Camera module elargol impedance testing device

Abstract

The utility model provides a camera module elargol impedance testing device. The camera module elargol impedance testing device comprises an upper cover and a base, the upper surface of the base is provided with a containing groove used for containing the camera module, and the upper cover is detachably arranged on the base; the upper surface of the base is provided with a connecting guide pin used for being electrically connected with the test box. The lower surface of the upper cover is provided with a switching copper block and a plurality of test PINs, and the test PINs are electrically connected with the switching copper block. According to the camera module testing device, the testing PINs are fixedly arranged at the upper cover, so that the testing PINs can be ensured to be in contact with the same point of different camera modules during testing each time, the detection precision can be improved, meanwhile, different testing PINs correspond to different testing point positions, and it can be ensured that the testing device completes detection of different point positions of the camera modules; in addition, the structure is simple, operation is rapid and convenient, and the working efficiency can be correspondingly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of camera module production, in particular to a silver glue impedance testing device for a camera module. Background Art

[0002] At present, the assembly of a camera module can be fixed by silver glue connection. Among them, silver glue has conductivity and is a commonly used conductive glue, mainly used for the connection and conduction of electronic products. For example, during the assembly process of a camera module, silver glue is used for connection at the circuit connection of the motor or the connection with other electronic devices, as well as at the wiring position of the bracket. After the silver glue is set in the camera module, it is necessary to perform impedance testing on the silver glue at the corresponding positions of the motor and the bracket to ensure that the silver glue impedance is maintained within a certain range, so as to prevent the silver glue from affecting the quality of the camera module.

[0003] In the prior art, basically, the staff manually conducts power-on testing on the silver glue of the camera module. Specifically, the staff holds the test PIN of the test box and places the test PIN on the corresponding position of the camera module, such as on the connecting silver glue between the motor and the bracket, or on the connecting silver glue between the bracket and the lens, so as to perform silver glue impedance detection. However, during the testing process, it is difficult for the staff to maintain the detection at the same point for different camera modules. Therefore, detection errors are likely to occur, resulting in low detection accuracy. Moreover, during the detection process, it is necessary to detect multiple points of the camera module, and manual operation by the staff is prone to missing detection points. In addition, manual detection by the staff also has the problems of troublesome operation and low detection efficiency.

[0004] Therefore, it is necessary to provide a technical solution that is convenient for detecting the silver glue impedance of a camera module and ensuring the detection accuracy. Content of the Utility Model

[0005] The utility model provides a silver glue impedance testing device for a camera module to solve the problems of low detection accuracy, troublesome operation and low working efficiency existing in the impedance detection of silver glue by manual labor in the existing camera module.

[0006] The technical solution adopted by the utility model is as follows: A silver glue impedance testing device for a camera module, comprising: an upper cover and a base; a receiving groove for placing the camera module is arranged on the upper surface of the base, the upper cover is detachably arranged on the base, and when the upper cover is pressed onto the upper surface of the base, the camera module is fixed in the receiving groove.

[0007] A connection guide pin for electrically connecting with a test box is provided on the upper surface of the base; a transfer copper block and a plurality of test PIN pins are provided on the lower surface of the upper cover, and the test PIN pins are electrically connected to the transfer copper block; when the upper cover is pressed onto the upper surface of the base, the plurality of PIN pins respectively contact the silver glue on the motor and the bracket of the camera module, and at the same time, the transfer copper block is connected and conducted with the connection guide pin, so that the test box performs impedance detection on the silver glue on the motor and the bracket.

[0008] In one embodiment, the test PIN pins include a first PIN pin and a second PIN pin. Both the first PIN pin and the second PIN pin are electrically connected to the transfer copper block. The first PIN pin is used to contact the silver glue on the motor, and the second PIN pin is used to contact the silver glue on the bracket.

[0009] In one embodiment, there are two first PIN pins and two second PIN pins on the upper cover. The two first PIN pins respectively contact the silver glue at different positions on the motor, and the two second PIN pins respectively contact the silver glue at different positions on the bracket.

[0010] In one embodiment, both the first PIN pin and the second PIN pin are installed on the upper cover through a pin base, and the connection guide pin is installed on the base through a pin base.

[0011] In one embodiment, it further includes a transfer board and a test box. The transfer board is arranged between the base and the test box, and the transfer board is electrically connected to the test box; the bottom end of the connection guide pin passes through the base and then is connected and conducted with the transfer board.

[0012] In one embodiment, a limiting block is provided on the lower surface of the upper cover. The middle of the limiting block is a limiting groove, and the structure of the limiting groove corresponds to the camera module. The upper cover limits and fixes the camera module at the limiting groove.

[0013] In one embodiment, a fixing block is provided on the upper surface of the base, and a card slot is provided on the lower surface of the upper cover. The fixing block corresponds to the card slot and is used to fix the connector of the camera module in the card slot.

[0014] In one embodiment, a connecting board is provided on the upper surface of the upper cover, and a plurality of connecting pieces are provided on the connecting board. The connecting pieces are connected and conducted with the transfer copper block; the upper ends of the test PIN pins pass through the upper cover and are respectively connected and conducted with the connecting pieces.

[0015] In one embodiment, the connecting pieces are arranged as copper pieces.

[0016] In one embodiment, a plurality of first connection holes are provided on the upper cover, and second connection holes corresponding to the first connection holes one by one are provided on the base. Bolts are installed at the corresponding first connection holes and second connection holes to lock the upper cover and the base.

[0017] The beneficial effects of the present utility model are as follows:

[0018] The silver glue impedance testing device for the camera module of the present application includes: an upper cover and a base; a placement groove for placing the camera module is provided on the upper surface of the base, and the upper cover is detachably arranged on the base; connection guide pins for electrically connecting with the test box are provided on the upper surface of the base; a transfer copper block and a plurality of test PIN pins are provided on the lower surface of the upper cover, and the test PIN pins are electrically connected to the transfer copper block; when the upper cover is pressed onto the upper surface of the base, the camera module will be fixed in the placement groove. At the same time, the PIN pins on the upper cover will respectively contact the silver glue on the motor and the bracket of the camera module, and the transfer copper block will be connected and conduct with the connection guide pins, so that the test box can energize the test PIN pins and perform impedance detection on the camera module; in the present application, the test PIN pins are fixedly arranged on the upper cover. Therefore, it can be ensured that the test PIN pins contact the same point position of different camera modules each time of testing, thereby improving the detection accuracy. At the same time, different test PIN pins correspond to different test point positions, which can ensure that the testing device completes the detection of different point positions of the camera module; in addition, the structure of the present application is simple, the operation is fast and convenient, and the working efficiency can be correspondingly improved. Description of the Drawings

[0019] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present utility model, but should not constitute a limitation to the present utility model. In the drawings:

[0020] Figure 1 It is a schematic structural diagram of a silver glue impedance testing device for a camera module according to an embodiment of the present utility model;

[0021] Figure 2 It is a schematic structural diagram after the base and the upper cover of the present utility model fix the camera module;

[0022] Figure 3 It is an unpacking schematic diagram of the base, the upper cover and the camera module of an embodiment of the present utility model;

[0023] Figure 4 It is a schematic structural diagram of the base according to an embodiment of the present utility model;

[0024] Figure 5 It is a schematic structural diagram of the base from another perspective according to an embodiment of the present utility model;

[0025] Figure 6 This is a schematic diagram of the structure of the upper cover of an embodiment of the utility model;

[0026] Figure 7 This is a schematic diagram of the disassembly of the upper cover and the connecting plate of an embodiment of the utility model;

[0027] Figure 8 It is a structural schematic diagram of a connecting plate according to an embodiment of the utility model.

[0028] Description of the accompanying drawings: 1. Upper cover; 101. Limit block; 102. Limit slot; 103. Card slot; 104. Adapter copper block; 105. First PIN needle; 106. Second PIN needle; 107. Connecting plate; 108. Connecting sheet; 109. First connecting hole; 2. Base; 3. Camera module; 301. Fixed block; 302. Receiving slot; 303. Needle holder; 304. Connecting guide pin; 305. Second connecting hole; 4. Adapter plate; 5. Test box. DETAILED DESCRIPTION

[0029] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0030] To facilitate understanding by those skilled in the art, the present application describes the specific implementation process of the technical solution provided by the present application through the following embodiments.

[0031] See also Figure 1 - Figure 6 The present application provides a camera module silver paste impedance test device, comprising: an upper cover 1 and a base 2; a receiving groove 302 for placing a camera module 3 is provided on the upper surface of the base 2, and the upper cover 1 is detachably provided on the base 2; a connecting guide pin 304 (such as a connecting guide pin 304 for electrically connecting to a test box 5) is provided on the upper surface of the base 2 Figure 4 and Figure 5As shown, the lower end of the connection guide pin 304 passes through the base 2 and is electrically connected to the test box 5; on the lower surface of the upper cover 1, there are transfer copper blocks 104 and several test PIN pins. The positions of the test PIN pins correspond to the silver glue on the motor and the bracket of the camera module. The test PIN pins are electrically connected to the transfer copper blocks 104; when the upper cover 1 is pressed onto the upper surface of the base 2, the camera module 3 will be fixed in the accommodation groove 302. At the same time, the PIN pins on the upper cover 1 will respectively contact the silver glue on the motor and the bracket of the camera module 3, and the transfer copper block 104 will be connected and conduct with the connection guide pin 304. Since the transfer copper block 104 is electrically connected to the test PIN pins, the test box 5 is used to energize the test PIN pins and perform impedance detection on the camera module 3; in this application, the test PIN pins are fixedly arranged on the upper cover 1. Therefore, each time a test is performed, it can be ensured that the test PIN pins contact the same point of different camera modules 3, thereby improving the detection accuracy. At the same time, different test PIN pins correspond to different test points, which can ensure that the test device completes the detection of different points of the camera module 3; in addition, the structure of this application is simple, the operation is fast and convenient, and the work efficiency can be correspondingly improved.

[0032] It should be noted that this application is mainly used for impedance detection of the silver glue on the motor and the bracket of the camera module 3. When it is detected that the silver glue impedance is outside the predetermined range, it proves that the quality of the camera module is unqualified at this time, and it needs to be removed or reinstalled.

[0033] Specifically, the silver glue is arranged at the line connection of the motor or the connection with other electronic devices, and the silver glue on the bracket is arranged at the wiring position. Of course, it includes but is not limited to the above positions. In the actual production process, the silver glue can also be connected at other positions of the camera module. And the test device of this application is mainly used for impedance testing of the silver glue at various positions of the camera module to ensure that the silver glue impedance remains within the predetermined range.

[0034] Furthermore, please refer to Figure 1 、 Figure 5 This application also includes a transfer board 4 and a test box 5. The transfer board 4 is arranged between the base 2 and the test box 5, and the transfer board 4 is electrically connected to the test box 5. The bottom end of the connection guide pin 304 passes through the base 2 and is connected and conducts with the transfer board 4. Among them, the power supply is connected through the transfer board 4 to energize the test box 5 and the test PIN pins, so as to perform the detection work.

[0035] Furthermore, please refer to Figure 3 - Figure 6The test PIN needle includes a first PIN needle 105 and a second PIN needle 106, and the first PIN needle 105 and the second PIN needle 106 are both electrically connected to the transfer copper block 104. The first PIN needle 105 is used to contact the silver glue of the motor on the camera module 3, and the second PIN needle 106 is used to contact the silver glue of the bracket of the camera module 3. Specifically, the upper cover 1 has two first PIN needles 105 and two second PIN needles 106, wherein the two first PIN needles 105 are installed on the upper cover 1 through the needle holder 303, and are both connected and conducted with the transfer copper block 104. When the upper cover 1 is pressed onto the base 2, the two first PIN needles 105 are respectively in contact with two points of the motor, and through the silver glue on the motor, the two first PIN needles 105 are conducted at the motor, so that a power circuit is formed between the transfer copper block 104, a first PIN needle 105, the motor, and another first PIN needle 105, and thereby the test box 5 can detect the silver glue impedance on the motor; similarly, the two second PIN needles 106 are installed on the upper cover 1 through the needle seat 303, and are both connected to the adapter copper block 104. When the upper cover 1 is pressed onto the base 2, the two second PIN needles 106 are respectively in contact with two points of the bracket, and through the silver glue on the bracket, the two second PIN needles 106 are connected to the bracket for conduction, so that an electrical circuit is formed between the adapter copper block 104, a second PIN needle 106, the motor, and another second PIN needle 106, so that the test box 5 can detect the silver glue impedance on the bracket.

[0036] For further information, see Figure 6 - Figure 8 , a connection plate 107 is provided on the upper surface of the upper cover 1, and a plurality of connection pieces 108 are provided on the connection plate 107, and the connection pieces 108 are connected and conducted with the transfer copper block 104; the upper ends of the test PIN needles pass through the upper cover 1 and are connected and conducted with the connection pieces 108 one by one. Specifically, the connection pieces 108 are copper pieces, and at the same time, wires are arranged inside the connection plate 107, and the connection pieces 108 are connected and conducted with the transfer copper block 104 through the wires, so that the test PIN needles are connected and conducted with the transfer copper block 104.

[0037] For further information, see Figure 2 - Figure 6 A limiting block 101 is arranged on the lower surface of the upper cover 1, and the limiting block 101 is a frame structure with an opening. Therefore, the space surrounded by the middle of the limiting block 101 is a limiting groove 102. The limiting groove 102 structure corresponds to the camera module 3. When the upper cover 1 is pressed onto the base 2, the upper cover 1 covers the camera module 3 at the limiting groove 102, and thereby limits and fixes the camera module 3 in the accommodating groove 302 of the base 2.

[0038] For further information, see Figure 2 - Figure 6, a fixing block 301 is provided on the upper surface of the base 2, and a clamping groove 103 is provided on the lower surface of the upper cover 1 and located within the limiting groove 102. The fixing block 301 corresponds to the clamping groove 103. When the upper cover 1 is pressed onto the base 2, the fixing block 301 fixes the connector of the camera module 3 correspondingly within the clamping groove 103.

[0039] Further, please refer to Figure 2 - Figure 7 , a plurality of first connection holes 109 are provided on the upper cover 1, and second connection holes 305 corresponding to the first connection holes 109 one by one are provided on the base 2. Bolts are installed at the corresponding first connection holes 109 and second connection holes 305 to lock the upper cover 1 and the base 2, and thereby enable the upper cover 1 to stably fix the camera module 3 on the base 2 during detection, so as to stably carry out the detection work.

[0040] Compared with the prior art: The silver paste impedance testing device for the camera module 3 of the present application includes: an upper cover 1 and a base 2; a receiving groove 302 for placing the camera module 3 is provided on the upper surface of the base 2, and the upper cover 1 is detachably arranged on the base 2; a connection guide pin 304 for electrically connecting with the test box 5 is provided on the upper surface of the base 2; a transfer copper block 104 and a plurality of test PIN pins are provided on the lower surface of the upper cover 1, and the test PIN pins are electrically connected with the transfer copper block 104; when the upper cover 1 is pressed onto the upper surface of the base 2, the camera module 3 will be fixed within the receiving groove 302. At the same time, the PIN pins on the upper cover 1 will respectively contact the silver paste on the motor and the bracket of the camera module 3, and the transfer copper block 104 will be connected and conducted with the connection guide pin 304, so as to allow the test box 5 to energize the test PIN pins and thereby perform the impedance detection of the camera module 3; in the present application, the test PIN pins are fixedly arranged on the upper cover 1. Therefore, it can be ensured that the test PIN pins contact the same point of different camera modules 3 each time a test is performed, thereby improving the detection accuracy. At the same time, different test PIN pins correspond to different test points, which can ensure that the test device completes the detection of different points of the camera module 3; in addition, the structure of the present application is simple, the operation is fast and convenient, and the work efficiency can be correspondingly improved.

[0041] As long as it does not violate the idea of the present invention, any combination of various different embodiments of the present invention shall be regarded as the content disclosed by the present invention; within the technical concept scope of the present invention, various simple modifications of the technical solution and any combination of different embodiments without violating the idea of the present invention shall be within the protection scope of the present invention.

Claims

1. A camera module silver glue impedance test device, characterized in that: include: An upper cover and a base; a receiving groove for placing a camera module is provided on the upper surface of the base, the upper cover is detachably provided on the base, and the upper cover fixes the camera module in the receiving groove when pressed onto the upper surface of the base; A connecting guide pin for electrically connecting to a test box is provided on the upper surface of the base; a transfer copper block and a plurality of test PIN pins are provided on the lower surface of the upper cover, and the test PIN pins are electrically connected to the transfer copper block; when the upper cover is pressed onto the upper surface of the base, the plurality of PIN pins are in contact with the motor of the camera module and the silver glue on the bracket respectively, and at the same time, the transfer copper block is connected and conducted to the connecting guide pin, so that the test box performs impedance detection on the silver glue on the motor and the bracket.

2. The camera module silver paste impedance testing device according to claim 1, characterized in that: The test PIN needle includes a first PIN needle and a second PIN needle, the first PIN needle and the second PIN needle are both electrically connected to the transfer copper block, the first PIN needle is used to contact the silver glue on the motor, and the second PIN needle is used to contact the silver glue on the bracket.

3. The camera module silver paste impedance testing device according to claim 2, characterized in that: The upper cover is provided with two first PIN needles and two second PIN needles, the two first PIN needles are respectively in contact with the silver glue at different points of the motor, and the two second PIN needles are respectively in contact with the silver glue at different points of the bracket.

4. The camera module silver paste impedance testing device according to claim 2 or 3, characterized in that: The first PIN needle and the second PIN needle are both installed on the upper cover through a needle seat, and the connecting guide needle is installed on the base through a needle seat.

5. The camera module silver paste impedance testing device according to claim 1, characterized in that: It also includes an adapter plate and a test box, wherein the adapter plate is arranged between the base and the test box, and the adapter plate is electrically connected to the test box; the bottom end of the connecting guide pin passes through the base and is connected to the adapter plate.

6. The camera module silver paste impedance testing device according to claim 1, characterized in that: A limiting block is arranged on the lower surface of the upper cover, a limiting groove is formed in the middle of the limiting block, and the limiting groove structure corresponds to the camera module, and the upper cover limits and fixes the camera module at the limiting groove.

7. The camera module silver paste impedance testing device according to claim 1, characterized in that: A fixing block is arranged on the upper surface of the base, and a card slot is arranged on the lower surface of the upper cover. The fixing block corresponds to the card slot and is used to fix the connector of the camera module in the card slot.

8. The camera module silver paste impedance testing device according to claim 1, characterized in that: A connecting plate is arranged on the upper surface of the upper cover, and a plurality of connecting pieces are arranged on the connecting plate, and the connecting pieces are connected and conducted with the transfer copper block; the upper ends of the test PIN needles pass through the upper cover and are connected and conducted with the connecting pieces one by one.

9. The camera module silver paste impedance testing device according to claim 8, characterized in that: The connecting sheet is configured as a copper sheet.

10. The camera module silver paste impedance testing device according to claim 1, characterized in that: The upper cover is provided with a plurality of first connection holes, and the base is provided with second connection holes corresponding to the first connection holes one by one, and bolts are installed at the corresponding first connection holes and second connection holes to lock the upper cover and the base.

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