) and the other end is connected, a plurality of lower rotating shafts (28) are movably connected to the lifting plate (27) and one end passes through the C-shaped fixed frame (21) and the other end is connected to the lower rotating table (29), the upper rotating table (23) is arranged directly below the lower rotating table (29) and is coaxially arranged, and two positioning rotating shafts (210) are arranged on the side of the upper rotating table (23) away from the polishing adjustment device, and the positioning rotating shafts (210) are movably connected to the C-shaped fixed frame (21).

5. A polishing device for tungsten wire mold processing as claimed in claim 4, characterized in that: The polishing adjustment device comprises a discarding cylinder (211), a fixing plate (212), a displacement bar (213) and a polishing connecting plate (214); the discarding cylinder (211) is mounted on the fixing plate (212) and the piston rod is connected to the displacement bar (213); the fixing plate (212) is connected to a C-shaped fixing frame (21); the polishing connecting plate (214) is slidably connected to the displacement bar (213); and the polishing connecting plate (214) is connected to a polishing plate and fixing bolts.

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