Chip frame for improving packaging quality

Abstract

The utility model discloses a chip frame capable of improving packaging quality, which relates to the technical field of chip packaging, and comprises a plastic packaging body, a frame head is integrally formed on the plastic packaging body, an elliptical locking hole is arranged on the frame head, a frame pin is fixedly arranged at the lower part of the plastic packaging body, a frame middle rib is fixedly arranged on the frame pin, and the frame middle rib is fixedly arranged on the plastic packaging body. The plastic package body is further provided with a patch area, package body pocking marks are evenly arranged at the positions, close to the patch area, of the plastic package body, the patch area is of a rectangular structure, and waterproof grooves are formed in the periphery of the patch area. Under the condition that the thickness of the frame is kept unchanged, compared with the prior art, raw materials are saved by 40%, the height of a product finally exposed out of a circuit board is 13.8 mm, the purpose of being compact can be achieved, meanwhile, due to the fact that a full plastic package structure is adopted, a cooling fin insulation pad is omitted, and in addition, short frame pins are adopted, so that the cost is reduced. And after the product is inserted into the circuit board for tinning, redundant pins do not need to be cut off, so that the production process is simpler, and the use cost is lower.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a chip frame for improving packaging quality. Background Art

[0002] The packaged chip frame is an important part of semiconductor packaging technology, which is used to package the chip in the frame to protect the chip and improve its reliability and stability. With the miniaturization and high integration of electronic devices, the requirements for the packaged chip frame are also getting higher and higher.

[0003] In traditional electronic product manufacturing, some components or elements are usually used, and the length of their pins (leads) may exceed the thickness of the circuit board. When installing these components, it is usually necessary to trim the other side of the pins to ensure that the pins are not too long and affect the connection of other components or circuits. This trimming step usually requires additional manual operations or the use of automated equipment, increasing the production cost and complexity. Therefore, we propose a chip frame for improving packaging quality to solve the above-mentioned technical problems. Summary of the Utility Model

[0004] In view of this, the main purpose of the present utility model is to provide a chip frame for improving packaging quality, and its function is to solve the above problems.

[0005] To achieve the above purpose, the present utility model adopts the following technical solutions: It includes a plastic package body, a frame head is integrally formed on the plastic package body, an oval locking hole is opened on the frame head, a frame pin is fixedly arranged at the lower part of the plastic package body, a frame middle rib is fixedly arranged on the frame pin, a bonding area is also arranged on the plastic package body, and packaging body dimples are evenly arranged on the plastic package body near the bonding area. The bonding area is a rectangular structure, and waterproof grooves are opened around the bonding area. A bending part is arranged on the front surface of the plastic package body.

[0006] As a preferred solution, the parts of the frame pins on the left and right sides below the frame middle rib gradually become narrower from top to bottom.

[0007] As a preferred solution, the width of the frame pin is 0.8 ± 0.15 mm, the thickness is 0.5 ± 0.1 mm, and the distance from the frame pin to the plastic package body at the frame middle rib is 2 ± 0.3 mm, and the distance from the frame pin below the frame middle rib is 3.5 ± 0.5 mm.

[0008] As a preferred solution, the width of the frame middle rib is 1.2 ± 0.15 mm, and the height is 1 ± 0.4 mm.

[0009] As a preferred solution, the bending depth at the bending part is 2.33 ± 0.05 mm.

[0010] As a preferred solution, the patch area is rectangular in cross-section.

[0011] Compared with the prior art, the present utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solutions, the main ones are;

[0012] Under the condition that the frame thickness remains unchanged, compared with the prior art, the raw materials are saved by 40%. The final height of the product exposed on the circuit board is 13.8 mm, which can achieve a more compact purpose. At the same time, due to the use of a fully plastic-sealed structure, the use of heat sink insulation pads is eliminated. In addition, short frame pins are adopted, and there is no need to cut off the redundant pins after the product is inserted into the circuit board and soldered. Therefore, the production process is simpler and the use cost is lower.

[0013] To more clearly elaborate the structural features and functions of the present utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. Description of the Drawings

[0014] Figure 1 is the front view structural schematic diagram of the embodiment of the present utility model;

[0015] Figure 2 is the side view structural schematic diagram of the embodiment of the present utility model;

[0016] Figure 3 is the rear view structural schematic diagram of the embodiment of the present utility model;

[0017] Figure 4 is the partial sectional structural schematic diagram of the embodiment of the present utility model.

[0018] Description of the reference numerals: 1. Plastic-sealed body; 2. Frame head; 3. Oval locking hole; 4. Patch area; 5. Frame pin; 6. Frame middle rib; 7. Waterproof groove; 8. Encapsulation body pockmark; 9. Bending part. Detailed Embodiments

[0019] In order to make the purpose, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0020] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there may be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0021] Please refer to Figures 1 to 4 , an embodiment of the present utility model provides a chip frame for improving packaging quality, including a plastic package body 1, a frame head 2 is integrally formed on the plastic package body 1, an oval locking hole 3 is opened on the frame head 2, a frame pin 5 is fixedly arranged at the lower part of the plastic package body 1, a frame middle rib 6 is fixedly arranged on the frame pin 5, a chip attaching area 4 is also arranged on the plastic package body 1, encapsulation body pockmarks 8 are evenly arranged on the plastic package body 1 and near the chip attaching area 4, the chip attaching area 4 is a rectangular structure, waterproof grooves 7 are opened around the chip attaching area 4, and a bending part 9 is arranged on the front surface of the plastic package body 1;

[0022] In this embodiment, the total height of the device is 11.86 ± 0.5 mm, the thickness of the plastic package body 1 is 4.65 ± 0.3 mm, the height of the upper section of the frame head 2 on the plastic package body 1 is 2.67 ± 0.3 mm, and the thickness is 2.54 ± 0.2 mm. The frame pins 5 of this device have the same pin pitch distribution as the existing common ones. The center distance between the left and right frame pins 5 and the frame pin 5 is 2.54 ± 0.127 mm. Here, the width of the frame pin 5 is 0.8 ± 0.15 mm, and the thickness is 0.5 ± 0.1 mm. The left and right sides of the frame pin 5 gradually narrow from top to toe for easy insertion. In order to improve the reliability and stability of inserting the product into the circuit board, a middle rib is designed on the product pins to block the product and prevent the product body from contacting the circuit board. The width of the frame middle rib 6 of this device is 1.2 ± 0.15 mm, the height is 1 ± 0.4 mm, the distance from the frame pin 5 to the plastic package body 1 is 2 ± 0.3 mm, and the distance below the middle rib is 3.5 ± 0.5 mm.

[0023] Please refer to Figures 1 to 4 , the parts on the left and right sides of the frame pin 5 and below the frame middle rib 6 gradually narrow from top to bottom.

[0024] Please refer to Figures 1 to 4 , the width of the frame pin 5 is 0.8 ± 0.15 mm, the thickness is 0.5 ± 0.1 mm, the distance from the frame pin 5 to the plastic package body 1 is 2 ± 0.3 mm, and the distance from the frame pin 5 below the frame middle rib 6 is 3.5 ± 0.5 mm.

[0025] Please refer to Figures 1 to 4, the width of the middle rib 6 of the frame is 1.2 ± 0.15 mm, and the height is 1 ± 0.4 mm.

[0026] Please refer to Figures 1 to 4 , the bending depth of the bending part 9 is 2.33 ± 0.05 mm.

[0027] Please refer to Figures 1 to 4 , the bonding area 4 is a rectangle with a length of 7.3 mm and a width of 5.8 mm.

[0028] In summary, when the thickness of the frame remains unchanged, compared with the prior art, its raw materials are saved by 40%. The final height of the product exposed on the circuit board is 13.8 mm, which can achieve a more compact purpose. At the same time, due to the use of a fully plastic-sealed structure, the use of heat sink insulation pads is eliminated. In addition, short frame pins 5 are used, and there is no need to cut off the redundant pins after the product is inserted into the circuit board and soldered. Therefore, the production process is simpler and the cost is lower.

[0029] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A chip frame for improving packaging quality, characterized in that: The invention comprises a plastic package body (1), wherein a frame head (2) is integrally formed on the plastic package body (1), an elliptical locking hole (3) is provided on the frame head (2), a frame pin (5) is fixedly provided at the lower part of the plastic package body (1), a frame middle rib (6) is fixedly provided on the frame pin (5), a patch area (4) is also provided on the plastic package body (1), packaging body pitting (8) is evenly provided on the plastic package body (1) and close to the patch area (4), the patch area (4) is a rectangular structure, waterproof grooves (7) are provided around the patch area (4), and a bending part (9) is provided on the front of the plastic package body (1).

2. The chip frame for improving packaging quality according to claim 1, characterized in that: The left and right sides of the frame pin (5) and the portion located below the frame center rib (6) gradually narrow from top to bottom.

3. The chip frame for improving packaging quality according to claim 1, characterized in that: The width of the frame pin (5) is 0.8±0.15 mm, the thickness is 0.5±0.1 mm, the distance between the frame pin (5) located at the frame center rib (6) and the plastic package body (1) is 2±0.3 mm, and the distance between the frame pin (5) and below the frame center rib (6) is 3.5±0.5 mm.

4. The chip frame for improving packaging quality according to claim 1, characterized in that: The ribs (6) in the frame have a width of 1.2±0.15 mm and a height of 1±0.4 mm.

5. The chip frame for improving packaging quality according to claim 1, characterized in that: The bending depth of the bending point (9) is 2.33±0.05 mm.

6. The chip frame for improving packaging quality according to claim 1, characterized in that: The patch area (4) has a rectangular cross section.

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