Positioning suction cup of photoetching machine

Abstract

The utility model provides a photoetching machine positioning sucker which comprises a plurality of mounting rings which are mutually sleeved on the top end of a sucker body from inside to outside, and an air extractor which is arranged on the sucker body and is connected with the mounting rings, and a plurality of adsorption holes are formed in the end surface of one end, far away from the sucker body, of each mounting ring in a circumferential array manner. A plurality of mounting grooves matched with the mounting rings are formed in the end face of the top end of the suction cup body, and clamping holes communicated with the interior of the suction cup body are formed in the bottom walls of the mounting grooves; the air extractor comprises clamping pipes arranged on the end face of the bottom end of the mounting ring and matched with the clamping holes, a sealing assembly arranged in the suction cup body and used for sealing the multiple clamping holes, and a control assembly arranged in the suction cup body and used for controlling the multiple clamping holes to be communicated with the interior of the suction cup body from the axis direction to the side face direction of the suction cup body one by one. The air exhaust assembly is connected with an inner cavity of the suction cup body; according to the utility model, silicon wafers with different sizes can be conveniently positioned and adsorbed, and the positioning and adsorbing effect on the silicon wafers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lithography machines, in particular to a positioning chuck for a lithography machine. Background Technique

[0002] The chuck applied to a lithography machine is a hollow structure made of ceramics. The chuck is connected to a vacuum device through a connecting pipe, and then contacts with a large-sized silicon wafer. By starting vacuum pumping, negative pressure is generated inside the chuck, so as to firmly suck the silicon wafer.

[0003] The vacuum chuck is an essential component of a lithography machine, but the existing vacuum chuck is of a specification that only corresponds to adsorbing one kind of silicon wafer. In this case, if different-sized silicon wafers need to be adsorbed, multiple corresponding chucks have to be designed, which not only wastes manpower and financial resources, but also is not convenient for positioning and adsorbing silicon wafers of different sizes. Content of the Utility Model

[0004] Aiming at the above technical problems, the utility model provides a positioning chuck for a lithography machine, which can conveniently position and adsorb silicon wafers of different sizes, and improves the positioning and adsorption effect on the silicon wafers.

[0005] To achieve the above object, the utility model provides the following technical solution: A positioning chuck for a lithography machine, comprising a chuck body, a plurality of mounting rings sleeved on the top end face of the chuck body from inside to outside in sequence, and an air extraction device arranged on the chuck body and connected to the mounting rings. A plurality of adsorption holes are arranged in a circumferential array on the end face of the mounting ring far from the chuck body. A plurality of mounting grooves respectively matching with the plurality of mounting rings are arranged on the top end face of the chuck body, and a clamping hole communicating with the inside of the chuck body is arranged on the bottom wall of the mounting groove;

[0006] The air extraction device comprises a clamping tube arranged on the bottom end face of the mounting ring and matching with the clamping hole, a sealing component arranged inside the chuck body for sealing the plurality of clamping holes, a control component arranged inside the chuck body for controlling the plurality of clamping holes to communicate with the inside of the chuck body one by one from the axial direction to the side direction of the chuck body, and an air extraction component connected to the internal cavity of the chuck body.

[0007] Preferably, the sealing component comprises a plurality of telescopic rods arranged in the cavity and respectively located below the clamping holes and vertically arranged on the bottom wall of the cavity at the bottom ends, a sealing disc fixedly arranged on the top end face of the telescopic rod and fitting with the opening position of the clamping hole at the top end face, and an elastic member arranged on the telescopic rod for controlling the sealing disc to closely fit on the opening of the clamping hole.

[0008] Preferably, the elastic member comprises a limiting spring movably sleeved on the rod body of the telescopic rod and fixedly connected to the bottom wall of the cavity and the end face of the sealing disc at both ends. When the sealing disc fits the opening position of the clamping hole, the limiting spring is in a compressed state.

[0009] Preferably, the elastic member includes two magnet rings movably sleeved on the rod body of the telescopic rod and fixedly arranged on the bottom wall of the cavity and the end face of the sealing disc respectively, and the adjacent ends of the two magnet rings have the same magnetic poles.

[0010] Preferably, the control assembly includes a plurality of lifting rods respectively and fixedly arranged in the cavity and located on one side of the axis of the suction cup body at the bottom side of the plurality of sealing discs, a plurality of control rods arranged in parallel with each other and along the direction perpendicular to the rod body of the lifting rod on the same side of the lifting rod, and a control member arranged in the cavity and controlling the plurality of control rods to move towards the lifting rod. The distance between the ends of the plurality of control rods and the lifting rod gradually increases from the axis of the suction cup body towards the side direction, and the ends of the plurality of control rods close to the lifting rod are beveled; the control member controls the plurality of control rods to move towards the lifting rod, driving the plurality of lifting rods to gradually move downward in the vertical direction.

[0011] Preferably, the control member includes a linkage rod vertically and fixedly arranged at the end of the plurality of control rods far from the lifting rod, a threaded block fixedly arranged on the rod body of the linkage rod, a control lead screw threadedly connected through the threaded block and having a length direction parallel to the length direction of the control rod, and a control motor arranged in the cavity and driving the control lead screw to rotate.

[0012] The beneficial effects of the present utility model: Different sizes of silicon wafers are directly placed on the top of the suction cup body. At this time, the silicon wafers are located on the end faces of the plurality of mounting rings. The air in the cavity of the suction cup body is pumped out by the pumping assembly arranged. And the mounting ring is connected to the card hole through the card tube, that is, the air in the mounting ring is conveniently pumped out by the pumping assembly. At this time, it is convenient to suck the external air into the mounting ring through the adsorption holes of the mounting ring, so as to position and adsorb the silicon wafers placed on the end faces of the plurality of mounting rings. And the control assembly drives the sealing assembly to move, thereby controlling the plurality of card holes to gradually move from the axis direction of the suction cup body towards the side direction, which is convenient for adsorbing and fixing different sizes of silicon wafers, avoiding the situation that the silicon wafers cover the external card holes and pump air into the mounting ring, resulting in insufficient suction force of the adsorption holes below the silicon wafers and being inconvenient for adsorbing and fixing the silicon wafers. It can conveniently position and adsorb different sizes of silicon wafers, improving the positioning and adsorption effect of the silicon wafers. Description of the Drawings

[0013] The drawings are used to provide a further understanding of the present utility model, and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model, and do not constitute a limitation to the present utility model. In the drawings:

[0014] Figure 1 It is a schematic diagram of a simple structure of a positioning suction cup of a lithography machine proposed by the present utility model.

[0015] Figure 2Schematic diagram of the unfolding structure of the positioning chuck of the lithography machine proposed by the present utility model.

[0016] Figure 3 Schematic cross-sectional structure diagram of the chuck body of the present utility model.

[0017] Figure 4 Schematic structure diagram of the control component of the present utility model.

[0018] In the figure: 1, chuck body; 2, mounting groove; 3, mounting ring; 4, adsorption hole; 5, clamping hole; 6, clamping tube; 7, sealing disc; 8, telescopic rod; 9, limiting spring; 10, connecting tube; 11, control screw rod; 12, control motor; 13, threaded block; 14, linkage rod; 15, control rod; 16, lifting rod. Specific embodiments

[0019] In order to make the technical means, creative features, achieved purposes and effects realized by the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments and drawings. However, the following embodiments are only the preferred embodiments of the present utility model and not all of them. Based on the embodiments in the embodiments, other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the present utility model.

[0020] Please refer to Figures 1-4 , a positioning chuck of a lithography machine, including a chuck body 1, a plurality of mounting rings 3 sleeved on the top end surface of the chuck body 1 from the inside out, and an air extraction device arranged on the chuck body 1 and connected to the mounting ring 3. A plurality of adsorption holes 4 are arranged in a circumferential array on the end surface of the mounting ring 3 away from the chuck body 1. A plurality of mounting grooves 2 respectively matching the plurality of mounting rings 3 are arranged on the top end surface of the chuck body 1, and clamping holes 5 communicating with the inside of the chuck body 1 are arranged on the bottom wall of the mounting groove 2;

[0021] The air extraction device includes a clamping tube 6 arranged on the bottom end surface of the mounting ring 3 and matching the clamping hole 5, a sealing component arranged in the chuck body 1 for sealing a plurality of clamping holes 5, a control component arranged in the chuck body 1 for controlling a plurality of clamping holes 5 to communicate with the inside of the chuck body 1 one by one from the axial direction to the side direction of the chuck body 1, and an air extraction component connected to the inner cavity of the chuck body 1.

[0022] As Figures 1-4As shown, directly place the silicon wafer on the top end faces of multiple mounting rings 3. The mounting rings 3 pass through the clamping holes 5 via the clamping pipes 6 and communicate with the inside of the cavity. The suction cup body 1 is connected to the air extraction assembly. Then, the air extraction assembly can suck the external air outside the adsorption holes 4 opened on the end face of the mounting ring 3 into the mounting ring 3, so that the silicon wafer can be positioned and adsorbed on the mounting ring 3. The control assembly drives the sealing assembly arranged at the opening position of the clamping hole 5 to move, so that when positioning and adsorbing silicon wafers of different sizes, it is convenient to control the adsorption holes 4 covered by the silicon wafer to suck air into the mounting ring 3, avoiding the situation that the adsorption holes 4 outside the silicon wafer suck air into the mounting ring 3, resulting in a decrease in the suction force of the adsorption holes 4 covered under the silicon wafer. When controlling the adsorption holes 4 under the silicon wafer to suck air for the silicon wafer, control the sealing assembly of the clamping hole 5 under the silicon wafer to move downward, so as to facilitate the opening of the clamping hole 5 under the silicon wafer, and thus facilitate the tight adsorption of the end face of the silicon wafer through the adsorption holes 4 under the silicon wafer. Different sizes of silicon wafers can be positioned and adsorbed conveniently, improving the positioning and adsorption effect of the silicon wafer.

[0023] The sealing assembly includes a plurality of expansion rods 8 arranged in the cavity and corresponding to the positions below the clamping holes 5 one by one, with the bottom ends vertically arranged on the bottom wall of the cavity, a sealing disk 7 fixedly arranged on the top end face of the expansion rod 8 and fitting the opening position of the clamping hole 5 with the top end face, and an elastic member arranged on the expansion rod 8 to control the sealing disk 7 to closely fit on the opening of the clamping hole 5.

[0024] As Figure 3 shown, the elastic member arranged on the rod body of the expansion rod 8 in the cavity facilitates ensuring that the sealing disk 7 closely fits on the opening position of the clamping hole 5, so as to facilitate ensuring the sealing of the opening of the clamping hole 5 by the sealing disk 7. When positioning and adsorbing silicon wafers of different sizes, the control assembly drives the elastic member at the opening position of the clamping hole 5 under the silicon wafer to be compressed, driving the sealing disk 7 to move downward, so as to facilitate the communication between the clamping hole 5 under the silicon wafer and the inside of the cavity. The air extraction assembly is connected to the connecting pipe 10 arranged on the bottom end face of the suction cup body 1, so as to facilitate the extraction of the air in the clamping hole 5 under the silicon wafer, and thus facilitate the tight adsorption and positioning of the silicon wafer on the end face of the mounting ring 3. Different sizes of silicon wafers can be positioned and adsorbed conveniently, improving the positioning and adsorption effect of the silicon wafer.

[0025] The elastic member includes a limit spring 9 movably sleeved on the rod body of the expansion rod 8, with both ends fixedly connected to the bottom wall of the cavity and the end face of the sealing disk 7 respectively. When the sealing disk 7 fits the opening position of the clamping hole 5, the limit spring 9 is in a compressed state.

[0026] As Figure 3 shown, the compressed limit spring 9 facilitates pushing the sealing disk 7 to closely fit on the opening position of the clamping hole 5, thus ensuring the sealing performance of the sealing disk 7 arranged at the opening position of the clamping hole 5.

[0027] The elastic member includes two magnet rings that are movably sleeved on the rod body of the telescopic rod 8 and are respectively fixedly arranged on the bottom wall of the cavity and the end face of the sealing disc 7. The adjacent ends of the two magnet rings have the same magnetic poles.

[0028] Wherein, by setting the adjacent ends of the two magnet rings on the rod body of the telescopic rod 8 to have the same magnetic poles, it is convenient to make the sealing disc 7 closely fit on the opening position of the card hole 5.

[0029] The control assembly includes a plurality of lifting rods 16 that are respectively and fixedly arranged in the cavity and located on one side of the axis of the suction cup body 1 and on one side of the bottom ends of a plurality of sealing discs 7, a plurality of control rods 15 that are parallel to each other and arranged on the same side of the lifting rods 16 in a direction perpendicular to the rod bodies of the lifting rods 16, and a control member that is arranged in the cavity and controls the plurality of control rods 15 to move towards the lifting rods 16. The distance between the ends of the plurality of control rods 15 and the lifting rods 16 gradually increases from the axis of the suction cup body 1 towards the side direction, and one end of the plurality of control rods 15 close to the lifting rods 16 is beveled; the control member controls the plurality of control rods 15 to move towards the lifting rods 16, driving the plurality of lifting rods 16 to gradually move downward in the vertical direction.

[0030] The control member includes a linkage rod 14 vertically and fixedly arranged at one end of the plurality of control rods 15 away from the lifting rods 16, a threaded block 13 fixedly arranged on the rod body of the linkage rod 14, a control lead screw 11 that is threadedly connected through the threaded block 13 and has a length direction parallel to the length direction of the control rods 15, and a control motor 12 that is arranged in the cavity and drives the control lead screw 11 to rotate.

[0031] Such as Figures 1-4As shown in the figure, when adsorbing and positioning silicon wafers of different sizes, by controlling the motor 12 to drive the control lead screw 11 to rotate, the threaded block 13 sleeved on the rod body of the control lead screw 11 through a threaded connection can be driven to move. At this time, the linkage rod 14 arranged on the threaded block 13 drives the control rod 15 arranged on the rod body of the linkage rod 14 to move towards the positions of multiple lifting rods 16, and the distance between the end of the control rod 15 and the lifting rod 16 gradually increases from the axial direction of the suction cup body 1 to the side direction. When the threaded block 13 drives multiple control rods 15 to move towards the positions of the lifting rods 16, and the inclined surface at the end of the control rod 15 abuts against the lifting rod 16, it will drive the lifting rod 16 to move downward, so as to facilitate controlling the sealing disc 7 located at the opening positions of multiple card holes 5 in the cavity to move downward, so as to facilitate the communication between the card holes 5 and the inside of the cavity. That is, the multiple card holes 5 can be controlled to gradually move downward the multiple sealing discs 7 arranged at the opening positions from the axial direction of the suction cup body 1 to the side direction, so as to facilitate controlling the multiple card holes 5 to gradually communicate with the inside of the cavity. Thus, when positioning and adsorbing silicon wafers of different sizes on the suction cup body 1, by controlling the card holes 5 connected to the mounting ring 3 installed under the coverage of the silicon wafer to communicate with the inside of the cavity, it is convenient to control the suction holes 4 opened on the end faces of the multiple mounting rings 3 to position and adsorb and fix the silicon wafer, and silicon wafers of different sizes can be positioned and adsorbed conveniently, improving the positioning and adsorption effect of the silicon wafer.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and do not limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A photolithography machine positioning suction cup, comprising a suction cup body (1), a plurality of mounting rings (3) mutually sleeved on the top end surface of the suction cup body (1) from the inside to the outside, and an exhaust device arranged on the suction cup body (1) and connected to the mounting rings (3), wherein a plurality of adsorption holes (4) are arranged in a circumferential array on the end surface of the mounting ring (3) away from the suction cup body (1), characterized in that: The top end surface of the suction cup body (1) is provided with a plurality of mounting grooves (2) respectively matching with a plurality of mounting rings (3), and the bottom wall of the mounting groove (2) is provided with a clamping hole (5) penetrating the interior of the suction cup body (1); The air extraction device comprises a clamping tube (6) arranged on the bottom end surface of the mounting ring (3) and matching the clamping hole (5), a sealing component arranged in the suction cup body (1) and sealing the plurality of clamping holes (5), a control component arranged in the suction cup body (1) and controlling the plurality of clamping holes (5) to pass through the interior of the suction cup body (1) one by one from the axial direction to the side direction of the suction cup body (1), and an air extraction component connected to the internal cavity of the suction cup body (1).

2. A photolithography machine positioning chuck according to claim 1, characterized in that: The sealing assembly comprises a plurality of telescopic rods (8) arranged in the cavity and correspondingly located below the clamping holes (5) and having their bottom ends arranged vertically on the bottom wall of the cavity, a sealing disk (7) fixedly arranged on the top end surface of the telescopic rod (8) and in contact with the top end surface and the opening position of the clamping hole (5), and an elastic member arranged on the telescopic rod (8) and controlling the sealing disk (7) to be closely attached to the opening of the clamping hole (5).

3. A photolithography machine positioning chuck according to claim 2, characterized in that: The elastic member comprises a limit spring (9) movably sleeved on the body of the telescopic rod (8) and having two ends respectively fixedly connected to the bottom wall of the cavity and the end surface of the sealing disk (7); when the sealing disk (7) is in contact with the opening position of the clamping hole (5), the limit spring (9) is in a compressed state.

4. A photolithography machine positioning chuck according to claim 2, characterized in that: The elastic member comprises two magnetic rings which are movably sleeved on the body of the telescopic rod (8) and are respectively fixedly arranged on the bottom wall of the cavity and the end surface of the sealing disk (7); the magnetic poles of the adjacent ends of the two magnetic rings are the same.

5. A photolithography machine positioning chuck according to claim 3 or 4, characterized in that: The control assembly comprises a plurality of lifting rods (16) which are fixedly arranged in a one-to-one correspondence in the cavity and are located at a position on one side of the bottom end of a plurality of sealing plates (7) on one side of the axis of the suction cup body (1), a plurality of control rods (15) which are parallel to each other and are arranged at a position on the same side of the lifting rod (16) along a direction perpendicular to the rod body of the lifting rod (16), and a control member which is arranged in the cavity and controls the plurality of control rods (15) to move in the direction of the lifting rod (16), wherein the distance between the ends of the plurality of control rods (15) and the lifting rod (16) gradually increases from the axis of the suction cup body (1) to the side direction, and the ends of the plurality of control rods (15) adjacent to the lifting rod (16) are inclined; the control member controls the plurality of control rods (15) to move in the direction of the lifting rod (16) and drives the plurality of lifting rods (16) to gradually move downward in the vertical direction.

6. A photolithography machine positioning chuck according to claim 5, characterized in that: The control component comprises a linkage rod (14) vertically fixedly arranged on an end of a plurality of control rods (15) away from a lifting rod (16), a threaded block (13) fixedly arranged on the rod body of the linkage rod (14), a control screw rod (11) which penetrates the threaded block (13) through a threaded connection and has a length direction parallel to the length direction of the control rod (15), and a control motor (12) arranged in the cavity and driving the control screw rod (11) to rotate.

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