Rectifier

By adopting a combination of solid heat conduction and fluid heat exchange in the rectifier, the problem of insufficient heat dissipation characteristics of high-power rectifiers is solved, and a lighter and easier to move rectifier design is achieved.

CN223007774UActive Publication Date: 2025-06-20GUANGDONG JIUTIAN POWER SUPPLY CO LTD
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Patent Information

Application Number
CN202421695177.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-17
Publication Date
2025-06-20
Estimated Expiration
2034-07-17

AI Technical Summary

Technical Problem

The existing rectifiers lack heat dissipation characteristics under high power conditions, resulting in large and inconvenient movement of the body. At the same time, it is difficult to take into account good heat dissipation characteristics and lightweight bodies.

Method used

A rectifier is designed to use solid heat conduction to dissipate heat. By setting up a radiator and a fluid channel in the chassis, the fluid is used for heat exchange; the synchronization module and the transformer assembly are connected to the radiator for solid heat transfer, and the occupancy area is reduced by overlapping settings, and a smaller radiator and chassis are used.

Benefits of technology

It realizes that while maintaining good heat dissipation characteristics, the body size and weight of the rectifier are reduced, making it easier to move and adjust the process circuit.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of power supply equipment, and particularly relates to a rectifier, which comprises a case and a radiator arranged in the case, the radiator comprises a heat exchange surface used for heat transfer, the rectifier further comprises a synchronization module, the synchronization module comprises a PCB (printed circuit board), a conductive bottom plate and a conductive strip, and the conductive bottom plate and the conductive strip are connected through the PCB. The synchronization module is connected to the heat exchange surface through the conductive bottom plate and the conductive strip; the rectifier further comprises a transformer assembly, the transformer assembly comprises a heat conduction frame, and the heat conduction frame is connected to the heat exchange face through a heat conduction block arranged on the side of the synchronous module, so that the transformer assembly and the synchronous module are arranged in an overlapped mode. The synchronous module and the transformer assembly which generate large heat are connected with the radiator in a solid heat transfer mode and are arranged in an overlapped mode, the total occupied area of a heat exchange face is greatly reduced, and a rectifier machine body is light while the good heat dissipation characteristic of the rectifier machine is kept.
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Description

Technical Field

[0001] The utility model belongs to the technical field of power supply equipment, and particularly relates to a rectifier. Background Art

[0002] A rectifier is a machine used to adjust the current, voltage, etc. of a standard input power supply, also known as an electroplating power supply, an electrolysis power supply or an electrophoresis power supply. It is generally used in industrial application fields such as electroplating, aluminum anodizing, electrolysis, etc. that require direct current. Its function is to convert alternating current into direct current and supply it to the load after filtering.

[0003] In the prior art, a rectifier usually includes components such as a main circuit, a filter, a synchronization module and a transformer, etc., to ensure that alternating current is effectively converted into direct current, and the output direct current is stable and suitable for subsequent use requirements. The heat dissipation characteristics of the rectifier directly affect its power. Only when the heat dissipation conditions of the rectifier are good can its maximum power be normally exerted. In the prior art, in the case of a large power, the power components of the rectifier need to transfer heat by means of solid heat conduction to improve the heat exchange efficiency, which puts forward requirements for the heat exchange area of the radiator. The radiator with a large heat exchange area has a larger volume and mass, and usually the body of a high-power rectifier is also larger. And since the process line may need to be adjusted in actual applications, the rectifier also needs to be conveniently moved, and it is required to have both good heat dissipation characteristics and a relatively lightweight body. Summary of the Utility Model

[0004] To solve the above technical problems, it is necessary to provide a rectifier with good heat dissipation characteristics and a lightweight body.

[0005] To solve the above technical problems, the utility model provides the following technical solutions:

[0006] A rectifier includes a chassis, and further includes a radiator disposed inside the chassis. The radiator includes a heat exchange surface for heat transfer, and further includes a fluid channel through which a fluid passes to perform heat exchange with the heat exchange surface. The inlet and outlet of the fluid channel are disposed on the chassis; the rectifier further includes a synchronization module, the synchronization module includes a PCB board and a conductive bottom plate and a conductive bar connected through the PCB board, and the synchronization module is connected to the heat exchange surface through the conductive bottom plate and the conductive bar; the rectifier further includes a transformer assembly, the transformer assembly includes a heat conduction frame, and the heat conduction frame is connected to the heat exchange surface through a heat conduction block disposed beside the synchronization module, so that the transformer assembly and the synchronization module are stacked.

[0007] The rectifier provided by the utility model dissipates heat through solid heat conduction. When in use, a fluid is introduced into the fluid channel. As the fluid passes through the fluid channel, it continuously takes away heat from the radiator, keeping the surface of the radiator at a temperature suitable for the components to operate. The synchronization module conducts heat through the conductive base plate and conductive strips against the heat exchange surface. Since the areas of the conductive base plate and conductive strips are relatively large, the heat conduction area is increased, and thus the heat transfer efficiency is improved. The transformer assembly includes a heat-conducting frame, and heat exchange is carried out via the heat-conducting frame and heat-conducting blocks. The heat-conducting blocks are connected to the heat exchange surface. Due to the certain height of the heat-conducting blocks, the transformer assembly and the synchronization module can be arranged in an overlapping manner. The term "overlapping" refers to a close arrangement where the projections overlap, thereby reducing the total area occupied by the transformer assembly and the synchronization module on the heat exchange surface and enabling them to be closely arranged for convenient connection. In this structure, the two components with relatively large heat generation, namely the synchronization module and the transformer assembly, are both connected to the radiator for solid heat transfer. And due to the overlapping arrangement, the total area occupied on the heat exchange surface is greatly reduced, a radiator with a smaller size can be used, and thus a smaller chassis can be adopted. By adjusting the flux and flow rate of the fluid in the fluid channel as needed, the heat dissipation capacity of the radiator can be ensured, making the rectifier relatively light while maintaining good heat dissipation characteristics.

[0008] Preferably, an insulating layer is provided between the synchronization module and the heat exchange surface. This structure can prevent the current on the synchronization module from being conducted to the radiator. When a water-cooled radiator is used, if the surface of the radiator is charged, minerals in the water may be adsorbed on the wall surface of the fluid channel, resulting in mineral accumulation in the fluid channel, affecting the fluid flux and even causing blockage, reducing the heat dissipation performance of the radiator.

[0009] Preferably, the insulating layer is a ceramic plate. Ceramics are both insulating and heat-conducting, and have stable properties, making them suitable as an insulating layer between the synchronization module and the radiator.

[0010] Preferably, the radiator divides the chassis into a first accommodation cavity and a second accommodation cavity. The radiator includes a first heat exchange surface serving as the wall surface of the first accommodation cavity and a second heat exchange surface serving as the wall surface of the second accommodation cavity, and the first heat exchange surface and the second heat exchange surface are arranged opposite to each other. This structure makes the areas of the first heat exchange surface and the second heat exchange surface relatively large and facilitates connection with power components.

[0011] Preferably, the synchronization module and the heat-conducting blocks are connected to the first heat exchange surface, the transformer assembly is arranged in the first accommodation cavity, and / or an inverter and a rectifier bridge connected to the second heat exchange surface are further included.

[0012] Preferably, the transformer assembly includes a heat-conducting frame, a magnetic core and a coil connected to the heat-conducting frame. The heat-conducting frame includes a magnetic-core skeleton bolted to the conductive bottom plate and a heat-conducting bottom frame connected to the magnetic-core skeleton. In this structure, the connection between the heat-conducting frame and the synchronization module is relatively firm, combining the synchronization module and the transformer assembly firmly. The heat-conducting block plays a dual role of fixing and heat dissipation. The increased height of the heat-conducting block enables the synchronization module and the transformer assembly to be stacked.

[0013] Preferably, an output copper bar is connected between the edge of the heat-conducting bottom frame and the heat-conducting block. Connecting the output copper bar between the heat-conducting block and the heat-conducting bottom frame is convenient for fixing and can also be cooled by the heat-conducting block to ensure normal operation.

[0014] Preferably, an insulating layer is connected between the heat-conducting block and the first heat-exchange surface. Since the heat-conducting block generally uses an aluminum block in the prior art, insulation is required when used with a water-cooled radiator to avoid affecting the operation of the radiator.

[0015] Preferably, it further includes a fixing plate spaced from the first heat-exchange surface. The fixing plate is connected to the first heat-exchange surface and is provided with a through hole matching the shape of the heat-conducting block. The heat-conducting block passes through the through hole and is connected to the first heat-exchange surface. In this structure, the heat-conducting block is further stabilized through the fixing plate, reducing the vibration of the transformer.

[0016] Preferably, the chassis includes a bottom plate, two end plates connected to both ends of the bottom plate and arranged oppositely, and a cover shell covering the bottom plate and the two end plates to form a box body. The end plates extend at a 90° angle to the bottom plate with a connecting edge, and the inner wall of the cover shell is attached to the connecting edge. In this structure, the cover shell is attached to the connecting edge, and the cover shell and the connecting edge can be pressed tightly by bolts or other means to make the gap as small as possible and prevent water from entering. Description of the Drawings

[0017] The above and other objects, features and advantages of the present invention will become clearer through the preferred embodiments shown in the drawings. The same reference numerals in all the drawings indicate the same parts, and the drawings are not deliberately drawn to scale in actual size, with the emphasis on showing the gist of the present invention.

[0018] Figure 1 It is a top view of the preferred embodiment (the cover shell is not shown);

[0019] Figure 2 It is a front view of the preferred embodiment (the cover shell is not shown);

[0020] Figure 3 It is a rear view of the preferred embodiment (the cover shell is not shown);

[0021] Figure 4 Schematic diagram of the assembly of the transformer assembly, synchronization module, output copper bar, fixing block, and fixing plate in the preferred embodiment;

[0022] Figure 5 Schematic diagram of the structure of the transformer assembly in the preferred embodiment;

[0023] Figure 6 Schematic diagram of the structure of the synchronization module in the preferred embodiment.

[0024] In the figure: radiator 1, first heat exchange surface 11, second heat exchange surface 12, inlet 13, outlet 14, synchronization module 2, PCB board 21, conductive bottom plate 22, conductive bar 23, transformer assembly 3, heat-conducting bottom frame 31, magnetic core skeleton 32, inverter 4, rectifier bridge 5, output copper bar 7, bottom plate 81, end plate 82, connecting edge 84, heat-conducting block 91, fixing plate 92. Detailed implementation manners

[0025] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0026] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element and integrated therewith, or there may be an intermediate element at the same time. The terms "installation", "one end", "the other end" and similar expressions used herein are only for the purpose of explaining the present invention.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this technology belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0028] Reference Figure 1-6, a rectifier of the present utility model includes a chassis, and further includes a radiator 1 disposed inside the chassis. The radiator 1 includes a heat exchange surface for heat transfer, and further includes a fluid channel through which a fluid passes to perform heat exchange with the heat exchange surface. An inlet 13 and an outlet 14 of the fluid channel are disposed on the chassis. The rectifier further includes a synchronization module 2, which includes a PCB board 21 and a conductive base plate 8122 and a conductive strip 23 connected through the PCB board 21. The synchronization module 2 is connected to the heat exchange surface through the conductive base plate 8122 and the conductive strip 23. The rectifier further includes a transformer assembly 3, which includes a heat-conducting frame. The heat-conducting frame is connected to the heat exchange surface through a heat-conducting block 91 disposed beside the synchronization module 2, so that the transformer assembly 3 and the synchronization module 2 are stacked.

[0029] The rectifier provided by the present utility model completes heat dissipation through solid heat conduction. When in use, a fluid is introduced into the fluid channel. When the fluid passes through the fluid channel, it continuously takes away heat from the radiator 1, so that the surface of the radiator 1 is maintained at a temperature suitable for the components to work. The synchronization module 2 performs heat conduction by attaching the conductive base plate 8122 and the conductive strip 23 to the heat exchange surface. Since the areas of the conductive base plate 8122 and the conductive strip 23 are relatively large, the heat conduction area is increased, and thus the heat transfer efficiency is improved. The transformer assembly 3 includes a heat-conducting frame, and heat exchange is performed through the heat-conducting frame and the heat-conducting block 91. The heat-conducting block 91 is connected to the heat exchange surface. Since the heat-conducting block 91 has a certain height, the transformer assembly 3 and the synchronization module 2 can be stacked. The stacking means a close setting with overlapping projections, thereby reducing the total area of the heat exchange surface occupied by the transformer assembly 3 and the synchronization module 2, and enabling them to be closely set for convenient connection. In this structure, the two components with relatively large heat generation, namely the synchronization module 2 and the transformer assembly 3, are both connected to the radiator 1 for solid heat transfer. And due to the stacked setting, the total area of the heat exchange surface occupied is greatly reduced, and a radiator 1 with a smaller size can be used, and thus a smaller chassis can be adopted. By adjusting the flux and flow rate of the fluid passing through the fluid channel as needed, the heat dissipation capacity of the radiator 1 can be ensured, so that the rectifier is relatively light while having good heat dissipation characteristics. In a preferred embodiment, the radiator 1 is a water-cooled radiator 1, and the fluid channel is arranged in a U shape inside the radiator 1, and the water inlet and the water outlet are arranged on the same side of the radiator 1. In other embodiments, other types of radiators 1 such as an air-cooled radiator 1 and an oil-cooled radiator 1 can also be adopted.

[0030] In a preferred embodiment, an insulating layer is provided between the synchronization module 2 and the heat exchange surface. This structure can prevent the current on the synchronization module 2 from being conducted to the radiator 1. When using a water-cooled radiator 1, if the surface of the radiator 1 is charged, minerals in the water may be adsorbed on the wall surface of the fluid channel, resulting in mineral accumulation in the fluid channel, affecting the fluid flux and even causing blockage, and reducing the heat dissipation performance of the radiator 1.

[0031] In a preferred embodiment, the insulating layer is a ceramic plate. Ceramics are both insulating and heat-conducting, and have stable properties, making them suitable as an insulating layer between the synchronization module 2 and the radiator 1.

[0032] Reference Figure 1 ,- Figure 3 , in a preferred embodiment, the radiator 1 divides the chassis into a first accommodation cavity and a second accommodation cavity. The radiator 1 includes a first heat exchange surface 11 serving as the wall surface of the first accommodation cavity and a second heat exchange surface 12 serving as the wall surface of the second accommodation cavity, and the first heat exchange surface 11 and the second heat exchange surface 12 are arranged opposite to each other. This structure enables the first heat exchange surface 11 and the second heat exchange surface 12 to have a relatively large area and facilitates connection with power components. The water-cooled radiator 1 in the preferred embodiment is integrally plate-shaped, and a reinforcing rib with through holes is further provided above the radiator 1 as the chassis skeleton to enhance the structure.

[0033] Reference Figure 2 and Figure 3 , in a preferred embodiment, the synchronization module 2 and the heat conducting block 91 are connected to the first heat exchange surface 11, the transformer assembly 3 is arranged in the first accommodation cavity, and / or further includes an inverter 4 and a rectifier bridge 5 connected to the second heat exchange surface 12. The preferred embodiment also includes a transformer and a synchronization module 2 drive board arranged above the inverter 4, and they are all directly connected to the surface of the radiator 1. In the preferred embodiment, the IGBT module of the inverter 4 is directly connected to the heat exchange surface. In the preferred embodiment, the various components are mainly connected in relatively stable connection ways such as circuit boards, pins, copper bars or flexible copper strips to reduce the situation of poor contact.

[0034] Reference Figure 2 and Figure 4, in a preferred embodiment, the transformer assembly 3 includes a heat-conducting frame, a magnetic core and a coil connected to the heat-conducting frame. The heat-conducting frame includes a magnetic-core skeleton 32 bolted to the conductive bottom plate 8122 and a heat-conducting bottom frame 31 connected to the magnetic-core skeleton 32. In this structure, the connection between the heat-conducting frame and the synchronization module 2 is relatively firm, firmly combining the synchronization module 2 and the transformer assembly 3. The heat-conducting block 91 serves a dual role of fixing and heat dissipation. The increased height due to the heat-conducting block 91 allows the synchronization module 2 and the transformer assembly 3 to be stacked. In the preferred embodiment, the synchronization module 2 and the transformer assembly 3 are connected by a flexible copper strip. Specifically, a flexible copper strip is bolted between the heat-conducting bottom frame 31 and the conductive strip 23.

[0035] Reference Figure 1 、 Figure 2 and Figure 4 , in a preferred embodiment, an output copper busbar 7 is connected between the edge of the heat-conducting bottom frame 31 and the heat-conducting block 91. Connecting the output copper busbar 7 between the heat-conducting block 91 and the heat-conducting bottom frame 31 is convenient for fixing and can also be cooled by the heat-conducting block 91 to ensure normal operation. In the preferred embodiment, an inductor and a current sensor are also sleeved on the output copper busbar 7.

[0036] In a preferred embodiment, an insulating layer is connected between the heat-conducting block 91 and the first heat-exchange surface 11. Since the heat-conducting block 91 generally adopts an aluminum block in the prior art, insulation is required when used simultaneously with the water-cooled radiator 1 to avoid affecting the operation of the radiator 1.

[0037] Reference Figure 2 and Figure 4 , in a preferred embodiment, it further includes a fixing plate 92 spaced from the first heat-exchange surface 11. The fixing plate 92 is connected to the first heat-exchange surface 11 and is provided with a through hole matching the shape of the heat-conducting block 91. The heat-conducting block 91 passes through the through hole and is connected to the first heat-exchange surface 11. In this structure, the heat-conducting block 91 is further stabilized by the fixing plate 92, reducing the vibration of the transformer.

[0038] Reference Figure 3 , in a preferred embodiment, the chassis includes a bottom plate 81, two end plates 82 connected to both ends of the bottom plate 81 and arranged oppositely, and a housing covering the bottom plate 81 and the two end plates 82 to form a box body. A connecting edge 84 extends at an angle of 90° between the end plate 82 and the bottom plate 81, and the inner wall of the housing is attached to the connecting edge 84. In this structure, the housing is attached to the connecting edge 84. The housing and the connecting edge 84 can be pressed tightly by bolts or other means to make the gap as small as possible, and after assembly, painting treatment is carried out to seal the gap, making it not easy to let water in.

[0039] In this application, unless otherwise clearly stipulated and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0040] In the description of this specification, the description with reference to terms such as "preferred embodiment", "another embodiment", "other embodiments" or "specific examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0041] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting this application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A rectifier, comprising a chassis, characterized in that: The rectifier also comprises a radiator (1) arranged inside the chassis, the radiator (1) comprising a heat exchange surface for heat transfer, and a fluid channel for passing fluid to exchange heat with the heat exchange surface, the inlet (13) and the outlet (14) of the fluid channel being arranged on the chassis; the rectifier also comprises a synchronization module (2), the synchronization module (2) comprising a PCB board (21) and a conductive bottom plate (22) and a conductive strip (23) connected via the PCB board (21), the synchronization module (2) being connected to the heat exchange surface via the conductive bottom plate (22) and the conductive strip (23); the rectifier also comprises a transformer assembly (3), the transformer assembly (3) comprising a heat conduction frame, the heat conduction frame being connected to the heat exchange surface via a heat conduction block (91) arranged beside the synchronization module (2), so that the transformer assembly (3) and the synchronization module (2) are arranged in an overlapping manner.

2. The rectifier according to claim 1, characterized in that: An insulating layer is provided between the synchronization module (2) and the heat exchange surface.

3. The rectifier according to claim 2, characterized in that: The insulating layer is a ceramic plate.

4. The rectifier according to any one of claims 1 to 3, characterized in that: The heat sink (1) divides the chassis into a first accommodating chamber and a second accommodating chamber. The heat sink (1) comprises a first heat exchange surface (11) as a wall surface of the first accommodating chamber and a second heat exchange surface (12) as a wall surface of the second accommodating chamber. The first heat exchange surface (11) and the second heat exchange surface (12) are arranged opposite to each other.

5. The rectifier according to claim 4, characterized in that: The synchronization module (2) and the heat-conducting block (91) are connected to the first heat exchange surface (11), the transformer assembly (3) is arranged in the first accommodating cavity, and / or further includes an inverter (4) and a rectifier bridge (5) connected to the second heat exchange surface (12).

6. The rectifier according to claim 5, characterized in that: The transformer assembly (3) comprises a heat-conducting frame and a magnetic core and a coil connected to the heat-conducting frame, wherein the heat-conducting frame comprises a magnetic core skeleton (32) bolted to the conductive bottom plate (22) and a heat-conducting bottom frame (31) connected to the magnetic core skeleton (32).

7. The rectifier according to claim 6, characterized in that: An output copper busbar (7) is connected between the edge of the heat-conducting bottom frame (31) and the heat-conducting block (91).

8. The rectifier according to claim 4, characterized in that: An insulating layer is connected between the heat conducting block (91) and the first heat exchange surface (11).

9. The rectifier according to claim 4, characterized in that: It also includes a fixing plate (92) spaced apart from the first heat exchange surface (11); the fixing plate (92) is connected to the first heat exchange surface (11) and is provided with a through hole matching the shape of the heat conductive block (91); the heat conductive block (91) is connected to the first heat exchange surface (11) through the through hole.

10. The rectifier according to any one of claims 1 to 3, characterized in that: The chassis comprises a bottom plate (81), two end plates (82) connected to the two ends of the bottom plate (81) and arranged opposite to each other, and a cover shell arranged on the bottom plate (81) and the two end plates (82) to form a box body, wherein a connecting edge (84) is extended at an angle of 90° between the end plate (82) and the bottom plate (81), and an inner wall of the cover shell is in contact with the connecting edge (84).