Semiconductor transistor plastic package mold

Abstract

The utility model discloses a semiconductor transistor plastic package mould, which comprises a plastic package box and sliding rails, the sliding rails are symmetrically arranged on the inner wall of the plastic package box, a lower mould base is arranged in the plastic package box and is in sliding connection with the sliding rails, moving motors are arranged at the bottom ends of the sliding rails, and the moving motors are connected with the plastic package box. The output ends of the moving motors are provided with lead screws, the lead screws are movably connected with the sliding rails, the surfaces of the lead screws are sleeved with threaded sleeves, the threaded sleeves are in threaded connection with the lead screws, the side walls of the threaded sleeves are provided with L-shaped frames, the L-shaped frames are connected with the lower die base, and the top end of the lower die base is provided with two sets of containing grooves. And two groups of second motors are mounted at the bottom end of the lower die holder. According to the utility model, the semiconductor transistor can be conveniently and vertically sealed, the plastic-packaged semiconductor transistor can be conveniently and quickly output and taken, and the convenience of plastic packaging of the semiconductor transistor is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of plastic encapsulation molds, in particular to a plastic encapsulation mold for semiconductor transistors. Background Technique

[0002] A semiconductor transistor is an electronic component based on semiconductor materials and has various functions such as detection, rectification, amplification, switching, voltage regulation, and signal modulation. Plastic encapsulation is a process of sealing an object by heating and pressing a plastic film, aiming to protect the object from the external environment. The main purposes of plastic encapsulation are to prevent water, dust, and fading, thereby extending the service life of the object. This process is widely used to protect various items such as photos, documents, and certificates. After the semiconductor transistor is produced, it needs to be plastic encapsulated. In order to better plastic encapsulate the semiconductor transistor, a plastic encapsulation mold for semiconductor transistors is proposed.

[0003] As disclosed in a plastic encapsulation mold for semiconductor transistors with the authorization announcement number CN221407236U, which includes a processing plate. A support plate is bolted to the rear side of the top of the processing plate. The front side inside the top of the support plate is fixedly connected with a hydraulic rod. The top of the processing plate is fixedly connected with a lower mold. An upper mold is arranged on the top of the lower mold. The top of the upper mold is bolted to the telescopic end of the hydraulic rod.

[0004] Although it realizes that by setting a hydraulic rod, a lower mold, an upper mold, a placement groove, a placement component, a pressure spring component, a plastic encapsulation component, and a heating module, during use, the upper mold is driven to move upward by the hydraulic rod, then the semiconductor transistor sleeved with a thermoplastic film is placed on the placement plate in the placement groove of the lower mold, and then the thermoplastic mold seal is placed between the plastic encapsulation components. Then, the electric push rod is started to make the bottom surface of the upper mold fit with the top surface of the lower mold for mold closing.

[0005] However, it does not solve the problem that the existing plastic encapsulation mold is not convenient for quickly closing the upper and lower molds to plastic encapsulate the semiconductor transistor, and is not conducive to quickly outputting and taking the plastic encapsulated semiconductor transistor, which affects the convenience of plastic encapsulating the semiconductor transistor. Content of the Utility Model

[0006] The purpose of the utility model is to provide a plastic encapsulation mold for semiconductor transistors to solve the problems proposed in the above background technique that the plastic encapsulation mold is not convenient for quickly closing the upper and lower molds to plastic encapsulate the semiconductor transistor, and is not conducive to quickly outputting and taking the plastic encapsulated semiconductor transistor, which affects the convenience of plastic encapsulating the semiconductor transistor.

[0007] To achieve the above object, the present utility model provides the following technical solutions: A semiconductor transistor plastic encapsulation mold, including a plastic encapsulation box and a slide rail. Slide rails are symmetrically installed on the inner wall of the plastic encapsulation box. A lower mold base is arranged inside the plastic encapsulation box, and the lower mold base is slidably connected to the slide rails. Moving motors are installed at the bottom ends of the slide rails, screw rods are installed at the output ends of the moving motors, and the screw rods are movably connected to the slide rails. Threaded sleeves are sleeved on the surfaces of the screw rods, and the threaded sleeves are threadedly connected to the screw rods. L-shaped frames are installed on the side walls of the threaded sleeves, and the L-shaped frames are connected to the lower mold base. Two placement grooves are installed at the top end of the lower mold base. Two second motors are installed at the bottom end of the lower mold base, lower winding rollers are installed at the output ends of the second motors, and the lower winding rollers are movably connected to the lower mold base. A lower transparent plastic film is wound around the surfaces of the two lower winding rollers, and the lower transparent plastic film covers the upper surface of the placement groove and is slidably connected to the placement groove.

[0008] Preferably, a push arm is installed at the output end of the electric push rod, and a connecting arm is installed at the top end of the push arm.

[0009] Preferably, a pin shaft is installed at one end of the connecting arm close to the push arm, and the connecting arm is movably connected to the push arm through the pin shaft. A rotating shaft is installed at the end of the connecting arm far from the push arm, and the rotating shaft extends into the plastic encapsulation box and is movably connected to the plastic encapsulation box.

[0010] Preferably, a rotating block is fixedly installed on the surface of the rotating shaft, and a linkage frame is installed at the end of the rotating block far from the rotating shaft.

[0011] Preferably, a connecting shaft is installed at one end of the linkage frame close to the rotating block, and the linkage frame is movably connected to the rotating block through the connecting shaft.

[0012] Preferably, an upper mold base is arranged below the linkage frame. A support shaft is installed at one end of the linkage frame close to the upper mold base, and the linkage frame is movably connected to the upper mold base through the support shaft. Limit blocks are symmetrically installed on the side wall of the upper mold base. Limit grooves are installed on the side wall of the plastic encapsulation box on one side of the limit block, and the limit block is slidably connected to the limit groove.

[0013] Preferably, two heating rings are installed at the bottom end of the upper mold base. Blades are installed at the bottom end of the upper mold base around the heating rings. Two first motors are installed at the top end of the upper mold base, upper winding rollers are installed at the output ends of the first motors, and the upper winding rollers are movably connected to the upper mold base.

[0014] Preferably, an upper transparent plastic film is wound around the surfaces of the upper winding rollers, and the upper transparent plastic film covers the lower surfaces of the heating rings and the blades.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows: This plastic encapsulation mold not only realizes convenient upper and lower mold closing for encapsulating semiconductor transistors, facilitates the quick output and taking of the encapsulated semiconductor transistors, but also improves the convenience of semiconductor transistor encapsulation;

[0016] (1) Drive the lead screw to rotate through the moving motor, drive the L-shaped frame to move through the lead screw and the wire sleeve, drive the lower mold base to move through the L-shaped frame, and move the lower mold base to the outside of the plastic encapsulation box. Then place the semiconductor transistor on the surface of the lower transparent plastic film, and the placement position is above the placement groove. Then reverse the moving motor to drive the lower mold base back into the plastic encapsulation box. Drive the push arm to move through the electric push rod, drive the connecting arm to rotate through the push arm and the pin shaft, drive the rotating block to rotate through the connecting arm and the rotating shaft, drive the linkage frame to rotate through the rotating block and the connecting shaft, drive the upper mold base to move downward through the linkage frame and the support shaft, so that the heating ring and the blade are pressed into the inside of the placement groove, wrap the upper transparent plastic film and the lower transparent plastic film on the upper and lower surfaces of the semiconductor transistor respectively, heat and encapsulate the upper transparent plastic film and the lower transparent plastic film through the heating ring, and cut the upper transparent plastic film and the lower transparent plastic film through the blade, thereby completing the encapsulation operation of the semiconductor transistor. Then turn off the electric push rod to make the upper mold base away from the lower mold base. Open the moving motor again to drive the lower mold base and the encapsulated semiconductor transistor to move to the outside of the plastic encapsulation box, and then it can be taken manually, realizing convenient upper and lower mold closing for encapsulating semiconductor transistors, facilitating the quick output and taking of the encapsulated semiconductor transistors, and improving the convenience of semiconductor transistor encapsulation;

[0017] (2) Drive the lower winding roller to rotate through the second motor, and the two lower winding rollers rotate in the same direction to drive the lower transparent plastic film to move synchronously. One lower winding roller releases the lower transparent plastic film, and the other lower winding roller winds up the used lower transparent plastic film, covering the next available lower transparent plastic film on the surface of the placement groove. Drive the upper winding roller to rotate through the first motor, and the two upper winding rollers rotate in the same direction to drive the upper transparent plastic film to move synchronously. One upper winding roller releases the upper transparent plastic film, and the other upper winding roller winds up the used upper transparent plastic film, covering the next available upper transparent plastic film on the surface of the heating ring and the blade. Then continue to place the semiconductor transistor and repeat the above operations to sequentially complete the encapsulation operation of the semiconductor transistor. Description of the Drawings

[0018] Figure 1 is the three-dimensional structure schematic diagram of the present utility model;

[0019] Figure 2 is the three-dimensional structure schematic diagram of the plastic encapsulation box of the present utility model;

[0020] Figure 3This is a three-dimensional structure schematic diagram of the lower die base of the present utility model;

[0021] Figure 4 This is a front view structure schematic diagram of the present utility model;

[0022] Figure 5 This is a three-dimensional structure schematic diagram of the upper die base of the present utility model.

[0023] In the figure: 1, plastic sealing box; 2, limiting groove; 3, limiting block; 4, electric push rod; 5, placing groove; 6, lower die base; 7, lower transparent plastic film; 8, upper winding roller; 9, support shaft; 10, pin shaft; 11, push arm; 12, first motor; 13, connecting arm; 14, rotating shaft; 15, rotating block; 16, connecting shaft; 17, linkage frame; 18, moving motor; 19, lead screw; 20, slide rail; 21, lead screw sleeve; 22, L-shaped frame; 23, lower winding roller; 24, second motor; 25, upper die base; 26, upper transparent plastic film; 27, heating ring; 28, blade. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Please refer to Figures 1-5 , an embodiment provided by the present utility model: A semiconductor transistor plastic sealing mold, including a plastic sealing box 1 and a slide rail 20. Slide rails 20 are symmetrically installed on the inner wall of the plastic sealing box 1. A lower die base 6 is arranged inside the plastic sealing box 1, and the lower die base 6 is slidably connected to the slide rail 20. Moving motors 18 are installed at the bottom ends of the slide rails 20, and the moving motors 18 play a role of power drive. Output ends of the moving motors 18 are all installed with lead screws 19, and the lead screws 19 are movably connected to the slide rails 20. Lead screw sleeves 21 are sleeved on the surfaces of the lead screws 19, and the lead screw sleeves 21 are threadedly connected to the lead screws 19. L-shaped frames 22 are installed on the side walls of the lead screw sleeves 21, and the L-shaped frames 22 are connected to the lower die base 6. Two groups of placing grooves 5 are installed at the top end of the lower die base 6. Two groups of second motors 24 are installed at the bottom end of the lower die base 6, and the second motors 24 play a role of power drive. Output ends of the second motors 24 are all installed with lower winding rollers 23, and the lower winding rollers 23 are movably connected to the lower die base 6. Moreover, lower transparent plastic films 7 are wound around the surfaces of the two groups of lower winding rollers 23. An electric push rod 4 is movably installed on the outer wall of the plastic sealing box 1, and the electric push rod 4 plays a role of power drive. And the lower transparent plastic film 7 covers the upper surface of the placing groove 5 and is slidably connected to the placing groove 5;

[0026] Turn on the moving motor 18. The moving motor 18 drives the lead screw 19 to rotate. Under the threaded connection between the lead screw 19 and the lead screw sleeve 21, the lead screw 19 drives the L-shaped frame 22 to move through the lead screw sleeve 21. Under the sliding fit between the slide rail 20 and the lower die base 6, the L-shaped frame 22 drives the lower die base 6 to move, so as to move the lower die base 6 to the outside of the plastic sealing box 1. Then, place the semiconductor transistor on the surface of the lower transparent plastic film 7, and the placement position is above the placement groove 5. Then, reverse-turn on the moving motor 18, and the moving motor 18 drives the lower die base 6 back into the plastic sealing box 1. Turn on the electric push rod 4, and the electric push rod 4 drives the push arm 11 to move. The push arm 11 drives the connecting arm 13 to rotate through the pin shaft 10. The connecting arm 13 drives the rotating block 15 to rotate through the rotating shaft 14. The rotating block 15 drives the linkage frame 17 to rotate through the connecting shaft 16. Under the sliding fit between the limiting groove 2 and the limiting block 3, the linkage frame 17 drives the upper die base 25 to move downward through the support shaft 9, so that the heating ring 27 and the blade 28 are pressed into the interior of the placement groove 5, wrapping the upper transparent plastic film 26 and the lower transparent plastic film 7 around the upper and lower sides of the semiconductor transistor respectively. Turn on the heating ring 27, and the heating ring 27 heats and seals the upper transparent plastic film 26 and the lower transparent plastic film 7. The blade 28 cuts the upper transparent plastic film 26 and the lower transparent plastic film 7, thus completing the plastic sealing operation of the semiconductor transistor. Then, turn off the electric push rod 4 to move the upper die base 25 away from the lower die base 6. Turn on the moving motor 18 again, and the moving motor 18 drives the lower die base 6 and the plastic-sealed semiconductor transistor to move to the outside of the plastic sealing box 1. Then, it can be taken manually, realizing convenient upper and lower die clamping for plastic-sealing the semiconductor transistor, facilitating the quick output and taking of the plastic-sealed semiconductor transistor, and improving the convenience of plastic-sealing the semiconductor transistor;

[0027] The output end of the electric push rod 4 is equipped with a push arm 11. The top of the push arm 11 is equipped with a connecting arm 13. One end of the connecting arm 13 close to the push arm 11 is equipped with a pin shaft 10, and the connecting arm 13 is movably connected to the push arm 11 through the pin shaft 10. The end of the connecting arm 13 far from the push arm 11 is equipped with a rotating shaft 14, and the rotating shaft 14 extends into the plastic sealing box 1 and is movably connected to the plastic sealing box 1;

[0028] The surface of the rotating shaft 14 is fixedly equipped with a rotating block 15. One end of the rotating block 15 far from the rotating shaft 14 is equipped with a linkage frame 17. One end of the linkage frame 17 close to the rotating block 15 is equipped with a connecting shaft 16, and the linkage frame 17 is movably connected to the rotating block 15 through the connecting shaft 16;

[0029] A upper die base 25 is arranged below the linkage frame 17. One end of the linkage frame 17 close to the upper die base 25 is equipped with a support shaft 9, and the linkage frame 17 is movably connected to the upper die base 25 through the support shaft 9. Limiting blocks 3 are symmetrically installed on the side wall of the upper die base 25. Limiting grooves 2 are installed on the side wall of the plastic sealing box 1 on one side of the limiting block 3, and the limiting block 3 is slidably connected to the limiting groove 2;

[0030] Two sets of heating rings 27 are installed at the bottom end of the upper die base 25. Blades 28 are installed at the bottom end of the upper die base 25 on the periphery of the heating rings 27. Two sets of first motors 12 are installed at the top end of the upper die base 25. The first motors 12 play a role in power driving. Output shafts of the first motors 12 are all installed with upper winding rollers 8, and the upper winding rollers 8 are movably connected to the upper die base 25;

[0031] The upper transparent plastic films 26 are wound around the surface of the upper winding rollers 8, and the upper transparent plastic films 26 cover the lower surfaces of the heating rings 27 and the blades 28;

[0032] Turn on the second motor 24. The second motor 24 drives the lower winding rollers 23 to rotate. The two sets of lower winding rollers 23 rotate in the same direction to drive the lower transparent plastic film 7 to move synchronously. One set of lower winding rollers 23 releases the lower transparent plastic film 7, and the other set of lower winding rollers 23 winds up the used lower transparent plastic film 7. The next available lower transparent plastic film 7 is covered on the surface of the placement groove 5. Turn on the first motor 12. The first motor 12 drives the upper winding rollers 8 to rotate. The two sets of upper winding rollers 8 rotate in the same direction to drive the upper transparent plastic film 26 to move synchronously. One set of upper winding rollers 8 releases the upper transparent plastic film 26, and the other set of upper winding rollers 8 winds up the used upper transparent plastic film 26. The next available upper transparent plastic film 26 is covered on the surfaces of the heating rings 27 and the blades 28. Then continue to place the semiconductor transistors and repeat the above operations to sequentially complete the plastic encapsulation operation of the semiconductor transistors.

[0033] Working principle: Turn on the moving motor 18. The moving motor 18 drives the lead screw 19 to rotate. The lead screw 19 drives the L-shaped frame 22 to move through the screw sleeve 21. The L-shaped frame 22 drives the lower die holder 6 to move, so as to move the lower die holder 6 to the outside of the plastic sealing box 1. Then place the semiconductor transistor on the surface of the lower transparent plastic film 7, and the placement position is above the placement groove 5. Then turn on the moving motor 18 in the reverse direction. The moving motor 18 drives the lower die holder 6 back into the plastic sealing box 1. The electric push rod 4 drives the push arm 11 to move. The push arm 11 drives the connecting arm 13 to rotate through the pin shaft 10. The connecting arm 13 drives the rotating block 15 to rotate through the rotating shaft 14. The rotating block 15 drives the linkage frame 17 to rotate through the connecting shaft 16. Under the sliding fit of the limiting groove 2 and the limiting block 3, the linkage frame 17 drives the upper die holder 25 to move downward through the support shaft 9, so that the heating ring 27 and the blade 28 are pressed into the inside of the placement groove 5, and the upper transparent plastic film 26 and the lower transparent plastic film 7 are respectively wrapped on the upper and lower surfaces of the semiconductor transistor. The heating ring 27 heats and seals the upper transparent plastic film 26 and the lower transparent plastic film 7, and the blade 28 cuts the upper transparent plastic film 26 and the lower transparent plastic film 7, so as to complete the plastic sealing operation of the semiconductor transistor. Then turn off the electric push rod 4 to make the upper die holder 25 away from the lower die holder 6. The moving motor 18 drives the lower die holder 6 and the plastic-sealed semiconductor transistor to move to the outside of the plastic sealing box 1, and then it can be taken manually. The second motor 24 drives the lower winding roller 23 to rotate. The two groups of lower winding rollers 23 rotate in the same direction to drive the lower transparent plastic film 7 to move synchronously. One group of lower winding rollers 23 releases the lower transparent plastic film 7, and the other group of lower winding rollers 23 winds up the used lower transparent plastic film 7, and covers the next available lower transparent plastic film 7 on the surface of the placement groove 5. The first motor 12 drives the upper winding roller 8 to rotate. The two groups of upper winding rollers 8 rotate in the same direction to drive the upper transparent plastic film 26 to move synchronously. One group of upper winding rollers 8 releases the upper transparent plastic film 26, and the other group of upper winding rollers 8 winds up the used upper transparent plastic film 26, and covers the next available upper transparent plastic film 26 on the surfaces of the heating ring 27 and the blade 28. Then continue to place the semiconductor transistor and repeat the above operations to sequentially complete the plastic sealing operation of the semiconductor transistor.

Claims

1. A semiconductor transistor plastic packaging mold, comprising a plastic packaging box (1) and a slide rail (20), characterized in that: The inner wall of the plastic packaging box (1) is symmetrically provided with a slide rail (20), the interior of the plastic packaging box (1) is provided with a lower mold base (6), and the lower mold base (6) is slidably connected to the slide rail (20), the bottom end of the slide rail (20) is provided with a movable motor (18), the output end of the movable motor (18) is provided with a screw rod (19), and the screw rod (19) is movably connected to the slide rail (20), the surface of the screw rod (19) is provided with a threaded sleeve (21), and the threaded sleeve (21) is threadedly connected to the screw rod (19), and the side wall of the threaded sleeve (21) is provided with an L-shaped frame (22), and the L-shaped The frame (22) is connected to the lower mold base (6), the top end of the lower mold base (6) is equipped with two groups of placement grooves (5), the bottom end of the lower mold base (6) is equipped with two groups of second motors (24), the output ends of the second motors (24) are all equipped with lower winding rollers (23), and the lower winding rollers (23) are movably connected to the lower mold base (6), and the surfaces of the two groups of lower winding rollers (23) are mutually wrapped with lower transparent plastic films (7), an electric push rod (4) is movably installed on the outer wall of the plastic sealing box (1), and the lower transparent plastic film (7) covers the upper surface of the placement groove (5) and is slidably connected to the placement groove (5).

2. A semiconductor transistor plastic packaging mold according to claim 1, characterized in that: A push arm (11) is installed at the output end of the electric push rod (4), and a connecting arm (13) is installed at the top end of the push arm (11).

3. A semiconductor transistor plastic packaging mold according to claim 2, characterized in that: A pin shaft (10) is installed at one end of the connecting arm (13) close to the push arm (11), and the connecting arm (13) is movably connected to the push arm (11) through the pin shaft (10); a rotating shaft (14) is installed at one end of the connecting arm (13) away from the push arm (11), and the rotating shaft (14) extends into the interior of the plastic packaging box (1) and is movably connected to the plastic packaging box (1).

4. The semiconductor transistor plastic packaging mold according to claim 3, characterized in that: A rotating block (15) is fixedly mounted on the surface of the rotating shaft (14), and a linkage frame (17) is mounted on one end of the rotating block (15) away from the rotating shaft (14).

5. The semiconductor transistor plastic packaging mold according to claim 4, characterized in that: A connecting shaft (16) is installed at one end of the linkage frame (17) close to the rotating block (15), and the linkage frame (17) is movably connected to the rotating block (15) through the connecting shaft (16).

6. The semiconductor transistor plastic packaging mold according to claim 4, characterized in that: An upper die seat (25) is arranged below the linkage frame (17); a support shaft (9) is installed at one end of the linkage frame (17) close to the upper die seat (25); and the linkage frame (17) is movably connected to the upper die seat (25) via the support shaft (9); a limiting block (3) is symmetrically installed on the side wall of the upper die seat (25); a limiting groove (2) is installed on the side wall of the plastic packaging box (1) on one side of the limiting block (3); and the limiting block (3) is slidably connected to the limiting groove (2).

7. The semiconductor transistor plastic packaging mold according to claim 6, characterized in that: Two groups of heating rings (27) are installed at the bottom end of the upper mold base (25), and blades (28) are installed at the bottom end of the upper mold base (25) outside the heating rings (27). Two groups of first motors (12) are installed at the top end of the upper mold base (25), and upper winding rollers (8) are installed at the output ends of the first motors (12), and the upper winding rollers (8) are movably connected to the upper mold base (25).

8. The semiconductor transistor plastic packaging mold according to claim 7, characterized in that: An upper transparent plastic film (26) is wound around the surface of the upper winding roller (8), and the upper transparent plastic film (26) covers the lower surface of the heating ring (27) and the blade (28).

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