Chip module and electronic equipment
By introducing system chips and hub chips into the chip modules, the USB interface is expanded to multiple types, which solves the problem of insufficient resources of chip USB interfaces and realizes cost-effective interface expansion.
Patent Information
- Application Number
- CN202422028063.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-08-20
AI Technical Summary
The USB interface resources on the chip are too small, making it difficult to meet the needs of diversified applications, and the existing expansion methods are costly and over-performance.
By introducing system chips, first hub chips and second hub chips into the chip module, the extended USB unit is a variety of interfaces, including USB3.1, USB2.0 and full-function USB3.1 interfaces, to meet the transmission rate requirements of different peripherals.
It achieves the cost-effectiveness while meeting different peripheral needs.
Smart Images
Figure CN223006440U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of electronic technologies, and in particular, to a chip module and an electronic device. Background Art
[0002] The USB (Universal Serial Bus) interface is a serial bus standard and also a technical specification for input / output interfaces, which is widely used in electronic products such as computers, mobile phones, and game consoles. In product design, there are too few USB interface resources on the chip, and it is necessary to expand the USB interface to ensure the diversity of applications supported by the product. Utility Model Content
[0003] The embodiments of the present application provide a chip module and an electronic device, which can expand the USB interface on the chip, thereby providing multiple different types of interfaces to meet the peripheral requirements.
[0004] According to some embodiments of the present application, on the one hand, an embodiment of the present application provides a chip module, including: a system chip, at least one first hub chip, and at least one second hub chip;
[0005] The system chip includes at least one USB unit, and each USB unit includes a transmitting end, a receiving end, a data positive signal end, and a data negative signal end; the first hub chip includes a first input end and a plurality of first output ends; the second hub chip includes a second input end and a plurality of second output ends;
[0006] The transmitting end and the receiving end of each USB unit are respectively electrically connected to the first input end of the corresponding first hub chip, and the data positive signal end and the data negative signal end of each USB unit are respectively electrically connected to the second input end of the corresponding second hub chip;
[0007] The plurality of first output ends are divided into a first group and a second group, and the plurality of second output ends are divided into a third group and a fourth group; each first output end in the first group is respectively used as a first interface; each second output end in the third group is respectively used as a second interface; each first output end in the second group and each second output end in the corresponding fourth group are jointly used as a third interface; wherein, the signal transmission rate of the first interface and the signal transmission rate of the third interface are both greater than the signal transmission rate of the second interface.
[0008] According to some embodiments of the present application, the first group includes three of the first output ends, and the second group includes one of the first output ends;
[0009] The third group includes three of the second output ends, and the fourth group includes one of the second output ends.
[0010] According to some embodiments of the present application, the number of the USB unit, the first hub chip, and the second hub chip is one.
[0011] According to some embodiments of the present application, the system chip includes an MCU chip, an FPGA chip, a DSP chip, or an ARM chip.
[0012] According to some embodiments of the present application, the first hub chip is a Hub3.1 chip, and the second hub chip is a Hub2.0 chip; the first interface and the third interface are both USB3.1 interfaces, and the second interface is a USB2.0 interface.
[0013] According to some embodiments of the present application, the system chip, at least one of the first hub chips, and at least one of the second hub chips are integrally arranged on the same circuit board.
[0014] According to some embodiments of the present application, the chip module further includes a first power module; the first power module is electrically connected to the system chip; the first power module is used to supply power to the system chip.
[0015] According to some embodiments of the present application, the chip module further includes a second power module; the second power module is respectively electrically connected to each of the first hub chips; the second power module is used to supply power to each of the first hub chips.
[0016] According to some embodiments of the present application, the chip module further includes a third power module; the third power module is respectively electrically connected to each of the second hub chips; the third power module is used to supply power to each of the second hub chips.
[0017] According to some embodiments of the present application, on the other hand, an embodiment of the present application provides an electronic device, including: the above chip module.
[0018] Embodiments of the present application provide a chip module and an electronic device. In this chip module, through the first hub chip and the second hub chip, the USB unit of the system chip is expanded into three interfaces, namely a first interface, a second interface, and a third interface, so as to provide interfaces with different transmission rates, and further, while meeting the requirements of different peripherals, the cost is reduced as much as possible, and it has high cost performance. Description of the Drawings
[0019] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the figures in the drawings do not constitute a scale limitation; To more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0020] Figure 1 It is a schematic structural diagram of a chip module provided by an embodiment of the present application;
[0021] Figure 2 It is a schematic structural diagram of another chip module provided by an embodiment of the present application. Detailed implementation manners
[0022] To make the objectives, technical solutions and advantages of the present application clearer, the following will clearly and completely describe the technical solutions of the present application in combination with the specific embodiments and the corresponding drawings of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.
[0023] In the description of the embodiments of the present application, the meaning of "at least one" is one or more, and the meaning of "a plurality" is two or more, unless otherwise clearly and specifically defined.
[0024] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features.
[0025] Referring to "embodiment" in this article means that the specific features, structures or characteristics described in combination with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.
[0026] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
[0027] With the continuous improvement of data transmission rate, USB has evolved from USB1.0 through USB2.0, USB3.0 to USB3.1. If only a USB3.1 interface is provided in the chip, when it is necessary to meet the peripherals with multiple USB interfaces, the USB3.1 interface must be expanded. If the USB3.1 interface of the chip is expanded into multiple USB3.1 interfaces, due to the downward compatibility of USB3.1, the transmission requirements of different peripherals for speed can be met. However, currently, most USB peripherals use USB2.0 interfaces, and only a small part requires USB3.1 interfaces. This interface expansion method of expanding a single USB3.1 interface into multiple USB3.1 interfaces is obviously a performance overkill and has too high a cost.
[0028] Based on this, the embodiments of the present application provide a chip module, as shown in Figure 1 including: a system chip 10, at least one first hub chip 11 and at least one second hub chip 12.
[0029] As shown in Figure 1 the system chip 10 includes at least one USB unit 100, and each USB unit includes a transmitting end ( Figure 1 the USB_TX end shown in Figure 1 ), a receiving end ( Figure 1 the USB_RX end shown in Figure 1 ), a positive data signal end ( Figure 1 the DP end shown in
[0030] ), and a negative data signal end ( Figure 1 the DM end shown in Figure 1 ); the first hub chip 11 includes a first input end 111 and multiple first output ends 112; the second hub chip 12 includes a second input end 121 and multiple second output ends 122. As shown in Figure 1The shown USB_RX terminal) is respectively electrically connected to the first input terminal 111 of the corresponding first hub chip 11, and the data positive signal terminals of each USB unit 100 ( Figure 1 The shown DP terminal) and the data negative signal terminal ( Figure 1 The shown DM terminal) are respectively electrically connected to the second input terminal 121 of the corresponding second hub chip 12.
[0031] The multiple first output terminals are divided into a first group and a second group; the multiple second output terminals are divided into a third group and a fourth group; each first output terminal in the first group is respectively used as a first interface; each second output terminal in the third group is respectively used as a second interface; each first output terminal in the second group and each second output terminal in the corresponding fourth group are jointly used as a third interface; wherein, the signal transmission rate of the first interface and the signal transmission rate of the third interface are both greater than the signal transmission rate of the second interface.
[0032] Reference Figure 1 As shown, the USB unit may include a full - function USB3.1 interface, and the full - function USB3.1 interface can be backward - compatible; wherein, the transmitting end ( Figure 1 The shown USB_TX terminal) is used to transmit the USB_TX signal, and the receiving end ( Figure 1 The shown USB_RX terminal) is used to transmit the USB_RX signal, the data positive signal terminal ( Figure 1 The shown DP terminal) is used to transmit the DP signal, and the data negative signal terminal ( Figure 1 The shown DM terminal) is used to transmit the DM signal. The USB_TX signal and the USB_RX signal are used to implement the USB3.1 function, and the DP signal and the DM signal are used to implement the USB2.0 function. It should be noted that the USB unit may also include a full - function USB3.0 interface or a full - function USB3.2 interface, which is specifically determined according to the system chip.
[0033] The hub chip (Hub chip) can expand a single port into multiple ports; the above - mentioned first hub chip can be a Hub3.1 chip, which can expand multiple USB3.1 interfaces; the above - mentioned second hub chip can be a Hub2.0 chip, which can expand multiple USB2.0 interfaces; among them, the USB3.1 interfaces expanded by the first hub chip and the USB2.0 interfaces expanded by the second hub chip can form a full - function USB3.1 interface.
[0034] The above - mentioned first interface can be a USB3.1 interface, the second interface can be a USB2.0 interface, and the third interface can be a full - function USB3.1 interface, so as to meet the requirements of various peripherals and reduce costs at the same time. The above - mentioned first interface is a pure USB3.1 interface and cannot be backward - compatible with USB2.0; the third interface is a full - function USB3.1 interface and can be backward - compatible with USB2.0.
[0035] The specific type of the above System on Chip (SOC) is not limited and can be selected according to actual needs. In the above system chip, the specific number of USB units is not limited, Figure 1 and Figure 2 both are illustrated by taking the system chip including one USB unit as an example.
[0036] In the chip module provided by the embodiments of the present application, through the first hub chip and the second hub chip, the USB unit of the system chip is expanded into three interfaces, namely a first interface, a second interface and a third interface, so as to provide interfaces with different transmission rates, and further reduce the cost as much as possible while meeting the requirements of different peripherals, and has high cost performance.
[0037] In one or more embodiments, since the current USB peripherals have little demand for full-function USB3.1 interfaces, in order to further improve the cost performance, the first group includes three first output terminals, and the second group includes one first output terminal; the third group includes three second output terminals, and the fourth group includes one second output terminal. That is, through the first hub chip and the second hub chip, the USB unit of the system chip is expanded into three first interfaces, three second interfaces and one third interface.
[0038] If the system chip includes more USB units, it will undoubtedly increase the cost; in order to further reduce the cost, in one or more embodiments, the system chip includes one USB unit, and the chip module includes one first hub chip and one second hub chip, that is, the number of the USB unit, the first hub chip and the second hub chip is one.
[0039] In one or more embodiments, according to different application requirements, the above system chip may include an MCU (Microcontroller Unit) chip, an FPGA (Field Programmable Gate Array) chip, a DSP (Digital Signal Processor) chip or an ARM (Advanced RISC Machines) chip. Of course, it may also include other types of chips.
[0040] In one or more embodiments, the first hub chip is a Hub3.1 chip, and the second hub chip is a Hub2.0 chip; the first interface and the third interface are both USB3.1 interfaces, and the second interface is a USB2.0 interface, so as to reduce the cost as much as possible while meeting the requirements of different peripherals,
[0041] In one or more embodiments, to improve integration, further reduce costs, and save space at the same time, the system-on-chip, at least one first hub chip, and at least one second hub chip are integrally provided on the same circuit board. Of course, according to different application requirements, the three chips can also be arranged in other ways. For example, the system-on-chip can be separately provided on one circuit board, and at least one first hub chip and at least one second hub chip can be integrally provided on another circuit board.
[0042] In one or more embodiments, to supply power to the chip module to ensure the normal operation of the system-on-chip, refer to Figure 2 As shown, the chip module further includes a first power module 13; the first power module 13 is electrically connected to the system-on-chip 10; the first power module 13 is used to supply power to the system-on-chip 10.
[0043] In one or more embodiments, to supply power to the first hub chip to ensure the normal operation of the first hub chip, refer to Figure 2 As shown, the chip module further includes a second power module 14; the second power module 14 is electrically connected to each first hub chip 11 respectively; the second power module 14 is used to supply power to each first hub chip 11. Figure 2 Taking the chip module including one first hub chip as an example for illustration.
[0044] In one or more embodiments, to supply power to the second hub chip to ensure the normal operation of the second hub chip, refer to Figure 2 As shown, the chip module further includes a third power module 15; the third power module 15 is electrically connected to each second hub chip 12 respectively; the third power module 15 is used to supply power to each second hub chip 12. Figure 2 Taking the chip module including one second hub chip as an example for illustration.
[0045] The embodiment of the present application further provides an electronic device, including: the above-mentioned chip module. To protect the chip module, the electronic device may further include a protective case, and the chip module may be disposed within the protective case.
[0046] The electronic device can be components and products applied in fields such as intelligent housing, transportation, smart home, consumer electronics, monitoring, industrial automation, in-cabin detection, and healthcare. By way of example, the electronic device can be an intelligent transportation device (e.g., a car, bicycle, motorcycle, ship, subway, or train, etc.), a security device (e.g., a camera), a liquid level / flow rate detection device, a smart wearable device (e.g., a bracelet or glasses, etc.), a smart home device (e.g., a floor cleaning robot, door lock, TV, air conditioner, or smart light, etc.), various communication devices (e.g., a mobile phone or tablet computer, etc.), and such as a barrier gate, intelligent traffic indicator, intelligent sign, traffic camera, or various industrial robotic arms (or robots), etc., or can also be various instruments for detecting vital sign parameters or various devices equipped with such an instrument, for example: in-cabin detection of a car, indoor personnel monitoring, intelligent medical device, or consumer electronic device, etc.
[0047] Those of ordinary skill in the art can understand that the above-described embodiments are specific examples for implementing the present application, and in actual applications, various changes can be made to them in form and details without departing from the spirit and scope of the present application. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application should be subject to the scope defined by the claims.
Claims
1. A chip module, characterized in that: include: a system chip, at least one first hub chip, and at least one second hub chip; The system chip includes at least one USB unit, each of which includes a transmitting end, a receiving end, a data positive signal end, and a data negative signal end; the first hub chip includes a first input end and a plurality of first output ends; the second hub chip includes a second input end and a plurality of second output ends; The transmitting end and the receiving end of each USB unit are respectively electrically connected to the first input end of the corresponding first hub chip, and the data positive signal end and the data negative signal end of each USB unit are respectively electrically connected to the second input end of the corresponding second hub chip; The plurality of the first output ends are divided into a first group and a second group, and the plurality of the second output ends are divided into a third group and a fourth group; Each of the first output ends in the first group is used as a first interface respectively; Each of the second output ends in the third group is used as a second interface respectively; each of the first output ends in the second group and each of the corresponding second output ends in the fourth group are used together as a third interface; wherein the signal transmission rate of the first interface and the signal transmission rate of the third interface are both greater than the signal transmission rate of the second interface.
2. The chip module according to claim 1, characterized in that: The first group includes three of the first output terminals, and the second group includes one of the first output terminals; The third group includes three of the second output terminals, and the fourth group includes one of the second output terminals.
3. The chip module according to claim 1, characterized in that: The number of the USB unit, the first hub chip and the second hub chip is one.
4. The chip module according to claim 1, characterized in that: The system chip includes an MCU chip, an FPGA chip, a DSP chip or an ARM chip.
5. The chip module according to claim 1, characterized in that: The first hub chip is a Hub 3.1 chip, and the second hub chip is a Hub 2.0 chip; the first interface and the third interface are both USB 3.1 interfaces, and the second interface is a USB 2.0 interface.
6. The chip module according to claim 1, characterized in that: The system chip, at least one of the first hub chips and at least one of the second hub chips are integrated on the same circuit board.
7. The chip module according to claim 1, characterized in that: The chip module also includes a first power module; the first power module is electrically connected to the system chip; the first power module is used to supply power to the system chip.
8. The chip module according to claim 1, characterized in that: The chip module also includes a second power module; the second power module is electrically connected to each of the first hub chips respectively; the second power module is used to supply power to each of the first hub chips.
9. The chip module according to claim 1, characterized in that: The chip module also includes a third power module; the third power module is electrically connected to each of the second hub chips respectively; the third power module is used to supply power to each of the second hub chips.
10. An electronic device, characterized in that: include: The chip module according to any one of claims 1 to 9.