Multi-product type chip integrated test board

Abstract

The utility model belongs to the field of chip test board structure design, and particularly relates to a multi-product type chip integrated test board which comprises a test mainboard, four different test areas are arranged on the surface of the test mainboard, and a plurality of orderly distributed test boards Pad are fixed in the four test areas on the surface of the test mainboard. Pin areas are formed in the positions, corresponding to all the test areas, of the back face of the test mainboard, a plurality of evenly-distributed Pin modules are arranged in the Pin areas, each Pin module comprises a fixing shell and a Pin, the design can be applied to engineering test verification, chips of multiple product types are integrated on one chip test board to be tested, and the test efficiency is improved. According to the integrated design, the complicated operation of frequently replacing the test board due to different products is reduced, the working efficiency of staff is improved, and the risk that the test board is damaged due to frequent replacement and plugging of the test board is reduced.

Description

Technical Field

[0001] The present invention relates to the field of chip test board structure design, and specifically to an integrated test board for multi-product type chips. Background Art

[0002] Currently, the structure framework of the existing traditional test board is that one chip ball array distribution corresponds to one test board, that is, the test board Pad corresponding to one array distribution. When it is necessary to test chip products with other different ball array distributions, employees need to remove the original test board on the machine and install the chip test board to be tested later on the machine. Such frequent removal and insertion actions are extremely likely to bend and damage the Pin pins of the test bottom board, resulting in subsequent test abnormal problems. In addition, in the design of the traditional test bottom board Pin pins, one test board Pad corresponds to one bottom board Pin pin. This design has a large number of Pin pins, increasing the probability of Pin pin damage;

[0003] Therefore, an integrated test board for multi-product type chips is provided, which realizes that chips of multiple product types can be tested on the same test board, reduces the frequency of test board replacement, and also reduces the risk of test board damage caused by frequent plugging and unplugging, improving the work efficiency of employees. Summary of the Invention

[0004] The purpose of the present invention is to provide an integrated test board for multi-product type chips, which solves the problems raised in the background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: An integrated test board for multi-product type chips, including a test main board, on the surface of which there are four different test areas, and a plurality of orderly distributed test board Pads are fixed in each of the four test areas on the surface of the test main board;

[0006] At the back of the test main board, a Pin pin area is provided corresponding to each test area, and a plurality of evenly distributed Pin pin modules are arranged in the Pin pin area. The Pin pin module includes a fixed shell and Pin pins. The number of Pin pins is multiple, and multiple Pin pins are evenly arrayed and fixed in the fixed shell.

[0007] At the back of the test main board, a Pin pin area is provided corresponding to each test area, and a plurality of evenly distributed Pin pin modules are arranged in the Pin pin area. The Pin pin module includes a fixed shell and Pin pins. The number of Pin pins is multiple, and multiple Pin pins are evenly arrayed and fixed in the fixed shell;

[0008] By adopting the above technical solution, when the chip test socket is installed on the test main board, the test socket contacts the test board Pad. The array distribution of the balls at the bottom end of the chip is consistent with the array distribution of the test board Pad. That is, a chip product with a certain ball array distribution corresponds to a test board Pad with a corresponding array distribution. Therefore, during testing, the chip test socket is installed in the corresponding test area so that it can contact the test board Pad with a matching distribution. At the same time, the Pin pin module at the bottom of the test main board is inserted into the tester, and then the testing can be carried out. There are a total of four Pin pin areas at the bottom end of the test main board, and the four Pin areas correspond to the test board Pads in the four test areas on the upper surface of the test main board. When the existing chip product testing is completed and subsequent testing of other chip products is required, the test area can be directly changed, and the testing can be completed without replacing the test board, saving manpower and the time for replacing hardware.

[0009] As a preferred embodiment of the present invention, the test board Pads on the surface of each of the test areas are evenly divided into four different array areas and are distributed in an orderly manner.

[0010] By adopting the above technical solution, the distribution arrays of the test board Pads distributed in the four test areas are all different, thus ensuring that they can correspond to different chip test sockets.

[0011] As a preferred embodiment of the present invention, a cross groove is provided at the middle of the surface of the test main board.

[0012] By adopting the above technical solution, the setting of the cross groove enables the division of the four different test areas, thus facilitating the staff to operate on different areas and making the distinction clear.

[0013] As a preferred embodiment of the present invention, a plurality of evenly distributed positioning holes are provided on the surfaces of the four test areas of the test main board.

[0014] By adopting the above technical solution, the setting of the positioning holes enables positioning and guiding during the installation of the chip test socket, ensuring the accuracy of the installation.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] The integrated test board design and integrated Pin pin design for multiple types of chip products of the present invention can greatly reduce the frequency of test board replacement, and synchronously reduce the occurrence of abnormalities such as Pin pin bending and damage caused by plugging and unplugging Pin pins during test board replacement. The reduction of the test board replacement frequency not only alleviates the fatigue of employees caused by the complicated work of replacing the test board, but also improves the work efficiency of employees. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments read in conjunction with the accompanying drawings:

[0018] Figure 1 Schematic diagram of the overall structure of an integrated test board for multi-product type chips according to the present invention;

[0019] Figure 2 Schematic diagram of the back structure of an integrated test board for multi-product type chips according to the present invention;

[0020] Figure 3 Enlarged schematic diagram of A of an integrated test board for multi-product type chips according to the present invention;

[0021] Figure 4 Enlarged schematic diagram of B of an integrated test board for multi-product type chips according to the present invention.

[0022] In the figure:

[0023] 1. Test main board; 11. Positioning holes; 12. Test board Pad; 13. Pin needle area;

[0024] 2. Pin needle module; 21. Fixed shell; 22. Pin needles. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0026] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0027] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected", and "set" should be understood in a broad sense. For example, it can be fixedly connected and set, or detachably connected and set, or integrally connected and set. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations. The models of the electrical appliances provided in the present invention are only for reference, and different models of electrical appliances with the same function can be replaced according to actual use situations.

[0028] Please refer toFigures 1-4 , the present invention provides a technical solution: a multi-product type chip integrated and integrated test board, including a test main board 1. Four different test areas are arranged on the surface of the test main board 1, and a plurality of orderly distributed test board Pads 12 are fixed in each of the four test areas on the surface of the test main board 1;

[0029] Corresponding to each test area on the back of the test main board 1, a Pin needle area 13 is provided. A plurality of evenly distributed Pin needle modules 2 are arranged in the Pin needle area 13. The Pin needle module 2 includes a fixed shell 21 and Pin needles 22. The number of Pin needles 22 is multiple, and a plurality of Pin needles 22 are evenly arrayed and fixed in the fixed shell 21;

[0030] The circuits of the test board Pads 12 in the four test areas on the upper surface of the test main board 1 are respectively integrated on the corresponding Pin needles 22 in the four Pin needle areas 13. This design greatly reduces the number of Pin needles 22 and reduces the probability of bending and damage of the Pin needles 22 caused by replacing and plugging the test board;

[0031] In actual use, when the chip test socket is installed on the test main board 1, the test socket contacts the test board Pad 12. The array distribution of the balls at the bottom of the chip is the same as the array distribution of the test board Pad 12, that is, a chip product with a ball array distribution corresponds to a test board Pad 12 with an array distribution. Therefore, during the test, the chip test socket is installed in the corresponding test area so that it can contact the test board Pad 12 with a matching distribution. At the same time, the Pin needle module 2 at the bottom of the test main board 1 is inserted into the test machine, and then the test can be carried out. There are a total of four Pin needle areas 13 at the bottom end of the test main board 1. The four Pin areas 13 correspond to the test board Pads 12 in the four test areas on the upper surface of the test main board 1. When the existing chip product test is completed and subsequent other chip products need to be tested, the test area can be directly replaced, and the test can be completed without replacing the test board, saving manpower and the time for replacing hardware.

[0032] As Figure 1 and 3 shown; A plurality of evenly distributed positioning holes 11 are provided on the surfaces of the four test areas of the test main board 1. The setting of the positioning holes 11 enables the chip test socket to be positioned and guided during installation, ensuring the accuracy of installation.

[0033] As Figure 1 shown; The test board Pads 12 on the surface of each test area are divided into four different array areas and are orderly distributed, and the distribution arrays of the test board Pads 12 distributed in the four test areas are all different, so as to ensure that different chip test sockets can be corresponded.

[0034] As Figure 1As shown in the figure; a cross groove is provided in the middle of the surface of the test main board 1. The setting of the cross groove enables the division of four different test areas, facilitating the operation of staff on different areas and making the distinction clear.

[0035] The implementation principle of a multi-product type chip integrated integrated test board of the present application is as follows: in actual use, when the chip test socket is installed on the test main board 1, the test socket contacts the test board Pad 12. The array distribution of the balls at the bottom of the chip is the same as the array distribution of the test board Pad 12, that is, a chip product with a certain ball array distribution corresponds to a test board Pad 12 with a corresponding array distribution. Therefore, during testing, the chip test socket is installed in the corresponding test area to make contact with the test board Pad 12 with a matching distribution. At the same time, the Pin pin module 2 at the bottom of the test main board 1 is inserted into the tester, and then the test can be carried out. It is possible to complete the test without replacing the test board, saving manpower and the time for replacing hardware. The circuits of the test board Pad 12 in the four test areas on the upper surface of the test main board 1 are respectively integrated on the corresponding Pin pins 22 in the four Pin pin areas 13. This design greatly reduces the number of Pin pins 22 and reduces the probability of bending and damage of the Pin pins 22 caused by replacing and plugging the test board.

[0036] In addition, all the components included in a multi-product type chip integrated integrated test board of the present invention are common standard components or components known to those skilled in the art. Its structure and principle can be known to those skilled in the art through technical manuals or obtained through conventional experimental methods. In the idle space of this device, all the above-mentioned electrical components, which refer to power elements, electrical components, and the adapted monitoring computer and power supply, are connected by wires. For the specific connection means, reference should be made to the following working principle and the sequence of work among the electrical components to complete the electrical connection. The detailed connection means are well-known techniques in the art. The following mainly introduces the working principle and process, and no further description of electrical control will be made.

[0037] The above shows and describes the basic principles, main features, and advantages of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and without departing from the spirit or basic features of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0038] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment contains only an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multi-product type chip integrated test board, comprising a test main board (1), characterized in that: The surface of the test main board (1) is provided with four different test areas, and a plurality of orderly distributed test board Pads (12) are fixed in the four test areas on the surface of the test main board (1); A pin area (13) is provided on the back side of the test main board (1) corresponding to each test area, and a plurality of evenly distributed pin modules (2) are arranged in the pin area (13).

2. The integrated test board for multi-product type chips according to claim 1, characterized in that: The Pin needle module (2) comprises a fixed shell (21) and Pin needles (22). The number of the Pin needles (22) is multiple, and the multiple Pin needles (22) are fixed in the fixed shell (21) in a uniform array.

3. The integrated test board for multi-product type chips according to claim 1, characterized in that: The test plate Pad (12) on the surface of each test area is divided into four different array areas and distributed in an orderly manner.

4. The integrated test board for multi-product type chips according to claim 1, characterized in that: A cross groove is provided in the middle of the surface of the test main board (1).

5. The integrated test board for multi-product type chips according to claim 1, characterized in that: The surfaces of the four test areas of the test main board (1) are each provided with a plurality of evenly distributed positioning holes (11).

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