Gas drying device for high and low temperature experiment box

Abstract

The utility model relates to a gas drying device for a high and low temperature experiment box, which belongs to the technical field of air drying devices, and comprises a shell, a gas-liquid separation condenser and a drying cylinder, and the shell is provided with a ventilation inlet hole and a ventilation outlet hole; the gas-liquid separation condenser comprises a condensation box, a semiconductor chilling plate and a plurality of refrigeration fins, and the condensation box is fixed on the shell; the semiconductor chilling plate is fixed in the condensation box; the plurality of refrigeration fins are fixed on the semiconductor refrigeration sheet; and the drying cylinder is fixed and communicated with the ventilation outlet hole. According to the utility model, the gas is firstly guided into the condensing box, the semiconductor chilling plate is fixed in the condensing box, and the plurality of refrigeration fins are fixed on the refrigeration end surface of the semiconductor chilling plate at intervals, so that the temperature of the gas in the condensing box can be quickly reduced, and moisture contained in the gas is condensed and separated; the drying agent bags are fixed in the drying cylinder at intervals, so that moisture contained in the gas can be absorbed, and the drying effect of the gas is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of air drying devices, and particularly relates to a gas drying device for a high and low temperature test chamber. Background Art

[0002] A high and low temperature test chamber is the most common temperature test equipment in environmental test equipment. Similar related products include high and low temperature alternating test chambers, constant temperature and humidity test chambers, high and low temperature humidity alternating test chambers, etc. It is applicable to the reliability tests of industrial products at high and low temperatures. For the components and materials of related products such as electronic and electrical, automotive and motorcycle, aerospace, ship and weaponry, institutions of higher learning, and scientific research units under the condition of cyclic change of high and low temperatures (alternating), their various performance indicators are inspected. The product has a relatively wide temperature control range, and its performance indicators all meet the national standard GB10592 - 89 Technical Conditions for High and Low Temperature Test Chambers, and is applicable to the low temperature, high temperature tests and constant temperature and humidity tests of products according to GB2423.1, GB2423.2 "Environmental Tests for Electrical and Electronic Products - Test A: Low Temperature Test Method, Test B: High Temperature Test Method". The product conforms to GB2423.1, GB2423.2, GJB150.3, GJB150.4, IEC, and MIL standards.

[0003] During the use of a high and low temperature test chamber, when the test requires a change from low temperature (below zero degrees Celsius) to high temperature, the heating rate of the test piece is slower than the gas temperature rise rate, resulting in condensation on the surface of the test piece. Sometimes, the test piece cannot be tested under the condition of condensation. At this time, it is necessary to keep the gas in the high and low temperature test chamber at a very low humidity. Currently, the high and low temperature test chambers that have considered the low humidity condition generally adopt the method of condensation drainage and dehumidification. However, the main problems of such devices are: ① They cannot meet the low humidity requirements of some test pieces; ② When the condensation temperature is too low, frosting is extremely likely to occur, affecting the dehumidification effect.

[0004] Therefore, how to design a drying device for a high and low temperature test chamber with better drying effect and high drying efficiency is an urgent problem to be solved by those skilled in the art. Summary of the Utility Model

[0005] The utility model provides a gas drying device for a high and low temperature test chamber, which solves the technical problems of poor drying effect and low drying efficiency of the existing drying device for the test chamber.

[0006] The technical solution for the utility model to solve the above technical problems is as follows: A gas drying device for a high and low temperature test chamber includes: a housing, a gas - liquid separation condenser, a drying component, and a wind direction driving mechanism.

[0007] The top wall of the housing is provided with a ventilation inlet hole and a ventilation outlet hole, and its bottom wall is provided with a drain hole; the gas-liquid separation condenser includes a condensation box, a semiconductor refrigeration sheet and a plurality of refrigeration fins located inside the condensation box. The bottom wall of the condensation box is fixed on the top wall of the housing, and its bottom wall is provided with an air outlet hole communicating with the ventilation inlet hole, and one side wall thereof is provided with an air inlet hole; the hot end face of the semiconductor refrigeration sheet is arranged opposite to the air inlet hole, and its bottom side is fixed on the inner bottom surface of the condensation box; one side of the plurality of refrigeration fins is vertically fixed at intervals on the cold end face of the semiconductor refrigeration sheet, and the gap between them is a refrigeration channel communicating with the air outlet hole and the air inlet hole; the drying assembly includes a drying cylinder and a plurality of desiccant packages. The drying cylinder is located on one side of the condensation box, and its bottom opening end is vertically fixed on the top wall of the housing and correspondingly communicates with the ventilation outlet hole; the plurality of desiccant packages are fixed at intervals along the axial direction of the drying cylinder; the air direction driving mechanism includes an intake fan and an exhaust fan, and the intake fan is fixed in the air inlet hole; the exhaust fan is fixed at the top opening end of the drying cylinder.

[0008] The beneficial effects of the present utility model are as follows: It improves the drying method of the traditional drying device for high and low temperature boxes. First, the intake fan is used to introduce gas into the condensation box. Since a semiconductor refrigeration sheet is fixed in the condensation box and a plurality of refrigeration fins are vertically fixed at intervals on the refrigerating end face of the semiconductor refrigeration sheet, the temperature of the gas in the condensation box can be quickly reduced, and the moisture contained in the gas can be condensed and separated; then, the exhaust fan is used to sequentially introduce the gas in the condensation box into the housing and the drying cylinder. Since a variety of different desiccant packages are fixed at intervals in the drying cylinder, the moisture contained in the gas can be absorbed, and the drying efficiency and drying effect of the gas can be improved.

[0009] On the basis of the above technical solution, the present utility model can be further improved as follows.

[0010] Further, the gas-liquid separation condenser further includes a plurality of heat absorption fins. The plurality of heat absorption fins are all located in the condensation box, and one side of them is vertically fixed at intervals on the hot end face of the semiconductor refrigeration sheet. The gap between the plurality of heat absorption fins is a heating channel communicating with the air inlet hole and the refrigeration channel.

[0011] The beneficial effect of adopting the above is: Utilizing the known physical principle (the greater the temperature difference, the more moisture is separated from the gas), a plurality of heat absorption fins are vertically fixed at intervals on the heating end face of the semiconductor refrigeration sheet. The temperature of the gas can be increased first and then decreased, increasing the temperature difference of the gas, improving the water output of the gas, and enhancing the drying efficiency and drying effect of the gas.

[0012] Further, it further includes a partition plate, which is located inside the housing and arranged along the height direction of the housing. The top side of the partition plate is fixed to the inner top surface of the housing corresponding to between the ventilation inlet hole and the ventilation outlet hole, and there is a predetermined gap between the bottom side of the partition plate and the inner bottom surface of the housing.

[0013] The beneficial effect of the above further aspect is that the partition plate can change the flow direction of the gas inside the housing, extend the residence time of the gas inside the housing, and increase the water output of the gas.

[0014] Further, it further includes a filter screen, which is fixed inside the air inlet hole and located on the side of the intake fan away from the semiconductor refrigeration sheet.

[0015] Further, it further includes a one-way valve, which is fixed to the top opening end of the drying cylinder and located on the side of the exhaust fan away from the housing.

[0016] Further, it further includes a hydrophobic coating, which adheres to the inner side surface of the housing.

[0017] Further, the inner bottom surface of the housing is arranged to slope downward in sequence from the direction away from the drain hole to the direction close to the drain hole.

[0018] The beneficial effect of the above further aspect is that by setting the drain hole at the lowest position of the inner bottom surface of the housing, the drainage efficiency can be improved. Description of the Drawings

[0019] Figure 1 is a schematic internal structure diagram of a gas drying device for a high and low temperature test chamber of the present invention;

[0020] Figure 2 is a demonstration schematic diagram of a gas drying device for a high and low temperature test chamber of the present invention.

[0021] In the drawings, the list of components represented by each reference numeral is as follows:

[0022] 1. Housing, 11. Ventilation inlet hole, 12. Ventilation outlet hole, 13. Drain hole, 2. Gas-liquid separation condenser, 21. Condensation box, 211. Air inlet hole, 22. Semiconductor refrigeration sheet, 23. Refrigeration fins, 24. Heat absorption fins, 3. Drying assembly, 31. Drying cylinder, 32. Desiccant package, 4. Intake fan, 5. Exhaust fan, 6. Partition plate. Detailed Embodiments

[0023] The principles and features of the present invention will be described below with reference to the accompanying drawings. The examples given are only used to explain the present invention and are not intended to limit the scope of the present invention.

[0024] As Figure 1As shown in the figure, a gas drying device for a high and low temperature test chamber includes: a housing 1, a gas-liquid separation condenser 2, a drying assembly 3, and a wind direction driving mechanism.

[0025] The top wall of the housing 1 is provided with a ventilation inlet hole 11 and a ventilation outlet hole 12, and its bottom wall is provided with a drain hole 13; the gas-liquid separation condenser 2 includes a condensation box 21, a semiconductor refrigeration sheet 22 and a plurality of refrigeration fins 23 located inside the condensation box 21. The bottom wall of the condensation box 21 is fixed on the top wall of the housing 1, and its bottom wall is provided with an air outlet hole communicating with the ventilation inlet hole 11, and an air inlet hole 211 is provided on one of its side walls; the hot end surface of the semiconductor refrigeration sheet 22 is arranged opposite to the air inlet hole 211, and its bottom side is fixed on the inner bottom surface of the condensation box 21; one side of the plurality of refrigeration fins 23 is vertically fixed at intervals on the cold end surface of the semiconductor refrigeration sheet 22, and the gap between them is a refrigeration channel communicating with the air outlet hole and the air inlet hole 211; the drying assembly 3 includes a drying cylinder 31 and a plurality of desiccant packages 32. The drying cylinder 31 is located on one side of the condensation box 21, and its bottom opening end is vertically fixed on the top wall of the housing 1 and corresponds to communicate with the ventilation outlet hole 12; the plurality of desiccant packages 32 are fixed at intervals along the axial direction of the drying cylinder 31; the wind direction driving mechanism includes an intake fan 4 and an exhaust fan 5. The intake fan 4 is fixed in the air inlet hole 211; the exhaust fan 5 is fixed at the top opening end of the drying cylinder 31.

[0026] In some specific embodiments, the gas-liquid separation condenser 2 may further include a plurality of heat absorption fins 24. The plurality of heat absorption fins 24 are all located inside the condensation box 21, and one side of them is vertically fixed at intervals on the hot end surface of the semiconductor refrigeration sheet 22. The gap between the plurality of heat absorption fins 24 is a heating channel communicating with the air inlet hole 211 and the refrigeration channel.

[0027] In some specific embodiments, it may further include a partition plate 6. The partition plate 6 is located inside the housing 1 and is arranged along the height direction of the housing 1. The top side of the partition plate 6 is fixed on the inner top surface of the housing 1 corresponding to between the ventilation inlet hole 11 and the ventilation outlet hole 12, and there is a predetermined gap between the bottom side of the partition plate 6 and the inner bottom surface of the housing 1.

[0028] In some specific embodiments, it may further include a filter screen. The filter screen is fixed in the air inlet hole 211 and is located on the side of the intake fan 4 away from the semiconductor refrigeration sheet 22.

[0029] In some specific embodiments, it may further include a one-way valve. The one-way valve is fixed at the top opening end of the drying cylinder 31 and is located on the side of the exhaust fan 5 away from the housing 1.

[0030] In some specific embodiments, it may further include a hydrophobic coating. The hydrophobic coating adheres to the inner side surface of the housing 1.

[0031] Specifically, the inner bottom surface of the housing 1 is arranged to be inclined downward in sequence from the direction away from the drain hole 13 to the direction close to the drain hole 13.

[0032] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A gas drying device for a high and low temperature test chamber, characterized in that: include: A shell (1), wherein the top wall of the shell (1) is provided with a ventilation inlet hole (11) and a ventilation outlet hole (12), and the bottom wall of the shell (1) is provided with a drainage hole (13); A gas-liquid separation condenser (2), the gas-liquid separation condenser (2) comprising a condensation box (21) and a semiconductor cooling plate (22) and a plurality of cooling fins (23) located inside the condensation box (21); the bottom wall of the condensation box (21) is fixed to the top wall of the shell (1) and the bottom wall is provided with an air outlet hole communicating with the air inlet hole (11), and one side wall is provided with an air inlet hole (211); the hot end surface of the semiconductor cooling plate (22) is arranged opposite to the air inlet hole (211) and the bottom side is fixed to the inner bottom surface of the condensation box (21); one side of the plurality of cooling fins (23) is fixed vertically to the cold end surface of the semiconductor cooling plate (22) at intervals and the gaps between them are cooling channels communicating with the air outlet hole and the air inlet hole (211); A drying component (3), the drying component (3) comprising a drying cylinder (31) and a plurality of desiccant bags (32), the drying cylinder (31) being located on one side of the condensation box (21) and having a bottom open end vertically fixed on the top wall of the shell (1) and correspondingly connected to the vent hole (12); the plurality of desiccant bags (32) being fixed in the drying cylinder (31) at intervals along the axial direction of the drying cylinder (31); A wind direction driving mechanism, the wind direction driving mechanism comprising an air intake fan (4) and an exhaust fan (5), the air intake fan (4) being fixed in the air intake hole (211); the exhaust fan (5) being fixed at the top opening end of the drying cylinder (31).

2. A gas drying device for a high and low temperature test chamber according to claim 1, characterized in that: The gas-liquid separation condenser (2) further comprises a plurality of heat absorbing fins (24), wherein the plurality of heat absorbing fins (24) are all located in the condensation box (21) and one side of the plurality of heat absorbing fins (24) is vertically fixed at intervals to the hot end surface of the semiconductor refrigeration plate (22), and the gaps between the plurality of heat absorbing fins (24) are heating channels connected to the air inlet (211) and the refrigeration channel.

3. The gas drying device for a high and low temperature test chamber according to claim 1, characterized in that: It also includes a partition (6), which is located inside the shell (1) and arranged along the height direction of the shell (1), the top side of the partition (6) is fixed to the inner top surface of the shell (1) corresponding to the ventilation inlet hole (11) and the ventilation outlet hole (12), and there is a predetermined gap between the bottom side of the partition (6) and the inner bottom surface of the shell (1).

4. The gas drying device for a high and low temperature test chamber according to claim 1, characterized in that: It also includes a filter screen, which is fixed in the air inlet hole (211) and is located on a side of the air inlet fan (4) away from the semiconductor cooling plate (22).

5. The gas drying device for a high and low temperature test chamber according to claim 1, characterized in that: It also comprises a one-way valve, which is fixed at the top open end of the drying cylinder (31) and is located on the side of the exhaust fan (5) away from the housing (1).

6. The gas drying device for a high and low temperature test chamber according to claim 1, characterized in that: It also includes a hydrophobic coating, which is adhered to the inner side of the shell (1).

7. The gas drying device for a high and low temperature test chamber according to claim 1, characterized in that: The inner bottom surface of the shell (1) is arranged to be tilted downward in sequence from a direction away from the drainage hole (13) to a direction close to the drainage hole (13).

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