Jig for leveling product warped due to mold sealing

Abstract

The utility model provides a jig for leveling a product warped due to mold sealing, which comprises a base, a plurality of positioning blocks, a plurality of positioning blocks, a plurality of positioning blocks and a plurality of positioning blocks, the accommodating piece is arranged in the groove and comprises an accommodating space which is provided with an upward opening and is used for accommodating a product; the spring structure is arranged in the groove, is connected with the bottom surface of the accommodating part and is used for applying an acting force to the accommodating part in the opening direction; the upper cover is used for being arranged above the base and exerting downward acting force on the containing piece. The utility model aims to provide a jig for leveling a product which is warped due to mold sealing, so as to at least effectively level the product.

Description

Technical Field

[0001] The utility model relates to a fixture for flattening a warped product due to die encapsulation. Background Art

[0002] Figures 1 to 4 The die encapsulation process of the prior art is shown. Figure 1 The substrate 1 of the prior art is shown. Figure 2 It shows that the substrate 1 is die encapsulated using a die encapsulation mold 2 of the prior art, with the two die encapsulation molds 2 clamping the substrate 1 in the middle. Figure 3 It shows the substrate 1 after selective die encapsulation is completed, with a die encapsulation layer 3 formed on the substrate 1. Figure 4 It shows a single-piece (unit) product 4 after singulation. The product 4 has a smiling face shape on the side with the die encapsulation layer 3. Since the substrate 1 is very thin and the overall structure is uneven after die encapsulation, the product 4 is more susceptible to the shrinkage rate of the molding compound than a general product. After becoming a single piece, it is found that its warpage exceeds the specification, and the inspection result deviation (out of specification, OOS) / defect rate / yield loss averages about 3.33%.

[0003] The shape and material of the product 4 are fixed. Product process parameters have been tried to be adjusted, but the situation where the warpage exceeds the specification still cannot be overcome. In order to improve the yield problem at the process end, an attempt is made to make the product 4 return to a flat state, and this action is called flattening. Summary of the Utility Model

[0004] Aiming at the problems existing in the related art, the purpose of the utility model is to provide a fixture for flattening a warped product due to die encapsulation, so as to at least effectively flatten the product.

[0005] To achieve the above purpose, the utility model provides a fixture for flattening a warped product due to die encapsulation, including: a base, including a groove recessed from the top surface of the base; a receiving member, disposed in the groove and including a receiving space with an upward opening for placing the product; a spring structure, disposed in the groove and connected to the bottom surface of the receiving member, for applying a force to the receiving member in the direction of the opening; and an upper cover, for being disposed above the base and applying a downward force to the receiving member.

[0006] In some embodiments, the fixture further includes: a magnet, buried at the bottom of the receiving member.

[0007] In some embodiments, when the product is placed in the receiving member, the magnet applies a downward magnetic force to the product.

[0008] In some embodiments, the upper cover is made of a material that can be affected by the magnetic force of the magnet.

[0009] In some embodiments, the magnet is disposed on the central axis of the receiving member.

[0010] In some embodiments, the spring structure is disposed on the central axis of the receiving member.

[0011] In some embodiments, the projection of the spring structure and the magnet overlap in the vertical direction.

[0012] In some embodiments, when the upper cover is not covered on the base, the receiving member protrudes from the top surface of the base.

[0013] In some embodiments, when the upper cover is not covered on the base, the spring structure protrudes from the top surface of the base.

[0014] In some embodiments, when the upper cover is not covered on the base, the bottom surface of the accommodating space is higher than the top surface of the base in the vertical direction.

[0015] In some embodiments, when the product is placed in the receiving member and the upper cover is covered on the base, the top surface of the product contacts the upper cover.

[0016] In some embodiments, when the product is placed in the receiving member and the upper cover is covered on the base, the top surface of the product is flush with the top surface of the base.

[0017] In some embodiments, the upper cover includes positioning holes, and the base includes positioning posts, and the positioning holes and the positioning posts can be fitted with each other.

[0018] In some embodiments, the positioning holes and the positioning posts are respectively disposed at the corners of the upper cover and the base.

[0019] In some embodiments, the lateral dimension of the accommodating space is larger than the product.

[0020] In some embodiments, the base includes a plurality of grooves and receiving members and spring structures corresponding to the grooves one by one.

[0021] An embodiment of the present application further provides a jig for flattening a product warped due to die sealing, including: a base including a groove recessed from the top surface of the base; a receiving member disposed in the groove and including an accommodating space for placing the product with an upward opening; a spring structure disposed in the groove and connected to the bottom surface of the receiving member for applying a force to the receiving member in the direction of the opening; a magnet disposed at the bottom of the receiving member for adsorbing the product; and an upper cover for being disposed above the base and applying a downward force to the receiving member.

[0022] In some embodiments, the magnet is buried inside the receiving member and does not directly contact the product.

[0023] In some embodiments, both ends of the spring structure are respectively fixed to the groove and the receiving member.

[0024] In some embodiments, the base includes a plurality of grooves, accommodating members, magnets, and spring structures corresponding to the grooves one by one, and the plurality of grooves are arranged in an array.

[0025] The beneficial technical effects of the present utility model are as follows:

[0026] The jig of the embodiment of the present application levels the product through the cooperation of the upward elastic force provided by the spring structure and the downward pressure provided by the gravity of the upper cover itself, reducing the warpage of the product. Description of the Drawings

[0027] Figure 1 A substrate of the prior art is shown.

[0028] Figure 2 The encapsulation of the substrate using an encapsulation mold of the prior art is shown.

[0029] Figure 3 A substrate after selective encapsulation of the prior art is shown.

[0030] Figure 4 A single product after singulation of the prior art is shown.

[0031] Figure 5 A jig for leveling a product warped due to encapsulation according to an embodiment of the present application is shown.

[0032] Figure 6 Shown is Figure 5 A perspective view of one of the grooves and the accommodating member, spring structure, and magnet therein.

[0033] Figure 7 Shown is Figure 5 A cross-sectional view of one of the grooves and the accommodating member, spring structure, and magnet therein. Detailed Description of the Embodiments

[0034] To better understand the spirit of the embodiments of the present application, the following further describes some preferred embodiments of the present application.

[0035] The embodiments of the present application will be described in detail below. Throughout the specification of the present application, components that are the same or similar and components having the same or similar functions are denoted by similar reference numerals. The embodiments of the drawings described herein are illustrative, diagrammatic, and are used to provide a basic understanding of the present application. The embodiments of the present application should not be construed as a limitation of the present application.

[0036] As used herein, the terms "substantially", "generally", "essentially" and "about" are used to describe and account for minor variations. When used in connection with an event or circumstance, these terms can refer to instances where the event or circumstance occurs precisely and instances where it occurs approximately.

[0037] In this specification, unless specifically stated or limited otherwise, relative terms such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "upper", "lower", "top", "bottom" and derivatives thereof (such as "horizontally", "downwardly", "upwardly", etc.) should be construed to refer to the directions described in the discussion or shown in the drawings. These relative terms are for convenience of description only and do not require the application to be constructed or operated in a particular orientation.

[0038] For convenience of description, "first", "second", "third", etc. may be used herein to distinguish different components of a figure or a series of figures. "First", "second", "third", etc. are not intended to describe corresponding components.

[0039] For a warped product 200, it is common to use fixtures and molds during the manufacturing process; and fixtures for flattening after the process. The key lies in the mechanism of using a force (mechanical force, magnetic force, gravity, adhesion, etc.) to make the product 200 return to flat.

[0040] Figure 5 A fixture 100 for flattening a product 200 warped due to mold encapsulation according to an embodiment of the present application is shown, where the lower left part shows a groove 12 and the accommodating member 20, spring structure 30, and magnet 50 therein. It should be understood that Figure 5 The four grooves 12 of the shown fixture 100 and the structures therein are the same. It should also be understood that the groove 12 is not limited to Figure 5 the shown two rows and two columns. The fixture 100 may include more grooves 12, such as 8 rows and 8 columns, etc. In Figure 5 only one product 200 is disposed on one of the accommodating members 20. It should be understood that whether each accommodating member 20 needs to be used can be determined according to the number of products 200 to be flattened as needed, and the products 200 and the accommodating members 20 are in one-to-one correspondence. Figure 6 Shown is Figure 5 a perspective view of one of the grooves 12 and the accommodating member 20, spring structure 30, and magnet 50 therein. One side of the groove 12 is open to more clearly show the internal structure. It should be understood that in reality, all four sides of the groove 12 are closed. Figure 7shows Figure 5 a sectional view of one of the grooves 12 and the accommodating member 20, the spring structure 30, and the magnet 50 therein.

[0041] The jig 100 of the present application includes: a base 10, including a groove 12 recessed from the top surface of the base 10; an accommodating member 20 disposed in the groove 12, the accommodating member 20 including an accommodating space 22 with an upward opening for placing a product 200; a spring structure 30 disposed in the groove 12 and connected to the bottom surface of the accommodating member 20, the spring structure 30 being used to apply a force to the accommodating member 20 in the direction of the opening; and an upper cover 40, used to be disposed above the base 10 and apply a downward force to the accommodating member 20. The jig 100 of the embodiment of the present application cooperates with the upward elastic force provided by the spring structure 30 and the downward pressure provided by the gravity of the upper cover 40 itself to flatten the product 200 and reduce the warping of the product 200.

[0042] In some embodiments, the jig 100 further includes: a magnet 50, buried at the bottom of the accommodating member 20.

[0043] In some embodiments, when the product 200 is placed in the accommodating member 20, the magnet 50 applies a downward magnetic force to the product 200. The magnet 50 assists in positioning the product 200.

[0044] In some embodiments, the upper cover 40 is made of a material that can be affected by the magnetic force of the magnet 50. Therefore, the magnet 50 enables the accommodating member 20 to be adsorbed on the upper cover 40, further providing an upward pressure for the product 200 and improving the flattening effect of the jig 100.

[0045] In some embodiments, the magnet 50 is disposed on the central axis of the accommodating member 20.

[0046] In some embodiments, the spring structure 30 is disposed on the central axis of the accommodating member 20.

[0047] In some embodiments, the projection of the spring structure 30 and the magnet 50 in the vertical direction overlaps. The spring structure 30 and the magnet 50 are both disposed on the central axis of the accommodating member 20, which can make the force on the product 200 more uniform.

[0048] In some embodiments, when the upper cover 40 is not covered on the base 10, the accommodating member 20 protrudes from the top surface of the base 10.

[0049] In some embodiments, when the upper cover 40 is not covered on the base 10, the spring structure 30 protrudes from the top surface of the base 10.

[0050] In some embodiments, when the upper cover 40 is not covered on the base 10, the bottom surface of the accommodating space 22 is higher than the top surface of the base 10 in the vertical direction.

[0051] In some embodiments, when the product 200 is placed in the accommodating member 20 and the upper cover 40 covers the base 10, the top surface of the product 200 contacts the upper cover 40. When the upper cover 40 is pressed down, it can directly contact the product 200. The spring structure 30 enables the entire accommodating member 20 to be pressed down and rebound, and through the expansion and contraction of the spring, the entire product 200 can be evenly stressed and will not be affected by the tolerances of the product 200 and the fixture 100.

[0052] In some embodiments, when the product 200 is placed in the accommodating member 20 and the upper cover 40 covers the base 10, the top surface of the product 200 is flush with the top surface of the base 10.

[0053] In some embodiments, the upper cover 40 includes positioning holes 60, and the base 10 includes positioning posts 62, and the positioning holes 60 and the positioning posts 62 can be fitted with each other. In some other embodiments, as Figure 5 shown, the upper cover 40 includes positioning posts 62, and the base 10 includes positioning holes 60, and the positioning holes 60 and the positioning posts 62 can be fitted with each other.

[0054] In some embodiments, the positioning holes 60 and the positioning posts 62 are respectively arranged at the corners of the upper cover 40 and the base 10.

[0055] In some embodiments, the lateral dimension of the accommodating space 22 is larger than that of the product 200.

[0056] In some embodiments, the base 10 includes a plurality of grooves 12 and accommodating members 20 and spring structures 30 corresponding to the grooves 12 one by one.

[0057] An embodiment of the present application further provides a fixture 100 for flattening a product 200 warped due to die encapsulation, including: a base 10 including grooves 12 recessed from the top surface of the base 10; an accommodating member 20 disposed in the grooves 12, the accommodating member 20 including an accommodating space 22 with an upward opening for placing the product 200; a spring structure 30 disposed in the grooves 12 and connecting the bottom surface of the accommodating member 20 for applying a force to the accommodating member 20 in the direction of the opening; a magnet 50 disposed at the bottom of the accommodating member 20 for adsorbing the product 200; and an upper cover 40 for being disposed above the base 10 and applying a downward force to the accommodating member 20. The fixture 100 according to the embodiment of the present application flattens the product 200 by the cooperation of the upward elastic force provided by the spring structure 30 and the downward pressure provided by the gravity of the upper cover 40 itself, reducing the warping of the product 200.

[0058] In some embodiments, the magnet 50 is buried inside the accommodating member 20 and does not directly contact the product 200. That is to say, the magnet 50 and the product 200 are separated by a part of the accommodating member 200.

[0059] In some embodiments, both ends of the spring structure 30 are respectively fixed to the groove 12 and the accommodating member 20.

[0060] In some embodiments, the base 10 includes a plurality of grooves 12, accommodating members 20, magnets 50, and spring structures 30 that correspond to the grooves 12 one by one, and the plurality of grooves 12 are arranged in an array.

[0061] Embodiments of the present application flatten the product 200 with warpage exceeding the specification, bringing the warpage back to the range that meets the specification, reducing the warpage of the product 200, reducing the process defect rate of the product 200, and improving the process yield. Embodiments of the present application embed magnets 50 in the accommodating member 20 and use magnetic flattening to improve the situation where the warpage of the product 200 exceeds the specification, thereby improving the yield.

[0062] The present application relates to the design of a flattening tool, and the product 200 of the present application can be a System In Package (SIP), Antenna in Package (AiP), 5G / 6G millimeter-wave device, sensor, etc.

[0063] In some embodiments, the flattening of the jig 100 can be used in conjunction with the reflow process. Heating makes the product 200 easier to be flattened, and the warpage flattening effect can be achieved with only about 1 / 10 of the heating process time when not heated. Moreover, the upper cover 40 performs flatness and surface treatment on the product 200, so that the appearance and overall functionality of the product 200 are not affected after flattening.

[0064] Embodiments of the present application flatten the product 200 without affecting the appearance and function of the product 200, and the overall warpage of the product 200 is reduced by about 50%. Embodiments of the present application reduce the defect rate of the warpage of the product 200 exceeding the specification and increase the overall yield by about 3%. Embodiments of the present application can also be developed for use in flattening products 200 with irregular surfaces.

[0065] In some embodiments, the accommodating space 22 of the accommodating member 20 is designed according to the size of the product 200. For example, the lateral dimension of the accommodating space 20 is larger than the lateral dimension of the product 200, and the depth of the accommodating space 20 depends on the thickness of the product 200 and the warpage acceptance standard. The accommodating space 20 is actually a shallow groove, so the magnet 50 is needed to position the product 200.

[0066] When using the fixture 100 of the present application, first place the product 200 with its back facing up in the accommodation space 22, and carefully confirm the placement position of the product 200; place the positioning posts 62 around the base 10; then cover the upper cover 40, where the positioning holes 60 and the positioning posts 62 are fitted with each other. The telescopic sinking resilience of the spring structure 30 of the present application can make each product 200 evenly stressed. At the same time, the upper cover 40 being attracted by the magnetic force of the magnet 50 will also make the contact surface between the upper cover 40 and each accommodating member 20 more evenly stressed, enabling all products 200 to achieve a leveling effect.

[0067] In some embodiments, for products with larger sizes, such as substrates before singulation, a laser process can be used for warpage leveling, but the cost is relatively high. By using the fixture 100 of the present application, the singulated product 200 can be leveled, and the cost is relatively low. The embodiments of the present application achieve a device with functions of positioning, leveling, and balanced force application by utilizing the characteristics of each component.

[0068] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, various modifications and changes can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A jig for leveling a product that is warped due to mold sealing, characterized in that: include: A base, comprising a groove sunken from a top surface of the base; A container, disposed in the groove and comprising a container space with an upward opening for placing the product; A spring structure, disposed in the groove and connected to the bottom surface of the receiving member, for applying a force to the receiving member in the direction of the opening; The upper cover is used for being arranged above the base and exerting a downward force on the accommodating component.

2. The fixture according to claim 1, characterized in that: Also includes: A magnet is buried at the bottom of the container. When a product is placed in the container, the magnet exerts a downward magnetic force on the product.

3. The fixture according to claim 2, characterized in that: The upper cover is made of a material that can be affected by the magnetic force of the magnet.

4. The fixture according to claim 2, characterized in that: The magnet is arranged on the central axis of the accommodation component.

5. The fixture according to claim 4, characterized in that: The spring structure is arranged on the central axis of the accommodation component.

6. The fixture according to claim 4, characterized in that: The spring structure overlaps with a projection of the magnet in a vertical direction.

7. The fixture according to claim 1, characterized in that: When the upper cover is not covering the base, the accommodating component protrudes from the top surface of the base.

8. The fixture according to claim 7, characterized in that: When the upper cover is not covering the base, the spring structure protrudes from the top surface of the base.

9. The fixture according to claim 7, characterized in that: When the upper cover is not covering the base, the bottom surface of the accommodating space is higher in vertical direction than the top surface of the base.

10. The fixture according to claim 1, characterized in that: The upper cover comprises a positioning hole, the base comprises a positioning column, and the positioning hole and the positioning column can be embedded with each other.

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