Heat dissipation device, printed circuit board and electric control device
By using thermally conductive elastic members and cooling medium paths in the heat dissipation device, closely contacting and effectively dissipating electrical components of complex shapes, the shortcomings of existing heat dissipation devices in complex components are solved, and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202422201116.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-09-09
AI Technical Summary
Existing heat dissipation devices are difficult to effectively dissipate heat. It has electrical components with complex appearance and arrangement. Especially under the high power and multi-regional heat dissipation needs, the cooling effect of air-cooled convective heat dissipation devices is poor.
The heat dissipation device using a thermally conductive elastic member and a cooling medium passage is used. The thermally conductive elastic member is in close contact with the mating surface of the electrical components, and a cooling medium passage is set inside to dissipate heat using the cooling medium.
It realizes efficient heat dissipation for electrical components with complex shapes and arrangements, improves heat dissipation effect, and is suitable for high power and multi-region heat dissipation needs.
Smart Images
Figure CN223024842U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a heat dissipation device, a printed circuit board, and an electric control device, and particularly relates to a heat dissipation device capable of dissipating heat from electrical components with complex shapes. Background Art
[0002] In the past, various heat dissipation devices with rigid outer shapes, such as air-cooled heat dissipation devices and water-cooled heat dissipation devices, have been known for dissipating heat from electrical components and the like. However, with the increasing use of electrical components with high heat fluxes, the performance requirements for heat dissipation devices are getting higher and higher. Conventional rigid-mounted heat dissipation devices are difficult to apply to the layout of components in multiple regions and with complex shapes. For example, on a printed circuit board such as a high-power variable-frequency drive board, various electrical components such as thin-film capacitors, electrolytic capacitors, and diodes are arranged. These electrical components have different shapes, functions, and heat generation powers. For these electrical components, it is difficult to effectively conduct liquid-cooling heat dissipation using existing liquid-cooled heat dissipation devices. Therefore, only an air-cooled convection heat dissipation device can be used for heat dissipation. However, the air-cooled convection heat dissipation device has a poor cooling effect and does not have a long-term high-power heat dissipation function. Therefore, a heat dissipation device capable of effectively dissipating heat from electrical components with complex outer shapes and layouts is needed. Summary of the Utility Model
[0003] The present application is made in view of the technical problems existing in the above-mentioned prior art, and its purpose is to provide a heat dissipation device capable of effectively dissipating heat from electrical components with complex outer shapes and layouts.
[0004] According to one aspect of the present application, a heat dissipation device is provided. The heat dissipation device includes a thermally conductive elastic member and a cooling medium passage. The thermally conductive elastic member has an electrical component mating surface that contacts the electrical component to be cooled and a cooling medium passage arrangement portion for arranging the cooling medium passage. The cooling medium passage is arranged in the cooling medium passage arrangement portion, and a cooling medium is provided in the cooling medium passage.
[0005] According to the above heat dissipation device of the present application, it may also be that: the cooling medium passage arrangement portion is provided inside the thermally conductive elastic member.
[0006] According to the above heat dissipation device of the present application, it may also be that: a cutout portion is formed on the surface of the thermally conductive elastic member opposite to the electrical component mating surface, and the cutout portion communicates with the cooling medium passage arrangement portion.
[0007] According to the above heat dissipation device of the present application, it may also be that: the heat dissipation device further includes a cover plate, and the cover plate is press-fitted on the surface of the thermally conductive elastic member opposite to the electrical component mating surface.
[0008] According to the above-mentioned heat dissipation device of the present application, it can also be: the cover plate is a metal plate with thermal conductivity.
[0009] According to the above-mentioned heat dissipation device of the present application, it can also be: a mating groove matching the electrical component to be cooled is formed on the mating surface of the electrical component.
[0010] According to the above-mentioned heat dissipation device of the present application, it can also be: an exhaust groove communicating with the mating groove is further formed on the mating surface of the electrical component.
[0011] According to the above-mentioned heat dissipation device of the present application, it can also be: the mating groove is in interference fit with the electrical component to be cooled.
[0012] According to the above-mentioned heat dissipation device of the present application, it can also be: the cooling medium passage is formed in a bent shape passing through each of the multiple electrical components to be cooled.
[0013] According to the above-mentioned heat dissipation device of the present application, it can also be: the cooling medium passage is formed as a single-channel passage.
[0014] According to the above-mentioned heat dissipation device of the present application, it can also be: the cooling medium passage is formed as a multi-channel parallel passage.
[0015] According to the above-mentioned heat dissipation device of the present application, it can also be: the cooling medium network is formed as a capillary network structure.
[0016] According to the above-mentioned heat dissipation device of the present application, it can also be: the thermally conductive elastic member has electrical insulation.
[0017] According to another solution of the present application, a printed circuit board is provided. The printed circuit board includes a plurality of electrical components electrically connected to each other through printed circuits, and the heat dissipation device as described in any one of the above, and the plurality of electrical components are dissipated heat through the heat dissipation device.
[0018] According to another solution of the present application, an electric control device is provided. The electric control device includes a box body and a control circuit board installed in the box body. The control circuit board includes a plurality of electrical components and the heat dissipation device as described in any one of the above, and the plurality of electrical components are dissipated heat through the heat dissipation device.
[0019] Effects of the utility model
[0020] According to the heat dissipation device of the present application, by utilizing the elasticity of the thermally conductive elastic member, the heat dissipation device is in good contact with electrical components with complex shapes and arrangements. Moreover, by utilizing the thermal conductivity of the thermally conductive elastic member, the heat of the electrical components is transferred to the cooling medium in the cooling medium passage, and the electrical components are dissipated heat. Therefore, it can effectively dissipate heat from electrical components with complex shapes and arrangements.
[0021] In addition, by disposing the cooling medium passage configuration portion inside the thermally conductive elastic member, the cooling medium passage can be buried inside the thermally conductive elastic member, and the cooling medium passage can be wrapped by the thermally conductive elastic member, so that the thermally conductive elastic member can transfer the heat from the electrical component to the cooling medium passage more effectively, thereby dissipating heat more effectively.
[0022] In addition, by providing a cutout portion on the surface of the thermally conductive elastic member opposite to the mating surface with the electrical component and connecting the cutout portion to the cooling medium passage configuration portion, the cooling medium passage can be conveniently inserted into the cooling medium passage configuration portion through the cutout, so that the installation and replacement of the cooling medium passage can be easily performed.
[0023] In addition, by pressing the cover plate against the surface of the thermally conductive elastic member opposite to the mating surface with the electrical component, the thermally conductive elastic member can be pressed by the cover plate, so that the thermally conductive elastic member can be used as a buffer member to protect the electrical component from external impacts, preventing the electrical component from falling off or failing due to external impacts, vibrations, etc.
[0024] In addition, by making the cover plate a metal plate with thermal conductivity, the heat dissipation effect of the heat dissipation device can be further improved by the thermal conductivity of the cover plate.
[0025] In addition, by forming a mating groove on the mating surface with the electrical component that matches the electrical component to be cooled, the heat dissipation device can be adapted to the complex shapes and arrangements of the electrical components to be cooled, thereby obtaining a better heat dissipation effect.
[0026] In addition, by forming an exhaust groove communicating with the above-mentioned mating groove on the mating surface with the electrical component, the air existing between the inner surface of the mating groove and the surface of the electrical component to be cooled can be effectively discharged by the exhaust groove, so that the thermally conductive elastic member can be more closely attached to the surface of the electrical component to be cooled, thereby further improving the heat dissipation effect of the heat dissipation device.
[0027] In addition, by making the mating groove formed on the mating surface with the electrical component have an interference fit with the electrical component to be cooled, the reliable contact and tight attachment between the inner surface of the mating groove and the surface of the electrical component to be cooled can be further ensured, and thus the heat dissipation effect of the heat dissipation device on the electrical component can be ensured.
[0028] In addition, by forming the cooling medium passage into a bent shape passing through each of the plurality of electrical components to be cooled, effective heat dissipation can be performed for each of the plurality of electrical components to be cooled.
[0029] In addition, by forming the cooling medium passage into a single-channel type passage, the structure of the heat dissipation device can be simplified and the cost can be reduced.
[0030] In addition, by forming the cooling medium passage into a multi-channel parallel passage, the heat transfer area between the thermally conductive elastic member and the cooling medium passage can be increased, and the heat dissipation capacity of the heat dissipation device can be improved.
[0031] In addition, by forming the cooling medium passage into a capillary network structure, the heat transfer area between the thermally conductive elastic member and the cooling medium passage can be further increased, and the heat dissipation capacity of the heat dissipation device can be further improved.
[0032] In addition, since the thermally conductive elastic member has electrical insulation properties, the thermally conductive elastic member can be used to prevent short circuits from occurring between multiple electrical components.
[0033] According to the printed circuit board of the present application, by having the heat dissipation device of the present application as described above, the technical effects brought by the heat dissipation device of the present application can be obtained.
[0034] According to the electronic control device of the present application, by having the heat dissipation device of the present application as described above, the technical effects brought by the heat dissipation device of the present application can be obtained. Description of the Drawings
[0035] Figure 1 It is a schematic perspective view of a printed circuit board cooled by the heat dissipation device of the present application.
[0036] Figure 2 It is a schematic perspective view of the heat dissipation device of the present application.
[0037] Figure 3 It is a schematic exploded perspective view of the heat dissipation device and the printed circuit board of the present application.
[0038] Figure 4 It is a schematic perspective view of the heat dissipation device and the printed circuit board of the present application.
[0039] Figure 5 It is a schematic perspective view of an open electronic control device equipped with the heat dissipation device of the present application.
[0040] Description of the Reference Numerals:
[0041] 1 Printed circuit board
[0042] 2 Heat dissipation device
[0043] 3 Open electronic control device
[0044] 11 Chip
[0045] 12 Polyester capacitor
[0046] 13 Current sensor
[0047] 14 Transformer
[0048] 15 Electrolytic capacitor
[0049] 16 Thin-film capacitor
[0050] 21 Heat-conducting elastic member
[0051] 22 Cooling medium passage
[0052] 23 Cover plate
[0053] 24 Electrical component mating surface
[0054] 241 Mating groove
[0055] 25 Surface
[0056] 26 Cooling medium passage arrangement part
[0057] 27 Notch part
[0058] 31 Weak-current control board
[0059] 32 Reactor
[0060] 33 Box body Detailed implementation manners
[0061] The present disclosure will be described in detail below. In the following paragraphs, different aspects of the embodiments are defined in more detail. Each aspect so defined can be combined with any other one aspect or more aspects, unless explicitly stated that they cannot be combined. In particular, any feature considered to be preferred or advantageous can be combined with any other one or more features considered to be preferred or advantageous.
[0062] The terms "first", "second", etc. that appear in the present disclosure are only for convenience of description to distinguish different components with the same name, and do not indicate a sequence or primary-secondary relationship.
[0063] In addition, when a component is referred to as being "on" another component, the component can be directly on the other component, or can be indirectly on the other component with one or more intermediate components inserted therebetween. Further, when a component is referred to as being "connected to" another component, the component can be directly connected to the other component, or can be indirectly connected to the other component with one or more intermediate components inserted therebetween. In the following text, the same reference numerals denote the same components.
[0064] Descriptions of the orientation or positional relationship using terms such as "upper", "lower", "top", "bottom", "front", "rear", "inner", and "outer" in this disclosure are only for the convenience of describing this disclosure, rather than indicating or implying that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the protection scope of this application.
[0065] Next, embodiments of this application will be described in detail with reference to the accompanying drawings.
[0066] Figure 1 is a schematic perspective view of a printed circuit board 1 cooled by the heat dissipation device of this application. As Figure 1 shown, various electrical components are provided on the printed circuit board 1, and each electrical component is electrically connected to each other through printed circuits. As an example, Figure 1 the printed circuit board 1 shown is, for example, a frequency conversion control board used in an open electrical control device, and the electrical components provided on the printed circuit board 1 may include, for example, a chip 11, a polyester capacitor 12, a current sensor 13, a transformer 14, an electrolytic capacitor 15, a thin film capacitor 16, etc. However, it should be understood that the printed circuit board 1 of this application is not limited to a frequency conversion control board, but can be a printed circuit board for any use, and the electrical components provided on the printed circuit board 1 are not limited to the components listed above, but can be any appropriate electrical components. It can be seen from Figure 1 that electrical components such as the chip 11, the polyester capacitor 12, the current sensor 13, the transformer 14, the electrolytic capacitor 15, and the thin film capacitor 16 have different shape sizes respectively, the arrangement and position of each electrical component are complex, and the heat generation power is different. Therefore, the rigid liquid cooling type heat dissipation device in the prior art is difficult to be applicable to dissipating heat from such a printed circuit board, and thus usually only an air cooling type convection heat dissipation device can be used. However, in the case of using an air cooling type convection heat dissipation device, there is a problem that the heat dissipation capacity of the heat dissipation device is insufficient, and it is difficult to achieve the effect of long-term high-power heat dissipation. To solve the above technical problems, this application provides a heat dissipation device including a thermally conductive elastic member and a cooling medium passage provided in the thermally conductive elastic member, which can effectively dissipate heat from the printed circuit board 1 provided with a plurality of electrical components having different shape sizes, complex arrangements and positions.
[0067] Next, with reference to Figure 2 、 Figure 3 and Figure 4 , the heat dissipation device 2 of this application will be described. Among them, Figure 2 is a schematic perspective view of the heat dissipation device of this application; Figure 3 is a schematic exploded perspective view of the heat dissipation device and the printed circuit board of this application; Figure 4 is a schematic perspective view of the heat dissipation device and the printed circuit board of this application.
[0068] As Figure 2 and Figure 3 shown, the heat dissipation device 2 is formed in a shape corresponding to the portion of the printed circuit board 1 where electrical components to be cooled are provided. Specifically, in the example shown in Figure 2 and Figure 3 it is formed in a substantially L shape with a certain thickness. However, the heat dissipation device of the present application is not limited to such a shape, but can be formed in any shape as long as it can cover the electrical components to be cooled in the printed circuit board 1. As can be clearly seen from Figure 3 the heat dissipation device 2 includes, for example, a thermally conductive elastic member 21 and a cooling medium passage 22.
[0069] The thermally conductive elastic member 21 can be constituted by, for example, a silicone rubber body infiltrated with metal oxide. By using a silicone rubber body infiltrated with metal oxide as the material, the thermally conductive elastic member 21 has good elasticity (deformability), thermal conductivity, and electrical insulation. As Figure 2 and Figure 3As shown, the thermally conductive elastic member 21 has an electrical component mating surface 24 that contacts and mates with the electrical components on the printed circuit board 1, and a surface 25 on the opposite side of the electrical component mating surface. The thermally conductive elastic member 21 is formed with one or more mating grooves 241 on the electrical component mating surface 24, and each of the mating grooves 241 has a different shape and size to match the electrical components with corresponding shapes and sizes provided on the printed circuit board 1. When the thermally conductive elastic member 21 is installed on the printed circuit board 1, each of the mating grooves 241 mates with the corresponding electrical component, and by virtue of the elasticity of the thermally conductive elastic member 21, the inner surface of each of the mating grooves 241 is closely attached to the surface of the corresponding electrical component. Preferably, the size of the mating groove 241 is set to be slightly smaller than the outer dimension of the corresponding electrical component to be cooled before elastic deformation, so that when the electrical component is fitted into the mating groove 241 by virtue of the elasticity of the thermally conductive elastic member 21, an interference fit is formed between the mating groove 241 and the electrical component to be cooled. In this way, it can be further ensured that the inner surface of the mating groove 241 is reliably in contact with and attached to the surface of the electrical component, thereby ensuring the heat dissipation effect of the heat dissipation device 2. Additionally, although not shown in the figure, for example, an exhaust groove communicating with the mating groove 241 may be provided on the electrical component mating surface 24 of the thermally conductive elastic member 21, so that the air existing between the inner surface of the mating groove 241 and the surface of the electrical component to be cooled can be effectively discharged by using this exhaust groove, thereby enabling the thermally conductive elastic member 21 to be more closely attached to the surface of the electrical component to be cooled, so as to improve the heat dissipation effect. Further, when the heat dissipation device 2 is installed on the printed circuit board 1, the electrical insulation of the thermally conductive elastic member 21 can be utilized to prevent short circuits of the various electrical components provided on the printed circuit board 1.
[0070] As Figure 2 and Figure 3 shown, a hollow cooling medium passage configuration portion 26 is provided inside the thermally conductive elastic member 21, and the cooling medium passage 22 is arranged in the cooling medium passage configuration portion 26. As Figure 3 shown in the example, the cooling medium passage 22 can be formed into a hollow tubular shape with a circular cross-section, and the cooling medium passage 22 can be formed into a bent shape passing through each of the electrical components to be cooled on the printed circuit board 1 (in the examples of Figure 2 and Figure 3 , it is formed into a serpentine bent shape), so that the cooling medium flowing in the cooling medium passage 22 can flow through each of the electrical components to be cooled on the printed circuit board 1 and dissipate the heat generated by these electrical components. Obviously, the shape of the cooling medium passage in the present application is not limited to this, but can be formed into any shape suitable for dissipating heat from the electrical components. Additionally, inFigure 2 and Figure 3 In the example shown, an example where the cooling medium passage 22 is a single-channel passage is illustrated. By adopting a single-channel passage, the structure of the heat dissipation device can be simplified and the cost of the device can be suppressed. However, the present application is not limited thereto. For example, the cooling medium passage 22 can also be a multi-channel parallel passage or a passage having a capillary network structure. The more the number of passages of the cooling medium passage 22, the more complex the structure, but the better the heat dissipation effect. Therefore, it can be appropriately selected according to the heat dissipation requirements of the printed circuit board 1. By providing the cooling medium passage 22 inside the thermally conductive elastic member 21, the heat generated by each electrical component on the printed circuit board 1 can be transferred to the cooling medium passage 22 by means of the thermal conductivity of the thermally conductive elastic member 21, and the heat transferred by the thermally conductive elastic member 21 is dissipated by the cooling medium flowing in the cooling medium passage 22.
[0071] In addition, in Figure 3 the example shown, a cutout portion 27 can be formed on the surface 25 of the thermally conductive elastic member 21 on the side opposite to the surface 24 that mates with the electrical component, and the cutout portion 27 is communicated with the cooling medium passage arrangement portion 26. Thus, the cooling medium passage 22 can be conveniently installed in the cooling medium passage arrangement portion 26 through the cutout portion 27, and the cooling medium passage 22 is reliably held in the cooling medium passage arrangement portion 26 by means of the elasticity of the thermally conductive elastic member 21.
[0072] In addition, as Figure 3 shown, in addition to the thermally conductive elastic member 21 and the cooling medium passage 22, the heat dissipation device 2 can further include a cover plate 23. Figure 4 is a perspective view showing the state where the heat dissipation device 2 is mounted on the printed circuit board 1. As Figure 3 and Figure 4 shown, the cover plate 23 is press-fitted onto the surface 25 of the thermally conductive elastic member 21 on the side opposite to the surface 24 that mates with the electrical component. Thus, the thermally conductive elastic member 21 can be pressed by the cover plate 23, and the cutout portion 27 formed on the surface 25 of the thermally conductive elastic member 21 is closed. Thereby, the thermally conductive elastic member 21 can be firmly fixed to the printed circuit board 1 and, as a buffer member, to protect the electrical components on the printed circuit board 1 from being impacted by transportation, vibration, etc., and to prevent the electrical components from falling off or failing due to external impacts, vibrations, etc. In addition, the cover plate 23 can be, for example, a metal plate having thermal conductivity, so that the heat dissipation effect of the heat dissipation device 2 can be further improved by means of the thermal conductivity of the cover plate 23.
[0073] Next, with reference to Figure 5 , the open-type electric control device 3 equipped with the heat dissipation device 2 of the present application will be described. As Figure 5As shown, the open-type electric control device 3 may include, for example, a low-voltage control board 31, a reactor 32, a printed circuit board 1 serving as a variable-frequency control board, and a box body 33 for accommodating these components. Among them, a plurality of electrical components that generate heat during operation are provided on the printed circuit board 1 serving as a variable-frequency control board. As previously described, the shapes and sizes of these electrical components on the printed circuit board 1 are different from each other, and they have a complex arrangement and installation positions. Therefore, in order to effectively dissipate heat from these electrical components on the printed circuit board 1, the heat dissipation device 2 of the present application as described with reference to Figure 2 , Figure 3 and Figure 4 can be used. By installing the heat dissipation device 2 on the printed circuit board 1 and using the heat dissipation device 2 to cover the electrical components that need to be cooled, the heat dissipation device 2 can be effectively used for heat dissipation.
[0074] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be covered within the scope of the claims and the description of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.
Claims
1. A heat dissipation device, characterized in that: The heat dissipation device includes a heat-conductive elastic component and a cooling medium passage. The heat-conductive elastic component has an electrical component mating surface that contacts the electrical component to be cooled and a cooling medium passage configuration portion for configuring the cooling medium passage. The cooling medium passage is configured in the cooling medium passage configuration portion, and there is a cooling medium in the cooling medium passage.
2. The heat dissipation device according to claim 1, characterized in that: The cooling medium passage arrangement portion is provided inside the thermally conductive elastic member.
3. The heat dissipation device according to claim 2, characterized in that: A cutout portion is formed on the surface of the thermally conductive elastic member opposite to the electrical component mating surface, and the cutout portion is communicated with the cooling medium passage arrangement portion.
4. The heat dissipation device according to any one of claims 1 to 3, characterized in that: The heat dissipation device further comprises a cover plate, which is pressed onto a surface of the heat-conductive elastic member opposite to the mating surface of the electrical component.
5. The heat dissipation device according to claim 4, characterized in that: The cover plate is a metal plate with thermal conductivity.
6. The heat dissipation device according to any one of claims 1 to 3, characterized in that: The electrical component matching surface is formed with a matching groove matching the electrical component to be cooled.
7. The heat dissipation device according to claim 6, characterized in that: The electrical component mating surface is also formed with an exhaust groove which is connected with the mating groove.
8. The heat dissipation device according to claim 7, characterized in that: The matching groove is interference-fitted with the electrical component that needs to be cooled.
9. The heat dissipation device according to any one of claims 1 to 3, characterized in that: The cooling medium passage is formed in a curved shape passing through each of a plurality of electrical components to be cooled.
10. The heat dissipation device according to claim 9, characterized in that: The cooling medium passage is formed as a single-channel passage.
11. The heat dissipation device according to claim 9, characterized in that: The cooling medium passage is formed as a multi-channel parallel passage.
12. The heat dissipation device according to claim 9, characterized in that: The cooling medium passage is formed as a capillary network structure.
13. The heat dissipation device according to any one of claims 1 to 3, characterized in that: The thermally conductive elastic member has electrical insulation properties.
14. A printed circuit board, characterized in that: The printed circuit board comprises a plurality of electrical components electrically connected to each other via a printed circuit, and a heat sink as claimed in any one of claims 1 to 13, wherein the plurality of electrical components dissipate heat via the heat sink.
15. An electronic control device, comprising a housing and a control circuit board installed in the housing, the control circuit board comprising a plurality of electrical components, and a heat dissipation device as described in any one of claims 1 to 13, wherein the plurality of electrical components dissipate heat through the heat dissipation device.