Heat dissipation cover of circuit board

Abstract

The utility model discloses a circuit board heat dissipation cover, and relates to the field of heat dissipation device design. Comprising a cover plate, a plurality of cooling fins are integrally formed on the front face of the cover plate, and every two adjacent cooling fins are parallel to each other and are separately arranged; a positioning frame is integrally formed on the back face of the cover plate, one or more limiting bosses are formed on the positioning frame, and stepped groove structures are formed between the two ends of each limiting boss and the positioning frame. A thickened surface is integrally formed on the back surface of the cover plate and is positioned in the positioning frame; compared with the prior art, the radiator and the shielding cover are integrally arranged, the occupied space on the circuit board is reduced, meanwhile, the effect of rapidly transferring heat is achieved, and assembling is convenient and rapid.

Description

Technical Field

[0001] The utility model relates to the field of radiator design, in particular to a circuit board heat dissipation cover. Background Art

[0002] Due to the rapid development of semiconductor technology, chips integrate more and more functions, resulting in continuous increase in the operating speed and velocity of the chips. However, the size of the chips is getting smaller and smaller. Therefore, the heat generated by the chips also increases accordingly. Moreover, due to high integration, the structure of the chips is relatively dense, resulting in more difficult heat dissipation of the chips. In order to ensure the normal operation of the chips, a large amount of heat generated by the chips must be discharged in time.

[0003] For this reason, a chip heat dissipation structure is disclosed in the prior art (Publication No.: CN112804817A, Publication Date: May 14, 2021). A shielding cover, a graphene thin film layer, thermal conductive silica gel and a heat sink are sequentially arranged on the chip. Since there are multiple layers of structures between the chip and the heat sink, the heat transfer effect is not good. Moreover, in this solution and other solutions in the prior art, the heat sink and the shielding cover are not integrally designed. These two components are separate individuals, resulting in more space occupied on the circuit board and inconvenient installation. Summary of the Utility Model

[0004] The utility model provides a technical solution that can solve the above problems to overcome the above deficiencies.

[0005] A circuit board heat dissipation cover includes a cover plate. A plurality of heat sinks are integrally formed on the front surface of the cover plate, and two adjacent heat sinks are parallel to each other and separated.

[0006] A positioning frame is integrally formed on the back surface of the cover plate. One or more limiting bosses are formed on the positioning frame, and a stepped groove structure is formed between the two ends of the limiting boss and the positioning frame.

[0007] A thickened surface is integrally formed on the back surface of the cover plate, and the thickened surface is located within the positioning frame.

[0008] Further: A glue application edge is provided on the positioning frame.

[0009] Further: A shielding cover structure is formed between the back surface of the cover plate and the positioning frame.

[0010] Further: A plurality of bolt holes are integrally formed on the back surface of the cover plate, and the plurality of bolt holes are respectively arranged on the side edges of the positioning frame.

[0011] Further: The end surface of the bolt hole is higher than the positioning frame.

[0012] Further: One or more clearance grooves are formed on the outer side of the cover plate, and wire grooves are integrally formed on one or more of the heat sinks on the front surface of the cover plate.

[0013] Further: The cover plate is made of DC01 cold plate.

[0014] Further: The outer surface of the cover plate is provided with a black sand pattern powder spray coating.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] 1. A positioning frame is integrally formed on the back surface of the cover plate directly, so that a shielding cover structure is formed between the positioning frame and the cover plate. During installation, thermal conductive silicone grease is coated on the chip of the circuit board, and then the cover plate is directly installed on the circuit board. Since the chip is located in the shielding cover structure, an electromagnetic shielding effect can be achieved.

[0017] 2. A thickened surface is provided at the corresponding position on the back surface of the cover plate. After the cover plate is installed, the thermal conductive silicone grease will be filled between the chip and the thickened surface, achieving the effect of rapid heat transfer.

[0018] 3. Multiple heat sinks are formed on the front surface of the cover plate, thereby increasing the area of contact between the cover plate and the air, achieving the effect of rapid heat dissipation, and can also be used in combination with a cooling fan.

[0019] The present utility model integrates the radiator and the shielding cover, reduces the occupied space on the circuit board, and at the same time has the effect of rapid heat transfer, and the assembly is convenient and fast.

[0020] The additional aspects and advantages of the present utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 is a schematic structural diagram of the present utility model;

[0023] Figure 2 is a schematic structural diagram of another perspective of the present utility model;

[0024] Figure 3It is a schematic structural view of the front side of the cover plate of the present utility model;

[0025] Figure 4 It is a schematic structural view of the back side of the cover plate of the present utility model.

[0026] As shown in the figure: 1. Cover plate; 2. Heat sink; 3. Positioning frame; 4. Limit boss; 5. Thickened surface; 6. Glue application edge; 7. Bolt hole; 8. Clearance groove; 9. Wire passing groove; 10. Step groove structure; 11. Shielding cover structure. Detailed implementation manners

[0027] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model.

[0028] Generally, the components of the embodiments of the present utility model described and shown in the accompanying drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model.

[0029] All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts fall within the scope of protection of the present utility model.

[0030] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0031] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0032] Such as Figures 1-4As shown in the figure, a heat dissipation cover for a circuit board of the present utility model includes a cover plate 1. A plurality of heat dissipation fins 2 are integrally formed on the front surface of the cover plate 1. Adjacent two of the heat dissipation fins 2 are parallel to each other and are separately arranged;

[0033] A positioning frame 3 is integrally formed on the back surface of the cover plate 1. One or more limiting bosses 4 are formed on the positioning frame 3. A stepped groove structure 10 is formed between both ends of the limiting boss 4 and the positioning frame 3;

[0034] A shielding cover structure 11 is formed between the back surface of the cover plate 1 and the positioning frame 3;

[0035] A thickened surface 5 is integrally formed on the back surface of the cover plate 1. The thickened surface 5 is located within the positioning frame 3;

[0036] The principle is as follows: The positioning frame 3 is directly integrally formed on the back surface of the cover plate 1, and the shielding cover structure 11 is formed between the positioning frame 3 and the cover plate 1. During installation, thermal conductive silicone grease is coated on the chip of the circuit board, and then the cover plate 1 is directly installed on the circuit board. Since the chip is located within the shielding cover structure 11, an electromagnetic shielding effect can be achieved. Moreover, a thickened surface 5 is provided at the corresponding position on the back surface of the cover plate 1. After the cover plate 1 is installed, the thermal conductive silicone grease will fill between the chip and the thickened surface 5, achieving the effect of rapid heat transfer. At the same time, a plurality of heat dissipation fins 2 are formed on the front surface of the cover plate 1, thereby increasing the area of contact between the cover plate 1 and the air and achieving the effect of rapid heat dissipation. It can be additionally used in conjunction with a heat dissipation fan. The present utility model integrates the radiator and the shielding cover, reducing the occupied space on the circuit board, and at the same time having the effect of rapid heat transfer, and the assembly is convenient and fast.

[0037] Furthermore: A glue - applying edge 6 is provided on the positioning frame 3; When installing the cover plate 1, thermal conductive glue can be applied on the glue - applying edge 6, so that the cover plate 1 can be directly adhered to the circuit board for fixation, which can ensure the stable installation of the cover plate 1.

[0038] Furthermore: A plurality of bolt holes 7 are integrally formed on the back surface of the cover plate 1. The plurality of bolt holes 7 are respectively arranged on the side edges of the positioning frame 3; The cover plate 1 can be locked to the circuit board by bolts, thereby ensuring its stable installation.

[0039] Furthermore: The end surface of the bolt hole 7 is higher than the positioning frame 3; It can be correspondingly installed on the circuit board. After the cover plate 1 is installed, there will be no displacement situation, and at the same time, it can quickly determine whether the cover plate 1 is installed in place, facilitating the assembly operation.

[0040] Furthermore, one or more clearance grooves 8 are formed on the outer side of the cover plate 1, and wire grooves 9 are integrally formed on one or more of the heat sinks 2 on the front surface of the cover plate 1; the provision of the clearance grooves 8 and the wire grooves 9 facilitates the installation and wiring of the cover plate 1 on the circuit board, and thus facilitates the assembly operation of the cover plate 1.

[0041] Furthermore, the cover plate 1 is made of DC01 cold plate; DC01 cold plate is a cold-rolled steel plate with good heat conduction effect, thus ensuring its heat dissipation effect.

[0042] Furthermore, the outer surface of the cover plate 1 is provided with a black sand pattern powder spray coating; it can achieve high-quality surface treatment effect, and at the same time has good weather resistance and salt spray resistance, is not easy to change color, has high thermal stability, and will not deform or crack when the chip temperature rises.

[0043] This embodiment does not impose any formal restrictions on the shape, material, structure, etc. of the present invention. Any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A circuit board heat dissipation cover, comprising a cover plate (1), characterized in that: The front side of the cover plate (1) is integrally formed with a plurality of heat sinks (2), and two adjacent heat sinks (2) are parallel to each other and are separately arranged; The back of the cover plate (1) is integrally formed with a positioning frame (3), one or more limiting bosses (4) are formed on the positioning frame (3), and a stepped groove structure (10) is formed between the two ends of the limiting boss (4) and the positioning frame (3); A shielding cover structure (11) is formed between the back side of the cover plate (1) and the positioning frame (3); The back side of the cover plate (1) is integrally formed with a thickened surface (5), and the thickened surface (5) is located in the positioning frame (3).

2. A circuit board heat dissipation cover according to claim 1, characterized in that: The positioning frame (3) is provided with a glue edge (6).

3. A circuit board heat dissipation cover according to any one of claims 1 or 2, characterized in that: The back side of the cover plate (1) is integrally formed with a plurality of bolt holes (7), and the plurality of bolt holes (7) are respectively arranged on the sides of the positioning frame (3).

4. A circuit board heat dissipation cover according to claim 3, characterized in that: The end surface of the bolt hole (7) is arranged higher than the positioning frame (3).

5. The circuit board heat dissipation cover according to claim 1, characterized in that: One or more air-avoiding grooves (8) are formed on the outer side of the cover plate (1), and a wire-passing groove (9) is also integrally formed on one or more of the heat sinks (2) on the front side of the cover plate (1).

6. The circuit board heat dissipation cover according to claim 1, characterized in that: The cover plate (1) is made of DC01 cold plate.

7. A circuit board heat dissipation cover according to any one of claims 1 or 6, characterized in that: The outer surface of the cover plate (1) is provided with a black sand-textured powder spray coating.

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