Heat dissipation fitting cover and headphone

Abstract

The utility model belongs to the technical field of headphones, and particularly relates to a heat dissipation attaching cover and a headphone. The heat dissipation attaching cover comprises an annular cover body, a mounting face and an attaching face are formed on the end faces of the cover body on the two sides respectively, the heat collection structure extends along the mounting face and is fixedly connected with the cover body, and the semiconductor cooler is arranged on the side face, away from the cover body, of the heat collection structure. The radiator is arranged on the side face, away from the heat collection structure, of the semiconductor cooler; the headphone comprises an arc-shaped headband and two earphone units, heat dissipation attaching covers are fixed to the sound production sides of the two earphone units respectively, and the semiconductor coolers are electrically connected with main boards of the earphone units. The semiconductor cooler can form a cold surface after being electrified, heat generated by a user is transmitted to the heat collection structure through the cover body, then is transmitted to the cold surface of the semiconductor cooler, and finally is radiated through the radiator, so that the problem that the ears of the user are easily stuffy when the headset is worn is solved, and the wearing comfort can be improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of head-mounted earphones, and particularly relates to a heat dissipation fitting cover and a head-mounted earphone. Background Art

[0002] At present, head-mounted earphones are more and more widely used in daily life, work and study. A cover body is installed on the earphone unit of the existing head-mounted earphone for buffering at the user's ear part, which can improve the wearing comfort of the user.

[0003] When wearing a head-mounted earphone, the cover body is closely attached to the user's ear, and a closed space will be formed between the user's ear, the cover body and the earphone unit. During use, the part where the user's ear is attached to the cover body is not breathable, which is very easy to cause stuffiness and heat, resulting in the user feeling fatigued and reducing the wearing comfort. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a heat dissipation fitting cover and a head-mounted earphone, aiming to solve the problem that the user's ear is prone to stuffiness and heat when wearing a head-mounted earphone, and improve the wearing comfort.

[0005] The utility model discloses a heat dissipation fitting cover, which comprises a cover body in a ring shape. An installation surface is formed on the end surface of one side of the cover body, and a fitting surface is formed on the end surface of the other side of the cover body; it further comprises a heat collection structure extending along the installation surface and fixedly connected with the cover body, a semiconductor refrigerator arranged on the side surface of the heat collection structure far away from the cover body, and a radiator arranged on the side surface of the semiconductor refrigerator far away from the heat collection structure.

[0006] As an improvement, the cover body comprises a soft filling body in a ring shape, a heat conduction layer wrapping the surface of the soft filling body, and an outer covering layer wrapping the surface of the heat conduction layer. An opening area is arranged on one side of the outer covering layer corresponding to the installation surface; the heat collection structure is attached to the heat conduction layer opposite to the opening area.

[0007] As an improvement, an outer heat insulation layer is arranged on the outer peripheral side of the cover body.

[0008] As an improvement, the outer heat insulation layer is arranged between the outer peripheral side of the heat conduction layer and the corresponding side of the outer covering layer.

[0009] As an improvement, an inner heat insulation layer is arranged on the inner ring side of the cover body.

[0010] As an improvement, the inner heat insulation layer is arranged between the inner ring side of the heat conduction layer and the corresponding side of the outer covering layer.

[0011] As an improvement, the heat collection structure is arranged as an annular plate body adapted to the installation surface.

[0012] As an improvement, at least two of the thermoelectric coolers are spaced apart on the side of the heat collection structure away from the cover body, and a radiator is respectively provided on the side of each thermoelectric cooler away from the heat collection structure.

[0013] As an improvement, two thermoelectric coolers are provided, and are respectively arranged on opposite sides of the mounting surface.

[0014] The present utility model also discloses a headphone. The headphone includes an arc-shaped headband, two earphone units respectively mounted at two end portions of the headband, and further includes the heat dissipation fitting cover fixed to the sound-emitting side of the earphone unit, and the thermoelectric cooler is electrically connected to the main board of the earphone unit.

[0015] As an improvement, a receiving cavity is provided on the side of the earphone unit close to the heat dissipation fitting cover. The thermoelectric cooler is arranged at the opening of the receiving cavity, the radiator is arranged inside the receiving cavity, and an external ventilation opening communicating with the receiving cavity is provided on the outer peripheral side of the earphone unit.

[0016] As an improvement, a mounting ring body portion is provided on the side of the earphone unit close to the heat dissipation fitting cover. The heat dissipation fitting cover is mounted on the ring end surface of the mounting ring body portion. The receiving cavity is arranged in the mounting ring body portion. The external ventilation opening is provided on the outer peripheral side wall of the mounting ring body portion. An internal ventilation opening communicating with the receiving cavity is provided on the inner peripheral side wall of the mounting ring body portion.

[0017] Due to the adoption of the above technical solution, the heat dissipation fitting cover of the present utility model includes a ring-shaped cover body. The cover end surface on one side of the cover body forms a mounting surface, and the cover end surface on the other side of the cover body forms a fitting surface. The heat collection structure is further included and extends along the mounting surface and is fixedly connected to the cover body. The thermoelectric cooler is arranged on the side surface of the heat collection structure away from the cover body, and the radiator is arranged on the side surface of the thermoelectric cooler away from the heat collection structure. The headphone includes an arc-shaped headband, two earphone units respectively mounted at two end portions of the headband. The heat dissipation fitting covers are respectively fixed to the sound-emitting sides of the two earphone units, and the thermoelectric cooler is electrically connected to the main board of the earphone unit.

[0018] During installation, the heat dissipation fitting cover is installed on the earphone unit of the headphone, and the semiconductor refrigerator is electrically connected to the earphone unit. The heat collection structure is arranged between the mounting surface of the cover body and the earphone unit. When worn, the fitting surface of the cover body fits with the user's ear. The heat generated by the user's ear is transferred to the heat collection structure through the cover body. After the semiconductor refrigerator is powered on, a cold surface is formed on the side surface of the semiconductor refrigerator in contact with the heat collection structure. The heat on the heat collection structure can be quickly transferred to the cold surface of the semiconductor refrigerator and dissipated through the semiconductor refrigerator to the radiator, which can reduce the temperature at the user's ear, avoid stuffiness, and effectively relieve fatigue. It solves the problem that the user's ear is prone to stuffiness when wearing the headphone and can improve the wearing comfort. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is an exploded structural schematic diagram of the heat dissipation fitting cover of the present utility model;

[0020] Figure 2 is a cross-sectional structural schematic diagram of the heat dissipation fitting cover of the present utility model;

[0021] Figure 3 is Figure 2 an enlarged structural schematic diagram of part A in

[0022] Among them, 10. cover body; 11. soft filling body; 12. heat conduction layer; 13. outer coating layer; 14. outer heat insulation layer; 15. inner heat insulation layer; 20. heat collection structure; 30. semiconductor refrigerator; 40. radiator; 50. earphone unit; 51. accommodation cavity; 52. outer ventilation opening; 53. mounting ring part; 54. inner ventilation opening. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0024] Figures 1 to 3 is a structural schematic diagram of the heat dissipation fitting cover of the present utility model, among which, Figure 1 shows an exploded structural schematic diagram of the heat dissipation fitting cover of the present utility model, Figure 2 shows a cross-sectional structural schematic diagram of the heat dissipation fitting cover of the present utility model, Figure 3 shows Figure 2 an enlarged structural schematic diagram of part A in. For the convenience of description, only the parts related to the present utility model are shown in the figure.

[0025] It should be noted that the directional indications (such as up, down, front, back, etc.) involved in the present utility model are only used to explain the relative positional relationship between components in a specific posture. If this specific posture changes, the directional indications will also change accordingly; for the descriptions such as "first", "second", etc. involved in the present utility model, these descriptions are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features.

[0026] As Figure 1 , Figure 2 and Figure 3 shown, the present utility model discloses a heat dissipation fitting cover, which includes a ring-shaped cover body 10. One side close to the earphone unit 50 of the headphone forms an installation surface, and the other side far from the earphone unit 50 of the headphone forms a fitting surface adapted to the user's ear; it also includes a heat collection structure 20 extending along the installation surface of the cover body 10 and fixedly connected to the cover body 10, a semiconductor refrigerator 30 arranged on the side of the heat collection structure 20 far from the cover body 10, and a radiator 40 arranged on the side of the semiconductor refrigerator 30 far from the heat collection structure 20.

[0027] During installation, the heat dissipation fitting cover is installed on the earphone unit 50 of the headphone, and the semiconductor refrigerator 30 is electrically connected to the earphone unit 50. The heat collection structure 20 is arranged between the installation surface of the cover body 10 and the earphone unit 50. Usually, a magnet adsorption structure, a buckle clamping structure and other structures are arranged between the cover body 10 and the earphone unit 50 to realize the installation. Of course, the installation can also be realized by bonding between the heat collection structure 20 and the earphone unit 50. When wearing, the fitting surface of the cover body 10 is in contact with the user's ear. The heat generated by the user's ear is transmitted to the heat collection structure 20 through the cover body 10. After the semiconductor refrigerator 30 is powered on, the side surface of the semiconductor refrigerator 30 in contact with the heat collection structure 20 forms a cold surface. The heat on the heat collection structure 20 can be quickly transmitted to the cold surface of the semiconductor refrigerator 30 and dissipated through the semiconductor refrigerator 30 to the radiator 40, which can reduce the temperature at the user's ear, avoid stuffiness, and effectively relieve fatigue; the heat dissipation fitting cover of the present utility model solves the problem that the user's ear is prone to stuffiness when wearing the headphone and can improve the wearing comfort.

[0028] Specifically, the technology of using the semiconductor refrigerator 30 for refrigeration is a well-known technology, and its structure and working principle will not be elaborated here.

[0029] In the present utility model, the cover body 10 includes a soft filling body 11 in an annular shape, a heat conduction layer 12 wrapping the surface of the soft filling body 11, and an outer covering layer 13 wrapping the surface of the heat conduction layer 12. An opening area is provided on one side of the outer covering layer 13 corresponding to the installation surface; the heat collection structure 20 is attached to the heat conduction layer 12 at the position directly opposite to the opening area. Since the heat conduction performance of the soft filling body 11 is poor, wrapping a heat conduction layer 12 on the surface of the soft filling body 11 can quickly transfer the heat at the user's ear to the heat collection structure 20 through the heat conduction layer 12, enhancing the heat dissipation performance and avoiding the accumulation of heat inside the soft filling body 11.

[0030] Specifically, the soft filling body 11 is made of soft materials such as foam and silica gel, and is an integral structure formed by injection molding, die cutting, hot pressing and other methods; the outer covering layer 13 is an integral structure made of materials with good air permeability such as textile cloth and mesh cloth; the heat conduction layer 12 is made of high heat conduction materials such as graphite sheets and silicon carbide. Usually, the heat conduction layer 12 includes an inner sheet body attached to the inner ring side of the soft filling body 11, an outer sheet body attached to the outer ring side of the soft filling body 11, a fitting side sheet body attached to one side of the corresponding fitting surface of the soft filling body 11, and an installation side sheet attached to one side of the corresponding installation surface of the soft filling body 11. Of course, the inner sheet body, the outer sheet body and the fitting side sheet body are an integral structure connected together, or the inner sheet body, the outer sheet body and the installation side sheet are an integral structure connected together.

[0031] In order to reduce the heat transfer from the external environment to the inside of the cover body 10, resulting in an increase in the heat dissipation amount, an outer heat insulation layer 14 is provided on the outer peripheral side of the cover body 10. Usually, the outer heat insulation layer 14 is provided between the outer peripheral side of the heat conduction layer 12 and the corresponding outer covering layer 13.

[0032] At the same time, when the heat of the user's ear is transferred to the heat collection structure 20 through the heat conduction layer 12, in order to reduce the heat transferred to the enclosed space formed between the user's ear, the cover body and the earphone unit, an inner heat insulation layer 15 is provided on the inner ring side of the cover body 10 to avoid the lens of the earphone unit 50 being fogged due to the temperature difference. Usually, the inner heat insulation layer 15 is provided between the inner ring side of the heat conduction layer 12 and the corresponding outer covering layer 13.

[0033] Usually, the heat collection structure 20 is set as an annular plate body, increasing the contact area with the heat conduction layer 12, thereby enhancing the heat dissipation effect.

[0034] In the present utility model, in order to enhance the heat dissipation effect, at least two semiconductor refrigerators 30 are arranged at intervals on the side of the heat collection structure 20 away from the cover body 10, and radiators 40 are respectively provided on the sides of each semiconductor refrigerator 30 away from the heat collection structure 20.

[0035] Specifically, two semiconductor refrigerators 30 are provided and are respectively arranged on opposite sides of the mounting surface of the cover 10.

[0036] Generally, the radiator 40 includes a plate body that fits against the semiconductor refrigerator 30, and a plurality of fins spaced apart on the side of the plate body away from the semiconductor refrigerator 30. Generally, the plate body and the plurality of fins are connected into an integral structure. In some other embodiments, the radiator 40 can also be directly set in the form of a heat dissipation plate, which can increase the heat dissipation area and improve the heat dissipation effect.

[0037] Such as Figure 1 , Figure 2 and Figure 3 As shown, the present utility model also discloses a pair of head-mounted headphones, which includes an arc-shaped headband, and two headphone units 50 respectively installed at both ends of the headband. The above-mentioned heat dissipation fitting cover is fixedly arranged on the sound-emitting sides of the two headphone units 50, and the semiconductor refrigerator 30 is electrically connected to the main board of the headphone unit 50.

[0038] Specifically, a receiving cavity 51 is provided on the side of the headphone unit 50 close to the heat dissipation fitting cover. The semiconductor refrigerator 30 is arranged at the opening of the receiving cavity 51, the radiator 40 is arranged inside the receiving cavity 51, and an external ventilation opening 52 communicating with the receiving cavity 51 is provided on the outer peripheral side of the headphone unit 50, which is convenient for the radiator 40 to dissipate heat to the external environment.

[0039] For the convenience of installation, a mounting ring body part 53 is provided on the side of the headphone unit 50 close to the heat dissipation fitting cover. The heat dissipation fitting cover is installed on the ring end surface of the mounting ring body part 53, the receiving cavity 51 is arranged in the mounting ring body part 53, the external ventilation opening 52 is arranged on the outer peripheral side wall of the mounting ring body part 53, and an internal ventilation opening 54 communicating with the receiving cavity 51 is provided on the inner peripheral side wall of the mounting ring body part 53, which is not only convenient for the installation of the radiator 40, but also can enhance the air circulation performance between the sealed space formed among the user's ear, the cover 10 and the headphone unit 50 and the external environment.

[0040] In some other embodiments, the heat dissipation fitting cover can also be installed on the main body of the head-mounted all-in-one machine to act as a face mask.

[0041] The above are only some embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A heat dissipation fitting cover, comprising a ring-shaped cover body, wherein the cover body end surface on one side of the cover body forms a mounting surface, and the cover body end surface on the other side of the cover body forms a fitting surface; characterized in that: It also includes a heat collecting structure extending along the installation surface and fixedly connected to the cover body, a semiconductor refrigerator arranged on the side of the heat collecting structure away from the cover body, and a radiator arranged on the side of the semiconductor refrigerator away from the heat collecting structure; the cover body includes a soft filling body in a ring shape, a heat conducting layer wrapping the surface of the soft filling body and an outer covering layer wrapping the surface of the heat conducting layer, and the outer covering layer is provided with an opening area on one side corresponding to the installation surface; the heat collecting structure is attached to the heat conducting layer at a position opposite to the opening area.

2. The heat dissipation cover according to claim 1, characterized in that: An outer heat insulation layer is provided on the outer peripheral side of the cover body.

3. The heat dissipation cover according to claim 2, characterized in that: The outer heat insulating layer is disposed between the outer peripheral side of the heat conductive layer and the outer covering layer on the corresponding side.

4. The heat dissipation cover according to claim 1, characterized in that: An inner heat insulation layer is provided at the inner circle side of the cover body.

5. The heat dissipation cover according to claim 4, characterized in that: The inner heat insulating layer is arranged between the inner circle side of the heat conductive layer and the outer covering layer on the corresponding side.

6. The heat dissipation cover according to claim 1, characterized in that: The heat collecting structure is configured as an annular plate body adapted to the mounting surface.

7. The heat dissipation cover according to any one of claims 1 to 6, characterized in that: At least two semiconductor refrigerators are arranged at intervals on the heat collection structure, and the heat sink is respectively arranged on a side of each semiconductor refrigerator away from the heat collection structure.

8. The heat dissipation cover according to claim 7, characterized in that: The semiconductor refrigerators are provided with two, which are respectively arranged at two opposite sides of the installation surface.

9. A headset, comprising an arc-shaped headband, and two earphone units respectively mounted at two ends of the headband, characterized in that: It also includes a heat dissipation fitting cover as described in any one of claims 1 to 8 fixed to the sound-emitting side of the earphone unit, and the semiconductor cooler is electrically connected to the mainboard of the earphone unit.

10. The headphone according to claim 9, characterized in that: A accommodating cavity is provided on one side of the earphone unit close to the heat dissipation fitting cover, the semiconductor cooler is arranged at the cavity opening of the accommodating cavity, the radiator is arranged inside the accommodating cavity, and an external vent connected to the accommodating cavity is provided on the outer peripheral side of the earphone unit.

11. The headphone according to claim 10, characterized in that: A mounting ring body is provided on one side of the earphone unit close to the heat dissipation fitting cover, the heat dissipation fitting cover is installed on the ring body end surface of the mounting ring body, the accommodating cavity is provided on the mounting ring body, the external vent is provided on the outer peripheral side wall of the mounting ring body, and an internal vent connected to the accommodating cavity is provided on the inner peripheral side wall of the mounting ring body.

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