Sensor and electronic device

Abstract

The utility model discloses a sensor and electronic equipment, relates to MEMS technical field, the sensor includes shell, chip subassembly, encapsulation layer and protective layer, the shell includes substrate and shell, said substrate and said shell enclose to form the cavity, said substrate or said shell is equipped with the sound hole that is communicated with said cavity, said shell is equipped with the sound hole that is communicated with said cavity. The chip assembly is arranged in the containing cavity and electrically connected with the substrate through a first gold wire, the chip assembly is provided with a sensitive area, the packaging layer is arranged in the containing cavity and wraps the first gold wire, the packaging layer and the sensitive area define an induction groove, the protection layer blocks a groove opening of the induction groove, and the protection layer is arranged in the containing cavity and electrically connected with the substrate through a second gold wire. And the sensing area is opposite to the sensitive area. The utility model aims to solve the problem of failure in the cleaning process, the sensor can effectively protect the MEMS chip and the gold wire, and the reliability and the product performance are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of MEMS, and particularly relates to a sensor and an electronic device applying the sensor. Background Art

[0002] MEMS (Micro-Electro-Mechanical System) technology is a high-tech that has developed rapidly in recent years. It adopts advanced semiconductor manufacturing processes to realize the mass production of devices such as sensors and actuators. Compared with corresponding traditional devices, MEMS devices have obvious advantages in terms of volume, power consumption, weight, and price.

[0003] With the rapid development of technology, electronic devices (such as mobile phones, headphones, and computers) are more and more widely used. Electronic devices have high requirements for cleanliness. To ensure the cleanliness of the main board circuit, there is a cleaning requirement after SMD. In order to achieve a perfect cleaning effect, surfactants are often added to water to further remove organic compounds.

[0004] In related technologies, after MEMS devices are mounted on the main board of an electronic device, the MEMS devices have air vents, and water will enter during cleaning. When the surfactant foams, it will burst due to the ultrasonic oscillation effect. A huge impact force will be generated at the moment of bursting, which will cause problems such as MEMS film rupture and gold wire breakage, resulting in inaccurate testing of MEMS devices or even loss of testing function, and ultimately affecting the failure of the customer terminal application evaluation. Summary of the Utility Model

[0005] The main purpose of the utility model is to provide a sensor and an electronic device, aiming to solve the problem of avoiding failure during the cleaning process. The sensor can effectively protect the MEMS chip and the gold wire, and improve the reliability and product performance.

[0006] To achieve the above purpose, the utility model proposes a sensor, which includes:

[0007] A housing, the housing includes a substrate and an outer shell, the substrate and the outer shell enclose a cavity, and the substrate or the outer shell is provided with a sound hole communicating with the cavity;

[0008] A chip assembly, the chip assembly is arranged in the cavity and is electrically connected to the substrate through a first gold wire, and the chip assembly is provided with a sensitive area;

[0009] An encapsulation layer, the encapsulation layer is arranged in the cavity and wraps the first gold wire, and an induction groove is formed by enclosing the encapsulation layer and the sensitive area; and

[0010] A protective layer that seals the notch of the induction groove and faces the sensitive area.

[0011] In one embodiment, the chip component is disposed on the substrate, the housing is provided with the sound holes, the encapsulation layer is filled in the cavity, the encapsulation layer wraps the first gold wire and the periphery of the chip component, and encloses the sensitive area to form the induction groove;

[0012] Wherein, the encapsulation layer and the protective layer enclose with the housing to form a sound cavity communicating with the sound holes.

[0013] In one embodiment, the encapsulation layer forms a support platform that surrounds the sensitive area to enclose and form the induction groove, and the periphery of the protective layer is connected to the support platform to seal the notch of the induction groove and face the sensitive area.

[0014] In one embodiment, the protective layer is connected and supported on the side of the support platform facing away from the chip component;

[0015] And / or, a bonding layer is provided between the protective layer and the support platform, and the bonding layer is formed by a bonding adhesive.

[0016] In one embodiment, the protective layer is a waterproof and breathable membrane;

[0017] And / or, the material of the encapsulation layer is epoxy resin.

[0018] In one embodiment, the housing is a metal housing;

[0019] And / or, the housing and the substrate are welded or bonded with a conductive adhesive;

[0020] And / or, a first pad is provided on the side of the substrate facing the cavity, and the first gold wire is welded to the first pad;

[0021] And / or, a second pad is provided on the side of the substrate facing away from the cavity, and the second pad is used for connecting to an external circuit.

[0022] In one embodiment, the chip component includes a MEMS chip and an ASIC chip, the ASIC chip is electrically connected to the substrate through the first gold wire, the MEMS chip is electrically connected to the ASIC chip through a second gold wire, and the MEMS chip is provided with the sensitive area;

[0023] Wherein, the encapsulation layer wraps the first gold wire and the second gold wire.

[0024] In one embodiment, the MEMS chip and the ASIC chip are spaced apart on the substrate, and both the MEMS chip and the ASIC chip are connected to the substrate through an adhesive layer.

[0025] In one embodiment, the ASIC chip is disposed on the substrate and connected to the substrate through an adhesive layer. The MEMS chip is stacked on a side of the ASIC chip facing away from the substrate and connected to the ASIC chip through an adhesive layer.

[0026] The present utility model further provides an electronic device, and the electronic device includes the sensor described above.

[0027] In the sensor according to the technical solution of the present utility model, by setting the housing as a substrate and a housing, a cavity is formed by enclosing the substrate and the housing, so as to facilitate the installation, fixation and protection of the chip assembly using the cavity. Moreover, sound holes communicating with the cavity are provided in the substrate or the housing, so that external air flow or sound can smoothly enter the cavity through the sound holes, thus facilitating the chip assembly to perform detection or induction. At the same time, by providing a packaging layer and a protection layer in the cavity, the first gold wire is wrapped by the packaging layer, and an induction groove is formed by enclosing the packaging layer and the sensitive area of the chip assembly. The notch of the induction groove is blocked by the protection layer and is opposite to the sensitive area. In this way, the packaging layer can be used to protect the first gold wire, and the protection layer is further used to protect the sensitive area of the chip assembly. During the cleaning process, cleaning agents and water enter the cavity through the sound holes. Due to the cooperation of the packaging layer and the protection layer, it can effectively prevent water and bubbles from directly contacting the sensitive area of the chip assembly, and prevent the sensitive area from cracking, deforming or the gold wire breaking after the bubbles burst, thereby protecting the sensitive area of the chip assembly and the gold wire, avoiding performance degradation or failure and affecting the product performance, and improving the reliability and product performance. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative efforts.

[0029] Figure 1 It is a schematic cross-sectional view of an embodiment of the sensor provided by the present utility model.

[0030] Explanation of the reference numerals in the drawings:

[0031] 100. Sensor; 1. Housing; 11. Substrate; 12. Outer shell; 121. Sound hole; 13. Cavity; 14. Sound cavity; 2. Chip assembly; 21. MEMS chip; 211. Sensitive area; 22. ASIC chip; 23. First gold wire; 24. Second gold wire; 25. Adhesive layer; 3. Encapsulation layer; 31. Induction groove; 32. Support platform; 4. Protective layer; 5. Bonding layer.

[0032] The realization, functional features and advantages of the present utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0034] It should be noted that all directional indications (such as up, down, left, right, front, back,...) in the embodiments of the present utility model are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0035] At the same time, the meaning of "and / or" or "and / or" appearing throughout the text is that it includes three solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B at the same time.

[0036] In addition, the descriptions such as "first" and "second" in the present utility model are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0037] MEMS (Micro-Electro-Mechanical System) technology is a high-tech that has developed rapidly in recent years. It adopts advanced semiconductor manufacturing processes to realize the mass production of devices such as sensors and drivers. Compared with the corresponding traditional devices, MEMS devices have obvious advantages in terms of volume, power consumption, weight and price.

[0038] With the rapid development of technology, electronic devices (such as mobile phones, earphones, computers) are more and more widely used. Electronic devices have relatively high requirements for cleanliness. To ensure the cleanliness of the main board circuit, there is a cleaning requirement after SMD. In order to achieve a perfect cleaning effect, surfactants are often added to water to further remove organic compounds.

[0039] In the related art, after the MEMS device is mounted on the main board of the electronic device, the MEMS device has air vents. During cleaning, cleaning agents and water will enter through the air vents, resulting in direct contact between water and bubbles with the MEMS film. The MEMS film is thin and brittle. After the surfactant foams, it will burst due to the ultrasonic oscillation effect. During the bursting instant, a huge impact force will be generated on the MEMS film / gold wire, which will cause the MEMS film to rupture or deform, resulting in poor performance or failure. At the same time, when the bubbles burst, they will impact the weak area of the gold wire, causing the gold wire to break, affecting the product performance. This leads to inaccurate testing of the MEMS device, and even loss of the testing function, ultimately affecting the failure of the customer terminal application evaluation.

[0040] Based on the above concepts and problems, the present utility model proposes a sensor 100. It can be understood that the sensor 100 is applied to an electronic device. The electronic device can be a sounding electronic product such as a speaker, a mobile phone, a tablet computer, an earphone, etc., which is not limited here.

[0041] In this embodiment, the sensor 100 is a device manufactured based on MEMS technology. The sensor 100 can convert the sound pressure change into a capacitance change, and then the ASIC chip converts the capacitance change into an electrical signal to achieve "sound - electricity" conversion and detection.

[0042] Please refer to Figure 1 As shown, in the embodiment of the present utility model, the sensor 100 includes a housing 1, a chip component 2, a packaging layer 3 and a protective layer 4. Among them, the housing 1 includes a substrate 11 and a housing 12. The substrate 11 and the housing 12 enclose a cavity 13. The substrate 11 or the housing 12 is provided with a sound hole 121 communicating with the cavity 13. The chip component 2 is arranged in the cavity 13 and is electrically connected to the substrate 11 through a first gold wire 23. The chip component 2 is provided with a sensitive area 211. The packaging layer 3 is arranged in the cavity 13 and wraps the first gold wire 23. The packaging layer 3 and the sensitive area 211 enclose an induction groove 31. The protective layer 4 plugs the notch of the induction groove 31 and is opposite to the sensitive area 211.

[0043] In this embodiment, by setting the housing 1 as the substrate 11 and the outer shell 12, the cavity 13 formed by enclosing the substrate 11 and the outer shell 12 can provide an installation, fixing, protection, and shielding space for the chip component 2, thereby effectively preventing external components and signals from affecting it. It can be understood that the outer shell 12 of the housing 1 is a concave structure, the substrate 11 is a flat plate, and the outer shell 12 is buckled on the substrate 11 to form the cavity 13. Of course, the substrate 11 can also be set as a concave structure, the outer shell 12 is a cover plate, and the outer shell 12 is covered on the substrate 11 to form the cavity 13; or, both the substrate 11 and the outer shell 12 are set as concave structures and are connected to each other in a butt joint to form the cavity 13, which is not limited here.

[0044] It can be understood that the substrate 11 can be selected as a circuit board. For example, the substrate 11 is a PCB board, and circuits are printed on the PCB board to achieve corresponding electrical functions, which can be selected and designed according to actual needs. It should be noted that the PCB board can be composed of a single-layer or multi-layer structure. For example, it includes a substrate layer, one or more copper foil layers, and one or more solder mask ink layers, which are specifically selected according to the actual application scenario.

[0045] In this embodiment, the substrate 11 is provided with a circuit layer, which has a copper layer, and has an installation position for installing the chip component 2. The installation position has contacts such as pads for connecting the internal circuit of the substrate 11, and signal contacts are arranged on the surface of the substrate 11 for connecting to an external circuit.

[0046] Optionally, the outer shell 12 is a metal outer shell. In this embodiment, the outer shell 12 can be an integrally formed metal outer shell (the metal material can be selected from stainless steel materials, aluminum materials, aluminum alloy materials, copper materials, copper alloy materials, iron materials, iron alloy materials, etc.) or a non-metal outer shell coated with a metal material, so as to achieve electromagnetic shielding. It can be understood that the longitudinal section of the outer shell 12 is arranged in a U shape, and the outer shell 12 and the substrate 11 enclose a closed cavity 13 at one end in the opening direction to achieve peripheral wrapping and hardness support of the chip component 2 to protect the chip component 2 from damage.

[0047] In one embodiment, as Figure 1 shown, the outer shell 12 includes a top plate and side plates. The top plate is arranged opposite to the substrate 11, the side plates are arranged on the periphery of the top plate, and surround the chip component 2. One end of the side plate away from the top plate is connected to the substrate 11. It can be understood that the top plate and the side plates of the outer shell 12 form a concave structure, so that the top plate and the substrate 11 are arranged opposite and parallel to each other, and the side plates are located between the top plate and the substrate 11 and are connected to the top plate and the substrate 11 to enclose the cavity 13.

[0048] It can be understood that when the outer shell 12 is a metal outer shell, the top plate and the side plates can be made of stainless steel, aluminum, aluminum alloy, copper, copper alloy, iron, iron alloy, etc., or a non-metal plate structure coated with a metal material. The outer shell 12 can be used to wrap the chip component 2 in the cavity, so that the electromagnetic shielding ability of the substrate 11 in the related art can be effectively complemented, and the electromagnetic shielding ability of the sensor 100 can be improved. Optionally, the top plate and the side plates are of an integrally formed structure.

[0049] In an embodiment, the outer shell 12 and the substrate 11 are welded or bonded with a conductive adhesive. It can be understood that the outer shell 12 and the substrate 11 can be connected by a conductive adhesive or solder paste, etc., so as to realize the electrical connection between the outer shell 12 and the substrate 11, thereby forming a conductive shielding cavity. The chip component 2 is arranged in the cavity 13, which can prevent external electromagnetic wave interference, enhance the protection effect on both of them, and ensure the conversion performance of the chip component 2. Of course, the outer shell 12 and the substrate 11 can also be connected through other conductive materials, which are not limited herein.

[0050] In this embodiment, as Figure 1 shown, the side plates of the outer shell 12 can be connected to the substrate 11 by welding or a conductive layer. The conductive layer can be optionally composed of solder paste or a conductive adhesive, which is not limited herein. It can be understood that in order to improve the connection stability between the outer shell 12 and the substrate 11, a welding groove is provided on the side of the substrate 11 facing the outer shell 12. One end of the side plate away from the top plate is partially received and limited in the welding groove, and is connected to the substrate 11 by an adhesive, a conductive adhesive or solder paste, etc., which is not limited herein.

[0051] Optionally, the shape of the structure formed by enclosing the outer shell 12 and the substrate 11 can be a cube, a cylinder or a sphere, etc., which is not limited herein.

[0052] It should be noted that in order to fix the substrate 11 to the applied product or system and transmit electrical signals, in an embodiment, pads (i.e., the second pads) are provided on the surface of the substrate 11 facing away from the outer shell 12. It can be understood that the pads can be solder joints or pins, and the pins or pads can facilitate soldering to the main board circuit of a specific product through processes such as SMT. Optionally, there can be 3 or 4 pads to improve the stability of structural connection and data transmission, which is not limited herein.

[0053] In order to facilitate the signal transmission of the chip component 2 to the substrate 11 and then to an external product or system via the substrate 11, the substrate 11 is provided with pads (i.e., the first pads, the second pads, etc.). It can be understood that the pads can be solder joints or pins, and the pins or pads can facilitate soldering to the main board circuit of a specific product through processes such as SMT. Optionally, there can be 2, 3 or 4 pads to improve the stability of structural connection and data transmission, which is not limited herein.

[0054] Of course, in other embodiments, pads may also be provided on the housing 12. For example, pads are provided at one end of the housing 12 adjacent to the substrate 11, the pads are electrically connected to the substrate 11, and the chip component 2 is electrically connected to the pads through gold wires, etc., which are not limited herein.

[0055] It can be understood that by providing pads on the outside of the housing 12, the structure of opening vias on the side wall of the housing 12 is effectively avoided, thereby effectively reducing the side wall thickness of the housing 12 and improving the electromagnetic interference resistance performance of the sensor 100 at the same time. Optionally, the gold wire can be a gold wire or a copper wire, etc., effectively improving the stability of the electrical connection.

[0056] In one embodiment, a first pad is provided on the side of the substrate 11 facing the cavity 13, and the first gold wire 23 is welded to the first pad. It can be understood that the first pad can be a solder joint or a solder pad, and the solder pad or the solder joint can facilitate welding to the main board circuit of a specific product through processes such as SMT. Optionally, the number of first pads can be 2, 3, or 4 to improve the stability of the structural connection and data transmission, which are not limited herein. Optionally, the first gold wire 23 can be a gold wire or a copper wire, etc., effectively improving the stability of the electrical connection.

[0057] In order to fix the substrate 11 to the applied product or system and transmit electrical signals, in one embodiment, a second pad is provided on the side of the substrate 11 facing away from the cavity 13, and the second pad is used to connect to an external circuit. It can be understood that the external circuit can be connected to the second pad of the substrate 11 to be electrically connected to the substrate 11. Among them, the connection between the external circuit and the second pad can adopt methods such as wire bonding, conductive adhesive bonding, or welding, which are not limited herein.

[0058] In this embodiment, the chip component 2 is disposed in the cavity 13. The chip component 2 can be disposed on the substrate 11, that is, the chip component 2 is connected to the substrate 11 and electrically connected to the substrate 11 through the first gold wire 23; or, the chip component 2 can be disposed on the housing 12, that is, the chip component 2 is connected to the housing 12 and electrically connected to the substrate 11 through the first gold wire 23; or, part of the chip component 2 is disposed on the substrate 11, part of the chip component 2 is disposed on the housing 12, and the chip component 2 is electrically connected to the substrate 11 through the first gold wire 23, which are not limited herein.

[0059] In one embodiment, as Figure 1 shown, the chip component 2 is disposed on the substrate 11, the housing 12 is provided with a sound hole 121, the encapsulation layer 3 is filled in the cavity 13, the encapsulation layer 3 wraps the periphery of the first gold wire 23 and the chip component 2, and encloses an induction groove 31 with the sensitive area 211; wherein, the encapsulation layer 3 and the protective layer 4 enclose a sound cavity 14 communicating with the sound hole 121 with the housing 12.

[0060] It can be understood that by providing the encapsulation layer 3 and the protection layer 4, the encapsulation layer 3 is disposed within the cavity 13, wraps the first gold wire 23, and an induction groove 31 is formed by enclosing with the sensitive area 211 using the encapsulation layer 3. The protection layer 4 blocks the notch of the induction groove 31 and faces the sensitive area 211. In this way, while the encapsulation layer 3 can be used to protect the first gold wire 23, the encapsulation layer 3 and the protection layer 4 cooperate to protect and safeguard the sensitive area 211 of the chip component 2, enabling the sensitive area 211 to sense or detect the airflow or sound entering the sound cavity 14 via the sound hole 121 through the protection layer 4.

[0061] In this embodiment, the material of the encapsulation layer 3 can be selected as epoxy resin. The encapsulation layer 3 can protect and fix the first gold wire 23, protect the chip component 2 from external impacts, and also protect the PAD in life from being corroded by chemicals. The encapsulation layer 3 has insulating properties and can protect the chip component 2 from electrostatic breakdown in a dusty environment.

[0062] In an embodiment, the encapsulation layer 3 is formed with a support platform 32. The support platform 32 is disposed around the sensitive area 211 to enclose and form the induction groove 31. The periphery of the protection layer 4 is connected to the support platform 32 to block the notch of the induction groove 31 and face the sensitive area 211.

[0063] In this embodiment, as Figure 1 shown, the encapsulation layer 3 wraps the periphery of the chip component 2 and forms a support platform 32 adjacent to the sensitive area 211, such that the support platform 32 is disposed around the sensitive area 211. In this way, the support platform 32 and the sensitive area 211 enclose and form the induction groove 31. By providing the protection layer 4, the periphery of the protection layer 4 is connected to the support platform 32 to block the notch of the induction groove 31 and face the sensitive area 211. In this way, the encapsulation layer 3 and the protection layer 4 cooperate to protect the sensitive area 211 of the chip component 2. Thus, after the external airflow and sound enter the sound cavity 14 via the sound hole 121, they are detected and sensed by the sensitive area 211 of the chip component 2 through the protection layer 4.

[0064] Optionally, the protection layer 4 is a waterproof and breathable membrane. It can be understood that the protection layer 4 can prevent water vapor and foreign objects from entering, block the influence of water and air bubbles on ultrasound on the sensitive area 211 or prevent foreign objects from falling on the sensitive area 211, avoiding contamination of the sensitive area 211 of the chip component 2, and can replace the complex assembly structure of a waterproof whole machine; at the same time, the change in the air pressure environment can pass through the protection layer 4 without affecting the perception of the sensitive area 211 of the chip component 2.

[0065] In an embodiment, as Figure 1As shown, the protective layer 4 is connected to and supported on the side of the support platform 32 facing away from the chip assembly 2. It can be understood that by supporting the protective layer 4 on the side of the support platform 32 facing away from the chip assembly 2, the installation and fixation of the protective layer 4 can be achieved. Optionally, a bonding layer 5 is provided between the protective layer 4 and the support platform 32, and the bonding layer 5 is formed by a bonding adhesive.

[0066] Of course, in other embodiments, the protective layer 4 may also be located in the sensing groove 31, and the peripheral edge of the protective layer 4 is connected to the side wall of the support platform 32 facing the sensing groove 31 and is opposite and spaced from the sensitive area 211, which is not limited herein.

[0067] In the sensor 100 of the present utility model, by setting the housing 1 as the substrate 11 and the outer shell 12, a cavity 13 is formed by enclosing the substrate 11 and the outer shell 12, so as to facilitate the installation, fixation and protection of the chip assembly 2 using the cavity 13. And sound holes 121 communicating with the cavity 13 are provided on the substrate 11 or the outer shell 12, so that external air flow or sound can smoothly enter the cavity 13 through the sound holes 121, thus facilitating the chip assembly 2 to perform detection or induction. At the same time, by providing a packaging layer 3 and a protective layer 4 in the cavity 13, the first gold wire 23 is wrapped by the packaging layer 3, and an induction groove 31 is formed by enclosing the packaging layer 3 and the sensitive area 211 of the chip assembly 2, and the notch of the induction groove 31 is blocked by the protective layer 4 and is opposite to the sensitive area 211. In this way, the first gold wire 23 can be protected by the packaging layer 3, and the sensitive area 211 of the chip assembly 2 can be further protected in cooperation with the protective layer. In this way, during the cleaning process, the cleaning agent and water enter the cavity 13 through the sound holes. Due to the cooperation of the packaging layer 3 and the protective layer 4, it can effectively prevent the water and air bubbles from directly contacting the sensitive area 211 of the chip assembly 2, and prevent the sensitive area 211 from cracking or deforming and the gold wire from breaking after the air bubbles burst, etc., so as to protect the sensitive area 211 and the gold wire of the chip assembly 2, avoid performance degradation or failure and affect the product performance, and improve the reliability and product performance.

[0068] In one embodiment, the chip assembly 2 includes a MEMS chip 21 and an ASIC chip 22. The ASIC chip 22 is electrically connected to the substrate 11 through a first gold wire 23, and the MEMS chip 21 is electrically connected to the ASIC chip 22 through a second gold wire 24. The MEMS chip 21 is provided with a sensitive area 211. Among them, the packaging layer 3 wraps the first gold wire 23 and the second gold wire 24.

[0069] In this embodiment, as Figure 1As shown, the chip component 2 is mainly used in a mobile terminal to receive sound and air flow and convert the sound and air flow into electrical signals. The chip component 2 can include any type of component capable of converting sound and air flow into electrical signals, and includes MEMS components based on MEMS technology, such as but not limited to MEMS micro-capacitive sensors and / or MEMS micro-capacitive pole heads. The MEMS micro-capacitive pole head can include a silicon diaphragm for receiving sound and a silicon back electrode. The silicon diaphragm can directly receive an audio signal, which is transmitted to a micro-integrated circuit through the MEMS micro-capacitive sensor. The micro-integrated circuit converts and amplifies the high-impedance audio electrical signal into a low-impedance electrical signal, and at the same time filters it through an RF anti-noise circuit, and outputs an electrical signal matching the front-end circuit, thus completing the acoustic-electric conversion.

[0070] It should be noted that in this embodiment, when the sensor 100 is applied to an electronic device, it can establish an electrical connection with an external circuit through the substrate 11 or the housing 12, or as in the following embodiment, part of the substrate 11 is located outside the cavity 13 for connecting to the external circuit. In addition, in this embodiment, the substrate 11 can be a printed substrate 11, a flexible substrate 11 or other components capable of carrying a circuit, which is not limited here.

[0071] It can be understood that a closed cavity 13 is formed by enclosing the housing 12 and the substrate 11, and part of the substrate 11 provided with the chip component 2 is arranged in the cavity 13. At this time, there is also a substrate 11 on the side of the substrate 11 facing away from the housing 12 to play an electromagnetic shielding role, avoiding external electromagnetic interference from entering the inside of the packaging structure through the circuit layer, so that a metal shielding effect can be achieved in all directions of the cavity 13, protecting the substrate 11 and the chip component 2 in the cavity 13 from the influence of electromagnetic interference, and improving the electromagnetic interference resistance of the sensor 100. In addition, using the substrate 11 and the metal housing 12 to form a shielding housing 1 can improve the strength of the external housing of the sensor 100, making the sensor 100 have better mechanical strength and reliability.

[0072] In this embodiment, the MEMS chip 21 of the chip component 2 is used to sense and detect sound or air flow signals flowing in from the sound hole 121, can convert the sound or air flow signals into electrical signals for transmission, and transmit them to the ASIC chip 22; the ASIC chip 22 is used to provide a voltage for the MEMS chip 21 and process and amplify the signals output by the MEMS chip 21, so that the sensor 100 provides a sound receiving function for the electronic device.

[0073] It should be noted that the MEMS chip 21 can convert external physical and chemical signals into electrical signals. MEMS is the abbreviation of Micro-Electro-Mechanical System, and its Chinese name is micro-electromechanical system. Briefly speaking, the MEMS chip 21 is to manufacture an electro-mechanical system on a silicon wafer using semiconductor technology. More vividly, it is to make a mechanical system at the micron and nanometer scale, which can convert external physical and chemical signals into electrical signals. The most common function of such chips is to undertake the sensing function, which is somewhat similar to the human sensory system in the entire large information system. For example, the MEMS microphone chip is equivalent to a person's ear and can sense sound; the MEMS speaker chip is equivalent to a person's mouth and can emit sound; the MEMS accelerometer, gyroscope, and magnetic sensor chips are equivalent to a person's cerebellum and can sense direction and speed; the MEMS pressure chip is equivalent to a person's skin and can sense pressure; the MEMS chemical sensor is equivalent to a person's nasal cavity and can sense taste and temperature and humidity. A device formed by packaging a MEMS chip 21 and a dedicated integrated circuit chip (ASIC chip 22) together is a MEMS sensor. That is, the sensor 100 of the present application is a MEMS sensor.

[0074] In this embodiment, through the wire bonding process, the ASIC chip 22 is interconnected with the circuit of the substrate 11 through the first gold wire 23, so that the ASIC chip 22 can process the signals fed back by the MEMS chip 21 and then transmit them to the substrate 11, thereby using the pads on the substrate 11 to connect with the external circuit to achieve the transmission of signals.

[0075] It can be understood that the process of connecting the electrodes on the MEMS chip 21 to the electrodes, pins, or solder joints on the ASIC chip 22 with wires is the bonding of the second gold wire 24. In this embodiment, wiring pads or pad structures are provided on the MEMS chip 21 and / or the ASIC chip 22. Through the bonding method of the second gold wire 24, the wiring pads or pads of the MEMS chip 21 are electrically connected to the wiring pads or pads of the ASIC chip 22. In this way, when the step of bonding the second gold wire 24 is carried out, there will be no overflow glue in the prior art on the wiring pads. Therefore, the electrical performance of the MEMS chip 21 and the ASIC chip 22 after the bonding of the second gold wire 24 can be guaranteed.

[0076] It should be noted that the MEMS chip 21 includes a back plate and a diaphragm. The material of the back plate of the MEMS chip 21 is generally single-crystalline silicon, polycrystalline silicon, silicon nitride or other materials, and the external shape of the back plate is generally cubic. The diaphragm can be a piezoelectric structure or a capacitive structure, which is not limited herein. For example, when the diaphragm is a piezoelectric structure, it includes a diaphragm and piezoelectric materials provided on both sides of the diaphragm. The diaphragm is excited by a sound signal to vibrate, so that the pressure of the piezoelectric materials changes, and a corresponding electrical signal is output. When the diaphragm is a capacitive structure, it includes a back plate and a diaphragm. The back plate and the diaphragm face each other, and electrically conductive layers that can be energized are provided on the back plate and the diaphragm respectively. However, the energized layers are insulated from each other. In this way, the back plate and the diaphragm form a capacitor structure, and at this time, the diaphragm forms a sensitive area 211.

[0077] In one embodiment, the MEMS chip 21 and the ASIC chip 22 are spaced apart on the substrate 11, and both the MEMS chip 21 and the ASIC chip 22 are connected to the substrate 11 through an adhesive layer 25.

[0078] In this embodiment, both the MEMS chip 21 and the ASIC chip 22 of the chip assembly 2 are mounted on the substrate 11 through the adhesive layer 25. The MEMS chip 21 is electrically connected to the ASIC chip 22 through a second gold wire 24, and the ASIC chip 22 is electrically connected to the substrate 11 through a first gold wire 23.

[0079] It can be understood that the MEMS chip 21 forms a sensitive area 211, and the encapsulation layer 3 wraps the first gold wire 23 and the second gold wire 24. Optionally, the encapsulation layer 3 wraps the periphery of the MEMS chip 21 and encloses an induction groove 31 with the sensitive area 211.

[0080] Of course, in other embodiments, an adhesive can be coated on the ASIC chip 22, and the ASIC chip 22 is pasted on the substrate 11 so that the ASIC chip 22 and the MEMS chip 21 are spaced apart, and the adhesive is baked to cure the adhesive. It can be understood that the adhesive is a conductive adhesive, and the ASIC chip 22 is fixed on the substrate 11 through the adhesive and electrical connection is achieved. The adhesive is heated and cured to achieve a strengthening effect.

[0081] Of course, in order to avoid affecting the performance of the adhesive layer 25 due to baking and curing of the adhesive on the ASIC chip 22, the ASIC chip 22 can be mounted first, that is, after the step of mounting the ASIC chip 22 on the substrate 11 is completed, the step of mounting the MEMS chip 21 on the substrate 11 is carried out, which is not limited herein.

[0082] In one embodiment, the ASIC chip 22 is disposed on the substrate 11 and connected to the substrate 11 through the adhesive layer 25. The MEMS chip 21 is stacked on the side of the ASIC chip 22 facing away from the substrate 11 and connected to the ASIC chip 22 through the adhesive layer 25.

[0083] In this embodiment, as Figure 1 shown, the MEMS chip 21 is directly stacked on the ASIC chip 22. The periphery of the MEMS chip 21 and the ASIC chip 22 can be encapsulated by injection molding to form the encapsulation layer 3. In this way, the size of the sensor 100 can be reduced and the integration degree can be improved. Optionally, the ASIC chip 22 is mounted on the substrate 11 through the adhesive layer 25, and the MEMS chip 21 is mounted on the ASIC chip 22 through the adhesive layer 25.

[0084] It should be noted that the MEMS chip 21 and the ASIC chip 22 are connected to each other through a connector. The connector is a structural component for connecting the MEMS chip 21 and the ASIC chip 22 through the TSV (Through-Silicon Via) packaging technology. Of course, the MEMS chip 21 is electrically connected to the ASIC chip 22 through the second gold wire 24, which is not limited herein.

[0085] In this embodiment, the ASIC chip 22 is electrically connected to the substrate 11 and the MEMS chip 21 respectively. With such a setting, when the MEMS chip 21 converts the vibration signal of the diaphragm into an electrical signal, it can be transmitted to the ASIC chip 22 for identification and amplification, and then transmitted to the substrate 11 for external transmission.

[0086] It can be understood that the adhesive layer 25 can be a bonding adhesive, an encapsulation adhesive, etc., which is not limited herein. In this embodiment, the adhesive layer 25 is prepared through the following steps: a layer of high thermal conductivity resin liquid is paved on the second adhesive surface, a support body is paved on the high thermal conductivity resin liquid, and the high thermal conductivity resin liquid is poured into the layer formed by the support body to form a thermal conductive layer provided with the support body. The first adhesive surface is paved on the surface of the thermal conductive layer to obtain the adhesive layer 25.

[0087] In this application, a sealed cavity 13 is formed by enclosing a substrate 11 and a housing 12 to achieve omnidirectional electromagnetic shielding, preventing internal chip components 2 and the like from being interfered by external electromagnetic waves. The metal shielding ability is related to the thickness of the metal shielding layer. The thicker the shielding layer, the stronger the electromagnetic shielding ability. In one embodiment, it is defined that the thickness T of the substrate 11 satisfies 0.05 mm ≤ T ≤ 0.5 mm, where T can take values of 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, or any value between 0.05 mm and 0.5 mm, which is not limited here. If T is less than 0.05 mm, the metal shielding ability of the substrate 11 is weak, and in areas with strong electromagnetic waves and large interference, there are still some electromagnetic waves that will pass through the substrate 11 and enter the cavity 13 to interfere with internal devices. If T exceeds 0.5 mm, it will cause the mass and volume of the sensor 100 to be relatively large, restricting the use and installation of the sensor 100, reducing the applicability of the sensor 100, and being unfavorable for the development of small-sized electronic devices.

[0088] Similarly, it is defined that the thickness t of the housing 12 satisfies 0.05 mm ≤ t ≤ 0.5 mm, where t can take values of 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, or any value between 0.05 mm and 0.5 mm, which is not limited here. If t is less than 0.05 mm, the metal shielding ability of the housing 12 is weak, and in areas with strong electromagnetic waves and large interference, there are still some electromagnetic waves that will pass through the housing 12 and enter the cavity 13 to interfere with internal devices. If t exceeds 0.5 mm, it will cause the mass and volume of the sensor 100 to be relatively large, restricting the use and installation of the sensor 100, reducing the applicability of the sensor 100, and being unfavorable for the development of small-sized electronic devices.

[0089] Of course, in other embodiments, a conductive coating may be provided on the surface of the substrate 11, and the conductivity of the conductive coating is stronger than that of the substrate 11; and / or, a conductive coating is provided on the surface of the housing 12, and the conductivity of the conductive coating is stronger than that of the housing 12.

[0090] It can be understood that the shielding effect of the shielding housing on external electromagnetic waves is mainly that when electromagnetic waves encounter obstacles on the metal surface, phenomena such as reflection, refraction, and absorption will occur. The shielding housing made of metal materials can convert the energy of electromagnetic waves into current, thereby absorbing or reflecting the energy of electromagnetic waves.

[0091] In this embodiment, a conductive coating is provided on the surface of the substrate 11, and the conductivity of the conductive coating is stronger than that of the substrate 11. Herein, the conductive coating can be provided on the surface of the substrate 11 facing the cavity 13, or can be provided on the surface of the substrate 11 facing away from the cavity 13, which is not limited herein; the provision of the conductive coating improves the conductivity of the substrate 11, enhances the electromagnetic shielding ability of the substrate 11, can better absorb the energy of electromagnetic waves, and further prevents the internal components of the sensor 100 from being interfered by external electromagnetic signals.

[0092] Similarly, in some embodiments, a conductive coating is provided on the surface of the housing 12, and the conductivity of the conductive coating is stronger than that of the housing 12. Herein, the conductive coating can be provided on the inner surface of the housing 12, or can be provided on the outer surface of the housing 12, which is not limited herein; the provision of the conductive coating improves the conductivity of the housing 12, enhances the electromagnetic shielding ability of the substrate 11, can better absorb the energy of electromagnetic waves, and further prevents the internal components of the sensor 100 from being interfered by external electromagnetic signals.

[0093] Optionally, the material of the conductive coating includes at least one of silver and nickel. In this embodiment, among the materials of the conductive coating provided on the housing 12 or the substrate 11, at least one of the silver material and the nickel material is included. Both silver and nickel have high conductivity and strong electromagnetic shielding ability. At this time, the substrate 11 and the housing 12 can be made of materials such as stainless steel or copper to improve the structural strength of the shielding housing 1, and the electromagnetic shielding ability of the shielding housing 1 is further enhanced by using the conductive coating containing silver or nickel, so that the shielding housing 1 has good electromagnetic shielding performance while having high structural strength, ensuring the performance stability and reliability of the sensor 100.

[0094] The present utility model further provides an electronic device, and the electronic device includes the above-mentioned sensor 100. The specific structure of the sensor 100 refers to the foregoing embodiments. Since this electronic device adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought by the technical solutions of the foregoing embodiments, which will not be elaborated herein one by one.

[0095] In this embodiment, the electronic device may be, but is not limited to, an electric toothbrush, a mobile phone, a laptop computer, a tablet computer, a personal digital assistant (PDA), an e-book reader, an MP3 (Moving Picture Experts Group Audio Layer III) player, an MP4 (Moving Picture Experts Group Audio Layer IV) player, a wearable device, a navigator, a handheld game console, etc., which are not limited herein.

[0096] The above are only alternative embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made under the concept of the present invention by using the content of the specification and drawings of the present invention, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A sensor, characterized in that: The sensor comprises: A shell, the shell comprising a substrate and an outer shell, the substrate and the outer shell enclose a cavity, and the substrate or the outer shell is provided with a sound hole communicating with the cavity; A chip component, the chip component is disposed in the cavity and is electrically connected to the substrate via a first gold wire, and the chip component is provided with a sensitive area; A packaging layer, wherein the packaging layer is disposed in the cavity and wraps the first gold wire, and the packaging layer and the sensitive area are enclosed to form a sensing slot; and A protective layer blocks the notch of the sensing slot and is opposite to the sensitive area.

2. The sensor according to claim 1, characterized in that The chip component is arranged on the substrate, the housing is provided with the acoustic hole, the packaging layer is filled in the cavity, the packaging layer wraps the first gold wire and the periphery of the chip component, and encloses the sensitive area to form the sensing slot; The packaging layer, the protective layer and the outer shell are combined to form a sound cavity connected to the sound hole.

3. The sensor according to claim 2, characterized in that The packaging layer is formed with a support platform, and the support platform is arranged around the sensitive area to enclose the sensing groove. The periphery of the protective layer is connected to the support platform to block the notch of the sensing groove and is opposite to the sensitive area.

4. The sensor according to claim 3, characterized in that The protective layer is connected to and supported on a side of the support platform facing away from the chip assembly; And / or, an adhesive layer is provided between the protective layer and the support platform, and the adhesive layer is formed by an adhesive.

5. The sensor according to claim 1, characterized in that The protective layer is a waterproof and breathable membrane; And / or, the encapsulation layer is made of epoxy resin.

6. The sensor according to claim 1, characterized in that The housing is a metal housing; And / or, the housing and the substrate are welded or bonded with conductive adhesive; And / or, a first pad is provided on a side of the substrate facing the cavity, and the first gold wire is connected to the first pad by welding; And / or, a second pad is provided on a side of the substrate facing away from the cavity, and the second pad is used to connect to an external circuit.

7. The sensor according to any one of claims 1 to 6, characterized in that The chip assembly includes a MEMS chip and an ASIC chip, the ASIC chip is electrically connected to the substrate through the first gold wire, the MEMS chip is electrically connected to the ASIC chip through the second gold wire, and the MEMS chip is provided with the sensitive area; Wherein, the packaging layer wraps the first gold wire and the second gold wire.

8. The sensor according to claim 7, characterized in that The MEMS chip and the ASIC chip are arranged on the substrate at intervals, and both the MEMS chip and the ASIC chip are connected to the substrate via a glue layer.

9. The sensor according to claim 7, characterized in that The ASIC chip is arranged on the substrate and connected to the substrate through a glue layer, and the MEMS chip stack is arranged on a side of the ASIC chip facing away from the substrate and connected to the ASIC chip through a glue layer.

10. An electronic device, characterized in that: The electronic device comprises the sensor according to any one of claims 1 to 9.

Images