Temperature control device for testing performance of semiconductor element at high temperature

Abstract

The utility model relates to the technical field of semiconductor testing, and discloses a temperature control device for testing the performance of a semiconductor element at a high temperature. The device comprises a controller, a main heating plate and a plurality of auxiliary heating plates. The controller comprises a shell, a plurality of connecting columns are arranged on one side of the shell, and the controller has a temperature collection control function; the main heating plate is provided with a first positive electrode end and a first negative electrode end, and the first positive electrode end and the first negative electrode end are electrically connected with the corresponding connecting columns; each auxiliary heating plate is provided with a second positive electrode end and a second negative electrode end, the auxiliary heating plates and the main heating plate are connected in series and connected end to end to define a heating space, a semiconductor element to be detected is placed in the heating space, and the controller controls the heating temperature of the main heating plate and the auxiliary heating plates, so that the semiconductor element is heated to the temperature when the semiconductor element is to be detected. According to the temperature control device for testing the performance of the semiconductor element at the high temperature, the heating stability of the temperature control device can be ensured, the operation is convenient, the efficiency is high, and the temperature control device is suitable for semiconductor elements of various specifications.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of semiconductor testing, and particularly to a temperature control device for testing the performance of semiconductor components at high temperatures. Background Art

[0002] Semiconductor components are usually used in various scenarios, including but not limited to industrial regulations, automotive regulations, consumer-grade and other scenarios. With the improvement of the performance of semiconductor components and the functions of power semiconductors, the problem of heat generation during the use of semiconductor components has become increasingly prominent. Therefore, it is necessary to verify the performance of semiconductor component products at different detection temperatures.

[0003] Existing temperature control devices for testing the performance of semiconductor components at high temperatures usually use heating plates, temperature control boxes, and heating rods to heat semiconductor components. By setting the temperature value, the components are heated to the required test temperature. When connecting the device under test in this testing method, the power device sample needs to be fixed on the screw holes of the heating plate through screws. Through contact heat transfer, the power device sample is heated to achieve the test purpose. This kind of heating plate is relatively large in size. Each time a sample is heated, thermal grease needs to be applied and connected through screws. After completing a single sample, it is necessary to wait for the heating plate to cool down, then rotate the screws to remove the test sample, and replace the next test sample until the test is completed. When replacing components, it is necessary to remove the connected screws, fixtures, etc., and the operation is troublesome. Moreover, the shape and size of the heating plate are basically fixed, and it cannot be applied to semiconductor components of different sizes.

[0004] How to design a temperature control device for testing semiconductor components with stable heating, convenient operation, high efficiency, and applicable to various specifications of semiconductor components has become an urgent technical problem to be solved in the field of semiconductor component testing. Summary of the Utility Model

[0005] The purpose of the embodiments of the present application is to provide a temperature control device for testing the performance of semiconductor components at high temperatures, which can ensure stable heating, convenient operation, and is applicable to semiconductor components of various specifications.

[0006] To solve the above technical problems, the embodiments of the present application provide a temperature control device for testing the performance of semiconductor components at high temperatures. The temperature control device includes a controller, a main heating plate, and a plurality of auxiliary heating plates. The controller includes a housing, and a plurality of connecting columns are arranged on one side of the housing. The controller has a temperature collection and control function; the main heating plate is provided with a first positive terminal and a first negative terminal, and the first positive terminal and the first negative terminal are electrically connected to the corresponding connecting columns; each of the plurality of auxiliary heating plates is provided with a second positive terminal and a second negative terminal. The plurality of auxiliary heating plates are connected in series with the main heating plate and are connected end to end to form a heating space. The semiconductor component to be tested is placed in the heating space. The controller controls the heating temperature of the main heating plate and the auxiliary heating plates, so that the semiconductor component is heated to the temperature to be detected.

[0007] The temperature control device for testing the performance of semiconductor components at high temperatures provided by the embodiments of the present application connects multiple auxiliary heating plates in series with the main heating plate, end to end, to form a closed loop. The semiconductor component to be tested is surrounded in the middle of the circular area without direct contact, and heat is conducted from the heating plate to the semiconductor component in the form of thermal radiation and thermal convection, thereby heating the semiconductor component. Then, through the control of the controller, the semiconductor component is heated to the set temperature to be tested. This temperature control device does not require installation and disassembly operations on the semiconductor component to be tested. Different numbers of auxiliary heating plates can be used according to the specifications and dimensions of the semiconductor component, and it can be applied to semiconductor components of different specifications. It can ensure stable heating, convenient operation, high efficiency and applicability to semiconductor components of various specifications.

[0008] In some embodiments, mounting holes are provided at both the first positive terminal and the multiple second positive terminals, and bumps corresponding to the mounting holes are provided at both the first negative terminal and the multiple second negative terminals.

[0009] In some embodiments, both the main heating plate and the auxiliary heating plates are provided with heat insulation layers, and the mounting holes and the bumps are respectively provided at both ends of the heat insulation layer.

[0010] In some embodiments, there are two auxiliary heating plates, and the auxiliary heating plates and the main heating plate form a triangle.

[0011] In some embodiments, both the main heating plate and the multiple auxiliary heating plates are arc-shaped.

[0012] In some embodiments, one of the connecting columns is further connected to a first temperature sensor, and the first temperature sensor is arranged on the semiconductor component to be tested.

[0013] In some embodiments, the temperature control device further includes a lower computer, which is arranged on one side of the main heating plate. The lower computer is electrically connected to the main heating plate and electrically connected to one of the connecting columns.

[0014] In some embodiments, the main heating plate is provided with a first temperature measurement hole, and a second temperature sensor is arranged in the first temperature measurement hole. The second temperature sensor is electrically connected to the lower computer.

[0015] In some embodiments, multiple auxiliary heating plates are all provided with second temperature measurement holes, and third temperature sensors are arranged in the second temperature measurement holes. The third temperature sensors are indirectly electrically connected to the lower computer through connection with the main heating plate.

[0016] In some embodiments, the housing is further provided with a display screen, buttons are arranged below the display screen of the housing, and a switch is arranged on one side of the housing close to the connecting column. Description of the Drawings

[0017] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated. The drawings in the figures do not constitute a scale limitation.

[0018] Figure 1 is a schematic structural diagram of a temperature control device for testing the performance of semiconductor components at high temperatures provided by some embodiments of the present application;

[0019] Figure 2 is a schematic structural diagram of an auxiliary heating plate in a temperature control device for testing the performance of semiconductor components at high temperatures provided by some embodiments of the present application;

[0020] Figure 3 is a schematic connection diagram of heating plates when there are two auxiliary heating plates in a temperature control device for testing the performance of semiconductor components at high temperatures provided by some embodiments of the present application;

[0021] Figure 4 is a schematic connection diagram of heating plates when there are three auxiliary heating plates in a temperature control device for testing the performance of semiconductor components at high temperatures provided by some embodiments of the present application;

[0022] Figure 5 is a schematic connection diagram of heating plates when there are four auxiliary heating plates in a temperature control device for testing the performance of semiconductor components at high temperatures provided by some embodiments of the present application;

[0023] Figure 6 is a schematic connection diagram when the heating plate is arc-shaped in a temperature control device for testing the performance of semiconductor components at high temperatures provided by some embodiments of the present application.

[0024] Explanation of reference numerals in the drawings: 11 - Controller; 111 - Housing; 112 - Connecting column; 113 - Display screen; 114 - Button; 115 - Switch; 12 - Main heating plate; 121 - First positive terminal; 122 - First negative terminal; 123 - First temperature measuring hole; 124 - Second temperature sensor; 13 - Auxiliary heating plate; 131 - Second positive terminal; 132 - Second negative terminal; 133 - Second temperature measuring hole; 134 - Third temperature sensor; 14 - Mounting hole; 15 - Protrusion; 16 - Heat insulation layer; 17 - First temperature sensor; 18 - Lower computer; 19 - Semiconductor component. Detailed implementation manners

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will elaborate on each embodiment of this application in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that in each embodiment of this application, many technical details are provided to help readers better understand this application. Nevertheless, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in this application can still be implemented. The division of the following embodiments is for convenience of description and should not impose any limitation on the specific implementation of this application. The various embodiments can be combined and cross-referenced with each other on the premise of not being contradictory.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion.

[0027] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the quantity, specific order, or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, "a plurality of" means two or more unless otherwise specifically defined.

[0028] In the description of the embodiments of this application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of this application can be understood according to specific circumstances.

[0029] Semiconductor components are commonly used in various scenarios, including but not limited to industrial, automotive, and consumer-grade scenarios. With the improvement of the performance of semiconductor components and the functions of power semiconductors, the problem of heat generation during the use of semiconductor components has become increasingly prominent. Therefore, it is necessary to verify the performance of semiconductor component products at different detection temperatures.

[0030] Existing temperature control devices for testing the performance of semiconductor components at high temperatures usually use heating plates, temperature control boxes, and heating rods to heat the semiconductor components. By setting the temperature value, the components are heated to the required test temperature. When connecting the device under test in this testing method, the power device sample needs to be fixed on the screw holes of the heating plate through screws. Through contact heat transfer, the power device sample is heated to achieve the test purpose. This kind of heating plate is relatively large in size. Each time a sample is heated, thermal grease needs to be applied and connected through screws. After completing a single sample, it is necessary to wait for the heating plate to cool down, then rotate the screws to remove the test sample, and replace it with the next test sample until the test is completed. When replacing the component, it is necessary to remove the connected screws, fixtures, etc., which is troublesome to operate. Moreover, the shape and size of the heating plate are basically fixed and cannot be applied to semiconductor components of different sizes.

[0031] How to design a temperature control device for testing semiconductor components that has stable heating, is convenient to operate, has high efficiency, and is applicable to semiconductor components of various specifications has become a technical problem that urgently needs to be solved in the field of semiconductor component testing.

[0032] To solve the above technical problems, some embodiments of the present application provide a temperature control device for testing the performance of semiconductor components at high temperatures. By connecting multiple auxiliary heating plates in series with the main heating plate, they are connected end to end to form a closed loop. The semiconductor component to be detected is surrounded in the middle of the annular region. Without direct contact, heat is conducted from the heating plate to the semiconductor component in the form of thermal radiation and thermal convection, thereby heating the semiconductor component. Then, through the control of the controller, the semiconductor component is heated to the set temperature to be detected. This kind of temperature control device does not require installation and disassembly operations on the semiconductor component to be tested. According to the specification size of the semiconductor component, different numbers of auxiliary heating plates can be used, and it can be applied to semiconductor components of different specifications. It can ensure stable heating of the temperature control device, convenient operation, and applicability to semiconductor components of various specifications.

[0033] The following Figures 1 to 5 describes the temperature control device for testing the performance of semiconductor components at high temperatures provided by some embodiments of the present application.

[0034] As Figure 1 and Figure 2As shown in the figure, the temperature control device for testing the performance of the semiconductor component 19 at high temperatures provided by some embodiments of the present application includes a controller 11, a main heating plate 12, and a plurality of auxiliary heating plates 13. The controller 11 includes a housing 111, and a plurality of connecting posts 112 are arranged on one side of the housing 111. The controller 11 has the function of collecting temperature and controlling. The main heating plate 12 is provided with a first positive terminal 121 and a first negative terminal 122, and the first positive terminal 121 and the first negative terminal 122 are electrically connected to the corresponding connecting posts 112. Each of the plurality of auxiliary heating plates 13 is provided with a second positive terminal 131 and a second negative terminal 132. The plurality of auxiliary heating plates 13 are connected in series with the main heating plate 12, and are connected end to end to enclose a heating space. The semiconductor component 19 to be tested is placed in the heating space. The controller 11 controls the heating temperatures of the main heating plate 12 and the auxiliary heating plates 13, so that the semiconductor component 19 is heated to the temperature to be detected.

[0035] It should be noted that the controller 11 can be a microcomputer, with various chips built in as information processing units and displayed through a display screen 113, and has the functions of collecting temperature information and controlling the heating of the heating plate. The plurality of connecting posts 112 are connected to the built-in chips, and different connecting posts 112 have different functions. As Figure 1 shown in the figure, the uppermost connecting post 112 is connected to the first positive terminal 121 of the main heating plate 12, the connecting post 112 immediately below is connected to the lower computer 18, the connecting post 112 further below is connected to the first negative terminal 122 of the main heating plate 12, and the lowermost connecting post 112 is connected to the first temperature sensor on the semiconductor component 19 to be tested. By electrically connecting different connecting posts 112 to different components, different functions of the controller 11 are realized. The structures of the plurality of auxiliary heating plates 13 are the same and are also similar to the structure of the main heating plate 12. The difference is that the main heating plate 12 is directly electrically connected to the lower computer 18, while the auxiliary heating plates 13 need to be electrically connected to the main heating plate 12 through the second positive terminal 131 and the second negative terminal 132, and thus are indirectly electrically connected to the lower computer 18.

[0036] Specifically, the main heating plate 12 and the auxiliary heating plates 13 adopt a male-female socket design, and the heating plates can be connected through interfaces. The positive terminal interface of the heating plate is connected to the negative terminal interface of the previous heating plate, and so on, so that the heating plates are in a series mode. The negative terminal interface of the last heating plate is connected to the positive terminal interface of the first heating plate, so that the heating plates are connected end to end to form a closed loop. The internal circuits of the main heating plate 12 and the auxiliary heating plates 13 are designed such that the controller 11 only needs to be connected to the main heating plate 12 to conduct signals to each of the auxiliary heating plates 13, and the temperatures of the main heating plate 12 and the plurality of auxiliary heating plates 13 can be controlled simultaneously. The semiconductor component 19 to be tested is placed in the middle of the closed loop formed by the heating plates to heat the semiconductor component 19.

[0037] A temperature control device for testing the performance of semiconductor components 19 at high temperatures provided by some embodiments of the present application connects multiple auxiliary heating plates 13 in series with the main heating plate 12, with the head and tail connected to form a closed loop. The semiconductor component 19 to be detected is surrounded in the middle of the circular area without direct contact, and heat is conducted from the heating plate to the semiconductor component 19 in the form of thermal radiation and thermal convection, thereby heating the semiconductor component 19. Then, through the control of the controller 11, the semiconductor component 19 is heated to the set temperature to be detected. This temperature control device does not require installation and disassembly operations on the semiconductor component 19 to be tested. Different numbers of auxiliary heating plates 13 can be used according to the specifications and dimensions of the semiconductor component 19, and it can be applied to semiconductor components 19 of different specifications. It can ensure the stable heating of the temperature control device, convenient operation, high efficiency, and applicability to semiconductor components 19 of various specifications.

[0038] In some embodiments of the present application, mounting holes 14 are provided on both the first positive terminal 121 and the multiple second positive terminals 131, and protrusions 15 corresponding to the mounting holes 14 are provided on both the first negative terminal 122 and the multiple second negative terminals 132.

[0039] It should be noted that the structures of the mounting holes 14 and the protrusions 15 are a form of male-female port design for the main heating plate 12 and the auxiliary heating plate 13. The mounting holes 14 and the protrusions 15 are circular, and the mounting holes 14 are slightly larger than the protrusions 15 to facilitate direct docking and installation. In addition, the corresponding negative terminals and positive terminals can be directly electrically connected through connectors or wires to conduct control signals and current.

[0040] In some embodiments of the present application, both the main heating plate 12 and the auxiliary heating plate 13 are provided with heat insulation layers 16, and the mounting holes 14 and the protrusions 15 are respectively provided at both ends of the heat insulation layer 16.

[0041] It should be noted that the heat insulation layer 16 is provided above the heating plate and serves to isolate the temperature conduction of the lower heating plate to the upper environment. It can isolate the temperature near the semiconductor component 19, facilitate heating the semiconductor component 19, and increase the heat utilization efficiency. The mounting holes 14 and the protrusions 15 are provided at both ends of the heat insulation layer 16 to facilitate the disassembly and installation of the heating plate.

[0042] In some embodiments of the present application, there are two auxiliary heating plates 13, and the auxiliary heating plates 13 and the main heating plate 12 enclose a triangle.

[0043] As Figure 3As shown, two auxiliary heating plates 13 are connected to one main heating plate 12, enclosing a triangle. The semiconductor component 19 is placed at the center of the triangle. The semiconductor component 19 does not come into direct contact with the heating plates, and heat is conducted through thermal radiation to heat the semiconductor component 19. The two auxiliary heating plates 13 are the minimum number of auxiliary heating plates 13 that can form a closed loop. At this time, the size of the semiconductor component 19 is relatively small. As Figure 4 shown, when the size of the semiconductor component 19 is larger, three auxiliary heating plates 13 can be used, and the four heating plates enclose a quadrilateral. As Figure 5 shown, when the size of the semiconductor component 19 is even larger, five auxiliary heating plates 13 are needed, and a total of six heating plates enclose a hexagon. The specific number of auxiliary heating plates 13 needs to be determined according to the size and model of the semiconductor component 19.

[0044] In some embodiments of the present application, the main heating plate 12 and multiple auxiliary heating plates 13 are both arc-shaped.

[0045] Figure 6 As shown in the figure, when there are three auxiliary heating plates 13, the main heating plate 12 and the auxiliary heating plates 13 are schematically shown as arc-shaped connections from a top view. At this time, the heating space enclosed by the main heating plate 12 and multiple auxiliary heating plates 13 is approximately circular from a top view and approximately cylindrical from a three-dimensional space. The main heating plate 12 and the auxiliary heating plates 13 can have various arc angles, which are convenient for use in cooperation when heating semiconductor components 19 of different sizes and models. The main heating plate 12 and the auxiliary heating plates 13 are arc-shaped in order to enclose the largest heating space with the smallest size of the heating plates, saving heating plate materials and making the heating efficiency higher.

[0046] In some embodiments of the present application, one of the connecting columns 112 is also connected to a first temperature sensor, and the first temperature sensor is arranged on the semiconductor component 19 to be measured.

[0047] It should be noted that after the semiconductor component 19 to be detected is placed in the enclosed heating space, the first temperature sensor is pasted onto the device to be measured to monitor the temperature of the device to be measured. The first temperature sensor is directly connected to the controller 11 through the connecting column 112. The controller 11 can set the temperature to be reached, and the heating temperature on the semiconductor component 19 is transmitted to the controller 11 in real time, facilitating the adjustment of the heating effects of the main heating plate 12 and the auxiliary heating plates 13 through the controller 11.

[0048] In some embodiments of the present application, the temperature control device further includes a lower computer 18. The lower computer 18 is arranged on one side of the main heating plate 12, and the lower computer 18 is electrically connected to the main heating plate 12 and electrically connected to one of the connecting columns 112.

[0049] It should be noted that the slave computer 18 is a connection device between the main heating plate 12 and the controller 11. On the one hand, the slave computer 18 identifies and records the temperatures of the main heating plate 12 and the auxiliary heating plate 13, and transmits the temperature data to the controller 11; on the other hand, the slave computer 18 receives the control signal sent by the controller 11 and controls the heating of the main heating plate 12 and the auxiliary heating plate 13. The slave computer 18 will identify the number of connected auxiliary heating plates 13, transmit the information to the controller 11 and display it on the display screen 113. For example, if the temperature of the controller 11 is set at 150 °C, the controller 11 sends an instruction to the slave computer 18. After receiving the instruction, the slave computer 18 controls the heating current, and the main heating plate 12 and the auxiliary heating plate 13 start to heat up, and the temperature is monitored in real time, and the heating current is adjusted in real time to ensure the stability and accuracy of the temperature.

[0050] In some embodiments of the present application, the main heating plate 12 is provided with a first temperature measuring hole 123, and a second temperature sensor 124 is arranged in the first temperature measuring hole 123. The second temperature sensor 124 is electrically connected to the slave computer 18.

[0051] It should be noted that the first temperature measuring hole 123 penetrates into the interior of the heating plate, and the second temperature sensor 124 is attached to the inner wall of the first temperature measuring hole 123. Multiple second temperature sensors 124 can be installed at different positions to ensure the accuracy of the measured temperature. The second temperature sensor 124 transmits the measured temperature data to the slave computer 18, and the slave computer 18 then transmits it to the controller 11. After calculation by the controller 11, an instruction is sent to the slave computer 18 to control whether the heating plate continues to heat or stops heating, so as to realize the temperature control of the semiconductor element 19 to be measured.

[0052] In some embodiments of the present application, multiple auxiliary heating plates 13 are each provided with a second temperature measuring hole 133, and a third temperature sensor 134 is arranged in each second temperature measuring hole 133. The third temperature sensor 134 is indirectly electrically connected to the slave computer 18 through connection with the main heating plate 12.

[0053] It should be noted that the main heating plate 12 and each auxiliary heating plate 13 are equipped with temperature sensors to ensure that the temperature rise of each heating plate is basically the same. At the same time, the temperature sensors will monitor the actual temperature of the semiconductor element 19 to be measured, and through the calculation of the controller 11, the slave computer 18 is controlled to finely adjust the temperature.

[0054] In some embodiments of the present application, the housing 111 is further provided with a display screen 113. A button 114 is arranged below the display screen 113 of the housing 111, and a switch 115 is arranged on one side of the housing 111 adjacent to the connection column 112.

[0055] It should be noted that a display screen 113, buttons 114, a switch 115 and other structures are provided on the housing 111 of the controller 11 and are connected to the control chip inside the controller 11, which facilitates manual operation of the controller 11. When the temperature setting needs to be adjusted, after pressing the setting button 114, the temperature can be increased and decreased by the up and down keys, and the "ones, tens, hundreds" digits of the set temperature can be adjusted by the left key. There is only one left key for cyclic control, and all digits implement a cycle of 0-9. The set temperature can be displayed on the display screen 113.

[0056] In some embodiments of the present application, the slave computer 18 is a single-chip microcomputer, and the controller 11 is a microcomputer.

[0057] It should be noted that both the single-chip microcomputer and the microcomputer are simple information processing systems. The single-chip microcomputer has a simpler function, while the microcomputer has a more complex function and can implement more functions.

[0058] During the test, the temperature points to be heated are set through the controller 11, for example: 25°C, 75°C, 125°C, 175°C. After the heating program is configured, the heating wires in the main heating plate 12 and the auxiliary heating plate 13 start to heat up, and the temperature rises. When the temperature is about to reach the set temperature, the second temperature sensor 124 on the main heating plate 12 and the third temperature sensor 134 on the auxiliary heating plate 13 feedback the temperature to the slave computer 18, and the slave computer 18 uploads it to the controller 11. The controller 11 combines the temperature of the sample to be tested, calculates and sends an instruction to the slave computer 18, and the slave computer 18 adjusts the heating current. Generally, a temperature difference of ±0.5°C can be achieved. After the temperature of the semiconductor element 19 to be tested reaches the set temperature and remains for five minutes, the slave computer 18 feeds back the result to the controller 11. After the controller 11 calculates and confirms that the temperature reaches the measurement condition, the words "Reached test temperature, can test" will be displayed on the liquid crystal display of the controller 11. At this moment, manual operation can be performed to test various parameters of the element to be tested. After the test is completed, the set temperature can be lowered or the test current can be disconnected, and the temperature of the semiconductor element 19 starts to drop.

[0059] In some embodiments of the present application, the main heating plate 12 is connected to a plurality of auxiliary heating plates 13, and the size of the heating space formed by the connected heating plates is similar to the size of the semiconductor element 19 to be tested. The semiconductor element 19 to be tested is placed in the heating space formed by the heating plates, and the temperature of the element is monitored in real time to make its temperature more stable and accurate. The heating plate does not need to be in physical contact with the element to be tested, and there is no need to disassemble and install the element, which improves the test efficiency. By combining the heating plates into any heating shape, the heating area can be infinitely expanded to suit semiconductor elements 19 of different specifications and sizes. Through the temperature sensor and the controller 11 to monitor and control the temperature, automatic testing of the element can be realized under high-temperature static conditions, effectively reducing the labor cost.

[0060] Those of ordinary skill in the art can understand that the above-described embodiments are specific examples for implementing the present application, and in actual applications, various changes can be made to them in form and details without departing from the spirit and scope of the present application.

Claims

1. A temperature control device for testing the performance of semiconductor components at high temperatures, characterized in that: include: The controller comprises a housing, a plurality of connecting columns are arranged on one side of the housing, and the controller has a temperature collection and control function; A main heating plate is provided with a first positive terminal and a first negative terminal, wherein the first positive terminal and the first negative terminal are electrically connected to the corresponding connecting posts; Multiple auxiliary heating plates are each provided with a second positive terminal and a second negative terminal. The multiple auxiliary heating plates are connected in series with the main heating plate and connected end to end to form a heating space. The semiconductor element to be tested is placed in the heating space. The controller controls the heating temperature of the main heating plate and the auxiliary heating plates so that the semiconductor element is heated to the temperature to be tested.

2. The temperature control device for testing the performance of semiconductor components at high temperatures according to claim 1, characterized in that: The first positive terminal and the second positive terminals are both provided with mounting holes, and the first negative terminal and the second negative terminals are both provided with protrusions corresponding to the mounting holes.

3. The temperature control device for testing the performance of semiconductor components at high temperatures according to claim 2, characterized in that: The main heating plate and the auxiliary heating plate are both provided with a temperature insulation layer, and the mounting holes and the protrusions are respectively provided at two ends of the temperature insulation layer.

4. The temperature control device for testing the performance of semiconductor components at high temperatures according to claim 1, characterized in that: There are two auxiliary heating plates, which form a triangle with the main heating plate.

5. The temperature control device for testing the performance of semiconductor components at high temperatures according to claim 1, characterized in that: The main heating plate and the plurality of auxiliary heating plates are all arc-shaped.

6. The temperature control device for testing the performance of semiconductor components at high temperatures according to claim 1, characterized in that: One of the connection pillars is also connected to a first temperature sensor, and the first temperature sensor is arranged on the semiconductor element to be tested.

7. The temperature control device for testing the performance of semiconductor components at high temperatures according to claim 1, characterized in that: The temperature control device further comprises a lower computer, which is arranged at one side of the main heating plate and is electrically connected to the main heating plate and to one of the connecting posts.

8. The temperature control device for testing the performance of semiconductor components at high temperatures according to claim 7, characterized in that: The main heating plate is provided with a first temperature measuring hole, a second temperature sensor is provided in the first temperature measuring hole, and the second temperature sensor is electrically connected to the lower computer.

9. The temperature control device for testing the performance of semiconductor components at high temperatures according to claim 7, characterized in that: The plurality of auxiliary heating plates are each provided with a second temperature measuring hole, and a third temperature sensor is each provided in the second temperature measuring hole. The third temperature sensor is connected to the main heating plate and is indirectly electrically connected to the lower computer.

10. The temperature control device for testing semiconductor component performance at high temperature according to claim 1, characterized in that: The housing is also provided with a display screen, the housing is provided with a button below the display screen, and a switch is provided on one side of the housing adjacent to the connecting column.

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