Heat dissipation device of switch

Abstract

The utility model relates to a heat dissipation device of a switch, which comprises a switch main body, the top of the switch main body is detachably provided with a fixed frame, the fixed frame is movably provided with an air guide fan, the top surface of the switch main body is also provided with a heat-conducting fin, and the top surface of the heat-conducting fin is arranged close to the bottom surface of the air guide fan. The switch main body is also provided with a water cooling assembly which is inserted into the switch main body and the heat-conducting fins. The heat dissipation structure of an existing switch is improved, a heat conduction, water cooling and air cooling triple combined structure is adopted for heat dissipation, meanwhile, the whole switch body can be kept in a closed state, and therefore the switch can be suitable for some severe environments, interference of external factors can be effectively isolated on the premise that the heat dissipation function is kept, and the service life of the switch is prolonged. The operation stability of the switch is greatly improved, and the service life of the switch is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of switches, in particular to a heat dissipation device for a switch. Background Technique

[0002] A switch, meaning "switch", is a network device for forwarding electrical (optical) signals. It can provide an exclusive electrical signal path for any two network nodes connected to the switch. The most common switch is an Ethernet switch. Other common ones include telephone voice switches, fiber optic switches, etc.

[0003] Existing switches usually work for a long time, so the internal electronic components generate serious heat. To avoid causing failures, a heat dissipation structure is usually added to it. A relatively common heat dissipation structure is generally to open heat dissipation holes on its side walls, so as to use the external air to cool the inside. However, this will inevitably cause some dust, water vapor, etc. to enter the device, resulting in failures. Moreover, long-term contact with the outside will cause some internal electronic components to oxidize, affecting the service life of the switch. Summary of the Utility Model

[0004] Based on the above description, the utility model provides a heat dissipation device for a switch to solve the disadvantages that the existing heat dissipation structure of the switch is simple, cannot effectively isolate the interference of external environmental factors while maintaining heat dissipation, and is prone to cause equipment failures.

[0005] The utility model is realized through the following technical solutions:

[0006] A heat dissipation device for a switch, including a switch body. A fixed frame is detachably installed on the top of the switch body. A guide fan is movably installed on the fixed frame. A heat conduction sheet is also provided on the top surface of the switch body and is arranged close to the bottom surface of the guide fan. And a water cooling component is also provided on the switch body and penetrates inside the switch body and the heat conduction sheet.

[0007] On the basis of the above technical solutions, the utility model can be further improved as follows.

[0008] Further, the fixed frame is rectangular and has support angles at the four corners of the bottom surface. Step surfaces are correspondingly arranged at the four corners of the top surface of the switch body. The support angles are attached to the step surfaces and are locked and fixed by bolts.

[0009] Furthermore, a rectangular opening is arranged on the side wall of the fixed frame. The rectangular opening extends inwards and forms a slot on the inner side wall of the fixed frame. A plurality of guide fans are provided and detachably mounted on the fixing plate. The fixing plate is arranged in a rectangle and its two ends are respectively slidably inserted into the inside of the chute. Moreover, a flange is provided on the outer side of the fixing plate, and a limiting groove is provided on the edge of the rectangular opening and fits and fixes with the flange.

[0010] Furthermore, the heat conducting sheet is a rectangular metal sheet vertically arranged on the top surface of the switch body, and a plurality of through holes are arranged at intervals on each heat conducting sheet.

[0011] Furthermore, the water cooling assembly includes a cooling pipe, a heat conducting sleeve and a micro pump. The heat conducting sleeve is arranged on the switch body and penetrates through it from top to bottom. A plurality of guiding holes are also arranged through the heat conducting sleeve. The cooling pipe sequentially passes through the guiding holes and the through holes and converges on the bottom surface of the switch body along the side wall. The micro pump is embedded at the center of the bottom surface of the switch body and communicates with the cooling pipe to form a loop pipeline.

[0012] Furthermore, the cooling pipe is divided into a main pipe and branch pipes. There are two groups of branch pipes which are communicated with each other. One group is vertically inserted into the guiding holes of the heat conducting sleeve, and the other group is arranged in a mesh structure and inserted into the through holes. The main pipe is vertically arranged on the inner wall of the switch body and its two ends are respectively communicated with the branch pipes and the micro pump.

[0013] Furthermore, the cooling pipe is made of copper pipe or aluminum alloy pipe, and the heat conducting sleeve is a metal sleeve.

[0014] Compared with the prior art, the technical solution of the present application has the following beneficial technical effects:

[0015] 1. The present application improves on the existing heat dissipation structure of the switch, adopts a triple combination structure of heat conduction, water cooling and air cooling for heat dissipation, and can also keep the entire switch body in a closed state. Therefore, this switch can be applied to some harsh environments, can effectively isolate the interference of external factors while maintaining the heat dissipation function, greatly improves the stability of the switch operation, and increases the service life of the switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of the switch body and the fixed frame in this embodiment;

[0017] Figure 2 It is a schematic structural diagram of the top surface of the switch body in this embodiment;

[0018] Figure 3 It is a schematic structural diagram of the heat conducting sheet in this embodiment;

[0019] Figure 4 It is a sectional view of the heat conduction sleeve in this embodiment;

[0020] Figure 5 It is a schematic diagram of the conveying structure of the water cooling component in this embodiment;

[0021] Wherein: 1. Switch main body; 2. Fixed frame; 21. Support angle; 3. Guide fan; 31. Fixed plate; 4. Heat conduction sheet; 41. Through hole; 5. Water cooling component; 51. Cooling pipe; 511. Main pipe; 512. Branch pipe; 52. Heat conduction sleeve; 53. Micro pump; 54. Guide hole. Specific embodiments

[0022] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the specification of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0024] Combined with Figures 1-5 As shown, a switch heat dissipation device includes:

[0025] The switch main body 1, which is the main part of the switch and is composed of a housing and internal electronic components;

[0026] The fixed frame 2 is arranged on the top of the switch main body 1 to assist in fixing the air-cooled heat dissipation structure;

[0027] A plurality of guide fans 3 are provided and combined through a rectangular fixed plate 31, and are slidably inserted into the inside of the fixed frame 2 so that they can completely cover the top surface of the switch main body 1;

[0028] A number of heat conduction sheets 4 are provided and arranged in a mesh structure on the top surface of the switch main body 1 to export the heat inside the switch main body 1 by means of heat conduction;

[0029] The water cooling component 5 is arranged on the switch main body 1 and the heat conduction sheet 4 to further improve the heat dissipation efficiency in cooperation with the heat conduction and air-cooled structures.

[0030] Specifically; in this embodiment, four legs 21 extend downward from the four corners of the bottom surface of the fixed frame 2, and step surfaces are correspondingly arranged at the four corners of the top surface of the switch body 1. The four legs 21 just fit on the four step surfaces and are locked and fixed by bolts. Therefore, the staff can install or disassemble the entire air-cooling structure by loosening or tightening the bolts for subsequent maintenance or replacement.

[0031] A rectangular opening is arranged on the side wall of the fixed frame 2. A limiting groove is provided at the edge of the rectangular opening, and the rectangular opening extends inward and forms a sliding groove on the inner side wall of the fixed frame 2. Flanges are provided on the four sides of the outer surface of the fixing plate 31. At the same time, the two ends of the fixing plate 31 are respectively slidably inserted into the sliding groove. After being completely inserted into the fixed frame 2, the flanges just tightly fit in the limiting groove and are locked and fixed at its four corners respectively by bolts.

[0032] The guiding fan 3 is inside the fixed frame 2 and blows upward, so that the top surface of the switch body 1 can be exhausted, thereby quickly extracting its heat and achieving the purpose of cooling.

[0033] A groove is formed by recessing a part of the top surface of the switch body 1 downward, and the heat conducting sheet 4 is just arranged inside the groove and is arranged in a net shape through horizontal and vertical structures. The top surface of each heat conducting sheet 4 is flush with the top surface of the switch body 1, and through holes 41 are also arranged at intervals on the side wall of each heat conducting sheet 4. In addition, the heat conducting sheet 4 should be made of a metal sheet, which can be a heat dissipation aluminum fin or a heat dissipation copper sheet, so as to discharge the internal heat through heat conduction.

[0034] Combined Figure 3 As shown, the water-cooling assembly 5 includes a cooling pipe 51, a heat conducting sleeve 52 and a micro pump 53. Among them, four heat conducting sleeves 52 are provided and arranged in a rectangular array on the switch body 1 and penetrate through. A plurality of guiding holes 54 are also penetrated on the side wall of the heat conducting sleeve 52. The cooling pipe 51 sequentially passes through the guiding holes 54 and the through holes 41 on the heat conducting sheet 4 and converges on the bottom surface of the switch body 1 along the side wall. The micro pump 53 (which can adopt the MRB series micro gear pump of JONSN) is embedded at the center of the bottom surface of the switch body 1 and is communicated with the cooling pipe 51 to form a return pipeline.

[0035] The cooling pipe 51 is divided into a main pipe 511 and branch pipes 512. Among them, two groups of branch pipes 512 are provided and communicated with each other. One group is vertically inserted into the guiding holes 54 of the heat conducting sleeve 52, so that its bottom end is communicated with the micro pump 53, and the other group is arranged in a net structure and inserted into the through holes 41 and communicated with the first group of branch pipes 512. Therefore, the micro pump 53 can discharge the coolant into the net structure pipeline on the top surface to expand the contact range between the coolant and the heat conducting sheet 4 on the top surface;

[0036] The main pipe 511 is vertically arranged on the inner wall of the switch body 1, and its two ends are respectively connected and arranged with the branch pipe 512 and the micro pump 53, so as to recover the coolant after heat exchange and re-discharge it into the branch pipe 512 on the top surface again to continuously carry out the cooling treatment.

[0037] Moreover, in order to ensure the heat exchange effect of the above cooling pipe 51, the cooling pipe 51 should be set as a copper pipe or an aluminum alloy pipe.

[0038] Meanwhile, in the above structure, the heat conducting sleeve 52 should be arranged close to the electronic components inside the switch body 1, and it is also made of a heat-conducting metal material, such as copper or aluminum alloy. When the electronic components work, the heat will quickly be transferred to the surface through the heat conducting sleeve 52. The branch pipe 512 provided inside the heat conducting sleeve 52 can carry out heat exchange and cooling through the liquid and can also transfer the heat to the surface for heat dissipation. During the air extraction process of the top guide fan 3, the air flow speed at the heat conducting sleeve 52 can also be accelerated, so as to improve the heat dissipation efficiency on the surface of the heat conducting sleeve 52, so that the three structures of heat conduction, air cooling and water cooling are combined into a whole for heat dissipation. Compared with the general single heat dissipation system, its heat dissipation effect is better.

[0039] Combined Figure 5 As shown, the micro pump 53 conveys the coolant upwards. The coolant flows through the heat conducting sleeve 52 and cooperates with it for preliminary heat dissipation, and then diffuses through the mesh branch pipe 512 on the top surface, so that it covers the top surface of the switch body 1 and cooperates with the heat conducting fin 4 for heat dissipation. At the same time, the guide fan 3 blows air upwards and extracts the heat on the heat conducting fin 4. In this structure, the branch pipe 512 can be further set as a finned tube structure to further improve the heat dissipation effect. Moreover, some small holes can be appropriately opened between the heat conducting fins 4, so that air can flow in the mesh grid, so as to cool the coolant inside the branch pipe 512. The coolant after cooling returns to the micro pump 53 through the main pipe 511 arranged inside the side wall of the switch body 1 and is subjected to the second cycle of conveying.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device for a switch, characterized in that: The switch body (1) comprises a switch body (1), a fixed frame (2) being detachably mounted on the top of the switch body (1), a fan (3) being movably mounted on the fixed frame (2), a heat conducting sheet (4) being also disposed on the top surface of the switch body (1) and arranged so that the top surface is close to the bottom surface of the fan (3), and a water cooling component (5) is also disposed on the switch body (1) and is inserted into the switch body (1) and the heat conducting sheet (4).

2. A heat dissipation device for a switch according to claim 1, characterized in that: The fixed frame (2) is rectangular and has support angles (21) at the four corners of the bottom surface, respectively. The four corners of the top surface of the switch body (1) are correspondingly provided with step surfaces, and the support angles are fitted on the step surfaces and fixed by bolts.

3. A heat dissipation device for a switch according to claim 1, characterized in that: The side wall of the fixed frame (2) is provided with a rectangular opening, the rectangular opening extends inwardly and a slot is formed on the inner wall of the fixed frame (2), a plurality of the guide fans (3) are provided and are detachably mounted on the fixed plate (31), the fixed plate (31) is provided in a rectangular shape and its two ends are respectively slidably inserted into the inside of the slide groove, and a flange is also provided on the outward side of the fixed plate (31), and a limiting groove is provided on the edge of the rectangular opening and is fixedly fitted with the flange.

4. A heat dissipation device for a switch according to claim 1, characterized in that: The heat conducting sheet (4) is a rectangular metal sheet vertically arranged on the top surface of the switch body (1), and each heat conducting sheet (4) is provided with a plurality of through holes (41) arranged at intervals.

5. A heat dissipation device for a switch according to claim 4, characterized in that: The water cooling assembly (5) comprises a cooling pipe (51), a heat-conducting sleeve (52) and a micro pump (53), wherein the heat-conducting sleeve (52) is arranged on the switch body (1) and penetrates from top to bottom, and the heat-conducting sleeve (52) is also penetrated by a plurality of guide holes (54), the cooling pipe (51) passes through the guide holes (54) and the through hole (41) in sequence and converges along the side wall to the bottom surface of the switch body (1), and the micro pump (53) is embedded in the center of the bottom surface of the switch body (1) and communicates with the cooling pipe (51) to form a meandering pipeline.

6. A heat dissipation device for a switch according to claim 5, characterized in that: The cooling pipe (51) is divided into a main pipe (511) and a branch pipe (512), wherein the branch pipe (512) is provided in two groups and is connected to each other, one group is vertically inserted into the guide hole (54) of the heat-conducting sleeve (52), and the other group is arranged in a mesh structure and is inserted into the through hole (41); the main pipe (511) is vertically arranged on the inner wall of the switch body (1) and its two ends are respectively connected to the branch pipe (512) and the micro pump (53).

7. A heat dissipation device for a switch according to claim 6, characterized in that: The cooling tube (51) is a copper tube or an aluminum alloy tube, and the heat-conducting sleeve (52) is a metal sleeve.

Images