Cable bridge electroplating equipment convenient for homogenizing electroplating liquid

Abstract

The utility model discloses cable bridge electroplating equipment convenient to homogenize electroplating liquid, which comprises a base moving structure, an electroplating structure is arranged on the base moving structure, the base moving structure comprises a damping shock absorber, the bottom of the damping shock absorber is fixedly provided with a locking universal wheel, the damping shock absorber is fixedly connected with the bottom of a base plate with a mounting hole, and the damping shock absorber is fixedly connected with the bottom of the base plate. Meanwhile, the base plate is fixedly connected with one end of a synchronous air cylinder through a mounting hole, the other end of the synchronous air cylinder is fixedly connected with the bottom of a through hole mounting plate, the electroplating structure comprises electroplating equipment fixed to the through hole mounting plate, a hollow frame is fixed to the interior of the electroplating equipment through a mounting base, and meanwhile a connecting groove is formed in the hollow frame in a penetrating mode; the cable bridge electroplating equipment comprises a hollow frame, a connecting groove is formed in the hollow frame, a connecting hole connected with the connecting groove in a penetrating mode is formed in the hollow frame, an adjusting plate is rotationally installed in the hollow frame through a connecting pin and the connecting groove, and according to the cable bridge electroplating equipment convenient to homogenize the electroplating liquid, the damping shock absorber is arranged, so that buffering and shock absorption are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of cable trays, and specifically relates to a cable tray electroplating device for facilitating the homogenization of electroplating solution. Background Art

[0002] Cable trays are generally applicable to large enterprises, large-scale project power transformation, cable erection, large bridges, cable laying in subways, and offshore drilling fields. During the manufacturing process of cable trays, electroplating treatment is required for cable trays. After retrieval, it is found that in the prior art, the publication number is: CN219991775U, an electroplating device with an electroplating fixture, including an electroplating bath. A moving mechanism is fixedly installed at the top of the electroplating bath, and a lifting rod is fixedly installed at the moving end of the moving mechanism. This electroplating device with an electroplating fixture has the advantages of uniform electroplating, etc., and solves the problems that the existing fixtures can only hang certain specific-shaped or sized keychains, and due to the too-close distance between adjacent keychains, it is easy to contact due to swinging, resulting in uneven and insufficient electroplating of some keychains, leading to poor product quality. At the same time, when the number of keychains is too large, it is not convenient to fix them during electroplating, resulting in the keychains being easily dropped into the electroplating bath.

[0003] To sum up: For the electroplating device in the above case, the distribution of metal cations in the electroplating solution is not uniform enough, resulting in non-uniform electroplating processing of workpieces, a decline in the performance of the processed workpieces, and being unfavorable to the aesthetics of the workpieces. Content of the Utility Model

[0004] The purpose of the utility model is to provide a cable tray electroplating device for facilitating the homogenization of electroplating solution in view of the deficiencies of the prior art, so as to solve the problem that for the electroplating device in the above case in the background art, the distribution of metal cations in the electroplating solution is not uniform enough, resulting in non-uniform electroplating processing of workpieces, a decline in the performance of the processed workpieces, and being unfavorable to the aesthetics of the workpieces.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A cable tray electroplating device for facilitating the homogenization of electroplating solution, including a base moving structure, and an electroplating structure is arranged on the base moving structure;

[0006] The base moving structure includes a damping shock absorber with locking universal wheels fixed at the bottom, and the damping shock absorber is fixedly connected to the bottom of a base plate with mounting holes. At the same time, one end of a synchronous cylinder is fixedly connected to the base plate through the mounting holes;

[0007] The other end of the synchronous cylinder is fixedly connected to the bottom of a through-hole mounting plate.

[0008] By adopting the above technical solution, the damping shock absorber is provided to achieve buffering and shock absorption.

[0009] Preferably, the electroplating structure includes an electroplating device fixed on a through-hole mounting plate, and a hollow frame is fixed inside the electroplating device through a mounting seat. At the same time, a connecting groove is formed through the hollow frame, and a connecting hole communicating with the connecting groove is formed in the hollow frame.

[0010] By adopting the above technical solution, the hollow frame is provided to play a role in opening and fixing the connection.

[0011] Preferably, an adjusting plate is rotatably installed inside the hollow frame through a connecting pin and inside the connecting groove, and a through-hole block is slidably installed inside the adjusting plate. At the same time, the through-hole block is fixedly connected through the adjusting rod, and the other end of the adjusting rod penetrates through the electroplating device and is fixedly connected to the output end of the rotating motor.

[0012] By adopting the above technical solution, the adjusting plate is provided to play a role in swinging under force.

[0013] Preferably, connecting plates are fixed on both sides of the adjusting plate, and rod-shaped bands are fixed on both sides of the connecting plates.

[0014] By adopting the above technical solution, the rod-shaped bands are provided to play a role in driving the stirring.

[0015] Preferably, there are 3 synchronous cylinders, and the synchronous cylinders are arranged at equal intervals.

[0016] By adopting the above technical solution, the synchronous cylinders are provided to play a role in synchronous driving and adjustment.

[0017] Preferably, there is 1 group of connecting plates, and the connecting plates are arranged with respect to the transverse axis of the adjusting plate.

[0018] By adopting the above technical solution, the connecting plates are provided to play a role in driving the adjustment.

[0019] Compared with the prior art, the beneficial effect of the present invention is that for the cable tray electroplating device that facilitates the homogenization of electroplating solution,

[0020] (1) In this case, through the electroplating structure provided, the electroplating device in the above case is solved. For the electroplating device, the distribution of metal cations in the electroplating solution is not uniform enough, which leads to uneven electroplating processing of the workpiece, resulting in a decline in the performance of the processed workpiece and being unfavorable to the aesthetics of the workpiece. When the rotating motor operates during the electroplating process of the cable tray, during the operation of the rotating motor, the adjusting rod drives the adjusting plate to swing. When the adjusting plate swings under force, the rod-shaped bands are synchronously forced to swing through the connecting plates. When the adjusting plate, the connecting plates and the rod-shaped bands swing synchronously under force, the electroplating solution is stirred to avoid uneven electroplating of the workpiece caused by uneven distribution of metal cations in the electroplating solution;

[0021] (2) By setting the base moving structure, the problems that the overall electroplating equipment cannot be adjusted in lifting and moving are solved. When the overall electroplating equipment needs to change the overall lifting height, the synchronous cylinder is controlled to operate. During the operation of the synchronous cylinder, the lifting interval distance of the overall electroplating equipment is changed to adapt to operators of different heights for operation. And when the overall electroplating equipment needs to change the working place, the locking universal wheels are driven by the electroplating equipment to move, so as to change the working place of the overall electroplating equipment. Brief Description of the Drawings

[0022] Figure 1 It is a front view sectional structure schematic diagram of the present utility model;

[0023] Figure 2 It is a schematic diagram of the base moving structure of the present utility model;

[0024] Figure 3 It is a schematic diagram of the electroplating equipment, hollow frame, adjusting plate, adjusting rod, rotating motor, connecting plate and belt rod of the present utility model;

[0025] Figure 4 It is a schematic diagram of the hollow frame and connecting groove of the present utility model;

[0026] Figure 5 It is a schematic diagram of the through-hole block, adjusting rod and rotating motor of the present utility model.

[0027] In the figure: 1. Base moving structure; 101. Damping shock absorber; 102. Locking universal wheel; 103. Base plate; 104. Synchronous cylinder; 105. Through-hole mounting plate; 2. Electroplating structure; 201. Electroplating equipment; 202. Hollow frame; 203. Connecting groove; 204. Adjusting plate; 205. Through-hole block; 206. Adjusting rod; 207. Rotating motor; 208. Connecting plate; 209. Belt rod. Detailed Description of the Preferred Embodiment

[0028] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0029] Please refer to Figures 1-5 , the present utility model provides a technical solution: a cable tray electroplating equipment for facilitating the homogenization of electroplating solution, as Figure 1 and Figure 2As shown, it includes a base moving structure 1. The base moving structure 1 includes a damping shock absorber 101 with a locking universal wheel 102 fixed to the bottom. The damping shock absorber 101 is fixedly connected to the bottom of a base plate 103 with mounting holes. At the same time, one end of a synchronous cylinder 104 is fixedly connected to the base plate 103 through the mounting holes. There are 3 synchronous cylinders 104, and they are equidistantly distributed. When there are 3 of the above-mentioned components locked, it not only reflects the equidistant distribution of the installation of the above-mentioned components, but also reflects the synchronous force support and force dissipation of the installation of the above-mentioned components. And when there are 3 of the above-mentioned components set, it also reflects the drive control adjustment and simple operation control of the installation of the above-mentioned components.

[0030] Furthermore, in the above solution, the other end of the synchronous cylinder 104 is fixedly connected to the bottom of a through-hole mounting plate 105.

[0031] In the above solution, when the overall electroplating equipment 201 needs to change the overall lifting height, the synchronous cylinder 104 is controlled to operate. During the operation of the synchronous cylinder 104, the lifting interval distance of the overall electroplating equipment 201 is changed to adapt to operators of different heights for operation. And when the overall electroplating equipment 201 needs to change the working place, the locking universal wheel 102 is driven by the electroplating equipment 201 to move, so as to change the working place of the overall electroplating equipment 201.

[0032] As Figure 3 、 Figure 4 and Figure 5 As shown, an electroplating structure 2 is provided on the base moving structure 1. The electroplating structure 2 includes an electroplating equipment 201 fixed to the through-hole mounting plate 105. Inside the electroplating equipment 201, a hollow frame 202 is fixed through a mounting seat. At the same time, a connecting groove 203 is formed through the hollow frame 202, and a connecting hole communicating with the connecting groove 203 is opened in the hollow frame 202.

[0033] Furthermore, in the above solution, an adjusting plate 204 is rotatably installed inside the hollow frame 202 through a connecting pin and the inside of the connecting groove 203. A through-hole block 205 is slidably installed inside the adjusting plate 204. At the same time, the through-hole block 205 is fixedly connected through the adjusting rod 206. The other end of the adjusting rod 206 penetrates through the electroplating equipment 201 and is fixedly connected to the output end of a rotating motor 207. Among them, the above-mentioned components form a rotating swing structure. When using the rotating swing structure formed by the above-mentioned components, the adjusting plate 204 is effectively driven to swing left and right reciprocally.

[0034] Furthermore, in the above solution, connecting plates 208 are fixed to both sides of the adjusting plate 204, and rod carriers 209 are fixed to both sides of the connecting plates 208. There is 1 set of connecting plates 208, and the connecting plates 208 are arranged with respect to the horizontal axis of the adjusting plate 204. When there is 1 set of the above components, it not only reflects the symmetry of the installation of the above components, but also reflects the synchronous force-driven nature of the installation of the above components. And when there is 1 set of the above components, it also reflects the practicality and horizontal axis symmetry of the installation of the above components.

[0035] In the above solution, during the electroplating process of the cable tray, the rotation motor 207 is controlled to operate. During the operation of the rotation motor 207, the adjusting rod 206 drives the adjusting plate 204 to swing. When the adjusting plate 204 swings under force, the rod carriers 209 are synchronously forced to swing through the connecting plates 208. When the adjusting plate 204, the connecting plates 208 and the rod carriers 209 swing synchronously under force, the electroplating solution is stirred to prevent uneven distribution of metal cations in the electroplating solution from causing uneven electroplating of the workpiece.

[0036] The orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of simplifying the description of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation on the protection scope of the present invention.

[0037] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A cable tray electroplating device for homogenizing electroplating solution, comprising a base moving structure (1), characterized in that: The base moving structure (1) is provided with an electroplating structure (2); The base moving structure (1) comprises a damping shock absorber (101) having a locking universal wheel (102) fixed at the bottom, and the damping shock absorber (101) is fixedly connected to the bottom of a base plate (103) with a mounting hole, and the base plate (103) is fixedly connected to one end of a synchronous cylinder (104) through the mounting hole; The other end of the synchronous cylinder (104) is fixedly connected to the bottom of the through-hole mounting plate (105).

2. A cable tray electroplating device for homogenizing electroplating solution according to claim 1, characterized in that: The electroplating structure (2) comprises an electroplating device (201) fixed on a through-hole mounting plate (105), and a hollow frame (202) is fixed inside the electroplating device (201) via a mounting seat, and a connecting groove (203) is provided through the hollow frame (202), and a connecting hole is provided in the hollow frame (202) that is connected to the connecting groove (203).

3. A cable tray electroplating device for homogenizing electroplating solution according to claim 2, characterized in that: An adjusting plate (204) is rotatably installed inside the hollow frame (202) via a connecting pin and a connecting groove (203), and a through-hole block (205) is slidably installed inside the adjusting plate (204). Meanwhile, the through-hole block (205) is fixedly connected to an adjusting rod (206) through penetration, and the other end of the adjusting rod (206) penetrates the electroplating equipment (201) and is fixedly connected to the output end of the rotating motor (207).

4. A cable tray electroplating device for homogenizing electroplating solution according to claim 3, characterized in that: The connection plates (208) are fixed on both sides of the adjustment plate (204), and the connection plates (208) are fixed with belt rods (209) on both sides.

5. The cable tray electroplating equipment for homogenizing the electroplating solution according to claim 1, characterized in that: The number of synchronous cylinders (104) is three, and the synchronous cylinders (104) are equidistantly distributed.

6. The cable tray electroplating equipment for homogenizing the electroplating solution according to claim 4, characterized in that: The connecting plates (208) are provided in a group, and the connecting plates (208) are arranged about the transverse axis of the adjustment plate (204).

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