Charging device

Abstract

The utility model provides a charging device which comprises a first frame body, a circuit board and a coil assembly, the coil assembly is electrically connected with the circuit board, the first frame body is provided with a partition plate, the partition plate divides an assembly cavity into a first cavity and a second cavity, the coil assembly is arranged in the first cavity, and the circuit board is arranged in the second cavity. According to the charging device, the partition plate is arranged between the coil assembly and the circuit board, heat generated by the circuit board can be prevented from being transmitted into the first cavity where the coil assembly is located, so that heat between the charging device and the to-be-charged equipment is reduced, the temperature of the to-be-charged equipment during wireless charging is reduced, and then the charging and use experience feeling of a user is improved.

Description

Technical Field

[0001] This application relates to the technical field of accessories for electronic devices, and particularly to a charging device. Background Art

[0002] A charging device is a device that provides electrical power to an electronic device. For example, a wireless charger, and wireless charging technology is a special power supply method. It does not require a power cord and relies on electromagnetic wave propagation. Then, the electromagnetic wave energy is converted into electrical energy, and finally, wireless charging of mobile terminal devices such as mobile phones is realized. The device to be charged only needs to be placed on the charging device. During the charging process, the coils and circuit boards inside the charging device will continuously generate a large amount of heat, affecting the working efficiency of the charging device. For example, the 15W charging devices on the market generate a large amount of heat during charging. Especially for game users who often play while charging, the heat generation is even greater. The heat cannot be dissipated in time, resulting in an increase in the temperature of the mobile phone and situations such as lag, bringing a bad charging and usage experience to users.

[0003] Existing charging devices are provided with a circuit board and a charging coil. The charging coil and the circuit board are usually stacked in one space. The circuit board also generates heat during operation, and this part of the heat will be directly transferred to the charging coil, resulting in higher heat between the charging device and the mobile phone, which may cause a reduction in battery life or even damage to the mobile phone.

[0004] Based on this, it is necessary to improve the existing charging device to solve the above problems. Summary of the Invention

[0005] In view of this, this application provides a charging device that can effectively solve the above problems.

[0006] This application provides a charging device, including a first frame body, a circuit board, and a coil assembly. The coil assembly is electrically connected to the circuit board. The first frame body forms an installation cavity. The first frame body is provided with a partition. The partition divides the installation cavity into a first cavity and a second cavity. The coil assembly is disposed in the first cavity, and the circuit board is disposed in the second cavity.

[0007] In one embodiment, the first frame body includes a tubular frame. The tubular frame encloses to form the installation cavity. The partition is connected to the tubular frame to form the first cavity and the second cavity arranged along the height direction of the tubular frame.

[0008] In one embodiment, the charging device includes a semiconductor refrigeration component. The semiconductor refrigeration component is electrically connected to the circuit board. The partition is provided with a receiving portion, and the semiconductor refrigeration component is disposed in the receiving portion.

[0009] In one embodiment, the partition extends toward the second cavity to form a surrounding wall, the surrounding wall is a structure with openings at both ends, and the accommodating portion is formed in the surrounding wall and communicates with the first cavity and the second cavity.

[0010] In one embodiment, the circuit board is provided with an avoidance hole, and the avoidance hole is sleeved outside the accommodating portion.

[0011] In one embodiment, the charging device includes a heat sink, which is arranged in the second cavity and located on the side of the circuit board away from the partition; the semiconductor refrigeration element includes a cold end and a hot end arranged opposite to each other, the cold end is connected to the coil assembly, and the hot end is connected to the heat sink.

[0012] In one embodiment, the charging device includes a fan module, which includes a second frame and a fan electrically connected to the circuit board; the fan module is arranged on a side of the heat sink facing away from the semiconductor refrigeration component, and / or the second frame is fixedly connected to the first frame and arranged at an interval.

[0013] In one embodiment, a second accommodating position is disposed on a side of the second frame away from the first frame, and the charging device includes a bracket, and the bracket is rotatably disposed in the second accommodating position.

[0014] In one embodiment, the charging device includes a contact panel, and the contact panel is covered on a side of the coil assembly away from the partition.

[0015] In one embodiment, the contact panel is connected to the first frame, and the contact panel is connected to the coil assembly; the contact panel is made of super thermal conductive material or glass material.

[0016] In summary, the present application provides a charging device, including a first frame, a circuit board and a coil assembly, the coil assembly is electrically connected to the circuit board, a partition is provided on the first frame, the partition separates the installation cavity formed by the first frame into a first cavity and a second cavity, the coil assembly is arranged in the first cavity, and the circuit board is arranged in the second cavity. The present application can reduce the heat generated by the circuit board from being transferred to the first cavity where the coil assembly is located by arranging a partition between the coil assembly and the circuit board, thereby reducing the heat between the charging device and the device to be charged, reducing the temperature of the device to be charged during wireless charging, and thus improving the user's charging and use experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional schematic diagram of the charging device of the present application at an angle.

[0018] Figure 2 It is a three-dimensional schematic diagram of the charging device of the present application at another angle.

[0019] Figure 3 is Figure 1 a three-dimensional sectional view of the charging device in

[0020] Figure 4 is Figure 1 an exploded view of the charging device in

[0021] Figure 5 is Figure 1 an exploded view of the charging device in another angle in Detailed implementation manners

[0022] Before describing the embodiments in detail, it should be understood that the present application is not limited to the detailed structures or element arrangements described hereinafter or in the drawings of the present application. The present application can be implemented in other ways. Moreover, it should be understood that the terms and phrases used herein are only for descriptive purposes and should not be construed restrictively. The terms "including", "comprising", "having" and the like used herein are intended to include the matters listed thereafter, their equivalents and other additional matters. In particular, when describing "a certain element", the present application does not limit the number of the element to one, and multiple elements can also be included.

[0023] Please also refer to Figures 1 to 5 As shown, the present application provides a charging device 10, which can be used to charge mobile terminal electronic devices such as mobile phones and tablet computers. The charging device 10 can be a charger head, a mobile power supply, a wireless charger, etc. The present application takes a wireless charger as an example for detailed description. The charging device 10 includes a first frame body 12, a circuit board 14 and a coil assembly. The coil assembly is electrically connected to the circuit board 14. An installation cavity is formed in the first frame body 12. A partition 18 is provided on the first frame body to divide the installation cavity into a first cavity 20 and a second cavity 22. The coil assembly is arranged in the first cavity 20, and the circuit board 14 is arranged in the second cavity 22. By providing the partition 18 between the coil assembly and the circuit board 14 in the present application, the heat generated by the circuit board 14 can be reduced from being transferred into the first cavity 20 where the coil assembly is located, thereby reducing the heat between the charging device 10 and the device to be charged, lowering the temperature of the device to be charged during wireless charging, and further improving the charging and usage experience of the user.

[0024] Further, the first frame includes a tubular frame 16, which can be a cylindrical tube, a polygonal tube, etc., and is not limited herein. The internal space enclosed by the tubular frame 16 is an installation cavity. The partition 18 is connected to the inner side wall of the tubular frame 16 and divides the installation cavity into a first cavity 20 and a second cavity 22. The first cavity 20 and the second cavity 22 are arranged along the height direction of the tubular frame 16. Among them, the periphery of the partition 18 is connected to the tubular frame 16, so that the first cavity 20 and the second cavity 22 are not interconnected to prevent the heat generated by the circuit board 14 from being transferred into the first cavity 20.

[0025] Preferably, the first frame 12 can be made of a material with poor heat conduction such as plastic, so that the partition 18 separates the heat generated by the circuit board 14 and reduces the heat generated by the circuit board 14 from being transferred to the coil assembly side through the partition 18.

[0026] Among them, the device to be charged is a mobile terminal electronic device such as a mobile phone or a tablet computer. In this application, a mobile phone is taken as an example for detailed description. In this embodiment, the charging device 10 is generally cylindrical. Specifically, the first frame 12 is arranged in a cylindrical shape, and the circuit board 14 and the coil assembly are both designed to be circular. In other embodiments, they can also be designed in other shapes, and this application does not limit the specific shape of the charging device 10. The tubular frame 16 is a ring structure. The partition 18 is connected to the middle position of the inner side wall of the tubular frame 16, for example. The inner side wall of the tubular frame 16 is the side surface on the radially inward side of the tubular frame 16. The partition 18 divides the tubular frame 16 into upper and lower parts along its length direction. The upper part of the tubular frame 16 and the partition 18 enclose the first cavity 20, and the lower part of the tubular frame 16 and the partition 18 enclose the second cavity 22. The partition 18 and the tubular frame 16 are, for example, an integrally formed structure.

[0027] In the illustrated embodiment, the coil assembly includes a charging coil 24 and a magnetic isolation sheet provided at the bottom of the charging coil 24. The charging device 10 further includes a magnetic attraction assembly 26. The charging coil 24 and the magnetic attraction assembly 26 can be fixed in the first cavity 20 by means of buckles, pasting, etc., and are fixed on the partition 18. The circuit board 14 can be fixed in the second cavity 22 by means of buckles, pasting, etc., for example, by being attached to the partition 18. The charging coil 24 is electrically connected to the circuit board 14 and is used for wirelessly charging the mobile phone. The magnetic attraction assembly 26 includes a plurality of magnets, and the plurality of magnets are arranged in a ring structure. The magnetic attraction assembly 26 is used for magnetic attraction cooperation with the magnet array built in the mobile phone, so that when the mobile phone is placed on the charging device 10 for wireless charging, the magnetic attraction assembly 26 can magnetically fix the mobile phone to the charging device 10, so that the user can use the mobile phone while charging. Among them, the charging coil 24 is arranged at the center position of the first cavity 20, and the magnetic attraction assembly 26 is arranged around the periphery of the charging coil 24.

[0028] Specifically, the first cavity 20 includes a first mounting area 28 and a second mounting area 30. The second mounting area 30 surrounds the circumferential outer periphery of the first mounting area 28. The charging coil 24 is mounted and fixed in the first mounting area 28, for example, fixed to the partition 18 by pasting. The magnetic attraction assembly 26 is mounted and fixed in the second mounting area 30, for example, fixed to the partition 18 by pasting. In this embodiment, a separator 32 is provided in the first cavity 20. The separator 32 extends circumferentially and is located radially inside the tubular frame 16 to divide the first cavity 20 into a first mounting area 28 and a second mounting area 30. The separator 32 can be a single-piece plate structure or a plurality of split plate structures arranged at intervals in the circumferential direction.

[0029] In the illustrated embodiment, the charging device 10 further includes a contact panel 34 and a semiconductor refrigerating element 36. Among them, the contact panel 34 covers one side of the first frame 12 where the first cavity 20 is located, that is, the contact panel 34 covers the side of the coil assembly away from the partition 18, and the contact panel 34 completely covers the upper opening of the first frame 12 to block the coil assembly. The contact panel 34 is connected to the top of the first frame 12 by, for example, snap-fastening, and the contact panel 34 is in contact with the charging coil 24. During wireless charging, the back of the mobile phone is placed on the contact panel 34 so that the receiving coil of the mobile phone corresponds to the charging coil 24, and the built-in magnet array of the mobile phone corresponds to and magnetically attracts the magnetic attraction assembly 26. Preferably, the contact panel 34 is a super heat-conducting material to quickly transfer the cold generated by the semiconductor refrigerating element 36 to the mobile phone for heat dissipation, quickly export the heat at the contact part between the mobile phone and the contact panel 34, and reduce the temperature of the mobile phone and the charging device 10. The super heat-conducting material is, for example, a high thermal conductivity insulating material, which can be a composition of polycarbonate, graphite and a phosphorus-containing flame retardant. Among them, the concentration (i.e., mass fraction) of polycarbonate is 70%-80%, the concentration of graphite is less than or equal to 25%, and the concentration of the phosphorus-containing flame retardant is less than or equal to 5%. The phosphorus-containing flame retardant is, for example, a phosphate flame retardant. The contact panel 34 can also be a glass material to improve the ornamental value of the charging device 10.

[0030] The semiconductor refrigerating element 36 is electrically connected to the circuit board 14. The partition 18 is provided with a receiving portion 38, and the semiconductor refrigerating element 36 is disposed in the receiving portion 38. In this embodiment, the central portion of the partition 18 extends toward the second cavity 22 to form a surrounding wall 40. The surrounding wall 40 is a structure with openings at both the upper and lower ends. The receiving portion 38 is formed inside the surrounding wall 40 and communicates with the first cavity 20 and the second cavity 22, that is, the receiving portion 38 is a through-hole structure. The circuit board 14 is provided with an avoidance hole, and the avoidance hole is sleeved outside the receiving portion 38. For example, the circuit board 14 is disposed around the surrounding wall 40 and is attached to the partition 18. By providing the receiving portion 38 for accommodating the semiconductor refrigerating element 36 on the partition 18, component stacking can be avoided, and the thickness of the entire charging device 10 can be reduced.

[0031] In the illustrated embodiment, the charging device 10 further includes a heat dissipating member 42, and the heat dissipating member 42 is disposed on one side of the first frame 12 where the second cavity 22 is located. The thermoelectric cooler 36 includes a cold end 44 close to the first cavity 20 and a hot end 46 close to the second cavity 22. The cold end 44 and the hot end 46 are disposed at two opposite ends of the thermoelectric cooler 36. The cold end 44 is connected to the charging coil 24, and the hot end 46 is connected to the heat dissipating member 42. The heat dissipating member 42 is used to dissipate the heat of the hot end 46 of the thermoelectric cooler 36. When the thermoelectric cooler 36 works, the heat generated by the mobile phone, the heat between the mobile phone and the contact panel 34, and the heat generated by the charging coil 24 can all be transferred from the cold end 44 to the hot end 46 through the charging coil 24, and finally dissipated through the heat dissipating member 42, achieving a better heat dissipation effect. The cold energy generated by the cold end 44 can also be transferred to the coil assembly, the contact panel 34 and the mobile phone to achieve the ice feeling effect of the mobile phone. Since the heat dissipating member 42 and the circuit board 14 are on the same side of the partition 18, the heat generated by the circuit board 14 can be directly dissipated through the heat dissipating member 42, further preventing the heat generated by the circuit board 14 from entering the first cavity 20 through the partition 18.

[0032] Preferably, a first heat conducting member 48 is provided between the cold end 44 and the charging coil 24, and a second heat conducting member 50 is provided between the hot end 46 and the heat dissipating member 42. The first heat conducting member 48 and the second heat conducting member 50 contribute to the heat conduction between the charging coil 24, the thermoelectric cooler 36 and the heat dissipating member 42, can improve the heat conduction efficiency, enhance the heat dissipation effect. The first heat conducting member 48 and the second heat conducting member 50 are, for example, heat conducting silica gels.

[0033] Further, the heat dissipating member 42 includes a heat dissipating plate 52 and a plurality of heat dissipating protrusions 54 connected to the side of the heat dissipating plate 52 facing away from the thermoelectric cooler 36. The hot end 46 is connected to the heat dissipating plate 52 through the second heat conducting member 50, for example, connected to the central part of the heat dissipating plate 52. The heat dissipating plate 52 is, for example, located at the lower opening of the first frame 12, and can play a role in shielding internal components. A heat dissipating gap 56 is formed between the plurality of heat dissipating protrusions 54. The heat dissipating protrusions 54 are, for example, cylindrical structures, and the heat dissipating protrusions 54 and the heat dissipating plate 52 are, for example, integrally formed structures. By designing the heat dissipating member 42 as a structure of the heat dissipating plate 52 and a plurality of heat dissipating protrusions 54, the heat dissipation area of the heat dissipating member 42 can be increased, the heat dissipation efficiency can be enhanced. By designing the heat dissipating protrusions 54 as small cylinders, when the external air flow passes through the plurality of cylinders, the air flow stays on the heat dissipating member 42 for a longer time, the heat conduction efficiency is higher, and the noise is smaller.

[0034] In the illustrated embodiment, the charging device 10 further includes a fan module. The fan module is disposed on the side of the heat dissipation plate 52 away from the semiconductor refrigeration element 36, and is used to quickly blow out the heat of the heat dissipation member 42 by enhancing the air flow, further enhancing the heat dissipation efficiency, improving the heat dissipation effect of the charging device 10, reducing the internal temperature of the charging device 10, and preventing the charging efficiency of the charging device 10 from decreasing and the device from getting hot to the touch. Specifically, the fan module includes a second frame body 58 and a blower 60 electrically connected to the circuit board 14. The second frame body 58 is fixedly connected to the first frame body 12 and an interval portion 62 is formed between them at an interval. The second frame body 58 is located below the first frame body 12, and the second frame body 58 and the first frame body 12 are fixed, for example, by screws. The structure of the second frame body 58 is similar to that of the first frame body 12. Specifically, the second frame body 58 includes a fixing plate 64 and a surrounding edge 66 connected to the outer periphery of the fixing plate 64. The fixing plate 64 and the surrounding edge 66 are, for example, an integrally formed structure. The fixing plate 64 is, for example, connected to the middle part of the inner side wall of the surrounding edge 66, so that the fixing plate 64 divides the surrounding edge 66 into two parts. The upper part and the fixing plate 64 enclose a first accommodating position 68, and the first accommodating position 68 is located on the side of the second frame body 58 close to the first frame body 12. The lower part and the fixing plate 64 enclose a second accommodating position 70, and the second accommodating position 70 is located on the side of the second frame body 58 away from the first frame body 12.

[0035] A plurality of heat dissipation protrusions 54 are arranged in a ring along the circumference of the heat dissipation plate 52 and enclose to form an installation space 72. The blower 60 is disposed in the installation space 72 and is fixedly connected to the heat dissipation plate 52, for example, by screws. The heat dissipation gap 56 and the interval portion 62 together form an air inlet of the blower 60. The air inlet communicates the outside with the installation space 72, so that the heat dissipation member 42 is directly in contact with the outside air, improving the heat dissipation effect. The second frame body 58 is provided with an air outlet 76 corresponding to the blower 60. Specifically, one end of the plurality of heat dissipation protrusions 54 away from the heat dissipation plate 52 is accommodated in the first accommodating position 68. A protruding portion 78 is formed on the portion of the fixing plate 64 corresponding to the installation space 72 and protruding toward the side away from the installation space 72. The air outlet 76 is disposed on the protruding portion 78. The protruding portion 78 and the fixing plate 64 are, for example, an integrally formed structure. Optionally, the central portion of the fixing plate 64 is a through-hole structure. The protruding portion 78 includes an intermediate support portion 80 and a plurality of connecting ribs 82 connecting the intermediate support portion 80 and the inner wall of the through-hole structure. The plurality of connecting ribs 82 are arranged at intervals, so that the air outlet 76 is formed between the plurality of connecting ribs 82.

[0036] Preferably, an air outlet gap 84 communicating with the outside is formed between the middle support portion 80 and the second frame body 58, so that the air outlet 76 can communicate with the outside through the air outlet gap 84. For example, the middle support portion 80 protrudes out of the bottom surface of the second frame body 58, that is, the height of the second frame body 58 is lower than the height of the middle support portion 80, so that when the charging device 10 is placed on a surface, a height difference is formed between the middle support portion 80 and the second frame body 58, and thus the air outlet gap 84 is formed; alternatively, a bottom cover 86 is provided at the bottom of the middle support portion 80. The bottom cover 86 and the middle support portion 80 are, for example, snap-connected. The bottom cover 86 can raise the middle support portion 80, so that an air outlet gap 84 is formed between the middle support portion 80 and the second frame body 58, and at the same time, it can prevent foreign objects such as hair from entering the air outlet 76.

[0037] The second frame body 58 and the first frame body 12 are fixedly connected by screws. Specifically, fixing columns 88 are provided on one side of the fixing plate 64 facing the first frame body 12, and corresponding fixing holes 90 are provided on the partition plate 18. The fixing columns 88 pass through the heat dissipation plate 52 and the circuit board 14 is connected to the fixing holes 90. Screws are used to pass through the fixing holes 90 and are threadedly connected to the fixing columns 88 to realize the connection and fixation between the first frame body 12 and the second frame body 58. Preferably, a support block 92 is further provided between the circuit board 14 and the heat dissipation plate 52. The support block 92 is sleeved on the fixing column 88 and supports and positions the circuit board 14, so that the circuit board 14 is clamped and fixed between the partition plate 18 and the heat dissipation plate 52.

[0038] In the illustrated embodiment, the charging device 10 further includes a bracket 94. The bracket 94 is rotatably disposed in the second accommodation position 70. For example, the bracket 94 can rotate relative to the second frame body 58 between a support position and a storage position. In the support position, the bracket 94 rotates away from the second accommodation position 70 and forms a support angle with the second frame body 58 for supporting and erecting the charging device 10. In the storage position, the bracket 94 is stored in the second accommodation position 70; further, the bracket 94 can rotate relative to the second frame body 58 to adjust the support position of the bracket 94, so that the bracket 94 can rotate 360°. The user can adjust the support angle of the mobile phone to use the mobile phone, which brings convenience.

[0039] In the illustrated embodiment, keys and a data interface are provided on the outer wall of the first frame body 12. The keys and the data interface are respectively electrically connected to the circuit board 14. The keys and the data interface are, for example, respectively provided on opposite sides of the first frame body 12. The data interface can be connected to an external power supply to supply power to the charging device 10, and the keys can be used to control the startup or shutdown of the charging device 10.

[0040] In summary, the present application provides a charging device, which includes a first frame body, a circuit board and a coil assembly. The coil assembly is electrically connected to the circuit board. The first frame body includes a tubular frame and a partition. The partition is connected to the inner side wall of the tubular frame and divides the space enclosed by the tubular frame into a first cavity and a second cavity. The coil assembly is disposed in the first cavity, and the circuit board is disposed in the second cavity. By providing a partition between the coil assembly and the circuit board, the present application can reduce the heat generated by the circuit board from being transferred to the first cavity where the coil assembly is located, thereby reducing the heat between the charging device and the device to be charged, lowering the temperature of the device to be charged during wireless charging, and further enhancing the charging and usage experience of the user.

[0041] The concepts described herein can be implemented in other forms without departing from their spirit and characteristics. The specific embodiments disclosed should be considered illustrative rather than restrictive. Therefore, the scope of the present application is defined by the appended claims rather than by these previous descriptions. Any changes within the literal meaning and equivalent scope of the claims should fall within the scope of these claims.

Claims

1. A charging device, characterized in that: It includes a first frame, a circuit board and a coil assembly, the coil assembly is electrically connected to the circuit board, the first frame forms an installation cavity, a partition is provided on the first frame, the partition divides the installation cavity into a first cavity and a second cavity, the coil assembly is arranged in the first cavity, and the circuit board is arranged in the second cavity.

2. The charging device according to claim 1, characterized in that: The first frame includes a tubular frame, the tubular frame encloses the installation cavity, and the partition is connected to the tubular frame to form the first cavity and the second cavity arranged along the height direction of the tubular frame.

3. The charging device according to claim 1, characterized in that: The charging device comprises a semiconductor refrigeration element, the semiconductor refrigeration element is electrically connected to the circuit board, the partition is provided with a receiving portion, and the semiconductor refrigeration element is arranged in the receiving portion.

4. The charging device according to claim 3, characterized in that: The partition extends toward the second cavity to form a surrounding wall, and the surrounding wall is a structure with openings at both ends. The accommodating portion is formed in the surrounding wall and communicates with the first cavity and the second cavity.

5. The charging device according to claim 3, characterized in that: The circuit board is provided with an avoidance hole, and the avoidance hole is sleeved outside the accommodating portion.

6. The charging device according to claim 3, characterized in that: The charging device includes a heat sink, which is arranged in the second cavity and located on the side of the circuit board away from the partition; the semiconductor refrigeration element includes a cold end and a hot end arranged opposite to each other, the cold end is connected to the coil assembly, and the hot end is connected to the heat sink.

7. The charging device according to claim 6, characterized in that: The charging device includes a fan module, which includes a second frame and a fan electrically connected to the circuit board; the fan module is arranged on a side of the heat sink away from the semiconductor refrigeration component, and / or the second frame is fixedly connected to the first frame and arranged at an interval.

8. The charging device according to claim 7, characterized in that: A second accommodating position is provided on a side of the second frame body facing away from the first frame body, and the charging device comprises a bracket, and the bracket can be rotatably disposed at the second accommodating position.

9. The charging device according to claim 1, characterized in that: The charging device comprises a contact panel, and the contact panel is covered on a side of the coil assembly away from the partition.

10. The charging device according to claim 9, characterized in that: The contact panel is connected to the first frame, and the contact panel is connected to the coil assembly; the contact panel is made of super thermal conductive material or glass material.

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