Micro-nano printing flexible circuit board structure

Abstract

The utility model discloses a micro-nano printing flexible circuit board structure, relates to the technical field of flexible circuit boards, and aims to solve the technical problem that an insulation protection layer is directly coated on the surface of a micro-nano circuit, so that the contact effect between the insulation protection layer and the surface of a Wiener circuit is inconvenient to improve. The flexible circuit board assembly comprises a base body component, the two sides of the base body component are covered with electromagnetic shielding components, each electromagnetic shielding component comprises an electromagnetic shielding layer, the top and the bottom of each electromagnetic shielding layer are symmetrically provided with mutually-crossed stabilizing components, and each stabilizing component comprises a plurality of stabilizing structures arranged at equal intervals. The stabilizing structure comprises straight grooves which are symmetrically formed in the surface of the electromagnetic shielding layer in a staggered mode, inclined grooves are formed in the positions, located on the surface of the electromagnetic shielding layer, of the straight grooves in a communicated mode, and rhombic embedding grooves are formed in the mutually-crossed positions of the stabilizing components. The utility model has the advantage of improving the stability of the insulation protection layer for the protection of the micro-nano circuit.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible printed circuit boards, and more specifically, to a micro-nano printed flexible printed circuit board structure. Background Art

[0002] A flexible printed circuit board, also known as a "flexible board", is a printed circuit made of a flexible insulating substrate and has many advantages that rigid printed circuit boards do not have. It can be freely bent, wound, and folded, can be arranged arbitrarily according to the requirements of the spatial layout, and can move and stretch arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. Using FPC can greatly reduce the volume of electronic products and meet the needs of the development of electronic products towards high density, miniaturization, and high reliability.

[0003] At present, in the process of manufacturing a micro-nano circuit board, its substrate usually selects a flexible insulating material, conductive ink is coated on both sides of the flexible insulating substrate, and photoresist is coated on the conductive ink. The lithography technology is used to form a predetermined circuit pattern on the surface of the photoresist. After the development process, the part of the conductive ink layer not covered by the photoresist is removed to form a precise micro-nano circuit, and one or more insulating protective layers are evenly coated on the surface of the micro-nano circuit, thus completing the production and manufacturing of the micro-nano circuit. In the above process, the insulating protective layer is directly coated on the surface of the micro-nano circuit, which is not convenient for improving its contact effect with the surface of the micro-nano circuit, and further affects the stability of the protection of the insulating protective layer for the micro-nano circuit. In view of this, we propose a micro-nano printed flexible printed circuit board structure. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a micro-nano printed flexible printed circuit board structure to solve the technical problem that the insulating protective layer is directly coated on the surface of the micro-nano circuit, which is not convenient for improving its contact effect with the surface of the micro-nano circuit.

[0005] To solve the above technical problem, the utility model provides the following technical solution: A micro-nano printed flexible printed circuit board structure, including a flexible printed circuit board assembly;

[0006] The flexible printed circuit board assembly includes a substrate component covered with electromagnetic shielding components on both sides;

[0007] The electromagnetic shielding component includes an electromagnetic shielding layer with stable components intersecting symmetrically at the top and bottom;

[0008] The stable component includes a plurality of stable structures arranged at equal intervals;

[0009] The stable structure includes straight grooves symmetrically and staggeredly opened on the surface of the electromagnetic shielding layer, an inclined groove is communicated and opened on the surface of the electromagnetic shielding layer between the straight grooves, and a diamond-shaped fitting groove is formed at the intersecting position of the stable components.

[0010] The utility model designs an electromagnetic shielding layer, and through the electromagnetic shielding layer, an electromagnetic shielding effect can be formed outside the conductive ink inside the flexible insulating substrate, which is beneficial to maintaining the stability of the working state of the micro-nano circuit. Moreover, by etching straight grooves and inclined grooves on the surface of the electromagnetic shielding layer, the staggered arrangement of the straight grooves and the inclined grooves is beneficial to establishing a stable connection effect with the electromagnetic shielding layer after the first insulating protection layer and the second insulating protection layer are coated, thereby improving the stability of the first insulating protection layer for protecting the micro-nano circuit.

[0011] Preferably, a first insulating protection layer is coated on the surface of the electromagnetic shielding layer, and a second insulating protection layer is coated on the surface of the first insulating protection layer.

[0012] Preferably, the base member includes a flexible insulating substrate with grooves formed on both the upper surface and the lower surface, a conductive ink layer is arranged inside the grooves, and the electromagnetic shielding layer is arranged in the grooves.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] 1. The utility model designs an electromagnetic shielding layer, and through the electromagnetic shielding layer, an electromagnetic shielding effect can be formed outside the conductive ink inside the flexible insulating substrate, which is beneficial to maintaining the stability of the working state of the micro-nano circuit. Moreover, by etching straight grooves and inclined grooves on the surface of the electromagnetic shielding layer, the staggered arrangement of the straight grooves and the inclined grooves is beneficial to establishing a stable connection effect with the electromagnetic shielding layer after the first insulating protection layer and the second insulating protection layer are coated, thereby improving the stability of the first insulating protection layer for protecting the micro-nano circuit, and solving the problem that the insulating protection layer is directly coated on the surface of the micro-nano circuit, which is not convenient to improve the contact effect with the surface of the micro-nano circuit.

[0015] 2. The utility model also designs the stabilizing member as a symmetrically cross-arranged structure, and the stabilizing member includes a plurality of equidistantly arranged stabilizing structures, which is beneficial to further improving the stability of the first insulating protection layer for protecting the micro-nano circuit.

[0016] 3. The utility model also designs the stabilizing member as a symmetrically cross-arranged structure and forms a diamond-shaped fitting groove. The diamond-shaped structure of the diamond-shaped fitting groove is beneficial to establishing a stable connection effect at the center position of the electromagnetic shielding layer after the first insulating protection layer and the second insulating protection layer are coated, thereby improving the stability of the first insulating protection layer for protecting the micro-nano circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of the utility model;

[0018] Figure 2 is for the utility model Figure 1 split schematic diagram;

[0019] Figure 3 is a schematic structural diagram of the electromagnetic shielding component of the present utility model;

[0020] Figure 4 of the present utility model Figure 2 is an enlarged schematic diagram of the structure at position A in the present utility model;

[0021] Figure 5 of the present utility model Figure 4 is an enlarged schematic diagram of the structure at position B in the present utility model.

[0022] Explanation of the reference numerals in the figure:

[0023] 1. Flexible circuit board assembly; 101. First insulating protective layer; 102. Second insulating protective layer; 2. Electromagnetic shielding component; 201. Electromagnetic shielding layer; 202. Straight groove; 203. Oblique groove; 204. Rhombic fitting groove; 3. Substrate component; 301. Flexible insulating substrate; 302. Groove. Specific embodiments

[0024] As Figure 1 , Figure 2 , Figure 3 and Figure 5 shown, a micro-nano printed flexible circuit board structure related to the present utility model includes a flexible circuit board assembly 1. The flexible circuit board assembly 1 includes a substrate component 3 with electromagnetic shielding components 2 covered on both sides. The electromagnetic shielding component 2 includes an electromagnetic shielding layer 201 with stable components symmetrically formed at the top and bottom and intersecting with each other. The stable components include a plurality of stable structures arranged at equal intervals. The stable structure includes straight grooves 202 symmetrically and staggeredly opened on the surface of the electromagnetic shielding layer 201. Oblique grooves 203 are communicatively opened on the surface of the electromagnetic shielding layer 201 between the straight grooves 202. The stable components form rhombic fitting grooves 204 at the intersecting positions.

[0025] As Figures 2 - 4 shown, in the embodiment of the present utility model, a first insulating protective layer 101 is coated on the surface of the electromagnetic shielding layer 201, and a second insulating protective layer 102 is coated on the surface of the first insulating protective layer 101. The substrate component 3 includes a flexible insulating substrate 301 with grooves 302 formed on both the upper surface and the lower surface. A conductive ink layer is provided inside the grooves 302, and the electromagnetic shielding layer 201 is arranged in the grooves 302.

[0026] The embodiments disclosed in the present utility model are preferred embodiments, but are not limited thereto. Those of ordinary skill in the art can easily understand the spirit of the present utility model based on the above embodiments and make different extensions and changes. However, as long as they do not depart from the spirit of the present utility model, they are within the protection scope of the present utility model.

Claims

1. A micro-nano circuit board, characterized in that: It comprises a flexible circuit board assembly (1); The flexible circuit board assembly (1) comprises a base component (3) with electromagnetic shielding components (2) covering both sides thereof; The electromagnetic shielding component (2) comprises an electromagnetic shielding layer (201) whose top and bottom are symmetrically formed into mutually intersecting stable components; The stabilizing component includes a plurality of equidistantly arranged stabilizing structures; The stabilizing structure comprises straight grooves (202) symmetrically staggered and opened on the surface of the electromagnetic shielding layer (201), oblique grooves (203) are connected and opened on the surface of the electromagnetic shielding layer (201) between the straight grooves (202), and diamond-shaped interlocking grooves (204) are formed at mutually intersecting positions of the stabilizing components.

2. A micro-nano circuit board according to claim 1, characterized in that: The surface of the electromagnetic shielding layer (201) is coated with an insulating protective layer 1 (101), and the surface of the insulating protective layer 1 (101) is coated with an insulating protective layer 2 (102).

3. A micro-nano circuit board according to claim 2, characterized in that: The base component (3) comprises a flexible insulating substrate (301) having grooves (302) formed on both the upper surface and the lower surface, a conductive ink layer is arranged inside the groove (302), and the electromagnetic shielding layer (201) is arranged in the groove (302).

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