Chip assembly with temperature control adjusting function

Abstract

The utility model belongs to the field of chips, and particularly relates to a chip assembly with a temperature control adjusting function, which comprises a mounting seat, the interior of the mounting seat is hollow and is provided with a ventilation bin, air inlet fans are mounted in a plurality of groups of ventilation holes, heat dissipation fans are mounted in heat dissipation holes, and the air inlet fans are communicated with the heat dissipation holes. Fixing strips are fixed to the two opposite side surfaces of the two sets of mounting strips, a locking mechanism is jointly mounted on the two sets of mounting strips, a chip board is firstly placed on the upper surfaces of the two sets of fixing strips, then the chip board is locked to the two sets of fixing strips through the locking mechanism, and therefore the chip board is detachably mounted on the mounting base; when the chip assembly works, the heat dissipation fan in the heat dissipation hole dissipates heat and cools the chip board, and the protection plate protects the heat dissipation fan, so that the problem that the performance of the chip assembly is reduced due to the fact that electronic elements on the chip assembly can generate heat when the chip assembly works and the temperature of the whole chip assembly is increased is solved.

Description

Technical Field

[0001] The utility model relates to the field of chips, in particular to a chip component with a temperature control and adjustment function. Background Art

[0002] Multi-chip module is a new electronic assembly technology. A multi-chip module refers to a component in which multiple integrated circuit chips are electrically connected to a common circuit board and interconnection between the chips is achieved by using it. It is a typical high-level hybrid integrated component. These components are usually unsealedly assembled on a multi-layer interconnected substrate by means of wire bonding, tape automated bonding or flip chip, and then through plastic molding, and then installed on a printed circuit board in the same way as installing QFP or BGA packaged components.

[0003] Since the electronic components on the chip component will generate heat during operation, which will increase the temperature of the entire chip component and lead to a decline in the performance of the chip component; therefore, in view of the above problems, a chip component with a temperature control and adjustment function is proposed. Summary of the Utility Model

[0004] In order to make up for the deficiencies of the prior art, due to the fact that the electronic components on the chip component will generate heat during operation, which will increase the temperature of the entire chip component and lead to a decline in the performance of the chip component, the utility model proposes a chip component with a temperature control and adjustment function.

[0005] The technical solution adopted by the utility model to solve its technical problems is: a chip component with a temperature control and adjustment function described in the utility model includes a mounting base. The interior of the mounting base is hollow and is set as a ventilation chamber. Ventilation holes penetrating into the ventilation chamber are provided on both opposite surfaces of the mounting base. Intake fans are installed in each of the multiple groups of ventilation holes. A heat dissipation hole penetrating into the ventilation chamber is provided on the upper surface of the mounting base. A heat dissipation fan is installed in the heat dissipation hole. A protection plate is fixedly installed above the heat dissipation fan in the heat dissipation hole. Multiple through holes are provided on the protection plate. Mounting strips are fixed on both sides of the upper surface of the mounting base. Fixed strips are fixed on the opposite surfaces of the two mounting strips. Multiple openings are provided on the two mounting strips. A locking mechanism is jointly installed on the two mounting strips.

[0006] Preferably, the locking mechanism includes two rotating rods, and the two rotating rods respectively penetrate through the parts of the two mounting strips located at the openings in a rotating manner. Pressure plates are fixedly installed on the two rotating rods at the openings.

[0007] Preferably, second rubber pads are fixed on the upper surfaces of the two fixed strips, and first rubber pads are fixed on the lower surfaces of the multiple pressure plates.

[0008] Preferably, one end of each of the two groups of rotating rods is rotatably connected to a first pull rod, and the other ends of the two groups of first pull rods are jointly movably connected to a second pull rod.

[0009] Preferably, one side of the end of each of the two groups of first pull rods away from the rotating rod is fixedly installed with a connecting rod, and sliding openings are formed on one side surface of each end of the second pull rod, and the two groups of connecting rods are respectively slidably connected in the two sliding openings.

[0010] Preferably, a mounting plate is fixed in the middle of one side surface of the mounting seat, a mounting rod is rotatably installed on the upper surface of the mounting plate, a threaded hole is formed in the upper end of the mounting rod, a screw rod is threadedly connected in the threaded hole, and the upper end of the screw rod is fixedly connected to the lower side surface of the second pull rod.

[0011] The beneficial effects of the present utility model are as follows:

[0012] 1. In the present utility model, first, the chip board is placed on the upper surfaces of the two fixing strips, and the two fixing strips support it. Subsequently, the chip board is locked on the two fixing strips through the locking mechanism, so that the chip board can be detachably installed on the mounting seat. When the chip assembly works, the chip board is cooled by the cooling fan in the heat dissipation holes, and the protection plate protects the cooling fan. At the same time, the intake fan will ventilate and exchange air into the ventilation chamber through the ventilation holes, thereby controlling the temperature of the chip board, thus solving the problem that when the chip assembly works, the electronic components on it will generate heat, which will increase the temperature of the entire chip assembly and cause the performance of the chip assembly to decline.

[0013] 2. In the present utility model, by driving the rotation of the rotating rod, when the rotating rod rotates, it will drive the pressing plate fixed to it to rotate in the opening, so that it can rotate to press the chip board, which is convenient for fixing the chip board. Through the second rubber pad on the fixing strip, the chip board can be stably installed on the two fixing strips. Subsequently, when the pressing plate presses on the chip board, with the cooperation of the first rubber pad, the stability of the chip board installed on the mounting seat will be improved. By linearly moving the second pull rod up and down, when the second pull rod moves, it will drive the two groups of first pull rods to rotate, so as to drive the rotation of the rotating rod. When the second pull rod moves, it will drive the two groups of connecting rods to slide in the two sliding openings, and at the same time, it will also pull the two groups of first pull rods to rotate around the rotating rod. Since the rotating rod is fixedly connected to the first pull rod, the rotating rod will be driven to rotate. By rotating the mounting rod, the screw rod will linearly expand and contract under the cooperation of the thread. Since the screw rod is fixedly connected to the second pull rod, when the screw rod expands and contracts, it will drive the second pull rod to linearly move up and down. Description of the Drawings

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0015] Figure 1 Schematic diagram of the overall structure of the present invention;

[0016] Figure 2 Schematic diagram of the mounting seat structure of the present invention;

[0017] Figure 3 Explosion structure schematic diagram of the present invention;

[0018] Figure 4 Schematic diagram of the locking mechanism structure of the present invention.

[0019] In the figure: 1, mounting seat; 2, ventilation chamber; 3, ventilation hole; 4, heat dissipation hole; 5, intake fan; 6, heat dissipation fan; 7, protective plate; 8, through hole; 9, locking mechanism; 901, rotating rod; 902, pressing plate; 903, first rubber pad; 904, second rubber pad; 905, mounting plate; 906, mounting rod; 907, screw hole; 908, screw; 909, connecting rod; 910, first pull rod; 911, second pull rod; 912, sliding opening; 10, fixing strip; 11, opening; 12, mounting strip. Detailed implementation manners

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0021] Please refer to Figures 1-4As shown in the figure, a chip component with temperature control and regulation function includes a mounting base 1. The interior of the mounting base 1 is hollow and is set as a ventilation chamber 2. Multiple groups of ventilation holes 3 that penetrate through to the inside of the ventilation chamber 2 are opened on both opposite side surfaces of the mounting base 1. Intake fans 5 are installed in multiple groups of ventilation holes 3. A heat dissipation hole 4 that penetrates through to the inside of the ventilation chamber 2 is opened on the upper surface of the mounting base 1. A heat dissipation fan 6 is installed in the heat dissipation hole 4. A protective plate 7 is fixedly installed above the heat dissipation fan 6 in the heat dissipation hole 4. Multiple groups of through holes 8 are opened on the protective plate 7. Mounting strips 12 are fixedly installed on both sides of the upper surface of the mounting base 1. Fixed strips 10 are fixedly installed on the opposite side surfaces of the two groups of mounting strips 12. Multiple groups of openings 11 are opened on the two groups of mounting strips 12. A locking mechanism 9 is commonly installed on the two groups of mounting strips 12.

[0022] During operation, first place the chip board on the upper surfaces of the two groups of fixed strips 10, and support it by the two groups of fixed strips 10. Subsequently, lock the chip board on the two groups of fixed strips 10 through the locking mechanism 9, so that the chip board can be detachably installed on the mounting base 1. When the chip component is working, the heat dissipation fan 6 in the heat dissipation hole 4 dissipates heat from the chip board, and the protective plate 7 protects the heat dissipation fan 6. At the same time, the intake fan 5 will ventilate and exchange air into the ventilation chamber 2 through the ventilation holes 3, thereby controlling the temperature of the chip board, and solving the problem that the electronic components on the chip component will generate heat during operation, which will increase the temperature of the entire chip component and cause the performance of the chip component to decline.

[0023] Furthermore, the locking mechanism 9 includes two rotating rods 901. The two rotating rods 901 respectively rotate through the parts of the two groups of mounting strips 12 located at the openings 11. Pressure plates 902 are fixedly installed on the two rotating rods 901 at the openings 11.

[0024] During operation, by driving the rotation of the rotating rod 901, when the rotating rod 901 rotates, it will drive the pressure plate 902 fixed to it to rotate in the opening 11, so as to rotate and press the chip board, facilitating the fixation of the chip board.

[0025] Furthermore, second rubber pads 904 are fixedly installed on the upper surfaces of the two groups of fixed strips 10, and first rubber pads 903 are fixedly installed on the lower surfaces of multiple groups of pressure plates 902.

[0026] During operation, through the second rubber pads 904 on the fixed strips 10, the chip board can be stably installed on the two groups of fixed strips 10. Subsequently, when the pressure plate 902 presses on the chip board, with the cooperation of the first rubber pads 903, the stability of the chip board installed on the mounting base 1 will be improved.

[0027] Furthermore, one end of each of the two rotating rods 901 is rotatably connected to a first pull rod 910, and the other ends of the two first pull rods 910 are commonly movably connected to a second pull rod 911.

[0028] During operation, by linearly moving the second pull rod 911 up and down, the second pull rod 911 will drive two groups of first pull rods 910 to rotate when moving, thereby driving the rotating rod 901 to rotate.

[0029] Furthermore, on one side of the end of two groups of first pull rods 910 away from the rotating rod 901, a connecting rod 909 is fixedly installed, and sliding openings 912 are formed on one side surface of both ends of the second pull rod 911. The two groups of connecting rods 909 are respectively slidably connected in the two groups of sliding openings 912.

[0030] During operation, when the second pull rod 911 moves, it will drive the two groups of connecting rods 909 to slide in the two groups of sliding openings 912, and at the same time, it will also pull the two groups of first pull rods 910 to rotate around the rotating rod 901. Since the rotating rod 901 is fixedly connected to the first pull rod 910, the rotating rod 901 will be driven to rotate.

[0031] Furthermore, in the middle of one side surface of the mounting base 1, a mounting plate 905 is fixedly installed. On the upper surface of the mounting plate 905, a mounting rod 906 is rotatably installed. A threaded hole 907 is formed at the upper end of the mounting rod 906, and a screw rod 908 is threadedly connected in the threaded hole 907. The upper end of the screw rod 908 is fixedly connected to the lower side surface of the second pull rod 911.

[0032] During operation, by rotating the mounting rod 906, the screw rod 908 will linearly expand and contract under the cooperation of the thread. Due to the fixed connection between the screw rod 908 and the second pull rod 911, when the screw rod 908 expands and contracts, it will drive the second pull rod 911 to linearly move up and down.

[0033] Working principle: First, place the chip board on the upper surface of the two fixing strips 10, and the two fixing strips 10 support it. Subsequently, lock the chip board on the two fixing strips 10 through the locking mechanism 9, so that the chip board can be detachably installed on the mounting base 1. When the chip assembly works, the chip board is cooled by the cooling fan 6 in the heat dissipation holes 4, and the protective plate 7 protects the cooling fan 6. At the same time, the intake fan 5 will ventilate and exchange air into the ventilation chamber 2 through the ventilation holes 3, thereby controlling the temperature of the chip board.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A chip assembly with temperature control and regulation function, comprising a mounting seat (1), characterized in that: The interior of the mounting seat (1) is hollow and is provided as a ventilation chamber (2). The surfaces of the mounting seat (1) on both sides opposite to each other are provided with a plurality of ventilation holes (3) penetrating into the ventilation chamber (2). Intake fans (5) are installed in the plurality of ventilation holes (3). The upper surface of the mounting seat (1) is provided with heat dissipation holes (4) penetrating into the ventilation chamber (2). A heat dissipation fan (6) is installed in the heat dissipation holes (4). A protective plate (7) is fixedly installed above the heat dissipation fan (6) in the heat dissipation holes (4). The protective plate (7) is provided with a plurality of through holes (8). Mounting strips (12) are fixedly installed on both sides of the upper surface of the mounting seat (1). Fixed strips (10) are fixedly installed on the opposite sides of the two groups of mounting strips (12). A plurality of openings (11) are provided on the two groups of mounting strips (12). A locking mechanism (9) is installed on the two groups of mounting strips (12).

2. A chip assembly with temperature control function according to claim 1, characterized in that: The locking mechanism (9) comprises two groups of rotating rods (901), the two groups of rotating rods (901) respectively rotating through the parts of the two groups of mounting strips (12) located at the openings (11), and the two groups of rotating rods (901) are fixedly mounted with pressure plates (902) at the openings (11).

3. The chip assembly with temperature control function according to claim 2, characterized in that: A No. 2 rubber pad (904) is fixed on the upper surface of the two groups of fixing bars (10), and a No. 1 rubber pad (903) is fixed on the lower surface of the multiple groups of pressing plates (902).

4. The chip assembly with temperature control function according to claim 3, characterized in that: One end of the two groups of rotating rods (901) are both rotatably connected to a No. 1 pull rod (910), and the other ends of the two groups of No. 1 pull rods (910) are movably connected to a No. 2 pull rod (911).

5. The chip assembly with temperature control function according to claim 4, characterized in that: A connecting rod (909) is fixedly installed on one side of one end of the two groups of the first pull rods (910) away from the rotating rod (901), and a sliding opening (912) is opened on the surface of one side of both ends of the second pull rod (911), and the two groups of the connecting rods (909) are respectively slidably connected in the two groups of sliding openings (912).

6. The chip assembly with temperature control function according to claim 1, characterized in that: A mounting plate (905) is fixed in the middle of one side surface of the mounting seat (1), a mounting rod (906) is rotatably mounted on the upper surface of the mounting plate (905), a screw hole (907) is provided at the upper end of the mounting rod (906), a screw rod (908) is connected to the inner thread of the screw hole (907), and the upper end of the screw rod (908) is fixedly connected to the lower surface of the second pull rod (911).

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