Backlight module and display equipment
By setting grooves on the back plate of the backlight module and setting a first line layer and a light emitting device therein, the problem of increasing thickness of the backlight module in the prior art is solved, and the effects of thinner and brightness uniformity are achieved.
Patent Information
- Application Number
- CN202422116241.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-29
AI Technical Summary
In the prior art, backlight modules need to design sufficient light mixing distance to increase the thickness of the display product.
By providing grooves on the back plate of the backlight module, and providing a first line layer and a light emitting member therein, the structure is more compact and a thinner design is achieved.
The thinner design of the backlight module is achieved, reducing the need for mixed light distances and improving the brightness uniformity of the backlight module.
Smart Images
Figure CN223022510U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of display devices, and particularly to a backlight module and a display device. Background Art
[0002] With the increasing requirements of consumers for the form of display products, ultrathin has gradually become a standard feature of high-end display products. However, referring to Figure 1 , Figure 1 is a schematic structural diagram of a backlight module of a display product in the related art. As shown in Figure 1 , in the related art, a backlight module generally includes a backplane 1', a PCB board 2' stacked on the backplane 1', an LED lamp 3' and a lamp support 4' mounted on the PCB board 2', a diffusion plate 5' located on the light-emitting side of the LED lamp 3', and an optical film 6'. Such a backlight module generally needs to design a sufficient optical distance (OD), for example, an optical distance of 12 - 20 mm needs to be designed. That is, a sufficient distance needs to be reserved between the upper surface of the PCB board 2' and the diffusion plate 5'. In this way, the thickness of the display product will increase. Summary of the Utility Model
[0003] Embodiments of this application provide a backlight module and a display device, which are used to improve the problem that a sufficient distance needs to be reserved between the upper surface of the PCB board and the diffusion plate in the related art, resulting in an increase in the thickness of the display product.
[0004] In a first aspect, embodiments of this application provide a backlight module, including:
[0005] A backplane having opposite first and second surfaces, with a groove formed on the first surface, and at least part of the second surface constituting the appearance surface of the backlight module;
[0006] A first circuit layer formed on the inner wall surface of the groove;
[0007] A light-emitting component, at least part of which is located in the groove and electrically connected to the first circuit layer.
[0008] For the backlight module of the embodiments of this application, a groove is provided on the backplane of the backlight module, and a first circuit layer and a light-emitting component are provided in the groove. Compared with the related art in which a PCB board and an LED lamp are stacked on the surface of the backplane, the first circuit layer and the light-emitting component can be sunk on the backplane, making the structural design of the backlight module more compact and conducive to the thinner design of the backlight module; and the first circuit layer can be formed by a metal layer patterning process, and its thickness is greatly reduced compared with the PCB board, which is further conducive to the design of an ultrathin backlight module.
[0009] In some of these embodiments, the backplane is a glass backplane.
[0010] Based on the above embodiments, etching grooves on the glass and forming the first circuit layer are mature processes, which are beneficial to improving the manufacturing precision of the grooves, the first circuit layer, and so on.
[0011] In some of the embodiments, a plurality of spaced grooves are formed on the first surface. The backlight module includes a plurality of first circuit layers and a plurality of light-emitting elements, and a first circuit layer and a light-emitting element are disposed in each groove.
[0012] Based on the above embodiments, by providing a plurality of grooves, a plurality of first circuit layers, and a plurality of light-emitting elements, compared with providing only one light-emitting element, it is beneficial to improve the brightness of the backlight module.
[0013] In some of the embodiments, the first circuit layers in each groove are independent of each other.
[0014] Based on the above embodiments, the backlight module can separately control the first circuit layers in different grooves so that the corresponding light-emitting elements are lit. Since the control of the first circuit layers in each groove is independent of each other, therefore, whether the lighting of the light-emitting elements in each groove is independent of each other will not cause the problem that all the light-emitting elements cannot be lit due to local circuit damage, and the maintenance is convenient.
[0015] In some of the embodiments, a second circuit layer is further included, which is formed on the first surface, and the second circuit layer electrically connects the first circuit layers in at least two grooves.
[0016] Based on the above embodiments, the first circuit layers in at least two grooves are electrically connected to each other, which can simplify the control difficulty and reduce the control cost. The second circuit layer can be formed by a metal layer patterning process (for example, etching, exposure, development, etc.) and has a low thickness.
[0017] In some of the embodiments, the light-emitting surface of the light-emitting element is flush with the first surface.
[0018] Based on the above embodiments, the optical signal emitted through the light-emitting surface of the light-emitting element will not be blocked by the inner wall surface of the groove, and can be more evenly diverged outward, which is beneficial to improving the uniformity of the brightness of each area of the backlight module.
[0019] In some of the embodiments, the light-emitting element includes:
[0020] A light-emitting lamp, which is located in the groove and electrically connected to the first circuit layer;
[0021] A diffusion layer, which is located in the groove and on the light-emitting side of the light-emitting lamp, and the surface of the diffusion layer away from the light-emitting lamp constitutes the light-emitting surface.
[0022] Based on the above embodiments, the light-emitting lamp is used to emit optical signals. The diffusion layer is located on the light-emitting side of the light-emitting lamp and is used to scatter the optical signals emitted by the light-emitting lamp, so that the light brightness is uniform.
[0023] The surface of the diffusion layer away from the light-emitting lamp is configured as a light-emitting surface flush with the first surface of the backplane, so that the optical signals emitted from the light-emitting surface of the light-emitting component are already the optical signals scattered by the diffusion layer, and the light brightness is relatively uniform.
[0024] In some embodiments, the diffusion layer is a diffusion film.
[0025] Based on the above embodiments, compared with the related art in which a lens is disposed on the light-emitting side of the light-emitting lamp to scatter the optical signals, the thickness of the diffusion film is relatively thin, which is beneficial to reducing the requirement for the mixing distance of the backlight module and realizing the design of an ultra-thin backlight module.
[0026] In some embodiments, it further includes:
[0027] A diffusion plate, located on the light-emitting side of the light-emitting component and disposed opposite to the backplane;
[0028] An optical film sheet, located on the side of the diffusion plate away from the light-emitting component and disposed opposite to the diffusion plate.
[0029] Based on the above embodiments, the diffusion plate can scatter the optical signals emitted from the light-emitting surface of the light-emitting component, so that the light brightness is more uniform. The optical film sheet can be used to increase the light efficiency and / or light brightness, etc.
[0030] In a second aspect, an embodiment of the present application further provides a display device, including the above backlight module.
[0031] The display device according to the embodiment of the present application includes the above backlight module. Therefore, it has the technical effect of being ultra-thin of the above backlight module. Description of the Drawings
[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0033] Figure 1 It is a schematic structural diagram of a backlight module of a display product in the related art;
[0034] Figure 2 It is a partial structural schematic diagram of a backlight module provided by some embodiments of the present application;
[0035] Figure 3 It isFigure 2 Partial structural schematic diagram of the backlight module shown;
[0036] Figure 4 It is a partial structural schematic diagram of the backlight module provided in some other embodiments of the present application;
[0037] Figure 5 is Figure 4 Partial structural schematic diagram of the backlight module shown;
[0038] Figure 6 It is a partial structural schematic diagram of the display screen provided in some embodiments of the present application.
[0039] Description of reference numerals:
[0040] 1', backplane; 2', PCB board; 3', LED lamp; 4', lamp support; 5', diffusion plate; 6', optical film;
[0041] 1, backlight module; 2, display screen; 3, display panel;
[0042] 10, backplane; 11, first surface; 111, groove; 1111, inner wall surface; 1112, bottom surface; 1113, peripheral side surface; 12, second surface;
[0043] 20, first circuit layer;
[0044] 30, light-emitting component; 31, light-emitting surface; 32, light-emitting lamp; 33, diffusion layer;
[0045] 40, second circuit layer;
[0046] 50, diffusion plate;
[0047] 60, optical film. Detailed implementation manners
[0048] To make the objectives, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings.
[0049] When the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0050] As consumers' requirements for the form of display products increase, ultrathin has gradually become a standard feature of high-end display products. However, referring to Figure 1 , Figure 1 is a structural schematic diagram of the backlight module of a display product in the related art, asFigure 1 As shown, in the related art, a backlight module generally includes a backplane 1', a PCB board 2' stacked on the backplane 1', an LED lamp 3' and a lamp support 4' mounted on the PCB board 2', a diffusion plate 5' located on the light-emitting side of the LED lamp 3', and an optical film 6'. Such a backlight module usually needs to design a sufficient optical distance (abbreviated as OD). For example, an optical distance of 12 - 20 mm needs to be designed. That is, a sufficient distance needs to be reserved between the upper surface of the PCB board 2' and the diffusion plate 5'. In this way, the thickness of the display product will increase.
[0051] In the embodiments of the present application, a groove is provided on the backplane of the backlight module, and a first circuit layer and a light-emitting component are provided in the groove. Compared with the related art in which a PCB board and an LED lamp are stacked on the surface layer of the backplane, the first circuit layer and the light-emitting component can be sunken on the backplane, making the structural design of the backlight module more compact and facilitating the thinner design of the backlight module. Moreover, the first circuit layer can be formed by a metal layer patterning process, and its thickness is greatly reduced compared with that of the PCB board, which further facilitates the design of an ultra-thin backlight module.
[0052] Please refer to Figure 2 and Figure 3 , Figure 2 which are partial structural schematic diagrams of the backlight module provided by some embodiments of the present application. Figure 3 is Figure 2 the partial structural schematic diagram of the backlight module shown. As shown in Figure 2 and Figure 3 , the backlight module 1 includes a backplane 10, a first circuit layer 20, and a light-emitting component 30.
[0053] Among them, the backplane 10 has opposite first and second surfaces 11 and 12. A groove 111 is formed on the first surface 11, and at least a part of the second surface 12 constitutes the appearance surface of the backlight module 1. The first circuit layer 20 is formed on the inner wall surface 1111 of the groove 111. At least a part of the light-emitting component 30 is located in the groove 111 and is electrically connected to the first circuit layer 20.
[0054] In the embodiments of the present application, a groove 111 is provided on the backplane 10 of the backlight module 1, and a first circuit layer 20 and a light-emitting component 30 are provided in the groove 111. Compared with the related art in which a PCB board 2' and an LED lamp 3' are stacked on the surface layer of the backplane 1', the first circuit layer 20 and the light-emitting component 30 can be sunken on the backplane 10, making the structural design of the backlight module 1 more compact and facilitating the thinner design of the backlight module 1. Moreover, the first circuit layer 20 can be formed by a metal layer patterning process, and its thickness is greatly reduced compared with that of the PCB board 2', which further facilitates the design of an ultra-thin backlight module 1.
[0055] Regarding the backplane 10, at least part of which serves as the appearance part of the backlight module 1, it can play the role of fixing and protecting the first circuit layer 20 and the light-emitting element 30. Among them, the backplane 10 can be generally in a flat plate structure or generally in a concave plate structure with a receiving space, and this is not limited.
[0056] If the backplane 10 is generally in a concave plate structure with a receiving space, at this time, the backplane 10 can include a bottom plate and an outer peripheral plate surrounding the periphery of the bottom plate. The outer peripheral plate is connected to one side of the bottom plate and extends away from the bottom plate to form a receiving space with the bottom plate. The above-mentioned first surface 11 is formed with a groove 111, which can be that the bottom plate has a groove 111 on the side within the receiving space. The first circuit layer 20 and the light-emitting element 30 are arranged in the groove 111 of the bottom plate, and this is not limited. The above-mentioned outer peripheral plate can be connected to one side of the bottom plate and extend in a direction perpendicular to the bottom plate, or can be connected to one side of the bottom plate and extend in a direction obtuse to the bottom plate, and this is not limited.
[0057] The first surface 11 can be the surface of the backplane 10 facing the inside of the backlight module 1, and the second surface 12 can be the surface of the backplane 10 facing the outside of the backlight module 1. A groove 111 is provided on the first surface 11, and the first circuit layer 20 and the light-emitting element 30 are arranged in the groove 111, which is beneficial for the light-emitting element 30 to emit light on the inside of the backlight module 1. Among them, the inside of the backlight module 1 refers to the side that cannot be observed by the user when the backlight module 1 is assembled in the display device, and the outside of the backlight module 1 refers to the side that can be at least partially observed by the user when the backlight module 1 is assembled in the display device. The light-emitting element 30 emits light on the inside of the backlight module 1, which can avoid the problem of light leakage.
[0058] The above-mentioned first surface 11 is formed with a groove 111, which can be formed by processes such as laser and etching on the first surface 11, or can be formed by processes such as injection molding on the first surface 11. The embodiment of the present application does not limit the forming method of the groove 111.
[0059] In some embodiments, the first surface 11 is formed with a plurality of spaced grooves 111. The backlight module 1 includes a plurality of first circuit layers 20 and a plurality of light-emitting elements 30, and each groove 111 is provided with a first circuit layer 20 and a light-emitting element 30. By providing a plurality of grooves 111, a plurality of first circuit layers 20 and a plurality of light-emitting elements 30, compared with only providing one light-emitting element, it is beneficial to improve the brightness of the backlight module 1. Among them, the plurality of grooves 111 can be randomly arranged or regularly arranged. For example, they are arranged in an array along the first direction and / or the second direction, etc. The first direction is perpendicular to the second direction, and this is not limited.
[0060] It can be understood that one light-emitting component 30 or multiple light-emitting components 30 can be arranged in the same groove 111. The multiple light-emitting components 30 in the same groove 111 can all be electrically connected to the first circuit layer 20 in the groove 111. Further, if multiple light-emitting components 30 are arranged in the same groove 111, the multiple light-emitting components 30 can be arranged in an array along the first direction and / or the second direction, etc., and no limitation is made thereto. Among them, the groove 111 can be a long-strip groove, a square groove, a circular groove, etc., and no limitation is made thereto.
[0061] In some embodiments, the first circuit layers 20 in the respective grooves 111 are independent of each other. At this time, the backlight module 1 can control the first circuit layers 20 in different grooves 111 respectively, so that the corresponding light-emitting components 30 are lit. Since the control of the first circuit layers 20 in the respective grooves 111 is independent of each other, whether the lighting of the light-emitting components 30 in the respective grooves 111 is independent of each other will not cause the problem that all the light-emitting components 30 cannot be lit due to local circuit damage, and the maintenance is convenient.
[0062] At least a part of the second surface 12 constitutes the appearance surface of the backlight module 1, and it can be: the second surface 12 entirely constitutes the appearance surface of the backlight module 1. At this time, no other structural components are provided on the second surface 12, and it is entirely exposed. At least a part of the second surface 12 constitutes the appearance surface of the backlight module 1, and it can also be: a part of the second surface 12 constitutes the appearance surface of the backlight module 1. At this time, some parts of the second surface 12 can be provided with other structural components (for example, a main board and a main board cover) and are blocked by the structural components, and the remaining parts are not provided with structural components and are exposed. Among them, the appearance surface of the backlight module 1 refers to the surface that can be observed by the user when the backlight module 1 is assembled in the display device.
[0063] In some embodiments, the backplane 10 can be a glass backplane. Etching grooves 111 and the first circuit layer 20 on the glass is a mature process, which is beneficial to improving the manufacturing accuracy of the grooves 111 and the first circuit layer 20, etc.
[0064] In some embodiments, a light-shielding layer can be provided on the backplane 10 to prevent light leakage from the backplane 10. Among them, the light-shielding layer can be provided on the backplane 10 by coating or other means, and no limitation is made thereto. In some embodiments, a light-shielding layer can be provided on the second surface 12.
[0065] Regarding the first circuit layer 20, it is used to provide electrical signals for the light-emitting component 30.
[0066] In some embodiments, the first circuit layer 20 may be formed on the inner wall surface 1111 of the groove 111 through processes such as etching, exposure, and development, which will not be elaborated here. Specifically, the first circuit layer 20 may be formed on the bottom surface 1112 of the inner wall surface 1111, or may be formed on the circumferential side surface 1113 of the inner wall surface 1111, or may be formed on both the bottom surface 1112 and the circumferential side surface 1113 of the inner wall surface 111, and this is not limited.
[0067] In some embodiments, pads may be provided on the first circuit layer 20, and the first circuit layer 20 may be electrically connected to the light-emitting element 30 through the pads.
[0068] For the light-emitting element 30, it is used to emit optical signals to achieve the lighting of the backlight module 1.
[0069] At least a part of the above-mentioned light-emitting element 30 is located in the groove 111, which may be that the whole light-emitting element 30 is located in the groove 111, or a part of the light-emitting element 30 is located in the groove 111 and the remaining part protrudes from the groove 111.
[0070] In the embodiments of the present application, the light-emitting surface 31 of the light-emitting element 30 is flush with the first surface 11 of the backplane 10. In this way, the optical signal emitted from the light-emitting surface 31 of the light-emitting element 30 will not be blocked by the inner wall surface 1111 of the groove 111, and can be more evenly diverged outward, which is beneficial to improving the uniformity of the brightness of each area of the backlight module 1.
[0071] In some embodiments, the shape of the light-emitting surface 31 may be substantially similar to the shape of the port of the groove 111; for example, they may both be circular, square, etc., and this is not limited.
[0072] In some embodiments, the light-emitting element 30 includes a light-emitting lamp 32 and a diffusion layer 33. The light-emitting lamp 32 is located in the groove 111 and is electrically connected to the first circuit layer 20; the diffusion layer 33 is located in the groove 111 and on the light-emitting side of the light-emitting lamp 32, and the surface of the diffusion layer 33 away from the light-emitting lamp 32 constitutes the light-emitting surface 31. Among them, the light-emitting lamp 32 may be an LED lamp, etc., and the light-emitting lamp 32 is used to emit optical signals. The diffusion layer 33 is located on the light-emitting side of the light-emitting lamp 32 and is used to scatter the optical signals emitted by the light-emitting lamp 32 to make the light brightness uniform.
[0073] The above design that the surface of the diffusion layer 33 away from the light-emitting lamp 32 constitutes the light-emitting surface 31 flush with the first surface 11 of the backplane 10 can ensure that the optical signal emitted from the light-emitting surface 31 of the light-emitting element 30 is already the optical signal scattered by the diffusion layer 32, and the light brightness is relatively uniform.
[0074] In some embodiments, the diffusion layer 33 is a diffusion film. Compared with the related art in which a lens is disposed on the light-emitting side of the light-emitting lamp to disperse the light signal, the diffusion film has a relatively thin thickness, which is beneficial to reducing the requirement for the light mixing distance of the backlight module 1. For example, it can achieve an almost zero light mixing distance, realizing the design of an ultra-thin backlight module 1.
[0075] In some embodiments, the diffusion layer 33 may be a PET (Polyethyleneterephthalate) film added with diffusion particles. The diffusion particles may be TiO2, SiO2, etc., and are not limited thereto.
[0076] In some embodiments, the backlight module 1 further includes a diffusion plate 50. The diffusion plate 50 is located on the light-emitting side of the light-emitting member 30 and is disposed opposite to the back plate 10. The diffusion plate 50 can disperse the light signal emitted from the light-emitting surface 31 of the light-emitting member 30, making the light brightness more uniform.
[0077] In some embodiments, the backlight module 1 further includes an optical film 60. The optical film 60 is located on the side of the diffusion plate 50 away from the light-emitting member 30 and is disposed opposite to the diffusion plate 50. The optical film 60 can be used to increase the light efficiency and / or light brightness, etc., and is not limited thereto.
[0078] Please refer to Figure 4 and Figure 5 , Figure 4 are partial structural schematic diagrams of a backlight module provided in some other embodiments of the present application. Figure 5 is Figure 4 The partial structural schematic diagram of the backlight module shown, as Figure 4 and Figure 5 shown, the first circuit layers 20 in at least two grooves 111 can be electrically connected to each other to simplify the control difficulty and reduce the control cost.
[0079] In some embodiments, the backlight module 1 further includes a second circuit layer 40. The second circuit layer 40 is formed on the first surface 11, and the second circuit layer 40 electrically connects the first circuit layers 20 in at least two grooves 111. The second circuit layer 40 can be formed by a metal layer patterning process (for example, etching, exposure, development, etc.) and has a relatively low thickness.
[0080] Among them, the first circuit layer 20 is electrically connected to the second circuit layer 40. Part of the circuits of the first circuit layer 20 can be directly connected to part of the circuits of the second circuit layer 40 to form a whole. At this time, at least part of the first circuit layer 20 can be arranged on the circumferential side surface 1113 of the inner wall surface 1111 so that part of the circuits of the two can be directly connected to form a whole. Among them, the first circuit layer 20 is electrically connected to the second circuit layer 40, and it can also be that the first circuit layer 20 and the second circuit layer 40 can be electrically connected through an additionally arranged wire or the like, and this is not limited herein.
[0081] The light-emitting components 30 corresponding to the first circuit layer 20 that are electrically connected to each other above can form a light-emitting unit. The light-emitting components 30 within the same light-emitting unit can be lit simultaneously to simplify the wiring difficulty of the backlight module 1.
[0082] In some embodiments, the light-emitting components 30 within the same light-emitting unit can be randomly arranged, or can be arranged in an array along the first direction and / or the second direction, and this application embodiment does not limit this.
[0083] In the embodiments of this application, the light-emitting components 30 within the same light-emitting unit are arranged in an array along the first direction and / or the second direction and are adjacent to each other to simplify the design difficulty of the second circuit layer 40. For example, the second circuit layer 40 can be directly arranged at the first surface 11 between two adjacent light-emitting components 30 within the same light-emitting unit.
[0084] Refer to Figure 6 , Figure 6 is a partial structural schematic diagram of a display screen provided by some embodiments of this application. As Figure 6 shown, the display screen 2 includes the above-mentioned backlight module 1 and a display panel 3. The display panel 3 is located on the light-emitting side of the backlight module 1 and is arranged opposite to the backlight module 1. The specific structure of this backlight module 1 refers to the above embodiments. Since the display screen 2 adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, and will not be elaborated herein one by one.
[0085] Based on the same inventive concept, the embodiments of this application also provide a display device, and the display device includes the above-mentioned display screen. Since the display device includes a display screen with a backlight module 1, the specific structure of this backlight module 1 refers to the above embodiments. Since the display device adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, and will not be elaborated herein one by one.
[0086] Among them, the display device can be a terminal device with a display screen, such as: mobile phone, tablet computer, notebook computer, handheld computer, mobile Internet device, wearable device, etc., intelligent interactive flat panel.
[0087] In the description of the present application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances. In addition, in the description of the present application, unless otherwise specified, "a plurality of" means at least two, for example, two, three, four, etc. "And / or" describes the association relationship of associated objects and indicates that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.
[0088] The above-disclosed are only the preferred embodiments of the present application, and of course, the scope of rights of the present application cannot be limited thereby. Therefore, equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.
Claims
1. A backlight module, characterized in that: include: A back plate having a first surface and a second surface opposite to each other, wherein a groove is formed on the first surface, and at least a part of the second surface constitutes an appearance surface of the backlight module; A first circuit layer is formed on the inner wall surface of the groove; The light emitting element is at least partially located in the groove and is electrically connected to the first circuit layer.
2. The backlight module according to claim 1, characterized in that: The back plate is a glass back plate.
3. The backlight module according to claim 1, characterized in that: The first surface is formed with a plurality of spaced grooves. The backlight module includes a plurality of the first circuit layers and a plurality of the light-emitting components. The first circuit layer and the light-emitting component are disposed in each of the grooves.
4. The backlight module according to claim 3, characterized in that: The first circuit layers in the grooves are independent of each other.
5. The backlight module according to claim 3, characterized in that: Also includes: The second circuit layer is formed on the first surface, and the second circuit layer electrically connects the first circuit layers in at least two of the grooves.
6. The backlight module according to claim 1, characterized in that: The light emitting surface of the light emitting element is flush with the first surface.
7. The backlight module according to claim 6, characterized in that: The light emitting element comprises: a light-emitting lamp, located in the groove and electrically connected to the first circuit layer; The diffusion layer is located in the groove and on the light-emitting side of the light-emitting lamp, and the surface of the diffusion layer away from the light-emitting lamp constitutes the light-emitting surface.
8. The backlight module according to claim 7, characterized in that: The diffusion layer is a diffusion membrane.
9. The backlight module according to any one of claims 1 to 8, characterized in that: Also includes: A diffusion plate, located at the light-emitting side of the light-emitting element and arranged opposite to the back plate; The optical film is located on a side of the diffusion plate away from the light-emitting element and is arranged opposite to the diffusion plate.
10. A display device, characterized in that: A backlight module comprising any one of claims 1 to 9.