Cutting fluid circulating system and wire cutting device

Abstract

The utility model provides a cutting fluid circulation system and wire cutting device, including liquid collection device and flushing device, flushing device is used for providing cutting fluid to cutting area, liquid collection device includes liquid collection end and liquid outlet end, liquid collection end is used for collecting cutting fluid after acting on cutting area, and liquid outlet end is used for discharging the cutting fluid. The liquid outlet end is communicated with the flushing device so that cutting liquid can flow circularly. A new liquid connector used for filling new cutting liquid is arranged between the liquid collecting device and the flushing device. The content of the silicon powder in the cutting liquid of the cutting liquid circulating system can be adjusted in the cutting process, the step of cleaning the liquid supply cylinder is omitted, and the cutting quality and the cutting efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wire cutting equipment, and particularly to a cutting fluid circulation system and a wire cutting device. Background Art

[0002] A wire cutting equipment refers to a device that realizes cutting (such as truncating, squaring, slicing, etc.) of a workpiece to be cut (such as photovoltaic silicon, sapphire, semiconductor, silicon carbide, magnetic material, etc.) through relative movement between a cutting wire and the workpiece to be cut. Taking a slicing machine for cutting a silicon rod as an example, during wire cutting, the silicon rod to be cut is fixed on a feeding mechanism, and the feeding mechanism drives the silicon rod to move relative to a wire cutting mesh to realize slicing. During the cutting process, in order to ensure the cutting performance of the cutting wire, it is necessary to continuously spray cutting fluid onto the wire cutting mesh. One is to cool the cutting wire, the second is to disperse and wash the cut silicon powder, and the third is to lubricate the wire cutting mesh. As Figure 1 shown, the cutting fluid circulation system in the prior art includes a liquid collecting device 2, a liquid supply device 3 (a liquid supply cylinder in the prior art), a liquid supply pump, a second filtering device 4, etc. connected by a liquid supply pipeline, so as to realize the cyclic supply of cutting fluid during the cutting process (in the figure, the liquid collecting device is connected to other devices through a return pipeline, and control valves are respectively arranged on the return pipeline, and the purpose is only to drain the residual cutting fluid in other devices when the cutting fluid circulation system stops working).

[0003] However, the silicon powder generated during the cutting process continuously enters the cutting fluid, causing the silicon powder content in the cutting fluid to gradually increase. The cutting fluid containing silicon powder enters the liquid supply cylinder, and then enters the second filtering device through the liquid supply pump to filter out the impurities in the cutting fluid and then be used for spraying. It should be noted that the silicon powder will not be filtered out in the second filtering device. Therefore, as the cutting operation progresses, the silicon powder content in the cutting fluid gradually increases. The silicon powder in the cutting fluid will reduce the lubrication and cooling effects of the cutting fluid, increase the probability of the cutting wire jumping and breaking, and thus affect the cutting quality. At the same time, during the whole process, substances such as silicon powder will precipitate and accumulate on the inner wall of the liquid supply cylinder. Therefore, after each cutting is completed or regularly, the liquid supply cylinder needs to be specially drained and cleaned, and then new cutting fluid is introduced for the next cutting liquid supply; the inner wall of the pipeline of the cutting fluid circulation system will also deposit silicon powder and needs to be cleaned regularly. The above processes of draining and cleaning take a long time, and the wire cutting device needs to stop and wait for operation during this time, reducing the working efficiency of the equipment.

[0004] In summary, there is an urgent need for a new cutting fluid circulation system to solve the problems existing in the prior art. Summary of the Utility Model

[0005] In view of the above technical problems, the technical solution of the present utility model provides a cutting fluid circulation system and a wire cutting device, which are conducive to adjusting the content of silicon powder in the cutting fluid of the cutting fluid circulation system during the cutting process, saving the step of cleaning the liquid supply cylinder, and improving the cutting quality and cutting efficiency.

[0006] The present utility model provides a cutting fluid circulation system, including a liquid collecting device and a flushing device. The flushing device is used to supply cutting fluid to the cutting area. The liquid collecting device includes a liquid collecting end and a liquid outlet end. The liquid collecting end is used to collect the cutting fluid after acting on the cutting area, and the liquid outlet end is connected to the flushing device to enable the cutting fluid to circulate; a new liquid interface for filling new cutting fluid is arranged between the liquid collecting device and the flushing device.

[0007] Further optimization of the technical solution of the present utility model further includes a liquid supply device, and the liquid supply device is connected to the new liquid interface.

[0008] Further optimization of the technical solution of the present utility model, a control valve is arranged between the liquid supply device and the new liquid interface.

[0009] Further optimization of the technical solution of the present utility model, the liquid supply device is a liquid supply cylinder or a centralized liquid supply system.

[0010] Further optimization of the technical solution of the present utility model further includes a liquid discharge port for discharging the old cutting fluid, and the liquid discharge port is located upstream of the new liquid interface.

[0011] Further optimization of the technical solution of the present utility model, the liquid collecting device includes a liquid collecting pool and a first filtering device. The first filtering device is arranged at the outlet of the liquid collecting pool, and the liquid discharge port is arranged in the liquid collecting pool.

[0012] Further optimization of the technical solution of the present utility model, the liquid collecting device further includes an overflow valve, and the overflow valve is arranged on the liquid discharge port.

[0013] Further optimization of the technical solution of the present utility model, the liquid collecting device further includes a funnel cylinder body, the funnel cylinder body is connected to the liquid collecting pool and is arranged below the liquid collecting pool.

[0014] Further optimization of the technical solution of the present utility model, the new liquid interface is arranged on the funnel cylinder body, and the control valve between the liquid supply device and the funnel cylinder body is a one-way valve.

[0015] Further optimization of the technical solution of the present utility model further includes a rotary cleaning device, and the rotary cleaning device is connected in parallel to the corresponding liquid delivery pipeline of the flushing device.

[0016] For further optimization of the technical solution of the present utility model, a second filtering device and a heat exchanger are sequentially connected between the liquid collecting device and the flushing device through an infusion pipeline, and the fresh liquid interface is located upstream of the heat exchanger.

[0017] For further optimization of the technical solution of the present utility model, the fresh liquid interface is arranged between the second filtering device and the heat exchanger or between the liquid collecting device and the second filtering device.

[0018] For further optimization of the technical solution of the present utility model, the number of the second filtering devices is two, and the two second filtering devices are respectively located between the liquid collecting device and the heat exchanger and between the heat exchanger and the flushing device.

[0019] For further optimization of the technical solution of the present utility model, a main pipeline flowmeter is arranged between the heat exchanger and the flushing device; a sub-pipeline flowmeter is arranged on the liquid supply branch connected to the fresh liquid interface.

[0020] For further optimization of the technical solution of the present utility model, a densitometer is arranged between the main flowmeter and the spraying device, and the densitometer is used to detect the density of the cutting fluid.

[0021] A wire cutting device includes the cutting fluid circulation system described above.

[0022] For further optimization of the technical solution of the present utility model, the wire cutting device includes a cutting chamber, the flushing device is arranged in the cutting chamber, and the liquid collecting device is arranged at the bottom of the cutting chamber.

[0023] For further optimization of the technical solution of the present utility model, the flushing device includes a left spraying unit and a right spraying unit, and the controller of the cutting fluid circulation system controls the corresponding flushing device to perform forward spraying by detecting the rotation direction of the cutting roller.

[0024] For further optimization of the technical solution of the present utility model, the wire cutting device is a slicing machine.

[0025] Compared with the prior art, the advantages of the technical solution of the present utility model are as follows:

[0026] 1. The cutting fluid circulation system of the present application is provided with a fresh liquid interface, and fresh cutting fluid is filled into the cutting fluid circulation system through the fresh liquid interface, which is beneficial to adjusting the content of silicon powder in the circulating cutting fluid, reducing the content of silicon powder in the circulating cutting fluid, thereby maintaining a good spraying effect, and being beneficial to improving the cutting quality and cutting efficiency. In addition, the liquid supply device does not participate in the circulation of the cutting fluid, avoiding the pollution of the liquid supply device by the cutting fluid containing silicon powder during the cutting process, saving the steps of sewage discharge and cleaning of the liquid supply device, and being beneficial to improving the cutting efficiency.

[0027] 2. For the cutting fluid circulation system of the present application, the liquid supply device only provides new cutting fluid, and an overflow valve is provided at the liquid discharge port of the liquid collection device. When new cutting fluid is filled through the liquid supply device, as the volume of the cutting fluid in the cutting fluid circulation system increases, the liquid level height of the liquid collection device rises. When the liquid level height is higher than the overflow valve, the old cutting fluid in the liquid collection device is discharged through the liquid discharge port, which is conducive to adjusting and controlling the content of silicon powder in the circulating cutting fluid, so that the content of silicon powder in the cutting fluid circulation system is maintained within a reasonable range, reducing the risk of jumper or wire breakage caused by too high silicon powder content in the cutting fluid, and reducing the risk of scratches on the cutting surface, which is beneficial to improving the cutting quality and cutting efficiency. In addition, for the wire cutting device using the cutting fluid circulation system of the present application, the installation space of the liquid supply device is saved, and thus the floor space occupied by the wire cutting device can be reduced.

[0028] 3. The cutting fluid circulation system of the present application can control the left spraying unit and the right spraying unit respectively according to the running direction of the cutting wire mesh, so that during the spraying process, the spraying direction of the cutting fluid is the same as the running direction of the cutting wire mesh, that is, keep the spraying in the same direction as the movement, which is beneficial to reducing the problem of cutting fluid splashing during the cutting process, improving the working environment in the cutting chamber, and further reducing the risk of wire breakage or jumper caused by liquid splashing, back-splashing, etc.

[0029] 4. The cutting fluid circulation system of the present application can update the cutting fluid during the cutting process, which is beneficial to keeping the cutting fluid in good lubricating and cooling performance; in addition, after the cutting is completed, the cutting fluid circulation system of the present application can optionally use brand-new cutting fluid to clean the cutting chamber, with better cleaning effect, more convenient use, and higher working efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Hereinafter, the present utility model will be described in more detail based on embodiments and with reference to the drawings.

[0031] Figure 1 is a schematic structural diagram of a cutting fluid circulation system in the prior art;

[0032] Figure 2 is a schematic structural diagram of the new liquid interface of the cutting fluid circulation system of the present invention arranged on the funnel cylinder;

[0033] Figure 3 is a schematic structural diagram of the new liquid interface of the cutting fluid circulation system of the present invention arranged between the funnel cylinder and the first liquid supply pump;

[0034] Figure 4 is a schematic structural diagram of the new liquid interface of the cutting fluid circulation system of the present invention arranged on the funnel cylinder and with an initial liquid inlet provided at the same time;

[0035] Figure 5It is a schematic diagram of spray control of the spray device in the cutting liquid circulation system of the present invention under different rotation directions of the cutting roller.

[0036] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale.

[0037] Description of labels:

[0038] 1-flushing device; 11-left spray unit; 12-right spray unit; 13-cutting roller; 14-cutting wire net; 2-liquid collecting device; 21-first filtering device; 22-overflow valve; 23-funnel cylinder; 24-liquid collecting tank; 3-liquid supply device; 31-liquid supply branch; 4-second filtering device; 5-heat exchanger; 6-ditch; 61-reflux pipeline; 71-first liquid supply pump; 72-second liquid supply pump; 8-flow meter; 81-main flow meter; 82-secondary flow meter; 9-rotating cleaning device. DETAILED DESCRIPTION

[0039] The following is a specific embodiment of the present invention. People familiar with the technology can easily understand the other advantages and functions of the present invention from the contents disclosed in this specification. Obviously, the described embodiment is a part of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0041] It should also be noted that the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a product or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such product or system. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the product or system including the elements. In the description of the present utility model, it should be understood that the terms "upper", "lower", "bottom", "top", "front", "back", "inside", "outside", "left", "right" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model.

[0042] The following will be combined with the attached Figures 1-5 The utility model is further described.

[0043] In the field of wire cutting technology, taking photovoltaic silicon rod cutting as an example, a wire cutting device is usually used in the process of processing silicon rods. Since the high-speed cutting wire will generate a lot of heat when cutting silicon rods, it will also generate cutting powder (silicon powder). In order to ensure the working performance of the cutting wire, cutting fluid is usually sprayed on the cutting wire net. The purpose is to lubricate and cool the cutting wire, silicon rod and other mechanisms; second, it can wash away the silicon powder generated in the cutting process. Therefore, when the online cutting device is working, as the cutting time increases, the content of silicon powder in the circulating cutting fluid will continue to increase. Because the filtering device cannot filter out the silicon powder, the increase in the silicon powder content in the cutting fluid will inevitably reduce the lubrication and cooling effects, thereby increasing the probability of wire jumpers and breakages, and aggravating the cutting line marks on the cutting surface, reducing the cutting quality and cutting efficiency. At the same time, due to the cutting fluid circulation system in the prior art, such as Figure 1 As shown, the liquid supply device 3 (specifically, the liquid supply cylinder) participates in the entire cutting liquid circulation system and provides a transfer function for the cutting liquid (that is, after the spraying is completed, the cutting liquid containing silicon powder is collected and first enters the liquid supply cylinder, and then is transported to the flushing device again after transfer and storage in the liquid supply cylinder). As a result, silicon powder and other impurities will adhere to the inner wall of the liquid supply cylinder. Therefore, the cutting liquid in the liquid supply cylinder needs to be discharged regularly and the liquid supply cylinder needs to be cleaned, which is time-consuming and labor-intensive. At the same time, the wire cutting device is in standby mode during the process, which reduces work efficiency.

[0044] In view of the problems existing in the prior art, the technical solution of the present application provides a cutting fluid circulation system, including a flushing device for supplying cutting fluid to the cutting area. (The flushing device supplies cutting fluid to the cutting area, which can be in the form of spraying cutting fluid onto the cutting area, or in the case of immersion cutting, filling the debris box containing the cutting fluid with cutting fluid. In the present application, for the convenience of description, the main description is based on the method of spraying cutting fluid, but spraying cutting fluid or filling the debris box containing the cutting fluid with cutting fluid both fall within the protection scope of the present application), and a liquid collecting device for collecting the cutting fluid after it acts on the cutting area. The liquid collecting device is connected to the flushing device to enable the cutting fluid to circulate in the cutting fluid circulation system; a new liquid interface for filling new cutting fluid into the cutting fluid circulation system is arranged between the liquid collecting device and the flushing device, which can fill new cutting fluid during the flushing process to adjust or control the content of silicon powder in the cutting fluid circulation system, keep the silicon powder content within a reasonable range, and thus improve the cutting quality. The cutting fluid circulation system of the present application can selectively access a second filtering device 4, a heat exchanger, etc. In this embodiment, the description is based on accessing the second filtering device 4 and the heat exchanger. When applied to a specific wire slicing machine, the cutting fluid sprayed by the flushing device converges to the liquid collecting end of the liquid collecting device (the liquid collecting end of the liquid collecting device 2 is the end where the cutting fluid flows in, and the liquid outlet end is the end where the whole liquid collecting device 2 is connected to the downstream device); the liquid outlet end of the liquid collecting device 2 is connected to the inlet of the second filtering device 4 through a first liquid supply pump (for the convenience of description, this liquid supply pump is defined as the first liquid supply pump, and the liquid supply pump on the liquid supply branch pipe 31 below is defined as the second liquid supply pump) 71, and the outlet of the second filtering device 4 is connected to the inlet of the flushing device 1 through a heat exchanger, thereby forming a closed-loop system for the circulation of the cutting fluid.

[0045] In one embodiment, the new liquid interface of the cutting fluid circulation system of the present application is connected to a liquid supply device 3. Preferably, as Figure 3 shown, the connection new liquid interface is arranged between the liquid collecting device 2 and the first liquid supply pump 71, and a control valve is arranged on the liquid supply branch pipe 31 between the liquid supply device 3 and the new liquid interface. By adjusting this valve, it is possible to control the liquid supply device 3 to provide new cutting fluid for the cutting fluid circulation system.

[0046] To further improve the filtering effect of the cutting fluid circulation system, two second filtering devices 4 are arranged in the cutting fluid circulation system of the present application. One second filtering device 4 is connected between the liquid collecting device and the heat exchanger, and the other second filtering device 4 is connected between the heat exchanger 5 and the flushing device 1, so as to double-filter the circulating cutting fluid, prevent large-particle impurities from entering the flushing device, and avoid the risk of the cutting wire breaking or jumping caused by large-particle impurities.

[0047] A liquid discharge port for discharging the old cutting fluid is also provided in the cutting fluid circulation system of the present application, which is beneficial to the liquid supply balance of the cutting fluid in the cutting fluid circulation system. While new cutting fluid is filled through the new liquid interface, the old cutting fluid can be discharged through the liquid discharge port, thereby reducing the silicon powder content of the cutting fluid in the cutting fluid circulation system and achieving the purpose of adjusting the silicon powder content in the cutting fluid circulation system.

[0048] Preferably, the liquid discharge port is located upstream of the new liquid interface (the upstream described in this technical solution is determined according to the flow direction of the cutting fluid in the liquid delivery pipeline. For example, if the cutting fluid flows from the liquid collection device to the second filtration device 4, then the position where the liquid collection device is located is upstream of the second filtration device 4), so that the newly injected cutting fluid will not be directly discharged.

[0049] The liquid supply device 3 in the technical solution of the present application is a liquid supply cylinder or a centralized liquid supply system, etc. Preferably, a corresponding second liquid supply pump 72 is provided on the liquid supply branch pipe 31 to control the liquid supply flow rate of the new cutting fluid; through this design, the volume of the wire cutting device can also be reduced, because in the prior art, the volume of the liquid supply cylinder is relatively large and is generally arranged at the bottom of the wire cutting device, and the wire cutting device needs to reserve space for storing the liquid supply cylinder. However, in this technical solution, only a new liquid interface needs to be provided on the wire cutting device, and there is no need to set a space for accommodating the liquid supply cylinder, thereby reducing the volume of the entire wire cutting device.

[0050] The liquid collection device 2 in the present application includes a liquid collection tank 24, an overflow valve 22 and a first filtration device 21. The first filtration device 21 is arranged at the outlet of the liquid collection tank 24 and can preliminarily filter impurities or foreign matters in the cutting fluid. The overflow valve 22 is arranged in the liquid collection tank 24. The overflow valve 22 is connected to the liquid discharge port and further communicates to the outside of the cutting fluid circulation system. Preferably, it communicates to the trench 6. In an alternative embodiment, the liquid discharge port can be directly arranged in the liquid collection tank 24, and the overflow valve can be installed on the liquid discharge port. In this way, the overflow valve 22 is higher than the bottom surface of the liquid collection tank 24, and only when the liquid level in the liquid collection tank 24 rises to the height of the overflow valve can the cutting fluid containing silicon powder after spraying be discharged. Specifically, when the liquid supply device 3 injects new cutting fluid into the cutting fluid circulation system, since the volume of the cutting fluid in the cutting fluid circulation system is certain, the volume of the cutting fluid participating in the circulation in the cutting fluid circulation system will increase, thereby causing the liquid level of the cutting fluid in the liquid collection tank 24 to rise. The cutting fluid containing silicon powder will directly flow through the overflow valve 22 into the sewage pipeline of the liquid discharge port and then be discharged from the cutting fluid circulation system, thereby realizing the replacement of the old and new cutting fluids and the adjustment of the silicon powder content in the cutting fluid, which is beneficial to improving the spraying quality of the cutting fluid.

[0051] Preferably, when the liquid discharge port is directly arranged in the liquid collecting tank 24, a control switch is arranged on the sewage pipeline of the liquid discharge port. When new cutting fluid is filled into the cutting fluid circulation system, the control switch is turned on simultaneously to discharge the old cutting fluid containing silicon powder, and optionally, it is discharged into the trench 6.

[0052] Preferably, a funnel cylinder 23 is arranged at the lower part of the liquid collecting device 2. The inlet end of the funnel cylinder 23 is communicated with the liquid collecting tank 24, and the outlet end is communicated with the second filtering device 4 (when the funnel cylinder 23 is arranged on the liquid collecting device 2, the outlet end of the funnel cylinder 23 is the liquid outlet end of the liquid collecting device). The funnel cylinder 23 is beneficial to improving the stability of the supply of the cutting fluid in the cutting fluid circulation system to the second filtering device 4. At the same time, by changing the number or volume of the funnel cylinders 23, the overall volume of the cutting fluid circulation system can be adjusted.

[0053] In another embodiment, as Figure 2 shown, the new liquid interface is arranged on the funnel cylinder 23. The liquid supply device 3 filled with new cutting fluid is communicated with the funnel cylinder 23, and a second liquid supply pump 72 is arranged on the pipeline between the liquid supply device 3 and the funnel cylinder 23. A one-way valve is arranged between the second liquid supply pump 72 and the funnel cylinder 23 (when the liquid supply device 3 is a liquid supply cylinder, the control valve between the liquid supply cylinder and the new liquid interface is set as a one-way valve), which can prevent the cutting fluid in the funnel cylinder from flowing back to the liquid supply cylinder and polluting the new cutting fluid in the liquid supply device 3 when abnormal shutdown occurs. Another preferred implementation scheme is that in order to prevent the newly filled cutting fluid from directly entering the liquid collecting tank 24 and being discharged without passing through the flushing device, a one-way valve is also arranged between the funnel cylinder and the liquid collecting tank 24, so that the cutting fluid can only flow from the liquid collecting tank 24 to the funnel cylinder, thus avoiding the waste of the cutting fluid.

[0054] During the cutting process, the second liquid supply pump 72 extracts new cutting fluid from the liquid supply device 3 and makes it enter the funnel cylinder 23, and then participates in the cutting fluid circulation. When injecting new cutting fluid into the cutting fluid circulation system, since the volume of the cutting fluid in the connecting pipeline is certain, the liquid level in the liquid collecting tank 24 will rise. When the liquid level is higher than the overflow port height of the overflow valve, the cutting fluid enters the overflow port and then is discharged outside the cutting fluid circulation system through the liquid discharge port connected to the overflow valve. Preferably, it is discharged into the trench 6. During the cutting process, due to the continuous addition of new cutting fluid and the continuous discharge of the old cutting fluid containing silicon powder, the silicon powder contained in the old cutting fluid is also discharged together, so that the content of silicon powder in the whole cutting fluid circulation system is reduced, thereby realizing the control and adjustment of the content of silicon powder in the cutting fluid, and the control of the silicon powder content can be realized by adjusting the amount of replacement of the new and old cutting fluids.

[0055] In order to facilitate the cleaning and discharge of the cutting liquid in the cutting liquid circulation system in the present technical scheme, the second filter device 4, the heat exchanger 5 and the funnel cylinder 23 are respectively connected to the discharge port through the return pipe 61, and a control valve is provided on the corresponding return pipe 61. When the cutting is completed, the cutting liquid remaining in the cutting liquid circulation system (including the second filter device 4, the heat exchanger 5, the spray device 1 and the cutting liquid remaining in the funnel cylinder 23) can be directly discharged from the system by opening the control valve on the return pipe 61. Preferably, it is discharged into the ditch 6, and then new cutting liquid is filled into it through the liquid supply device 3. The next cutting can be carried out directly, avoiding the operation of draining and cleaning the liquid supply cylinder after use in the prior art, thereby reducing the investment in manpower and material resources and improving the cutting efficiency.

[0056] In a preferred embodiment, the cutting liquid circulation system of the present application is further provided with a rotary cleaning device 9, and the rotary cleaning device 9 is connected in parallel with the flushing device 1. The specific connection method is that the rotary cleaning device 9 and the flushing device 1 are respectively connected to the upstream heat exchanger through connecting pipes, and control valves are respectively provided on their respective connecting pipes, and the switching between the rotary cleaning device and the flushing device is achieved by opening and closing the corresponding control valves. The rotary cleaning device 9 is arranged in the cutting chamber. When the cutting is completed, the flushing device is closed, and the rotary cleaning device 9 is opened. The cutting environment is cleaned with the cutting liquid in the cutting liquid circulation system (which can be the circulating cutting liquid or the new cutting liquid filled by the liquid supply device 3). For example, when the cutting liquid circulation system of the present application is applied to a wire cutting machine, the rotary cleaning device 9 can clean the inner wall of the cutting chamber, which is convenient and quick, and is conducive to improving the cleaning efficiency of the cutting chamber.

[0057] By setting a main flow meter 81 between the heat exchanger and the spray device 1, it is convenient to monitor the amount of cutting liquid flowing into the spray device 1. Preferably, a densitometer is set on the main flow meter 81 or between the main flow meter 81 and the spray device 1, which can detect the density of the cutting liquid in the cutting liquid circulation system in real time, and calculate the concentration of silicon powder in the cutting liquid using the density formula and the molar concentration formula. By setting a fixed safety density value or a safety silicon powder concentration value in the controller of the cutting liquid circulation system (when setting the concentration value, the conversion formula needs to be programmed into the controller, and setting the density value only needs to convert the corresponding safety density value under a certain silicon powder concentration) to control the amount of new cutting liquid added to the circulating cutting liquid, the cutting liquid circulation system is more intelligent when working, and can use the best performance cutting liquid for spray cutting operations.

[0058] In order to facilitate the control of the amount of new cutting fluid filled into the cutting fluid circulation system, the present technical solution also provides a secondary flow meter 82 in the cutting fluid circulation system. The secondary flow meter 82 is arranged on the liquid supply branch 31 between the liquid supply device 3 and the new liquid interface. The secondary flow meter 8 can measure the amount of new cutting fluid added.

[0059] The present application also provides a wire cutting device, including a cutting chamber, a cutting roller and the cutting liquid circulation system described above. During the cutting process of the wire cutting device, the cutting roller 13 of the wire cutting device rotates alternately clockwise and counterclockwise, so that the corresponding cutting wire net 14 moves in a clockwise direction or a counterclockwise direction. When moving in a clockwise direction, the cutting liquid sprayed by the left spray unit 11 will enter the slit of the silicon rod driven by the moving cutting wire net. However, the cutting liquid sprayed by the right spray unit will be carried away by the cutting wire net in a direction away from the cutting joint and cannot act on the cutting position. Moreover, driven by the cutting wire net, the splashing degree of the cutting liquid will be aggravated. The present technical solution controls the flushing device 1 upstream of the moving direction of the cutting wire net 14 to work by detecting the rotation direction of the cutting roller 13 or the moving direction of the cutting wire net 14, so as to reduce the splashing degree of the cutting liquid, thereby improving the working environment in the cutting chamber. For example, when the cutting roller 13 rotates clockwise, only the left spray unit 11 is controlled to spray liquid, and when the cutting roller 13 rotates counterclockwise, only the right spray unit 12 is controlled to spray liquid. Figure 5 Schematic diagram of the rotation direction of the cutting roller 13 and the spray control of the flushing device. This method of controlling the spraying of the corresponding spraying components according to the rotation direction of the cutting roller 13 is called trend spraying.

[0060] The control method of the cutting fluid circulation system in the technical solution of the present application comprises the following steps:

[0061] S1, initial state, charging new cutting fluid into the cutting fluid circulation system.

[0062] Open the control valve between the liquid supply device 3 and the new liquid interface to fill the cutting fluid circulation system with the new cutting fluid in the liquid supply device 3. When filling with the new cutting fluid, the first liquid supply pump can be selected to provide the liquid infusion power, or the second liquid supply pump can be selected to provide the liquid infusion power. Specifically, for the first initial liquid filling method, when the new liquid interface is set between the funnel cylinder body 23 and the second filtering device 4, close the control valve between the first liquid supply pump and the funnel cylinder body 23, open the control valve between the first liquid supply pump and the liquid supply device 3 (which can be a liquid supply cylinder or a centralized liquid supply system), and start filling the cutting fluid circulation system with the new cutting fluid. When it is detected that the liquid level in the liquid collection pool 24 reaches the height of the overflow valve outlet, stop filling with the new cutting fluid. At this time, the cutting fluid circulation system is filled with the cutting fluid; the second initial liquid filling method is that when the new liquid interface is set on the funnel cylinder body, open the liquid supply control valve on the second liquid supply pump or the centralized liquid supply system, or the first liquid supply pump can also be selected to be opened simultaneously (at this time, the first liquid supply pump only provides power for the cutting fluid in the cutting fluid circulation system), and provide the new cutting fluid for the cutting fluid circulation system through the liquid supply device 3 until the liquid level in the liquid collection pool 24 reaches the height of the overflow valve outlet, then close the second liquid supply pump and the control valve between the funnel cylinder body 23 and the liquid supply device 3 to complete the initial liquid filling.

[0063] Another implementation method is as Figure 4 shown. The new liquid interface is set on the funnel cylinder body 23 and between the funnel cylinder body and the spraying device. Preferably, an initial liquid inlet 32 is provided between the funnel cylinder body and the first liquid supply pump. The initial liquid inlet 32 is connected to the liquid supply device. In the initial state, the new cutting fluid is filled into the cutting fluid circulation system through the initial liquid inlet 32 until the liquid level in the liquid collection pool 24 reaches the height of the overflow valve outlet, then close the initial liquid inlet 32 to complete the initial liquid filling. During the cutting process, the new cutting fluid is injected through the new liquid interface.

[0064] S2. When the cutting fluid is full, stop supplying the new cutting fluid and make the cutting fluid circulation system start to work.

[0065] In this step, the method for judging that the cutting fluid is full is as follows. The first method is to detect whether there is liquid flowing out of the overflow valve in the cutting pool, as specifically described in step S1 and will not be elaborated here; the second method is to set a liquid level gauge in the funnel cylinder body 23. The liquid level gauge feeds back the liquid level information in real time. When it is detected that the cutting fluid in the funnel cylinder body 23 is full, close the control valve between the liquid supply device 3 and the new liquid interface and make the cutting fluid circulation system start to work.

[0066] S3. Control the filling of the new cutting fluid according to the cutting progress.

[0067] By monitoring the cutting progress and controlling the filling of new cutting fluid in real time according to the cutting progress, specifically, the flow rate of the replenished new cutting fluid can be set according to the cutting depth of the silicon rod. For example, when the cutting depth of the silicon rod is less than 10 mm, the flow rate is set to 0, that is, no new cutting fluid is filled. As the cutting depth of the silicon rod increases, the content of silicon powder in the cutting fluid of the cutting fluid circulation system will become higher and higher. The flow rate of the replenished new cutting fluid is set to a certain value (the set value depends on the size of the silicon rod, the feed speed, and the diameter of the cutting wire used, that is, the flow rate of the replenished new cutting fluid is set according to the flow rate of the cut-off silicon powder). By filling new cutting fluid and discharging the old cutting fluid, the purpose of controlling the content of silicon powder in the cutting fluid circulation system is achieved.

[0068] An alternative technical solution is to set a time monitoring module. The time monitoring module is used to monitor the cutting time and set the flow rate of the filled new cutting fluid according to the cutting time. For example, first record the start time of the wire cutting device. In the first 15 minutes of cutting the silicon rod, the flow rate is set to 0, that is, no new cutting fluid is filled. As the cutting time extends, the content of silicon powder in the cutting fluid of the cutting fluid circulation system will become higher and higher. The flow rate of the replenished new cutting fluid is set to a certain value. By filling new cutting fluid and discharging the old cutting fluid, the purpose of controlling the content of silicon powder in the cutting fluid circulation system is achieved.

[0069] S4. After the workpiece cutting is completed, turn off the cutting fluid circulation system.

[0070] After cutting is completed, open the control valves between the funnel cylinder body 23, the second filtering device 4, the heat exchanger 5, etc. and the drain port respectively, and discharge the remaining cutting fluid in the cutting fluid circulation system into the trench 6, which can prevent the silicon powder in the remaining cutting fluid from depositing.

[0071] In the traditional cutting process, since the cutting fluid after spraying will splash when it touches the cutting wire mesh or the silicon rod during cutting, silicon powder, cutting fluid, etc. will also adhere to the inner wall of the cutting chamber. Therefore, step S41 is also set, that is, when the workpiece cutting is completed, close the control valve of the flushing device 1 and open the control valve of the rotary cleaning device 9 to allow the cutting fluid to clean the inner wall of the cutting chamber through the rotary cleaning device 9, where the rotary cleaning device is a rotary spray pipe. In this step, it is optional to use the circulating cutting fluid to clean the inner wall of the cutting chamber, or before cleaning the cutting chamber, open the reflux valve connected to the trench 6 in the circulating pipeline, discharge the cutting fluid containing a certain content of silicon powder, and then fill the cutting fluid circulation system with new cutting fluid to clean the inner wall of the cutting chamber.

[0072] Since the cutting equipment will be shut down for some reasons during operation, in order to avoid waste of the cutting fluid in the cutting equipment, step S31 is further set on the basis of step S3: when it is detected that the wire cutting device stops abnormally, the cutting fluid circulation system is closed, and step S2 is restarted when the wire cutting device returns to normal. Specifically, it can be determined whether to restart the cutting fluid circulation system by detecting the rotation information of the cutting roller through a sensor.

[0073] Preferably, this technical solution further includes step S5, that is, after the wire cutting device finishes cutting, the control valve on the drain pipe corresponding to the drain port of the liquid collecting device 2 is opened, and the control valve on the return pipe 61 corresponding to the second filtering device 4 is opened. All the cutting fluid in the cutting fluid circulation system is drained through the return pipe 61, and then the cutting fluid circulation system is filled with new cutting fluid. For details, refer to step S1, which will not be elaborated here. When the wire cutting device performs the tool withdrawal process, the flushing device is opened to spray the cutting fluid, which can improve the tool withdrawal efficiency and increase the cleanliness of the cut silicon wafer and the cutting wire mesh.

[0074] The control system for the cutting fluid circulating spray in this technical solution can be controlled in combination with a control circuit and a controller. Since those skilled in the art can implement it under the condition that the above control method and control structure are clear, no specific description will be made here.

[0075] Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0076] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0077] Although the present invention has been described with reference to the preferred embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A cutting fluid circulation system, characterized in that: It includes a liquid collecting device and a flushing device, the flushing device is used to provide cutting liquid to the cutting area, the liquid collecting device includes a liquid collecting end and a liquid outlet end, the liquid collecting end is used to collect the cutting liquid after acting on the cutting area, the liquid outlet end is connected with the flushing device to allow the cutting liquid to circulate; a new liquid interface for filling new cutting liquid is provided between the liquid collecting device and the flushing device.

2. The cutting fluid circulation system according to claim 1, characterized in that: It also includes a liquid supply device, which is connected to the new liquid interface.

3. The cutting fluid circulation system according to claim 2, characterized in that: A control valve is arranged between the liquid supply device and the new liquid interface.

4. The cutting fluid circulation system according to claim 2, characterized in that: The liquid supply device is a liquid supply cylinder or a centralized liquid supply system.

5. The cutting fluid circulation system according to claim 2, characterized in that: It also includes a drain port for discharging old cutting fluid, and the drain port is located upstream of the new fluid interface.

6. The cutting fluid circulation system according to claim 5, characterized in that: The liquid collecting device comprises a liquid collecting tank and a first filtering device, wherein the first filtering device is arranged on the outlet of the liquid collecting tank, and the liquid discharge port is arranged in the liquid collecting tank.

7. The cutting fluid circulation system according to claim 6, characterized in that: The liquid collecting device further comprises an overflow valve, and the overflow valve is arranged on the liquid discharge port.

8. The cutting fluid circulation system according to claim 7, characterized in that: The liquid collecting device further comprises a funnel cylinder, which is connected to the liquid collecting pool and is arranged below the liquid collecting pool.

9. The cutting fluid circulation system according to claim 8, characterized in that: The new liquid interface is arranged on the funnel cylinder, and the control valve between the liquid supply device and the funnel cylinder is a one-way valve.

10. The cutting fluid circulation system according to claim 9, characterized in that: It also includes an initial liquid inlet and a spray device. The initial liquid inlet is arranged between the funnel cylinder and the spray device, and the initial liquid inlet is connected to the liquid supply device through a liquid supply branch.

11. The cutting fluid circulation system according to any one of claims 1 to 8, characterized in that: It also includes a rotary cleaning device, which is connected in parallel to the infusion pipeline corresponding to the flushing device.

12. The cutting fluid circulation system according to claim 10, characterized in that: A second filtering device and a heat exchanger are sequentially connected between the liquid collecting device and the flushing device through a liquid infusion pipeline, and the new liquid interface is located upstream of the heat exchanger.

13. The cutting fluid circulation system according to claim 12, characterized in that: The new liquid interface is arranged between the second filtering device and the heat exchanger or between the liquid collecting device and the second filtering device.

14. The cutting fluid circulation system according to claim 13, characterized in that: There are two second filter devices, and the two second filter devices are respectively located between the liquid collecting device and the heat exchanger and between the heat exchanger and the flushing device.

15. The cutting fluid circulation system according to claim 12, characterized in that: A main flow meter is arranged between the heat exchanger and the flushing device; and a secondary flow meter is arranged on the liquid supply branch connected to the new liquid interface.

16. The cutting fluid circulation system according to claim 15, characterized in that: A densitometer is provided between the main flow meter and the spray device, and the densitometer is used to detect the density of the cutting fluid.

17. A wire cutting device, characterized in that: A cutting fluid circulation system comprising any one of claims 1-16.

18. The wire cutting device according to claim 17, characterized in that: The wire cutting device comprises a cutting chamber, the flushing device is arranged in the cutting chamber, and the liquid collecting device is arranged at the bottom of the cutting chamber.

19. The wire cutting device according to claim 18, characterized in that: The flushing device comprises a left spray unit and a right spray unit. The controller of the cutting liquid circulation system controls the corresponding flushing device to spray in accordance with the direction of rotation of the cutting roller by detecting the direction of rotation of the cutting roller.

20. The wire cutting device according to claim 18, characterized in that The wire cutting device is a slicer.

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