Sensor

Abstract

The utility model discloses a sensor, comprising a first chip module having a first chip pin; the second chip module is provided with second chip pins, and the second chip pins and the first chip pins are arranged at intervals in the first direction; the first electric connection part comprises a first part and a second part which are connected with each other, and the first part is bent towards the first chip pin and is connected with the first chip pin; the second electric connection part comprises a third part and a fourth part which are connected with each other, and the third part is bent towards the second chip pin and is connected with the second chip pin; the fourth part and the second part are arranged side by side in the second direction, and one part of the fourth part and one part of the second part extend in the third direction; the first direction, the second direction and the third direction are perpendicular to one another. The wiring terminal of the sensor framework is simple in structure, facilitates electrical connection between the wiring terminal and a chip pin, and is small in occupied space and low in cost.

Description

Technical Field

[0001] The utility model relates to the technical field of sensor skeletons, and particularly relates to a sensor. Background Art

[0002] A wheel speed sensor is a sensor for measuring the rotational speed of an automobile wheel, and is generally applied in an anti-lock braking system (ABS, Anti-lock Braking System). The wheel speed sensor includes a skeleton and a chip. The skeleton is a bracket for fixing and protecting the chip, and the chip is used for acquiring and processing wheel speed data.

[0003] Currently, common wheel speed sensors usually adopt dual chips arranged side by side. That is, two horizontally side-by-side receiving grooves are formed on the skeleton, then the chips are placed into the corresponding receiving grooves, and then the pins of the chips and the wiring terminals of the skeleton are welded on the front and back of the skeleton respectively. Finally, the welded chips and the skeleton are placed into an injection mold and co-injected with a fitting (sensor connector) to form a complete sensor. However, since the chips of such wheel speed sensors are arranged side by side horizontally and the induction point positions of the chips are different, in actual application, the signals received by the two chips are not synchronized.

[0004] Therefore, a skeleton that can enable the chips to be stacked longitudinally can be designed. That is, two longitudinally opposite receiving grooves are formed on the skeleton to enable the chips to be stacked longitudinally. Such a wheel speed sensor can effectively solve the problem of asynchronous signal reception by the chips. However, in this setting method, in order to enable the wiring terminals of the skeleton to simultaneously contact the chip pins on the upper and lower sides, it is necessary to increase the longitudinal volume of the wiring terminals, resulting in an increased occupied space of the wiring terminals, thereby further increasing the overall volume of the wheel speed sensor, which is not conducive to the miniaturization development of the wheel speed sensor, and increasing the manufacturing material of the wiring terminals, so the cost is relatively high. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the problems of large occupied space and high cost of the wiring terminals of a sensor adopting a longitudinally stacked dual-chip design. The utility model provides a sensor, and the wiring terminal structure of the sensor skeleton is simple, which is beneficial to the electrical connection with the chip pins, and the occupied space of the wiring terminal is small and the cost is low.

[0006] To solve the above technical problems, an embodiment of the utility model discloses a sensor, including:

[0007] A first chip module having first chip pins;

[0008] A second chip module having second chip pins, and the second chip pins are arranged at intervals from the first chip pins along a first direction;

[0009] The first electrical connection part includes a first part and a second part that are connected. The first part is bent towards the first chip pin and connected to the first chip pin;

[0010] The second electrical connection part includes a third part and a fourth part that are connected. The third part is bent towards the second chip pin and connected to the second chip pin; the fourth part and the second part are arranged side by side in a second direction, and a part of the fourth part and a part of the second part both extend in a third direction; the first direction, the second direction, and the third direction are perpendicular to each other.

[0011] With the above technical solution, the first chip module and the second chip module of the sensor in the embodiment of the present application are arranged at intervals in the first direction. On this basis, the first part of the first electrical connection part in the embodiment of the present application is bent towards the first chip pin to be connected to the first chip pin. Correspondingly, the third part of the second electrical connection part is bent towards the second chip pin to be connected to the second chip pin. This design scheme does not require increasing the volume of the electrical connection part in the first direction in order to enable the electrical connection part (i.e., the terminal) to contact the double chips stacked up and down at the same time. In other words, the first electrical connection part and the second electrical connection part in the embodiment of the present application have a simple structure. Only by bending the above-mentioned first part and third part respectively, they can contact the corresponding first chip pin and second chip pin. Therefore, the occupied space is effectively reduced, the space utilization rate is high, which is beneficial to the miniaturization development of the sensor (such as a redundant wheel speed sensor). At the same time, the material cost of the first electrical connection part and the second electrical connection part is low.

[0012] In addition, the second part connected to the first part and the fourth part connected to the third part are arranged side by side. That is, the upper surfaces of the second part and the fourth part are flush, and the lower surfaces of the second part and the fourth part are flush, ensuring that the electrical connection part of the sensor is in a straight line, thus facilitating connection with external devices (for example, a socket in an anti-lock braking system of an automobile).

[0013] According to another specific embodiment of the present invention, the first part includes a first inclined part and a first horizontal part. The first inclined part extends in a fourth direction. One end of the first inclined part is connected to the second part, and the other end of the first inclined part is connected to the first horizontal part. Along the first direction, the first horizontal part is connected to the first chip pin; the fourth direction intersects with the third direction.

[0014] According to another specific embodiment of the present utility model, the first horizontal portion includes a straight section and a first connecting section. The straight section extends along the third direction, one end of the straight section is connected to the first inclined portion, and along the second direction, the straight section is spaced apart from the second electrical connection portion. A first connecting section is connected to one side of the straight section along the second direction. Along the first direction, the first connecting section is connected to the bottom of the first chip pin, and the first connecting section is laser welded to the first chip pin.

[0015] With the above technical solution, the first part of the first electrical connection portion includes a connected first inclined portion and a first horizontal portion. The first inclined portion is inclined relative to the second part, so that the first part is bent as a whole towards the first chip pin, while the first horizontal portion can be first connected to the bottom of the first chip pin. Therefore, the occupied space of the first electrical connection portion is effectively reduced, and at the same time, the manufacturing cost of the first electrical connection portion is effectively reduced.

[0016] Meanwhile, on this basis, the first connecting section of the first horizontal portion and the first chip pin are secondarily connected, that is, the electrical connection between the first horizontal portion and the first chip pin is realized by using a laser welding process, effectively improving the welding efficiency between the first electrical connection portion and the first chip pin.

[0017] According to another specific embodiment of the present utility model, the third part includes a second inclined portion and a second horizontal portion. The second inclined portion extends along the fifth direction, one end of the second inclined portion is connected to the fourth part, and the other end of the second inclined portion is connected to the second horizontal portion. Along the first direction, the second horizontal portion is connected to the second chip pin; the fifth direction intersects with the third direction.

[0018] According to another specific embodiment of the present utility model, the second horizontal portion at least includes a second connecting section. The second connecting section is connected to the second inclined portion. The second connecting section extends along the second direction. Along the third direction, the second connecting section is spaced apart from the first connecting section of the first horizontal portion. Along the first direction, the second connecting section is connected to the top of the second chip pin, and the second connecting section is laser welded to the second chip pin.

[0019] With the above technical solution, the third part of the second electrical connection portion includes a connected second inclined portion and a second horizontal portion. The second inclined portion is inclined relative to the fourth part, so that the third part is bent as a whole towards the second chip pin, while the second horizontal portion can be first connected to the top of the second chip pin. The occupied space of the second electrical connection portion is effectively reduced, and at the same time, the manufacturing cost of the second electrical connection portion is effectively reduced.

[0020] Accordingly, on this basis, the second connection segment and the second chip pin of the second horizontal portion are secondarily connected, that is, the electrical connection between the second horizontal portion and the second chip pin is realized by using a laser welding process, effectively improving the welding efficiency between the second electrical connection portion and the second chip pin.

[0021] In addition, during the traditional welding process, upper and lower electrodes are required to weld the first chip pin and the second chip pin respectively on both sides in the first direction. The upper electrode will interfere with the first chip pin and the first electrical connection portion structurally. Correspondingly, there will also be structural interference between the lower electrode and the second chip pin and the second electrical connection portion, which is not conducive to welding. However, during the laser welding process of this solution, there will be no welding interference, further improving the welding efficiency.

[0022] According to another specific embodiment of the present invention, the first inclined portion and the first horizontal portion are arranged at a first angle, the second inclined portion and the second horizontal portion are arranged at a second angle, and the first angle is smaller than the second angle.

[0023] According to another specific embodiment of the present invention, the sensor further includes a skeleton body, the skeleton body includes a first surface and a second surface arranged opposite to each other along the first direction, the first chip module is arranged on the first surface, and the first chip pin is spaced from the first surface along the first direction, the second chip module is arranged on the second surface, and the second chip pin is spaced from the second surface along the first direction; the first electrical connection portion and the second electrical connection portion are respectively embedded in the skeleton body, and the first horizontal portion of the first portion protrudes relative to the first surface, and the second horizontal portion of the third portion protrudes relative to the second surface.

[0024] According to another specific embodiment of the present invention, the skeleton body is provided with a first through groove, the first through groove extends along a fourth direction, and the first surface of the skeleton body is provided with a first window; wherein, the first through groove accommodates the first inclined portion of the first portion, and the first horizontal portion of the first portion protrudes relative to the first window, so that the first horizontal portion fits against the first chip pin; the fourth direction intersects with the third direction.

[0025] According to another specific embodiment of the present utility model, the skeleton body is provided with a second through groove, the second through groove extends along a fifth direction, and along the second direction, the second through groove is spaced apart from the first through groove, and a second window is provided on the second surface of the skeleton body; wherein, the second inclined portion of the third part is received in the second through groove, and the second horizontal portion of the third part protrudes relative to the second window so that the second horizontal portion is attached to the second chip lead; the fifth direction intersects with the third direction.

[0026] According to another specific embodiment of the present utility model, the first chip leads include two spaced apart along the second direction, the first electrical connection portions correspond to the first chip leads one by one, the second chip leads include two spaced apart along the second direction, and the second electrical connection portions correspond to the second chip leads one by one; along the second direction, the projections of the two first electrical connection portions in the first direction are located between the projections of the two second electrical connection portions in the first direction, and the two first electrical connection portions and the two second electrical connection portions are spaced apart from each other. Description of the Drawings

[0027] Figure 1 Showing a three-dimensional view of the sensor according to the embodiment of the present utility model from a top-down perspective Figure 1 .

[0028] Figure 2 Showing a three-dimensional view of the sensor according to the embodiment of the present utility model from a bottom-up perspective Figure 1 .

[0029] Figure 3 Showing a three-dimensional view of the sensor according to the embodiment of the present utility model Figure 1 ; wherein, the skeleton body is not shown in the figure.

[0030] Figure 4 Showing a three-dimensional view of the first electrical connection portion and the second electrical connection portion in the sensor according to the embodiment of the present utility model.

[0031] Figure 5 Showing a top view of the first electrical connection portion and the second electrical connection portion in the sensor according to the embodiment of the present utility model.

[0032] Figure 6 Showing a partial enlarged view of the first electrical connection portion and the second electrical connection portion in the sensor according to the embodiment of the present utility model.

[0033] Figure 7 Showing a connection schematic diagram between the first electrical connection portion, the first chip lead, the second electrical connection portion, and the second chip lead in the sensor according to the embodiment of the present utility model.

[0034] Figure 8Shows the three-dimensional view of the sensor in the embodiment of the present utility model from the top-down perspective Figure 2 ; Among them, the first chip module and the second chip module are not shown in the figure.

[0035] Figure 9 Shows a partial enlarged view of the first electrical connection part in the sensor of the embodiment of the present utility model.

[0036] Figure 10 Shows the three-dimensional view of the sensor in the embodiment of the present utility model from the bottom-up perspective Figure 2 ; Among them, the first chip module and the second chip module are not shown in the figure.

[0037] Figure 11 Shows a partial enlarged view of the second electrical connection part in the sensor of the embodiment of the present utility model. Detailed implementation manners

[0038] The following specific embodiments illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. Although the description of the present utility model will be introduced in conjunction with the preferred embodiments, this does not mean that the features of this utility model are limited to this implementation manner. On the contrary, the purpose of introducing the utility model in conjunction with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of the present utility model. In order to provide a deep understanding of the present utility model, many specific details will be included in the following description. The present utility model can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of the present utility model, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other.

[0039] It should be noted that in this specification, similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0040] In the description of this embodiment, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "bottom", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this utility model is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0041] The terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0042] In the description of this embodiment, it should also be noted that unless otherwise clearly specified and defined, the terms "arranged", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this embodiment can be understood according to specific situations.

[0043] To make the objectives, technical solutions, and advantages of the present utility model clearer, the following will further describe in detail the implementation manners of the present utility model with reference to the accompanying drawings.

[0044] Refer to Figure 1 and Figure 2 An embodiment of the present application provides a sensor 10, including: an electrical connection part (i.e., the first electrical connection part 1 and the second electrical connection part 2) for connecting the sensor 10 to an external device, a first chip module 3, a second chip module 4, and a skeleton body 5.

[0045] It can be seen that the above-mentioned first chip module 3 and second chip module 4 are respectively installed in the skeleton body 5. Exemplarily, along the first direction (such as the Z direction shown in Figure 1 and Figure 2 ), the first chip module 3 is located at the top of the skeleton body 5 (i.e., the direction indicated by Z1 in Figure 1 and Figure 2 ), and the second chip module 4 is located at the bottom of the skeleton body 5 (i.e., the direction indicated by Z2 in Figure 1 and Figure 2 ). That is, the first chip module 3 and the second chip module 4 are stacked along the first direction.

[0046] At the same time, the above-mentioned electrical connection part is also connected to the skeleton body 5. The input end of the electrical connection part is connected to the first chip module 3 and the second chip module 4, and the output end of the electrical connection part is used to connect to an external device. Exemplarily, the external device includes a socket in an anti-lock braking system of an automobile, but the embodiment of the present application does not limit this.

[0047] Refer to Figure 1 , the first chip module 3 has two first chip pins 31. Refer to Figure 2 , the second chip module 4 has two second chip pins 41. Although Figure 1 and Figure 2Two first chip pins 31 and two second chip pins 41 are exemplarily shown respectively. However, the embodiments of the present application do not limit the number of the first chip pins 31 and the second chip pins 41. For example, the number of the first chip pins 31 can be set to one, three, four, etc. Correspondingly, the number of the second chip pins 41 can be set to one, three, four, etc. Refer to Figure 3 , it can be seen that the second chip pins 41 are arranged at intervals from the first chip pins 31 along the first direction (such as the Z direction shown in Figure 3 ).

[0048] Refer to Figure 4 and Figure 5 , it can be seen that the sensor includes two first electrical connection parts 1 and two second electrical connection parts 2. However, the embodiments of the present application do not limit the number of the first electrical connection parts 1 and the second electrical connection parts 2. For example, the number of the first electrical connection parts 1 can be set to one, three, four, etc. Correspondingly, the number of the second electrical connection parts 2 can be set to one, three, four, etc. As long as the first electrical connection parts 1 correspond to the above-mentioned first chip pins one by one and the second electrical connection parts 2 correspond to the above-mentioned second chip pins one by one, they all fall within the protection scope of the embodiments of the present application.

[0049] Exemplarily, along the second direction (such as the X direction shown in Figure 4 and Figure 5 ), the projections of the two first electrical connection parts 1 in the first direction (such as the Z direction shown in Figure 4 ) are located between the projections of the two second electrical connection parts 2 in the first direction. At the same time, the two first electrical connection parts 1 and the two second electrical connection parts 2 are arranged at intervals from each other.

[0050] Refer to Figures 4 to 7 , specifically, the first electrical connection part 1 includes a connected first part 11 and a second part 12. The first part 11 is bent towards the first chip pin 31 and is connected to the first chip pin 31.

[0051] The second electrical connection part 2 includes a connected third part 21 and a fourth part 22. The third part 21 is bent towards the second chip pin 41 and is connected to the second chip pin 41. At the same time, the fourth part 22 of the second electrical connection part 2 and the second part 12 of the first electrical connection part 1 are arranged side by side along the second direction (such as the X direction shown in Figure 4 and Figure 5 ), and a part of the fourth part 22 (for example, the second extension part 221 in Figure 2 described later) and a part of the second part 12 (for example, the first extension part 121 in Figure 1 described later) both extend along the third direction (such as the directions shown in Figure 4 and Figure 5extends in the Y direction shown. The above-mentioned first direction (such as Figure 4 extends in the Z direction shown, the second direction (such as Figure 4 extends in the X direction shown, the third direction (such as Figure 4 extends in the Y direction shown) are perpendicular to each other.

[0052] With the above technical solution, the first chip module 3 and the second chip module 4 of the sensor are arranged at intervals along the first direction. On this basis, the first part 11 of the first electrical connection part 1 of the embodiment of the present application bends towards the first chip pin 31 to be connected to the first chip pin 31. Correspondingly, the third part 21 of the second electrical connection part 2 bends towards the second chip pin 41 to be connected to the second chip pin 41. With this design, there is no need to increase the volume of the electrical connection part in the first direction in order to enable the electrical connection part (i.e., the terminal) to contact the double chips stacked up and down at the same time. In other words, the structures of the first electrical connection part 1 and the second electrical connection part 2 of the embodiment of the present application are simple. By only bending the above-mentioned first part 11 and third part 21 respectively, they can contact the corresponding first chip pin 31 and second chip pin 41. Therefore, the occupied space is effectively reduced, and the space utilization rate is high, which is beneficial to the miniaturization development of the sensor (such as a redundant wheel speed sensor). At the same time, the material costs of the first electrical connection part 1 and the second electrical connection part 2 are low.

[0053] In addition, the second part 12 connected to the first part 11 and the fourth part 22 connected to the third part 21 are arranged side by side. That is, the second part 12 and the fourth part 22 are in the same horizontal plane, ensuring that the electrical connection part of the sensor is in a straight line, so as to facilitate connection with external devices (for example, the socket in the anti-lock braking system of an automobile).

[0054] Referring to Figure 6 and Figure 7 , in a possible implementation manner, the above-mentioned first part 11 of the first electrical connection part includes: a first inclined part 111 and a first horizontal part 112. The first inclined part 111 extends along the fourth direction (such as Figure 6 and Figure 7 extends in the A direction shown), one end of the first inclined part 111 (i.e., Figure 6 the end pointed by the b direction in) is connected to the second part 12, the other end of the first inclined part 111 (i.e., Figure 6 the end pointed by the a direction in) is connected to the first horizontal part 112. Along the first direction (such as Figure 7 extends in the Z direction shown), the first horizontal part 112 is connected to the first chip pin 31; the above-mentioned fourth direction (such as Figure 7 extends in the A direction shown) intersects with the third direction (such as Figure 7 extends in the Y direction shown).

[0055] In a possible implementation, the first inclined portion 111 and the first horizontal portion 112 are arranged at a first angle β. Exemplarily, the value of the first angle β can be 90°, 110°, 145°, etc. The embodiments of the present application do not limit the first angle β. As long as the value can achieve the connection between the first part 11 and the first chip pin 31, it falls within the protection scope of the embodiments of the present application.

[0056] Continue to refer to Figure 6 and Figure 7 , in a possible implementation, the first horizontal portion 112 includes a straight section 1121 and a first connection section 1122. As Figure 6 and Figure 7 shown, the straight section 1121 extends along the third direction (such as the Y direction shown in Figure 6 and Figure 7 ). One end of the straight section 1121 (i.e., the end pointed by the c direction in Figure 6 ) is connected to the first inclined portion 111. Along the second direction (such as the X direction shown in Figure 6 and Figure 7 ), the straight section 1121 is spaced apart from two second electrical connection portions (i.e., the second electrical connection portion on the side pointed by the X1 direction and the second electrical connection portion on the side pointed by the X2 direction).

[0057] In addition, a first connection section 1122 is connected to one side of the straight section 1121 along the second direction. Figure 6 clearly shows the specific structure of the two first connection sections 1122. It can be seen that Figure 6 the first connection section 1122 of the first horizontal portion 112 pointed by the X2 direction in Figure 7 extends towards the X2 direction, while the first connection section 1122 of the first horizontal portion 112 pointed by the X1 direction extends towards the X1 direction. Further, the two first connection sections 1122 are respectively connected to the bottom of the corresponding first chip pin 31 (i.e., pointed by the Z2 direction in Figure 7 ) in

[0058] Refer to Figure 6 and Figure 7 and in combination with Figure 4, adopting the above technical solution, the first part 11 of the first electrical connection part 1 includes a connected first inclined part 111 and a first horizontal part 112. The first inclined part 111 is inclined relative to the second part 12, so that the whole of the first part 11 is bent toward the first chip pin 31, and the first horizontal part 112 can be connected to the bottom of the first chip pin 31 for the first time. Therefore, the occupied space of the first electrical connection part 1 is effectively reduced, and at the same time, the manufacturing cost of the first electrical connection part 1 is effectively reduced.

[0059] Meanwhile, on this basis, the first connection section of the first horizontal part 112 and the first chip pin 31 are connected for the second time, that is, the electrical connection between the first horizontal part 112 and the first chip pin 31 is realized by adopting a laser welding process, effectively improving the welding efficiency between the first electrical connection part 1 and the first chip pin 31.

[0060] Refer to Figure 6 and Figure 7 , in a possible implementation manner, the above-mentioned third part 21 of the second electrical connection part includes: a second inclined part 211 and a second horizontal part 212. The second inclined part 211 extends along the fifth direction (such as Figure 6 and Figure 7 the B direction shown in Figure 6 ), one end of the second inclined part 211 (that is, Figure 6 the end pointed by the e direction in Figure 7 ) is connected to the fourth part 22, and the other end of the second inclined part 211 (that is, Figure 7 the end pointed by the f direction in Figure 7 ) is connected to the second horizontal part 212. Along the first direction (such as

[0061] the Z direction shown in

[0062] ), the second horizontal part 212 is connected to the second chip pin 41; the fifth direction (such as Figure 6 and Figure 7 the B direction shown in Figure 6 and Figure 7As shown, the second connection segment 2121 is connected to the second inclined portion 211, and the second connection segment 2121 extends along the second direction (such as the X direction shown in Figure 6 and Figure 7 ).

[0063] Along the third direction (such as the Y direction shown in Figure 6 and Figure 7 ), the second connection segment 2121 is spaced apart from the first connection segment 1122 of the first horizontal portion 112. Along the first direction (such as the Z direction shown in Figure 7 ), the second connection segment 2121 is connected to the top of the second chip pin 41 (i.e., the direction indicated by Z1 in Figure 7 ), and an electrical connection is made between the second connection segment 2121 and the second chip pin 41 using a laser welding process. That is to say, the second connection segment 2121 is used to connect to the corresponding second chip pin 41. Exemplarily, the second connection segment 2121 can be regarded as the solder joint for its subsequent further welding with the second chip pin 41.

[0064] Referring to Figure 6 and Figure 7 and combining with Figure 4 , adopting the above technical solution, the third part 21 of the second electrical connection portion 2 includes a connected second inclined portion 211 and a second horizontal portion 212. The second inclined portion 211 is inclined relative to the fourth part 22 so that the third part 21 is bent as a whole towards the second chip pin 41, while the second horizontal portion 212 can be first connected to the top of the second chip pin 41. The occupied space of the second electrical connection portion 2 is effectively reduced, and at the same time, the manufacturing cost of the second electrical connection portion 2 is effectively reduced.

[0065] Correspondingly, on this basis, the second connection segment 2121 of the second horizontal portion 212 and the second chip pin 41 are secondarily connected, that is, the electrical connection between the second horizontal portion 212 and the second chip pin 41 is realized by using a laser welding process, effectively improving the welding efficiency between the second electrical connection portion 2 and the second chip pin 41.

[0066] In addition, during the traditional welding process, it is necessary to use upper and lower electrodes to weld the first chip pin 31 and the second chip pin 41 respectively on both sides in the first direction. The upper electrode will interfere with the first chip pin 31 and the first electrical connection portion 1 in terms of structure. Correspondingly, there will also be structural interference between the lower electrode and the second chip pin 41 and the second electrical connection portion 2, which is not conducive to welding. However, during the laser welding process of this solution, there will be no welding interference, further improving the welding efficiency.

[0067] Referring to Figures 8 to 11, in a possible implementation, according to the foregoing, it can be known that the first electrical connection part 1 and the second electrical connection part 2 are embedded in the skeleton body 5. Exemplarily, the connection of the three can be realized by an embedding process, but the embodiments of the present application do not limit this.

[0068] The skeleton body 5 includes a first surface 51 (as shown in Figure 8 and Figure 9 ) and a second surface 52 (as shown in Figure 10 and Figure 11 ) which are arranged opposite to each other along the first direction.

[0069] Referring to Figure 9 and combining with Figure 1 , it can be seen that the first chip module 3 is assembled on the first surface 51 of the skeleton body 5. Exemplarily, a first receiving cavity 511 is formed on the first surface 51 of the skeleton body 5, and the first chip module 3 is installed in the first receiving cavity 511. The first chip pins 31 of the first chip module 3 extend along the third direction (the Y direction shown in Figure 9 ), and each first chip pin 31 is spaced apart from the first surface 51 along the first direction (the Z direction shown in Figure 9 ). Further, the first horizontal part 112 of the first part 11 in the first electrical connection part 1 protrudes relative to the first surface 51.

[0070] Referring to Figure 11 and combining with Figure 2 , it can be seen that the second chip module 4 is assembled on the second surface 52 of the skeleton body 5. Exemplarily, a second receiving cavity 521 is formed on the second surface 52 of the skeleton body 5, and the second receiving cavity 521 and the above-mentioned second receiving cavity 511 are arranged opposite to each other along the first direction. The second chip module 4 is installed in the second receiving cavity 521. The second chip pins 41 of the second chip module 4 extend along the third direction (the Y direction shown in Figure 11 ), and the second chip pins 41 are spaced apart from the second surface 52 along the first direction (the Z direction shown in Figure 11 ). Correspondingly, the second horizontal part 212 of the third part 21 protrudes relative to the second surface 52.

[0071] Referring to Figure 9 and combining with Figure 6 , in a possible implementation, the skeleton body 5 is provided with a first through groove 53, and the first through groove 53 extends along the fourth direction (the A direction shown in Figure 6 ). Although the specific structure of the first through groove 53 is not clearly shown in Figure 9 , it should be noted that the first through groove 53 corresponds to the first inclined part 111 of the first electrical connection part 1 one by one. That is to say, the above-mentioned first inclined part 111 is received in the first through groove 53.

[0072] Also, see Figure 9 Combined with Figure 7 The first surface 51 of the skeleton body 5 is provided with a first window 510. When the first inclined portion 111 is accommodated in the first through slot 53, the first horizontal portion 112 connected to the first inclined portion 111 is exposed to the first window 510. Specifically, the first window 510 is connected to each first through slot 53, and the first horizontal portion 112 of the first electrical connection portion 1 is protruded relative to the first window 510. At this time, the first horizontal portion 112 is in contact with the first chip lead 31.

[0073] See also Figure 11 Combined with Figure 6 In a possible implementation manner, the skeleton body 5 is provided with a second through slot 54, along the second direction (such as Figure 11 The second through slot 54 is spaced apart from the first through slot 53. The second through slot 54 is spaced apart from the first through slot 53 along the fifth direction (as shown in FIG. Figure 6 B direction shown in FIG) extends, although Figure 11 The specific structure of the first through slot 53 is not clearly shown in the figure, but it should be noted that the second through slot 54 corresponds to the second inclined portion 211 of the second electrical connection portion 2. In other words, the second inclined portion 211 is accommodated in the second through slot 54.

[0074] Also, see Figure 11 Combined with Figure 7 The second surface 52 of the skeleton body 5 is provided with a second window 520. When the second inclined portion 211 is accommodated in the second through slot 54, the second horizontal portion 212 connected to the second inclined portion 211 is exposed to the second window 520. Specifically, the second window 520 is connected to each second through slot 54, and the second horizontal portion 212 of the second electrical connection portion 2 is protruded relative to the second window 520. At this time, the second horizontal portion 212 is in contact with the first chip lead 31.

[0075] Although the present invention has been illustrated and described with reference to certain preferred embodiments of the present invention, it should be understood by those skilled in the art that the above contents are further detailed descriptions of the present invention in combination with specific embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art may make various changes in form and details, including making several simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A sensor, characterized in that: include: A first chip module having a first chip pin; A second chip module has second chip pins, and the second chip pins are spaced apart from the first chip pins along a first direction; A first electrical connection portion, comprising a first portion and a second portion connected to each other, wherein the first portion is bent toward the first chip pin and connected to the first chip pin; The second electrical connection portion includes a third part and a fourth part that are connected to each other, the third part is bent toward the second chip pin and connected to the second chip pin; the fourth part and the second part are arranged side by side along the second direction, and a part of the fourth part and a part of the second part both extend along the third direction; the first direction, the second direction, and the third direction are perpendicular to each other.

2. The sensor according to claim 1, characterized in that The first part includes a first inclined portion and a first horizontal portion, the first inclined portion extends along a fourth direction, one end of the first inclined portion is connected to the second part, the other end of the first inclined portion is connected to the first horizontal portion, and along the first direction, the first horizontal portion is connected to the first chip pin; the fourth direction intersects with the third direction.

3. The sensor according to claim 2, characterized in that The first horizontal portion includes a straight section and a first connecting section, the straight section extends along the third direction, one end of the straight section is connected to the first inclined portion, and along the second direction, the straight section is spaced apart from the second electrical connecting portion; one side of the straight section along the second direction is connected to the first connecting section, and along the first direction, the first connecting section is connected to the bottom of the first chip pin, and the first connecting section is laser welded to the first chip pin.

4. The sensor according to claim 2, characterized in that The third part includes a second inclined portion and a second horizontal portion, the second inclined portion extends along a fifth direction, one end of the second inclined portion is connected to the fourth part, the other end of the second inclined portion is connected to the second horizontal portion, and along the first direction, the second horizontal portion is connected to the second chip pin; the fifth direction intersects with the third direction.

5. The sensor according to claim 4, characterized in that The second horizontal portion includes at least a second connecting section, which is connected to the second inclined portion. The second connecting section extends along the second direction. Along the third direction, the second connecting section is spaced apart from the first connecting section of the first horizontal portion. Along the first direction, the second connecting section is connected to the top of the second chip pin, and the second connecting section is laser welded to the second chip pin.

6. The sensor according to claim 4, characterized in that The first inclined portion and the first horizontal portion are arranged at a first angle, the second inclined portion and the second horizontal portion are arranged at a second angle, and the first angle is smaller than the second angle.

7. The sensor according to claim 1, characterized in that The sensor also includes a skeleton body, the skeleton body includes a first surface and a second surface arranged opposite to each other along the first direction, the first chip module is arranged on the first surface, and the first chip pin is spaced apart from the first surface along the first direction, the second chip module is arranged on the second surface, and the second chip pin is spaced apart from the second surface along the first direction; the first electrical connection part and the second electrical connection part are respectively embedded in the skeleton body, and the first horizontal part of the first part is protruding relative to the first surface, and the second horizontal part of the third part is protruding relative to the second surface.

8. The sensor according to claim 7, characterized in that The skeleton body is provided with a first through groove, and the first through groove extends along a fourth direction, and the first surface of the skeleton body is provided with a first window; wherein the first through groove accommodates the first inclined portion of the first part, and the first horizontal portion of the first part is protruded relative to the first window so that the first horizontal portion fits against the first chip pin; the fourth direction intersects with the third direction.

9. The sensor according to claim 8, characterized in that The skeleton body is provided with a second through slot, and the second through slot extends along a fifth direction. Along the second direction, the second through slot is spaced apart from the first through slot, and the second surface of the skeleton body is provided with a second window; wherein the second through slot accommodates the second inclined portion of the third part, and the second horizontal portion of the third part protrudes relative to the second window so that the second horizontal portion fits against the second chip pin; the fifth direction intersects with the third direction.

10. The sensor according to claim 1, characterized in that The first chip pins include two arranged at intervals along the second direction, and the first electrical connection parts correspond to the first chip pins one by one. The second chip pins include two arranged at intervals along the second direction, and the second electrical connection parts correspond to the second chip pins one by one. Along the second direction, the projections of the two first electrical connection parts along the first direction are located between the projections of the two second electrical connection parts along the first direction, and the two first electrical connection parts and the two second electrical connection parts are arranged at intervals from each other.

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