Glue seepage prevention rotary coating and glue uniformizing jig and semiconductor rotary coating and glue uniformizing equipment comprising same

Abstract

The utility model discloses an anti-seepage glue spin-coating and glue-uniformizing jig and semiconductor spin-coating and glue-uniformizing equipment comprising the jig, the jig comprises a jig body, the spin-coating surface of the jig body is provided with a bearing groove for bearing a special-shaped sheet, and the shape contour of the bearing groove is matched with the shape contour of the special-shaped sheet; a sealing groove used for loading a sealing piece is formed in the groove bottom face of the bearing groove, the sealing groove is formed in the position close to the edge of the bearing groove and distributed along the contour of the bearing groove, and the sealing piece is used for sealing a side face gap between the special-shaped piece and the bearing groove; an inner glue storage groove used for storing glue permeating inwards is further formed in the groove bottom face of the bearing groove, and the inner glue storage groove is formed in the position close to the sealing groove. According to the utility model, the problem of glue permeation on the back of the special-shaped sheet can be effectively solved, the production time is effectively saved, the subsequent process and automatic production are more convenient, and the yield of products is improved.

Description

Technical Field

[0001] The utility model specifically relates to an anti-seepage glue spin coating and leveling fixture and a semiconductor spin coating and leveling device including the fixture. Background Technique

[0002] At present, there are diversified appearance and functional product shape requirements in consumer electronic component products. For example, the back cover of a mobile phone, the front screen or the PAD screen. In most of the new technology requirements, semiconductor mask patterning etching is involved, so as to achieve the result of forming micro-textures on the optical glass substrate, thereby realizing some optical characteristics and effects of the empowered substrate. The development of this cutting-edge technology requires semiconductor processes for square or irregular sizes. At present, for square wafer coating, the large-area spraying glue process is basically used. After production, cutting is carried out according to the corresponding size, which is not conducive to the development of the R & D process, wastes material costs, and the film thickness uniformity is not easy to control, resulting in relatively large losses in the early-stage technology development.

[0003] Application No. 202322698125.3 discloses a spin coating and leveling fixture and a semiconductor spin coating and leveling device including the fixture. However, after the leveling fixture rotates and levels the glue, the excess imprinting glue penetrates and remains on the back of the square wafer, which is not conducive to the subsequent processes and automated production.

[0004] If not cleaned, it will contaminate each station or the surface processing area of the 2D wafer in the subsequent process, resulting in abnormal processing accuracy and failing to achieve the required effect.

[0005] At the current stage, when cleaning the back imprinting glue, since the surface imprinting glue needs to be retained to endow the substrate with some optical characteristics and effects, the whole wafer cannot be directly cleaned. And it is very easy to damage the imprinting area when manually holding it and contacting the front side. At present, only a suction pen can be used to adsorb the back of the 2D wafer and then wipe it with acetone, which seriously affects the production efficiency and manpower. Summary of the Utility Model

[0006] In order to solve the above technical problems, the utility model provides an anti-seepage glue spin coating and leveling fixture and a semiconductor spin coating and leveling device including the fixture.

[0007] In order to achieve the above purpose, the technical solution of the utility model is as follows:

[0008] On the one hand, the utility model discloses an anti-seepage glue spin coating and leveling fixture, including: a fixture body, and a carrying groove for carrying an irregular wafer is arranged on the spin coating surface of the fixture body, and the shape contour of the carrying groove matches the shape contour of the irregular wafer;

[0009] On the bottom surface of the bearing groove, there is a sealing groove for loading a sealing member. The sealing groove is arranged near the edge of the bearing groove and distributed along the contour of the bearing groove. The sealing member is used to seal the side gap between the special-shaped piece and the bearing groove.

[0010] On the bottom surface of the bearing groove, there is also an internal glue storage groove for storing the glue that seeps inwards. The internal glue storage groove is arranged near the sealing groove.

[0011] On the basis of the above technical solutions, the following improvements can be made:

[0012] As a preferred solution, the bottom surface area of the internal glue storage groove near the center of the fixture body is higher than the bottom surface area of the internal storage groove near the edge of the fixture body.

[0013] As a preferred solution, the bottom surface of the internal glue storage groove is an inclined surface or a stepped surface.

[0014] As a preferred solution, an external glue discharge groove and a glue discharge channel communicating with the external glue discharge groove are also provided on the fixture body. The external glue discharge groove is distributed along the outer contour of the bearing groove on the outer periphery of the bearing groove, and the glue discharge channel is used to discharge the excess glue.

[0015] As a preferred solution, the depth of the external glue discharge groove is greater than the depth of the bearing groove.

[0016] As a preferred solution, an adsorption hole communicating with the cavity of the bearing groove is provided on the fixture body.

[0017] As a preferred solution, a number of mutually connected ventilation grooves are distributed on the bottom surface of the bearing groove, and the ventilation grooves communicate with the adsorption holes.

[0018] As a preferred solution, a top sheet hole is provided on the fixture body for the ejector pin to pass through to eject the special-shaped piece in the bearing groove.

[0019] In addition, on the other hand, the present utility model also discloses a semiconductor spin coating and leveling device, including any one of the above anti-seepage glue spin coating and leveling fixtures.

[0020] The present utility model discloses an anti-seepage glue spin coating and leveling fixture and a semiconductor spin coating and leveling device including the fixture, which has the following beneficial effects:

[0021] First, the side gap between the special-shaped piece and the bearing groove is sealed by the sealing member, so that the excess glue is blocked and will not flow to the back of the special-shaped piece.

[0022] Second, an internal glue storage groove is also provided on the bottom surface of the bearing groove. When there is still some glue flowing in from the side gap between the special-shaped piece and the bearing groove, it flows into the internal glue storage groove to prevent the glue from spreading on the back of the special-shaped piece.

[0023] Thirdly, the utility model can effectively solve the problem of glue seepage on the back of special-shaped wafers, effectively save production time, make the subsequent processes and automated production more convenient, and improve the product yield. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a schematic structural diagram of the anti-glue seepage spin coating and glue leveling fixture provided by the embodiment of the present utility model.

[0026] Figure 2 is Figure 1 the sectional view taken along A-A' in

[0027] Figure 3 It is a schematic diagram of the internal glue storage tank provided by the embodiment of the present utility model.

[0028] Figure 4 It is another schematic diagram of the internal glue storage tank provided by the embodiment of the present utility model.

[0029] Wherein: 1-fixture body, 11-bearing groove, 12-sealing groove, 13-internal glue storage tank, 14-external glue discharge groove, 15-glue discharge channel, 16-adsorption hole, 17-ventilation groove 2-sealing member. Detailed Embodiment

[0030] The preferred embodiments of the present utility model will be described in detail below with reference to the drawings.

[0031] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0032] In addition, the expression "including" elements is an "open" expression. This "open" expression only means that there are corresponding components, and should not be interpreted as excluding additional components.

[0033] In order to achieve the purpose of the present utility model, in some embodiments of the anti-glue seepage spin coating and glue leveling fixture and the semiconductor spin coating and glue leveling equipment including the fixture, such as Figure 1-2As shown in the figure, the anti-seepage glue spin-coating and leveling fixture includes: a fixture body 1, and a loading groove 11 for carrying special-shaped wafers (such as square wafers, etc.) is provided on the spin-coating surface of the fixture body 1, and the shape contour of the loading groove 11 matches the shape contour of the special-shaped wafer;

[0034] A sealing groove 12 for loading a sealing member (such as a sealing ring, etc.) is provided on the bottom surface of the loading groove 11. The sealing groove 12 is arranged at a position close to the edge of the loading groove 11 and is distributed along the contour of the loading groove 11. The sealing member is used to seal the side gap between the special-shaped wafer and the loading groove 11;

[0035] An internal glue storage groove 13 for storing the glue that seeps inwards is also provided on the bottom surface of the loading groove 11. The internal glue storage groove 13 is arranged at a position close to the sealing groove 12.

[0036] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, and the difference lies in that the bottom surface area of the internal glue storage groove 13 close to the center of the fixture body 1 is higher than the bottom surface area of the internal storage groove close to the edge of the fixture body 1.

[0037] By adopting the above scheme, it is possible to effectively prevent the glue in the internal glue storage groove 13 from flowing towards the center of the fixture body 1.

[0038] Among them, the bottom surface of the internal glue storage groove 13 is an inclined surface (as shown in Figure 3 the figure) or a stepped surface (as shown in Figure 4 the figure).

[0039] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, and the difference lies in that an external glue discharge groove 14 and a glue discharge channel 15 communicating with the external glue discharge groove 14 are further provided on the fixture body 1. The external glue discharge groove 14 is distributed along the outer contour of the loading groove 11 on the outer periphery of the loading groove 11, and the glue discharge channel 15 is used to discharge the excess glue.

[0040] Among them, the depth of the external glue discharge groove 14 is greater than the depth of the loading groove 11.

[0041] The external glue discharge groove 14 is used to timely discharge the excess glue at the edge of the special-shaped wafer, preventing the excess glue from accumulating at the edge of the special-shaped wafer.

[0042] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, and the difference lies in that an adsorption hole 16 communicating with the cavity of the loading groove 11 is provided on the fixture body 1.

[0043] Among them, the adsorption hole 16 is arranged at the central position of the bearing groove 11, and the special-shaped piece is adsorbed and fixed in the bearing groove 11 by means of vacuum pumping. It should be noted that the number of adsorption holes 16 is not limited to 1, and can be 2, 3, etc., and its position is not limited to the center of the bearing groove 11.

[0044] Furthermore, a number of mutually connected ventilation grooves are distributed on the bottom surface of the bearing groove 11, and the ventilation grooves are communicated with the adsorption hole 16.

[0045] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, and the difference lies in that a top sheet hole is provided on the jig body 1, and the top sheet hole is used for the ejector pin to pass through to eject the special-shaped piece in the bearing groove 11.

[0046] When it is necessary to take out the special-shaped piece from the bearing groove 11, the ejector pin passes through the top sheet hole, thereby realizing the taking out of the special-shaped piece. In some embodiments, the top sheet hole and the adsorption hole 16 are the same through hole.

[0047] The above-mentioned multiple embodiments can be implemented in a cross-parallel manner.

[0048] The embodiment of the present invention also discloses a semiconductor spin coating and leveling equipment, including the anti-seepage glue spin coating and leveling jig disclosed in any one of the above embodiments.

[0049] The present invention can effectively solve the problem that in the existing semiconductor spin coating and leveling equipment, after the special-shaped piece is spin coated and leveled, the back surface of the special-shaped piece is affected by the glue seepage residue, which affects the subsequent processes and automated production.

[0050] The present invention discloses an anti-seepage glue spin coating and leveling jig and a semiconductor spin coating and leveling equipment including the jig, which has the following beneficial effects:

[0051] First, the side gap between the special-shaped piece and the bearing groove 11 is sealed by a sealing member, so that the excess glue is blocked and will not flow to the back surface of the special-shaped piece.

[0052] Second, an inner glue storage groove 13 is also provided on the bottom surface of the bearing groove 11. When part of the glue still flows in from the side gap between the special-shaped piece and the bearing groove 11, it flows into the inner glue storage groove 13 to prevent the glue from spreading on the back surface of the special-shaped piece.

[0053] Third, the present invention can effectively solve the problem of glue seepage on the back surface of the special-shaped piece, effectively save production time, make the subsequent processes and automated production more convenient, and improve the product yield.

[0054] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "center", "both ends", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0055] In the present utility model, unless otherwise clearly specified and defined, the terms "installed", "set", "connected", "fixed", "swivelly connected", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0056] The above shows and describes the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. Anti-seepage glue spin coating and glue leveling fixture, characterized in that: include: A fixture body, wherein a bearing groove for bearing the special-shaped sheet is provided on the spin-coating surface of the fixture body, and the shape contour of the bearing groove matches the shape contour of the special-shaped sheet; A sealing groove for loading a sealing member is provided on the bottom surface of the bearing groove, the sealing groove is arranged near the edge of the bearing groove and distributed along the contour of the bearing groove, and the sealing member is used to seal the side gap between the special-shaped sheet and the bearing groove; An inner glue storage groove for storing the glue that penetrates inward is also provided on the bottom surface of the bearing groove, and the inner glue storage groove is arranged at a position close to the sealing groove.

2. The anti-seepage glue spin coating and glue leveling jig according to claim 1, characterized in that: The bottom surface area of ​​the inner glue storage tank close to the center of the fixture body is higher than the bottom surface area of ​​the inner glue storage tank close to the edge of the fixture body.

3. The anti-seepage glue spin coating and glue leveling jig according to claim 2, characterized in that: The bottom surface of the inner glue storage tank is an inclined surface or a stepped surface.

4. The anti-seepage glue spin coating and glue leveling jig according to claim 1, characterized in that: The fixture body is also provided with an external glue discharge groove and a glue discharge channel connected with the external glue discharge groove. The external glue discharge groove is distributed on the outer periphery of the bearing groove along the outer contour of the bearing groove. The glue discharge channel is used to discharge excess glue.

5. The anti-seepage glue spin coating and glue leveling jig according to claim 4, characterized in that: The depth of the outer glue discharge groove is greater than the depth of the bearing groove.

6. The anti-seepage glue spin coating and glue leveling jig according to any one of claims 1 to 5, characterized in that: The fixture body is provided with an adsorption hole which is communicated with the groove cavity of the bearing groove.

7. The anti-seepage glue spin coating and glue leveling jig according to claim 6, characterized in that: A plurality of mutually connected ventilation grooves are distributed on the bottom surface of the bearing groove, and the ventilation grooves are connected with the adsorption holes.

8. The anti-seepage glue spin coating and glue leveling jig according to any one of claims 1 to 5, characterized in that: The fixture body is provided with an ejector hole, and the ejector pin is used to pass through the ejector hole to eject the special-shaped piece in the bearing groove.

9. Semiconductor spin coating and dispensing equipment, characterized in that: It comprises the anti-seepage glue spin coating and glue leveling jig as described in any one of claims 1 to 8.

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