Miniaturized base station circuit board and miniaturized base station

Abstract

The utility model relates to the technical field of base stations, and discloses a miniaturized base station circuit board and a miniaturized base station, the miniaturized base station circuit board comprises a base station circuit board, the base station circuit board is located in a base station shell and is electrically connected with the shell, a shielding plate is arranged above the base station circuit board, the base station circuit board comprises a printed board, and the printed board is electrically connected with the shielding plate. The printed board is a multi-layer circuit board, a shielding layer is arranged between every two adjacent layers, and the front face and the back face of the printed board are each provided with an independent circuit area and an independent copper-clad grounding area. The beneficial effects of the utility model are that the base station is of a multi-layer stacked structure, the structure is compact, and the heat dissipation performance is good.

Description

Technical Field

[0001] The utility model relates to the technical field of base stations, and particularly relates to a miniaturized base station circuit board and a miniaturized base station. Background Art

[0002] A miniaturized base station is a communication network architecture technology based on communication protocols and is a small and flexible wireless communication device. It can provide data and voice services similar to those of a mobile communication network to meet the wireless communication needs of organizations and individuals. A miniaturized base station consists of an antenna, a radio frequency unit, a digital signal processor, a controller, etc.

[0003] The coverage range of a miniaturized base station can vary from 10 meters to 200 meters. Therefore, they are often applied to the following scenarios: outdoor hot spots with discontinuous coverage, such as scenic spots, pedestrian streets, residential areas, roads, etc.; indoor areas, such as large stadiums, shopping malls, office buildings, etc.; and vertical industry application scenarios, such as mine shafts, industrial parks, manufacturing, warehousing and logistics, etc.

[0004] In the process of implementing the present utility model, it is found that the prior art has at least the following problems:

[0005] The existing miniaturized base station has a complex structure, a large volume, and poor heat dissipation performance. Summary of the Utility Model

[0006] In order to solve the problems of the prior art, the present utility model provides a miniaturized base station circuit board and a miniaturized base station. The base station has a multi-layer stacked structure, is structurally compact, and has good heat dissipation performance.

[0007] On the one hand, a miniaturized base station circuit board is provided, including a printed circuit board. The printed circuit board is a multi-layer circuit board, and a shielding layer is provided between adjacent layers. Independent circuit regions and independent copper-clad grounding regions are respectively provided on the front and back sides of the printed circuit board.

[0008] Further, the shielding layer is a copper layer.

[0009] Further, heat dissipation elements are provided on both the front and back sides of the printed circuit board.

[0010] According to another aspect of the present utility model, a miniaturized base station is provided, including the above-mentioned miniaturized base station circuit board. The base station circuit board is located inside the base station housing and is electrically connected to the housing, and a shielding plate is provided above the base station circuit board.

[0011] Further, independent partition cavities adapted to the independent circuit regions and cavity isolation ribs adapted to the independent copper-clad grounding regions are provided both inside the base station housing and on the shielding plate; the cavity isolation ribs are electrically connected to the independent copper-clad grounding regions.

[0012] Furthermore, an installation groove is provided on the cavity isolation rib, and a conductive bar is filled in the installation groove.

[0013] Furthermore, heat dissipation bosses adapted to the heat dissipation elements are provided both inside the base station housing and on the shielding plate.

[0014] Furthermore, heat dissipation fins are provided on the outer side of the base station housing and / or on the side of the shielding plate away from the base station circuit board.

[0015] Furthermore, an external connection socket is provided on the base station housing for external electrical connection.

[0016] Furthermore, a cover plate adapted to the housing is provided outside the shielding plate.

[0017] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0018] 1. This device has a multi-layer stacked structure, is structurally compact, has no redundant components / modules, is smaller in size, and the overall structure is more compact.

[0019] 2. The base station housing and the shielding plate achieve the heat dissipation function and the shielding function of the base station circuit board, and can timely take away heat under the condition of natural air convection, and have good heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 is a schematic diagram of the overall structure of the present utility model Figure 1 ;

[0022] Figure 2 is a schematic diagram of the overall structure of the present utility model Figure 2 ;

[0023] Figure 3 is an exploded view of the present utility model;

[0024] Figure 4 is a schematic diagram of the base station housing of the present utility model Figure 1 ;

[0025] Figure 5 is a schematic diagram of the base station housing of the present utility model Figure 2 ;

[0026] Figure 6 is a schematic diagram of the base station circuit board of the present utility model Figure 1 ;

[0027] Figure 7 is a schematic diagram of the base station circuit board of the present utility model Figure 2 ;

[0028] Figure 8 is a schematic diagram of the shielding plate of the present utility model Figure 1 ;

[0029] Figure 9 is a schematic diagram of the shielding plate of the present utility model Figure 2 .

[0030] Reference numerals shown in the accompanying drawings:

[0031] 1. Base station housing; 11. Independent isolation chamber; 12. Chamber isolation rib; 13. Heat dissipation boss; 14. Heat dissipation fin; 15. On-board connector outlet; 16. External cable outlet;

[0032] 2. Base station circuit board; 21. Printed circuit board; 22. Independent copper-clad grounding area; 23. Independent circuit area; 24. On-board connector; 25. Heat dissipation element;

[0033] 3. Shielding plate; 31. Independent isolation chamber; 32. Chamber isolation rib; 33. Heat dissipation fin;

[0034] 4. Cover body. Specific implementation manners

[0035] To make the objectives, technical solutions and advantages of the present utility model clearer, the following will further describe the implementation manners of the present utility model in detail with reference to the accompanying drawings.

[0036] As Figures 1-3 shown, a miniaturized base station is provided, including a base station circuit board 2, where the base station circuit board 2 is located inside the base station housing 1 and is electrically connected to the base station housing 1, and a shielding plate 3 is arranged above the base station circuit board 2. In this device, the base station circuit board realizes the conversion of electrical signals and the functions of wireless reception and transmission. The specific circuit principle belongs to the prior art; for the base station structure housing part, it provides the installation support, heat dissipation of the base station circuit board and the isolation function between the independent functional module circuits on both sides of the base station circuit board. The structure is compact, there is no redundant component / module design, and the volume is smaller.

[0037] Specifically, as Figures 6-7As shown in the figure, it is the detailed structure of the base station circuit board 2. The base station circuit board 2 is the core processing unit of this base station, including a printed circuit board 21. The printed circuit board 21 is a multi-layer circuit board, and a shielding layer is provided between adjacent layers. The shielding layer is a copper layer, which can isolate and shield the front and back circuits from each other. Independent circuit regions 23 and independent copper-clad grounding regions 22 are respectively provided on both the front and back sides of the printed circuit board 21. The front and back sides of the base station circuit board 2 are respectively connected to the base station housing 1 and the shielding plate 3 for use. Therefore, each independent circuit region 23 on both the front and back sides of the base station circuit board 2 is a metal enclosed space, having good electromagnetic shielding and isolation effects.

[0038] Furthermore, heat dissipation elements 25 are provided on both the front and back sides of the printed circuit board 21 for heat dissipation. Usually, board-mounted connectors 24 are also provided on the printed base station circuit board 21.

[0039] Specifically, as Figures 4-5 shown in the figure, it is the detailed structure of the base station housing 1. The base station housing 1 is made of aluminum alloy material through CNC machining, having good structural rigidity and thermal conductivity, and can be used for the fixed installation, heat dissipation, and shielding of the base station circuit board 2. The inner side of the base station housing 1 is an aluminum alloy processed conductive oxide surface, on which independent compartments 11 are provided. The independent circuit regions 23 provided on the contact surface with the base station circuit board 2 cooperate and close to form an independent space. Cavity isolation ribs 12 are provided on the inner side surface and are in conductive contact with the copper-clad grounding regions 22 on the base station circuit board to form good electromagnetic shielding.

[0040] A long installation groove is provided on the surface of the cavity isolation rib 12. A conductive rubber strip with an appropriate diameter can be placed in this installation groove. The conductive rubber strip is extruded by the contacted base station housing 1 and the back side of the base station circuit board 2 in the groove, forming plastic deformation, so as to completely fill the space in the groove, fully ensuring that the contact area between the base station housing 1 and the base station circuit board 2 is completely conductive, and thus effectively ensuring the electromagnetic shielding in each independent enclosed region and the non-interference of each circuit signal.

[0041] A number of heat dissipation bosses 13 are provided on the inner side of the base station housing 1. The heat dissipation bosses 13 are in indirect contact with the corresponding heat dissipation elements 25 on the base station circuit board 2 through heat conductive rubber gaskets for heat conduction. Heat dissipation fins 14 with a certain heat dissipation capacity are provided on the outer side of the base station housing 1 and are painted with paint to make the appearance beautiful. The heat dissipation fins 14 can effectively dissipate heat under natural air convection or when blown by an external fan. External cable outlets 16 are provided on both sides of the base station housing 1, and some connection cables on the base station circuit board 2 can be fixed and connected here for external electrical connection. A board-mounted connector outlet 15 is provided at the bottom of the base station housing 1, through which the board-mounted connector 24 on the base station circuit board 2 can pass for external electrical connection.

[0042] There is a threaded hole on one side of the heat dissipation fin 14 on the base station housing 1, which facilitates the installation of this base station with the cooperation of installation accessories.

[0043] Specifically, as Figures 8-9 shown, it is the detailed structure of the shielding plate 3. The shielding plate 3 is made of aluminum alloy material through CNC machining. It is similar to the base station housing 1 in function. There are independent compartments 31, cavity isolation ribs 32 and heat conduction bosses on the inner side. There are long grooves on the cavity isolation ribs 32, which can be filled with conductive rubber strips and are installed in extrusion docking with the front side of the base station circuit board 2, so that the independent circuit area 23 of the base station circuit board 2 and the independent compartment 31 on the shielding plate 3 form closed spaces under the combined action of the copper-clad grounding area 22 of the base station circuit board 2 and the cavity isolation ribs 32 of the shielding plate 3. There are heat dissipation fins 33 on the outer side of the shielding plate 3, which can help dissipate the heat of the components on the front side of the base station circuit board 2.

[0044] Specifically, the cover plate 4 is made of plastic material and is formed by injection molding. The cover plate 4 is installed on the top of the base station housing 1 to seal the shielding cover and also plays a role in dust prevention.

[0045] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A miniaturized base station circuit board, characterized in that: The printed board (21) is a multi-layer circuit board with a shielding layer arranged between two adjacent layers, and an independent circuit area (23) and an independent copper-clad grounding area (22) are respectively arranged on the front and back sides of the printed board (21).

2. A miniaturized base station circuit board according to claim 1, characterized in that: The shielding layer is a copper layer.

3. A miniaturized base station circuit board according to claim 1, characterized in that: Heat dissipation elements (25) are arranged on both the front and back sides of the printed circuit board (21).

4. A miniaturized base station, characterized in that: It comprises a miniaturized base station circuit board as described in any one of claims 1 to 3, wherein the base station circuit board (2) is located in a base station housing (1) and is electrically connected to the base station housing (1), and a shielding plate (3) is arranged above the base station circuit board (2).

5. A miniaturized base station according to claim 4, characterized in that: An independent compartment (11) adapted to the independent circuit area (23) and a cavity isolation rib (12) adapted to the independent copper-clad grounding area (22) are both arranged inside the base station housing (1) and on the shielding plate (3); the cavity isolation rib (12) is electrically connected to the independent copper-clad grounding area (22).

6. A miniaturized base station according to claim 5, characterized in that: A mounting groove is provided on the cavity isolation rib (12), and a conductive strip is filled in the mounting groove.

7. A miniaturized base station according to claim 4, characterized in that: A heat dissipation boss (13) adapted to the heat dissipation element (25) is arranged inside the base station housing (1) and on the shielding plate (3).

8. A miniaturized base station according to claim 4, characterized in that: Heat dissipation fins are arranged on the outer side of the base station housing (1) and / or on a side of the shielding plate (3) away from the base station circuit board (2).

9. A miniaturized base station according to claim 4, characterized in that: The base station housing (1) is provided with an external socket for external electrical connection.

10. A miniaturized base station according to claim 4, characterized in that: A cover plate (4) adapted to the base station housing (1) is arranged outside the shielding plate (3).

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