Height monitoring device

Abstract

The utility model provides a height monitoring device, and belongs to the field of semiconductor bonding. The height monitoring device comprises a bonding machine used for bearing a product to be bonded. And the height monitoring equipment is arranged above the bonding machine and is used for measuring the height of the product to be bonded and outputting measured data. And the control equipment is connected to the height monitoring equipment and is used for receiving the data output by the height monitoring equipment and outputting a control signal. And the laser is configured above the bonding machine, is connected with the control equipment, and is used for receiving the control signal and bonding the product to be bonded. According to the utility model, the height monitoring device is arranged to further confirm the height parameter of the product to be bonded, so that the problem of bonding height deviation caused by the deviation of the mobile device or the abnormal height of the carrier carrying the product to be bonded and conveyed by the feeding system in the laser heating auxiliary bonding process can be solved; therefore, the accuracy of the product bonding process and the stability of the product quality are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor bonding, and particularly relates to a height monitoring device. Background Technique

[0002] Packaging is the process of assembling integrated circuits into the final chip products. Simply put, after the integrated circuit chips produced by the FAB factory are cut, the chips and the carrier board are pasted, and through heating, tin and tin or tin and copper are connected together to achieve a connection effect, and then fixed and packaged into a whole.

[0003] With the continuous evolution of advanced packaging technologies, there is a trend towards achieving more complex heterogeneous integration, carrying larger-scale packaging carriers, manufacturing thinner chips, and meeting more innovative packaging requirements. The bonding accuracy and stability requirements for technologies such as Chiplet, 2.5D, and 3D are becoming increasingly strict. Among them, the laser-assisted bonding technology (Laser Assisted Bonding, LAB) is being used more and more widely. The laser-assisted bonding technology is a technology that uses laser energy to promote the formation of a firm connection between materials.

[0004] However, in the existing laser-assisted bonding technology, during the laser heating-assisted bonding process, the bonding height deviates due to the offset of the moving parts and the abnormal height of the incoming carrier, resulting in the problem that the product to be bonded fails or is not firmly bonded during bonding.

[0005] It should be noted that the information disclosed in the background art part of this utility model is only intended to deepen the understanding of the general background technology of this utility model, and should not be regarded as an admission or any form of implication that this information constitutes the prior art already known to those skilled in the art. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a height monitoring device to solve the problem that during the laser heating-assisted bonding process, due to the deviation of the height of the moving parts from the original set position and the deviation of the total thickness of the incoming products, the product to be bonded fails or is not firmly bonded during bonding.

[0007] To solve the above technical problems, the utility model provides a height monitoring device for a laser-assisted bonding system, including:

[0008] A bonding machine for carrying the product to be bonded;

[0009] A height monitoring device installed above the bonding machine for measuring the height of the product to be bonded and outputting the measured data;

[0010] A control device, connected to the height monitoring device, for receiving data output by the height monitoring device and outputting a control signal;

[0011] A laser, disposed above the bonding machine and connected to the control device, for receiving the control signal and bonding the product to be bonded.

[0012] Preferably, the height monitoring device is used to measure the sum of the heights of the bonding machine and the product to be bonded in the longitudinal direction.

[0013] Preferably, the height monitoring device includes a height monitor.

[0014] Preferably, the height monitoring device further includes a fixed identification device for calibrating the accuracy of the height monitoring device.

[0015] Preferably, the fixed identification device includes a support rod and a calibration piece disposed at the end of the support rod.

[0016] Preferably, the height monitoring device further includes:

[0017] A mobile device, disposed above the bonding machine, and the height monitoring device and the laser are both disposed on the mobile device.

[0018] Preferably, the height monitor is fixedly installed on the mobile device.

[0019] Preferably, the mobile device includes a gantry and a lifting device, the gantry moves in a first direction and a second direction, the lifting device moves in the longitudinal direction of the bonding machine, and the first direction, the second direction and the longitudinal direction of the bonding machine are perpendicular to each other.

[0020] Preferably, the height monitoring device further includes:

[0021] A camera, installed on the mobile device and connected to the control device, for confirming the position of the product to be bonded.

[0022] Preferably, the height monitoring device further includes an alarm, and the alarm is connected to the control device.

[0023] Compared with the prior art, the height monitoring device of the present invention has the following advantages:

[0024] The present invention further confirms the height parameters of the product to be bonded by providing a height monitoring device, so as to solve the problems that in the process of laser heating assisted bonding, the height of the mobile device deviates from the original set position and the total thickness of the carrier carrying the product to be bonded conveyed by the feeding system deviates, thereby ensuring the accuracy of the product bonding process and the stability of the product quality. Description of the Drawings

[0025] Figure 1 is a schematic structural diagram of a height monitoring device in an embodiment of the present utility model;

[0026] In the figure,

[0027] 1 - Laser; 2 - Camera;

[0028] 3 - Height monitoring device; 4 - Fixed identification device;

[0029] 5 - Bonding machine; 6 - Product to be bonded. Detailed Embodiment

[0030] In order to make the objectives, advantages and features of the present utility model clearer, the height monitoring device proposed by the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise scales, and are only used to conveniently and clearly assist in explaining the objectives of the embodiments of the present utility model. It should be understood that the drawings in the specification do not necessarily show the specific structure of the present utility model in proportion, and the illustrative features used to explain certain principles of the present utility model in the drawings of the specification will also adopt a slightly simplified drawing method. The specific design features of the present utility model disclosed herein, such as specific dimensions, directions, positions and shapes, will be partially determined by the specific application and use environment. Also, in the embodiments described below, sometimes the same reference numerals are used commonly between different drawings to represent the same part or parts having the same functions, and the repeated description thereof is omitted. In this specification, similar reference numerals and letters are used to represent similar items. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0032] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0033] The core idea of the present utility model is to provide a height monitoring device that can avoid deviations in the bonding height caused by the offset of moving parts and the abnormal height of the incoming material carrier, thereby ensuring the accuracy of the product bonding process and the stability of the product quality.

[0034] To achieve the above idea, the present utility model provides a height monitoring device for a laser-assisted bonding system. Figure 1 The disclosed height monitoring device includes: a bonding machine 5 for carrying the product 6 to be bonded. A height monitoring device 3 installed above the bonding machine 5 for measuring the height of the product 6 to be bonded and outputting the measured data. A control device connected to the height monitoring device 3 for receiving the data output by the height monitoring device 3 and outputting a control signal. A laser 1 configured above the bonding machine 5 and connected to the control device for receiving the control signal and bonding the product 6 to be bonded.

[0035] In a traditional laser height monitoring device, during the bonding process, although the height monitoring device performs bonding when the product 6 to be bonded moves to the set position according to the software parameters. When the feeding system (not shown in the figure) transports the product 6 to be bonded onto the bonding machine 5 and the position of the product 6 to be bonded is captured by the camera 2, the controller issues a bonding instruction, and the laser 1 bonds the product 6 to be bonded. However, due to the deviation of the height of the moving device from the original set position and the deviation of the total thickness of the carrier carrying the product 6 to be bonded transported by the feeding system, problems such as the failure or insecure bonding of the product 6 to be bonded during bonding occur.

[0036] However, the height monitoring device disclosed in this embodiment can monitor the height of the product to be bonded 6 by setting the height monitoring device 3. Only after the monitoring result is normal, the laser 1 will bond the product to be bonded 6, thus avoiding the problems of deviation of the height of the mobile device from the original set position and deviation of the total thickness of the carrier carrying the product to be bonded 6 conveyed by the feeding system. Thereby, the accuracy of the product bonding process and the stability of the product quality can be ensured.

[0037] Among them, the bonding machine 5 is used to carry the product to be bonded 6. The bonding machine 5 can have any structure such as a cylinder or a cuboid, and specific requirements are not made for the shape and material of the bonding machine 5 here. The bonding machine 5 is also equipped with a preheating device, etc. The bonding machine 5 is a prior art, and for those skilled in the art, the specific structure and principle of the bonding machine 5 are already familiar, and will not be elaborated here.

[0038] Among them, the control device can be a controller, a single-chip microcomputer, etc. In this embodiment, preferably, the control device is a controller, and the controller is a PLC controller. The controller can preset the position parameters of the product to be bonded 6, and is used to receive the monitoring data of the height monitoring device 3. At the same time, it can also issue an instruction to the laser 1 to enable the laser 1 to emit a laser beam to bond the product to be bonded 6.

[0039] It should be noted that the bonding machine 5, the control device, and the laser 1 belong to the prior art. For those skilled in the art, their specific working principles are already familiar, and will not be elaborated in detail here.

[0040] Exemplarily, the height monitoring device further includes a mobile device and a camera 2. The mobile device is arranged above the bonding machine 5, and both the height monitoring device 3 and the laser 1 are arranged on the mobile device. The camera 2 is installed on the mobile device and connected to the control device, and is used to confirm the position of the product to be bonded 6.

[0041] Specifically, referring Figure 1 as shown, the mobile device includes a gantry and a lifting device. The gantry moves along the first direction and the second direction, and the lifting device moves along the longitudinal direction of the bonding machine 5. The first direction, the second direction, and the longitudinal direction of the bonding machine 5 are perpendicular to each other. Among them, the longitudinal direction is Figure 1 the direction of the arrow Z shown. The first direction is the direction of the arrow X. The second direction is the direction of the arrow Y. For those skilled in the art, the specific structure and principle of the gantry and the lifting device are already familiar, and will not be elaborated here.

[0042] The laser 1 is fixedly installed on the mobile device. When bonding the product 6 to be bonded, the position parameters of the product 6 to be bonded can be set in advance, and the mobile laser 1 can be driven by the mobile device to move to the set position to bond the product 6 to be bonded.

[0043] The camera 2 is fixedly installed on the mobile device. The camera 2 takes pictures of the product 6 to be bonded to confirm the specific position of the product 6 to be bonded, and transmits the position information of the product 6 to be bonded to the control device.

[0044] Exemplarily, the height monitoring device 3 includes a height monitor.

[0045] Specifically, referring Figure 1 As shown, the height monitoring device 3 can be a height monitor. In this embodiment, one or more height monitors can be installed. The height monitoring device 3 can also include a device for driving its movement. In this embodiment, preferably, the height monitoring device 3 is a height monitor and one is installed. The height detector is fixedly installed on the mobile device. The measurement accuracy of the height monitor is below micrometers. The height monitor is fixedly installed on the mobile device. When the mobile device moves, it can drive the height monitor to move arbitrarily in the first direction, the second direction, and the longitudinal direction.

[0046] The height monitor is used to measure the height of the product 6 to be bonded. In this embodiment, the height monitor is used to measure the sum of the heights of the bonding machine 5 and the product 6 to be bonded in the longitudinal direction, that is, the height of the product 6 to be bonded can be confirmed.

[0047] The height monitor can be electrically connected to the controller. The height monitor transmits the collected data to the controller through an electrical signal. After analysis and judgment by the controller, a control instruction is issued.

[0048] Further, the height monitoring device further includes a fixed identification device 4 for calibrating the accuracy of the height monitoring device 3.

[0049] The fixed identification device 4 includes a support rod and a calibration piece provided at the end of the support rod. The calibration piece is a thin sheet with a fixed thickness and is used to calibrate the accuracy of the height monitor. The support rod is fixedly installed on one side of the bonding machine 5. The support rod plays a role in fixedly supporting the calibration piece.

[0050] Furthermore, the height monitoring device further includes an alarm (not shown in the figure). Before the height monitor measures the height of the product 6 to be bonded, the height monitor is first moved to a fixed identification position to confirm the longitudinal height position of the laser 1, that is, the height monitor measures the calibration sheet. If the measured height exceeds the preset position parameters of the product 6 to be bonded, the alarm will sound. If the height value is within the set range, it can be determined that the accuracy of the height monitor is within the error range. Next, the height of the product 6 to be bonded can be measured.

[0051] In this embodiment, when bonding the product 6 to be bonded, the position parameters of the product 6 to be bonded can be set through presetting, and the mobile laser 1 can be driven by a mobile device to move to the set position. Then, the controller controls the mobile device to move and moves the height monitor to the fixed identification device 4. The height monitor measures the calibration sheet, thereby enabling calibration of the accuracy. After calibration, the controller controls the mobile device to move to the position of the product 6 to be bonded, and the height monitor measures the height of the product 6 to be bonded to obtain a measurement data. The measurement data is transmitted to the controller and compared with the set height of the product 6 to be bonded. When the measured height value is within the set range, the laser 1 moves to the position of the product 6 to be bonded to bond the product 6 to be bonded. If the measured height value is not within the set range, the alarm will sound.

[0052] In this embodiment, by providing a height monitor to further confirm the height parameters of the product 6 to be bonded, it is possible to solve the problems of deviation of the height of the mobile device from the original set position and deviation of the total thickness of the carrier carrying the product 6 to be bonded conveyed by the feeding system during the laser heating assisted bonding process, thereby ensuring the accuracy of the product bonding process and the stability of the product quality.

[0053] In summary, the above embodiments have described in detail different configurations of the height monitoring device. Of course, the above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention in any way. The present invention includes but is not limited to the configurations listed in the above embodiments. Those skilled in the art can draw inferences from the content of the above embodiments. Any changes and modifications made by ordinary technical personnel in the field of the present invention based on the above disclosure are within the protection scope of the claims.

Claims

1. A height monitoring device for a laser-assisted bonding system, characterized in that: include: Bonding machine, used to carry the products to be bonded; A height monitoring device, installed above the bonding machine, for measuring the height of the product to be bonded and outputting the measured data; a control device, connected to the height monitoring device, configured to receive data output by the height monitoring device and output a control signal; The laser is arranged above the bonding machine and connected to the control device, and is used for receiving the control signal and bonding the product to be bonded.

2. The height monitoring device according to claim 1, characterized in that: The height monitoring device is used to measure the sum of the heights of the bonding machine and the product to be bonded along the longitudinal direction.

3. The height monitoring device according to claim 1, characterized in that: The altitude monitoring device includes an altitude monitor.

4. The height monitoring device according to claim 1, characterized in that: The height monitoring device also includes a fixed identification device for calibrating the accuracy of the height monitoring device.

5. The height monitoring device according to claim 4, characterized in that: The fixed identification device comprises a support rod and a calibration sheet arranged at the end of the support rod.

6. The height monitoring device according to claim 3, characterized in that: The height monitoring device also includes: The mobile device is arranged above the bonding machine, and the height monitoring device and the laser are both arranged on the mobile device.

7. The height monitoring device according to claim 6, characterized in that: The height monitor is fixedly installed on the mobile device.

8. The height monitoring device according to claim 6, characterized in that: The mobile device includes a gantry and a lifting device, the gantry moves along a first direction and a second direction, the lifting device moves along the longitudinal direction of the bonding machine, and the first direction, the second direction and the longitudinal direction of the bonding machine are perpendicular to each other.

9. The height monitoring device according to claim 6, characterized in that: The height monitoring device also includes: A camera is installed on the mobile device and connected to the control device, and is used to confirm the position of the product to be bonded.

10. The height monitoring device according to claim 1, characterized in that: The height monitoring device also includes: An alarm is connected to the control device.

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