Multi-channel wire electroplating bath
By designing a multi-channel wire plating tank, using the combination of comb flow module and liquid inlet pipe, the problems of unstable flow of the plating solution and multi-process electroplating requirements are solved, and the uniform flow of the plating solution and the stability of the liquid level are achieved, and the plating quality and production efficiency are improved.
Patent Information
- Application Number
- CN202422258990.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-09-14
AI Technical Summary
The prior art flow is unstable when replenishing the plating solution in the electroplating cell, resulting in unstable liquid level height, affecting the electroplating effect of bonding wires, and cannot meet the production needs of multi-bonding wires and multi-process electroplating.
A multi-channel wire plating tank is designed. By forming multiple channels and cavity spaced side by side in the tank body, a comb flow module is set to flow the plating solution evenly, and the plating solution is continuously replenished through the liquid inlet pipe to ensure the consistency of the plating solution flow rate.
The uniform flow of the electroplating solution and the stability of the liquid level are achieved, the plating quality is improved, and the synchronous electroplating of multi-wire materials is realized through multi-channel layout, improving production efficiency.
Smart Images
Figure CN223003059U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a multi-channel wire electroplating tank. Background Art
[0002] Although the chips obtained after the completion of semiconductor integrated circuit manufacturing already have specific functions, to realize these functions, they must be connected to external electronic components. The semiconductor integrated circuit chips need to go through a bonding process with the package body, and finally obtain a chip package, so that they can be connected to external electronic components through the pins of the package. In the bonding process between the chip and the package body, bonding wires are used to electrically connect the pads on the chip to the pins of the package body. Therefore, the bonding wire is an essential material for realizing the chip function.
[0003] Currently, when electroplating bonding wires, the generally used electroplating bath is provided with a liquid inlet at the bottom and an overflow outlet at the top. After the electroplating solution enters from the bottom liquid inlet, it overflows from the overflow outlet at the top. The bonding wire passes through the electroplating bath in a way that one end feeds the material and the other end winds it up, and is immersed in the electroplating solution, so as to realize synchronous electroplating of the part passing through the electroplating bath during the continuous feeding and winding of the bonding wire.
[0004] However, in the actual production process, when replenishing the electroplating solution in the electroplating bath in the prior art, since the flow rate of the electroplating solution is large near the overflow outlet and slow far from the overflow outlet, the flow of the electroplating solution in the electroplating bath is unstable, which easily leads to the instability of the overall liquid level height in the electroplating bath and affects the electroplating effect of the bonding wire; in addition, each time only a single bonding wire can be electroplated with a single process, which cannot meet the production requirements of multi-bonding wire and multi-process electroplating. Summary of the Invention
[0005] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved multi-channel wire electroplating tank.
[0006] To solve the above technical problem, the technical solution adopted by the utility model is as follows:
[0007] A multi-channel wire electroplating tank, which comprises a tank body with an overflow port and a liquid inlet, and a liquid inlet pipe. Multiple channels are formed in the tank body, which are arranged side by side at intervals and respectively form overflow ports, and cavities corresponding to each channel are formed below and respectively form liquid inlets. Multiple wires pass through the multiple channels correspondingly, and there are multiple liquid inlet pipes which are correspondingly communicated with the multiple liquid inlets; the electroplating tank further comprises a flow combing module correspondingly arranged between each channel and the cavity, wherein each flow combing module is divided into a first area far from the overflow port and a second area close to the overflow port, and the first area and the second area are correspondingly formed with first flow combing holes and second flow combing holes which penetrate up and down. When the liquid enters, the flow rate of the electroplating liquid passing upward through the first area in each cavity is equal to the flow rate passing upward through the second area.
[0008] According to a specific embodiment and a preferred aspect of the present utility model, the height of the channel is h1, and the height of the cavity is h2, where 1.5h1 ≤ h2 ≤ 2h1. Herein, based on the layout of the heights of the channels and cavities in the present application, while forming the best buffer for the replenishing kinetic energy of the electroplating liquid in the cavity, the replenishing rate of the electroplating liquid in the channel is ensured to guarantee the electroplating quality.
[0009] Preferably, the tank body includes a horizontally arranged tank bottom plate, a plurality of side plates arranged side by side at intervals on the tank bottom plate along the direction perpendicular to the wire transmission direction, and end plates arranged on the tank bottom plate and respectively connected to both ends of the plurality of side plates, wherein a cavity is formed between every two adjacent side plates, the tank bottom plate, the end plates, and the flow combing module; a channel is formed between every two adjacent side plates, the end plates, and the flow combing module. Herein, the structure is simple, which is convenient for installation and implementation.
[0010] Preferably, a plurality of overlapping grooves recessed inward from the inner wall are formed on each end plate, and each flow combing module is correspondingly overlapped in the overlapping grooves from opposite sides, and the four sides of the flow combing module are respectively attached to the corresponding side plates and the side walls of the overlapping grooves. Herein, the installation stability of the flow combing module is improved, and the shaking during bearing the replenishing kinetic energy of the electroplating liquid is avoided.
[0011] Preferably, an overflow port communicated with each channel is formed on each end plate, and a baffle which is adjustable up and down is arranged on the outer wall of each end plate to adjust the size of the overflow port, and each wire passes through the corresponding channel from the overflow port. Herein, by adjusting the size of the overflow port, it is beneficial to control the seepage rate of the electroplating liquid from the overflow port to accurately control the liquid level height.
[0012] Preferably, there are two second areas, which are symmetrically arranged on opposite sides of the first area in the wire transmission direction.
[0013] According to another specific embodiment and a preferred aspect of the present utility model, the liquid inlet is located at the bottom of the cavity, and in the orthographic projection on the horizontal plane, the connection position of each liquid inlet pipe and the cavity is located in the middle of the first area.
[0014] According to another specific embodiment and preferred aspect of the present utility model, the pore diameters of the first flow combing holes and the second flow combing holes are equal; a plurality of first flow combing holes are distributed in the first region, and a plurality of second flow combing holes are distributed in the second region, wherein the distance between the plurality of first flow combing holes is less than the distance between the plurality of second flow combing holes.
[0015] Preferably, the plurality of first flow combing holes are divided into a plurality of first flow combing groups, and the plurality of second flow combing holes are divided into a plurality of second flow combing groups, wherein the plurality of first flow combing holes and the second flow combing holes in each first flow combing group and the second flow combing group are respectively spaced apart along a direction perpendicular to the wire transmission direction; the distance between adjacent first flow combing groups is less than the distance between adjacent second flow combing groups.
[0016] In addition, the electroplating tank further includes two wire wheel groups respectively arranged at both ends of the tank body, wherein each wire wheel group includes a plurality of wire wheels connected in one-to-one correspondence with a plurality of channels.
[0017] Due to the implementation of the above technical solutions, the present utility model has the following advantages compared with the prior art:
[0018] When replenishing the electroplating solution in the electroplating tank in the prior art, since the flow rate of the electroplating solution is large near the overflow port and the flow rate of the electroplating solution far from the overflow port is slow, the flow of the electroplating solution in the electroplating tank is unstable, which easily leads to the instability of the overall liquid level height in the electroplating tank and affects the electroplating effect of the bonding wire; in addition, each time only a single process can be electroplated for a single bonding wire, which cannot meet the production requirements of electroplating multiple bonding wires with multiple processes; while the present application conducts an overall design on the structure of the multi-channel wire electroplating tank, skillfully solves the deficiencies and defects of the prior art. After adopting this electroplating tank, multiple wires pass through a plurality of channels in one-to-one correspondence; the electroplating solution is continuously replenished into the cavity through the liquid inlet pipe, and the electroplating solution passes through the first region and the second region on the flow combing module respectively having the first flow combing holes and the second flow combing holes from bottom to top to form flow combing and guiding, so that the flow rate of the electroplating solution far from the overflow port is equal to the flow rate of the electroplating solution near the overflow port. Therefore, compared with the prior art, on the one hand, the present utility model can realize the uniform flow of the electroplating solution through the distribution of the first flow combing holes and the second flow combing holes, ensure the stability of the electroplating solution level in the electroplating tank, and effectively improve the electroplating quality; on the other hand, based on the multi-channel layout, the electroplating process of the same process or different processes can be synchronously implemented for multiple wires, greatly improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a three-dimensional structural schematic diagram of the multi-channel wire electroplating tank of the present utility model;
[0020] Figure 2 is a top view of the multi-channel wire electroplating tank of the present utility model;
[0021] Figure 3 is Figure 2 the schematic cross-sectional view taken along the A-A direction in
[0022] Figure 4 is Figure 2 the schematic cross-sectional view taken along the B-B direction in
[0023] Wherein: 1. Slot body; t. Channel; q0. Cavity; 10. Slot bottom plate; 11. Side plate; 12. End plate; 120. Lapping slot; 121. Overflow port; 122. Baffle plate;
[0024] 2. Liquid inlet pipe;
[0025] 3. Flow combing module; q1. First region; k1. First flow combing hole; q2. Second region; k2. Second flow combing hole;
[0026] 4. Wire wheel group; 40. Wire wheel. Detailed implementation manners
[0027] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.
[0029] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0030] In this application, unless otherwise clearly defined or limited, terms such as "installed", "connected", "linked", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0031] In this application, unless otherwise clearly defined or limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0032] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.
[0033] As Figures 1 to 4 shown, the multi-channel wire electroplating tank of this embodiment includes a tank body 1 having an overflow port and a liquid inlet, a liquid inlet pipe 2, and a flow combing module 3.
[0034] Specifically, a plurality of channels t are formed in the tank body 1 and are arranged side by side at intervals and respectively form overflow ports, and cavities q0 corresponding to each channel t are provided below and respectively form liquid inlets, wherein each channel t extends along the length direction of the wire, and multiple wires pass through the plurality of channels t one by one, and an anode metal plate is installed in each channel t and extends along the wire transmission direction; there are multiple liquid inlet pipes 2 and they are correspondingly communicated with the plurality of cavities q0; there are multiple flow combing modules 3 and they are correspondingly arranged between each channel t and the cavity q0.
[0035] The slot body 1 includes a horizontally arranged slot bottom plate 10, a plurality of side plates 11 arranged side by side and spaced apart along a direction perpendicular to the wire transmission direction on the slot bottom plate 10, and end plates 12 arranged on the slot bottom plate 10 and respectively connected to both ends of the plurality of side plates 11. A cavity q0 is formed between every two adjacent side plates 11, the slot bottom plate 10, the end plates 12, and the flow combing module 3; a channel t is formed between every two adjacent side plates 11, the end plates 12, and the flow combing module 3. The height of the channel t is h1, and the height of the cavity q0 is h2, where 1.5h1 ≤ h2 ≤ 2h1. In this embodiment, preferably, h2 = 1.95h1.
[0036] For the convenience of installation, a plurality of lapping grooves 120 recessed inward from the inner wall are formed on each end plate 12. The flow combing modules 3 are lapped in the lapping grooves 120 correspondingly from opposite sides, and the peripheries of the flow combing modules 3 are respectively in fit with the corresponding side plates 11 and the side walls of the lapping grooves 120.
[0037] Meanwhile, an overflow port 121 communicating with each channel t is formed on each end plate 12, and a baffle 122 is arranged on the outer wall of each end plate 12 and can be adjusted up and down to adjust the size of the overflow port. Each wire passes through the corresponding channel t from the overflow port 121. In some specific embodiments, the baffle 122 is bolt - connected to the end plate 12. That is to say, in this application, there are two overflow ports on the slot body 1, and they are respectively located at both ends. The electroplating solution enters from bottom to top and overflows from the overflow ports at both ends. At the same time, the overflow ports of this application also serve the function of allowing the wire to pass through.
[0038] In this example, the liquid inlet is located at the bottom of the cavity q0, and each liquid inlet pipe 2 is communicated with the bottom of the corresponding cavity q0, that is to say, each liquid inlet pipe 2 is correspondingly connected to the slot bottom plate 10.
[0039] In this example, the flow combing module 3 is divided into a first region q1 far from the overflow port 121 and a second region q2 close to the overflow port 121, and the first region q1 and the second region q2 are respectively formed with first flow - combing holes k1 and second flow - combing holes k2 that penetrate up and down. When the liquid enters, the flow rate of the electroplating solution upward through the first region q1 in each cavity q0 is equal to the flow rate upward through the second region q2.
[0040] In some specific embodiments, there are two second regions q2, which are symmetrically arranged on opposite sides of the first region q1 in the wire transmission direction. Regarding the area sizes of the first region q1 and the second region q2, they are set according to the actual production working conditions, and the present application does not make any limitations. In the orthographic projection on the horizontal plane, each liquid inlet is located in the middle of the first region q1. The apertures of the first flow-combing holes k1 and the second flow-combing holes k2 are equal. A plurality of first flow-combing holes k1 are distributed in the first region q1, and a plurality of second flow-combing holes k2 are distributed in the second region q2. The spacing between the plurality of first flow-combing holes k1 is smaller than the spacing between the plurality of second flow-combing holes k2. At the same time, the plurality of first flow-combing holes k1 are divided into a plurality of first flow-combing groups, and the plurality of second flow-combing holes k2 are divided into a plurality of second flow-combing groups. Among them, the plurality of first flow-combing holes k1 and the plurality of second flow-combing holes k2 in each first flow-combing group and second flow-combing group are respectively spaced apart along a direction perpendicular to the wire transmission direction, and the spacing between adjacent first flow-combing groups is smaller than the spacing between adjacent second flow-combing groups.
[0041] In addition, the electroplating tank of this embodiment further includes two wire wheel groups 4 respectively arranged at both ends of the tank body 1. Each wire wheel group 4 includes a plurality of wire wheels 40 that are correspondingly connected to the plurality of channels t one by one. Each wire passes through the corresponding wire wheel 40 to enter and exit the corresponding channel t.
[0042] In summary, after adopting this electroplating tank, multiple wires pass through multiple channels one by one. The electroplating solution is continuously replenished into the cavity through the liquid inlet pipe. The electroplating solution passes through the first region and the second region of the flow-combing module respectively having the first flow-combing holes and the second flow-combing holes from bottom to top to form flow-combing and guiding, so that the flow rate of the electroplating solution far from the overflow port is equal to the flow rate of the electroplating solution near the overflow port. Therefore, compared with the prior art, on the one hand, the present utility model can achieve uniform flow of the electroplating solution through the distribution of the first flow-combing holes and the second flow-combing holes, ensure the stability of the electroplating solution level in the electroplating tank, and effectively improve the electroplating quality. On the other hand, based on the multi-channel layout, the electroplating processes of multiple wires can be synchronously implemented with the same process or different processes, greatly improving the production efficiency. Thirdly, based on the layout of the channels and the height of the cavity in the present application, while forming the best buffer for the replenishing kinetic energy of the electroplating solution in the cavity, it ensures the replenishing rate of the electroplating solution in the channels to guarantee the electroplating quality. Fourthly, it can improve the installation stability of the flow-combing module and avoid shaking when bearing the replenishing kinetic energy of the electroplating solution. Fifthly, by adjusting the size of the overflow port, it is beneficial to control the seepage rate of the electroplating solution from the overflow port to accurately control the liquid level height.
[0043] The above has made a detailed description of the present utility model, aiming to enable those skilled in this field of technology to understand the content of the present utility model and implement it. However, it should not be used to limit the protection scope of the present utility model. Any equivalent changes or modifications made according to the spirit and essence of the present utility model should be covered within the protection scope of the present utility model.
Claims
1. A multi-channel wire electroplating tank, comprising a tank body having an overflow port and a liquid inlet, and a liquid inlet pipeline, characterized in that: The tank body is provided with a plurality of channels which are spaced side by side and respectively form the overflow ports, and a cavity which is correspondingly arranged under each of the channels and respectively forms the liquid inlets, a plurality of wires pass through the plurality of channels, and a plurality of liquid inlet pipes are connected to the plurality of liquid inlets correspondingly; the electroplating tank further comprises a combing flow module which is correspondingly arranged between each of the channels and the cavity, wherein each of the combing flow modules is divided into a first area away from the overflow port and a second area close to the overflow port, and the first area and the second area are correspondingly provided with a first combing flow hole and a second combing flow hole which are connected up and down, and when liquid is introduced, the flow velocity of the electroplating liquid in each of the cavities passing through the first area upward is equal to the flow velocity passing through the second area upward.
2. The multi-channel wire electroplating tank according to claim 1, characterized in that: The height of the channel is h1, and the height of the cavity is h2, wherein 1.5h1≤h2≤2h1.
3. The multi-channel wire electroplating tank according to claim 1, characterized in that: The trough body includes a horizontally arranged trough bottom plate, a plurality of side plates arranged side by side and spaced apart on the trough bottom plate along a direction perpendicular to the wire transmission direction, and an end plate arranged on the trough bottom plate and respectively connected to both ends of the plurality of side plates, wherein the cavity is formed between every two adjacent side plates, trough bottom plates, end plates, and combing flow modules; and the channel is formed between every two adjacent side plates, end plates, and combing flow modules.
4. The multi-channel wire electroplating tank according to claim 3, characterized in that: A plurality of overlapping grooves recessed inward from the inner wall are formed on each of the end plates, and each of the combing flow modules is overlapped in the overlapping groove from opposite sides, and the four sides of the combing flow module are respectively fitted with the corresponding side plates and the side walls of the overlapping groove.
5. The multi-channel wire electroplating tank according to claim 3, characterized in that: The overflow port connected to each of the channels is formed on each of the end plates, and the outer wall of each of the end plates is provided with a baffle which can be adjusted up and down to adjust the size of the overflow port, and each wire passes through the corresponding channel from the overflow port.
6. The multi-channel wire electroplating tank according to claim 5, characterized in that: There are two second areas, which are symmetrically arranged on opposite sides of the first area in the wire transmission direction.
7. The multi-channel wire electroplating tank according to claim 1, characterized in that: The liquid inlet is located at the bottom of the cavity, and in the orthographic projection on the horizontal plane, the connection point between each of the liquid inlet pipes and the cavity is located in the middle of the first area.
8. The multi-channel wire electroplating tank according to claim 1, characterized in that: The apertures of the first comb flow holes and the second comb flow holes are equal; a plurality of the first comb flow holes are distributed in the first area, and a plurality of the second comb flow holes are distributed in the second area, wherein the spacing between the plurality of the first comb flow holes is smaller than the spacing between the plurality of the second comb flow holes.
9. The multi-channel wire electroplating tank according to claim 8, characterized in that: The plurality of first comb flow holes are divided into a plurality of first comb flow groups, and the plurality of second comb flow holes are divided into a plurality of second comb flow groups, wherein the plurality of first comb flow holes and second comb flow holes in each first comb flow group and second comb flow group are respectively spaced apart along a direction perpendicular to the wire transmission direction; and the spacing between adjacent first comb flow groups is smaller than the spacing between adjacent second comb flow groups.
10. The multi-channel wire electroplating tank according to claim 1, characterized in that: The electroplating tank also includes two wire wheel groups respectively arranged at two ends of the tank body, wherein each of the wire wheel groups includes a plurality of wire wheels connected to the plurality of channels in a one-to-one correspondence.