Gluing equipment for semiconductor production

Abstract

The utility model discloses gluing equipment for semiconductor production, and relates to the technical field of semiconductor processing. The gluing device comprises a rack, transmission rollers rotationally arranged at the two ends of the rack and a transmission belt wound on the two transmission rollers in a transmission mode, and further comprises a gluing mechanism which comprises a mounting frame arranged on the rack, an annular plate is arranged on one side of the mounting frame, a sleeve shell is arranged on the inner wall of the annular plate, a gluing wheel is rotationally arranged in the sleeve shell, and the gluing wheel is arranged on the mounting frame. A glue tank is arranged on the mounting frame, and a conveying pipe is communicated between the glue tank and the sleeve shell; the two transmission belts are wound on the two transmission rollers in a transmission mode, a gap is formed between the two transmission belts, a wafer is placed on the two transmission belts to be transmitted, the wafer is adsorbed and fixed through cooperation of an electric push rod and an adsorption rotating piece, the wafer is jacked into an annular plate to rotate, a gluing wheel is made to abut against the outer surface of the wafer in a rolling mode, and therefore the wafer can be conveniently and rapidly coated. Therefore, the outer surface of the wafer is uniformly coated with the glue, so that the glue is uniformly coated.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and particularly to a glue coating device for semiconductor production. Background Art

[0002] In the process of semiconductor manufacturing, wafer glue coating is a key step, mainly used for the lithography process, which is one of the core links in integrated circuit manufacturing. In the step of wafer glue coating, a layer of photoresist is evenly coated on the surface of the silicon wafer, and this layer of glue has photosensitive properties.

[0003] Currently, usually a glue coater is used to coat the photoresist on the wafer surface by means of rotary coating, that is, the wafer is driven to rotate at a high speed, and at the same time, the photoresist is dropped at the central position on the top surface of the wafer. The centrifugal force is used to throw out the glue liquid, so that the glue liquid is stretched and forms a thin film on the wafer surface. However, there are certain deficiencies in use. When the wafer rotates, the centrifugal forces received by the glue liquid attached to its surface are different, which will cause the glue liquid to be unevenly distributed, resulting in different coating thicknesses of the glue liquid, thus affecting the glue coating quality. Therefore, this application proposes a glue coating device for semiconductor production. Utility Model Content

[0004] The purpose of this application is to provide a glue coating device for semiconductor production to solve the problem that the existing glue coating device drops the glue onto the wafer and coats it by rotational centrifugal force, resulting in uneven coating.

[0005] Specifically, this application adopts the following technical solutions to achieve the above purpose:

[0006] A glue coating device for semiconductor production includes a frame, transmission rollers rotatably arranged at both ends of the frame, and a transmission belt wound around the two transmission rollers. It further includes:

[0007] A glue coating mechanism, including a mounting frame arranged on the frame. A ring plate is arranged on one side of the mounting frame. A sleeve is arranged on the inner wall of the ring plate. A glue coating wheel is rotatably arranged in the sleeve. A glue tank is arranged on the mounting frame. A conveying pipe is communicated between the glue tank and the sleeve.

[0008] A supporting plate is arranged at the bottom of the frame. An electric push rod is arranged on the supporting plate. An adsorption rotating member is arranged at the piston end of the electric push rod. The adsorption rotating member is used to adsorb and fix the wafer and drive it to rotate.

[0009] Further, the adsorption rotating member includes a U-shaped frame arranged at the piston end of the electric push rod. A conduit is rotatably penetrated through the U-shaped frame. The top end of the conduit is communicated with a suction cup. A driven gear is fixedly arranged on the conduit. A first motor is arranged on the U-shaped frame. A transmission gear meshing with the teeth of the driven gear is fixedly arranged on the output shaft of the first motor.

[0010] Furthermore, positioning rods are slidably penetrated through opposite sides of the inner wall of the frame. Arc-shaped plates are arranged at opposite ends of the two positioning rods, and a driving part for driving the two positioning rods to slide synchronously and in opposite directions is arranged on the supporting plate.

[0011] Furthermore, the driving part includes a second motor arranged on the supporting plate. A circular gear is fixedly arranged on the output shaft of the second motor. Rack teeth are arranged at free ends of the two positioning rods, and both rack teeth are meshed with the teeth of the circular gear.

[0012] Furthermore, a positioning plate is arranged on the U-shaped frame. A spring telescopic rod is arranged on the positioning plate, and a ball is rotatably inserted at the free end of the spring telescopic rod.

[0013] Furthermore, an annular liquid collecting cavity is formed inside the annular plate. Annular through grooves communicating with the annular liquid collecting cavity are formed in the inner wall of the annular plate. A liquid discharge pipe communicating with the annular liquid collecting cavity is arranged on the outer surface of the annular plate.

[0014] Furthermore, a rubber ring is arranged on the inner wall of the annular plate, and the top of the rubber ring is flush with the inner bottom wall of the annular through groove.

[0015] Furthermore, an annular ring is rotatably arranged on the inner wall of the annular plate, and the rubber ring is arranged on the inner wall of the annular ring.

[0016] The beneficial effects of the present application are as follows: In the present application, two transmission belts are wound around two transmission rollers in a driving manner, and there is a gap between the two transmission belts. The wafer is placed on the two transmission belts for transmission. Through the cooperation of the electric push rod and the adsorption rotating part, the wafer is adsorbed and fixed, and the wafer is lifted into the annular plate for rotation, so that the coating wheel rolls against the outer surface of the wafer, thereby uniformly coating the glue on the outer surface of the wafer. Through rotary rolling coating, the coating is made uniform. Description of the Drawings

[0017] Figure 1 is a three-dimensional structure diagram of the present application;

[0018] Figure 2 is a three-dimensional structure sectional view of the present application;

[0019] Figure 3 is another three-dimensional structure sectional view of the present application;

[0020] Figure 4 is the present application Figure 2 magnified view at A in;

[0021] Figure 5 is the present application Figure 3 magnified view at B in;

[0022] Figure 6 is the present applicationFigure 3 Enlarged view of point C in the middle;

[0023] Figure 7 This application Figure 3 Enlarged view of point D in the middle;

[0024] 1. Frame; 2. Conveying roller; 3. Conveying belt; 4. Gluing mechanism; 5. Supporting plate; 6. Electric push rod; 7. Adsorption rotating member; 8. Positioning rod; 9. Arc plate; 10. Driving unit; 11. Positioning plate; 12. Spring telescopic rod; 13. Annular liquid collecting chamber; 14. Annular groove; 15. Drain pipe; 16. Rubber ring; 17. Ring; 401. Mounting frame; 402. Ring plate; 403. Shell; 404. Gluing wheel; 405. Glue tank; 406. Conveying pipe; 701. U-shaped frame; 702. Conduit; 703. Suction cup; 704. Driven gear; 705. First motor; 706. Transmission gear; 1001. Second motor; 1002. Circular gear; 1003. Rack. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0026] like Figures 1-7 As shown, an embodiment of the present application proposes a semiconductor production glue coating device, including a frame 1, transmission rollers 2 rotatably arranged at both ends of the frame 1, and a transmission belt 3 driven and wound around the two transmission rollers 2. Preferably, the number of the transmission belts 3 is two, and a gap is left between the two transmission belts 3. When the wafer is transmitted, the wafer is placed on the two transmission belts 3, and the transmission roller 2 is driven by the driving motor to rotate, thereby driving the two transmission belts 3 to transmit synchronously in the same direction, thereby realizing the transmission of the wafer, and also includes:

[0027] The gluing mechanism 4 comprises a mounting frame 401 arranged on the frame 1, a ring plate 402 is arranged on one side of the mounting frame 401, a casing 403 is arranged on the inner wall of the ring plate 402, a gluing wheel 404 is rotatably arranged in the casing 403, preferably, the bottom of the casing 403 is open, and arc grooves are arranged on the opposite sides of the inner wall of the opening, the gluing wheel 404 is rotatably inserted in the two arc grooves, and a gap is left between the outer surface of the gluing wheel 404 and the arc groove to facilitate the glue to flow out and adhere to the surface of the gluing wheel 404, a glue tank 405 is arranged on the mounting frame 401, and a delivery pipe 406 is connected between the glue tank 405 and the casing 403, the glue tank 405 is used to store glue, and the glue in the glue tank 405 is delivered to the casing 403 through the delivery pipe 406, so that the glue adheres to the gluing wheel 404;

[0028] The supporting plate 5 is arranged at the bottom of the frame 1, and an electric push rod 6 is arranged on the supporting plate 5. The piston end of the electric push rod 6 is provided with an adsorption rotating member 7. The adsorption rotating member 7 is used to adsorb and fix the wafer and drive it to rotate. Preferably, the adsorption rotating member 7 is coaxially arranged with the ring plate 402, and the adsorption rotating member 7 can move through the gap between the two conveyor belts 3 during the lifting process, and the wafer is placed on the two conveyor belts 3 for transmission. When the conveyor belt 3 transfers the wafer to the top of the adsorption rotating member 7, the electric push rod 6 works, and its piston end drives the adsorption rotating member 7 to rise, thereby adsorbing and fixing the wafer. As the adsorption rotating member 7 continues to rise, the wafer is lifted off the conveyor belt 3 and the wafer is The circle is located in the ring plate 402, and the glue coating wheel 404 rolls and overlaps with the top of the wafer, and the glue in the casing 403 adheres to the outer surface of the glue coating wheel 404. The adsorption rotating member 7 drives the wafer to rotate, so that the glue coating wheel 404 rolls and rotates along the top of the wafer. As the glue coating wheel 404 rolls and rotates, the glue is coated on the outer surface of the wafer. When the wafer coating is completed, the electric push rod 6 drives the wafer to move down and reset, so that the wafer is placed on the two conveyor belts 3 again, and then the adsorption and fixation of the wafer is released. As the conveyor belt 3 is transmitted, the wafer that has been coated with glue is moved away, and the uncoated wafer is transmitted to the top of the adsorption rotating member 7, so as to perform batch continuous glue coating operations;

[0029] The overall structure of the device adopts two conveyor belts 3 with a gap between them. The wafer is placed on the two conveyor belts 3 and transferred to the top of the adsorption rotating member 7. The adsorption rotating member 7 fixes it and is placed in the ring plate 402 under the lifting of the electric push rod 6. As the adsorption rotating member 7 drives the wafer to rotate, the glue coating wheel 404 rolls along the wafer to coat the glue, so that the glue coating is even, thereby improving practicality.

[0030] like Figure 6 As shown, in some embodiments, the adsorption rotating member 7 includes a U-shaped frame 701 arranged at the piston end of the electric push rod 6, and a conduit 702 is rotatably penetrated on the U-shaped frame 701, and the top of the conduit 702 is connected to a suction cup 703. Preferably, the bottom end of the conduit 702 is connected to a rotary joint, which can be connected to an external air pipe through the rotary joint. A driven gear 704 is fixedly provided on the conduit 702, and a first motor 705 is arranged on the U-shaped frame 701. The output shaft of the first motor 705 is fixedly provided with a transmission gear 706 meshing with the driven gear 704. When the wafer is transferred to the top of the suction cup 703, the electric push rod 6 drives the U-shaped frame 701 to rise and fall, and makes the suction cup 703 contact with the wafer, and adsorbs and fixes the wafer. The first motor 705 does work, and its output shaft drives the transmission gear 706 to rotate, and the teeth of the transmission gear 706 and the driven gear 704 are meshed to drive the conduit 702 to rotate, so as to drive the wafer to rotate.

[0031] like Figure 1 andFigure 3 As shown, in some embodiments, positioning rods 8 slidably penetrate through opposite sides of the inner wall of the rack 1. Arc-shaped plates 9 are provided at opposite ends of the two positioning rods 8. A driving portion 10 for driving the two positioning rods 8 to slide synchronously and in opposite directions is provided on the supporting plate 5. Preferably, the center of the circle enclosed by the two arc-shaped plates 9 coincides with the center of the suction cup 703. When the wafer is transferred above the suction cup 703, the driving portion 10 drives the two positioning rods 8 to slide closer to each other, thereby driving the two arc-shaped plates 9 to approach synchronously. When the two arc-shaped plates 9 approach each other, they will contact the wafer, thereby correcting the position of the wafer, enabling the wafer to be coaxially aligned with the suction cup 703. After the suction cup 703 adsorbs and fixes the wafer, the wafer can be coaxially aligned with the annular plate 402 to ensure the coating effect of applying glue to it.

[0032] As Figure 7 As shown, in some embodiments, the driving portion 10 includes a second motor 1001 provided on the supporting plate 5. A circular gear 1002 is fixedly provided on the output shaft of the second motor 1001. Rack teeth 1003 are provided at the free ends of the two positioning rods 8, and both of the two rack teeth 1003 are engaged with the teeth of the circular gear 1002. When the second motor 1001 operates, its output shaft drives the circular gear 1002 to rotate. Through the engagement of the circular gear 1002 with the teeth of the two rack teeth 1003, the two positioning rods 8 are driven to slide synchronously and in opposite directions, so as to enable the two arc-shaped plates 9 to effectively correct the position of the wafer.

[0033] As Figure 6 As shown, in some embodiments, a positioning plate 11 is provided on the U-shaped frame 701. A spring telescopic rod 12 is provided on the positioning plate 11. A ball is rollingly inserted at the free end of the spring telescopic rod 12. Preferably, it should be noted that when the suction cup 703 is lower than the transmission surface of the conveyor belt 3, the top end of the spring telescopic rod 12 is higher than the transmission surface of the conveyor belt 3. When the wafer is transferred, it will be blocked by the spring telescopic rod 12. Through the blocking of the spring telescopic rod 12, the wafer can be controlled at a suitable position to facilitate the two arc-shaped plates 9 to effectively correct and position the wafer. When the wafer rises, the top end of the spring telescopic rod 12 will contact the annular plate 402, and the spring telescopic rod 12 will axially contract to facilitate the wafer to be placed into the annular plate 402 to contact the glue application wheel 404. By rollingly inserting a ball at the end of the spring telescopic rod 12, the ball contacts the annular plate 402 to reduce the contact friction force and make the rotation of the wafer smoother. After the wafer is coated with glue and is placed on the conveyor belt 3 again, the electric push rod 6 drives the U-shaped frame 701 to move downward by a certain distance again, so that the top end of the spring telescopic rod 12 is lower than the transmission surface of the conveyor belt 3 to facilitate the transfer of the wafer after coating with glue.

[0034] As Figure 4 and Figure 5As shown, in some embodiments, an annular liquid collection cavity 13 is formed inside the annular plate 402, an annular through groove 14 communicating with the annular liquid collection cavity 13 is formed in the inner wall of the annular plate 402, and a liquid discharge pipe 15 communicating with the annular liquid collection cavity 13 is arranged on the outer surface of the annular plate 402. Preferably, when the wafer abuts and overlaps with the glue coating wheel 404, the top of the wafer is slightly higher than the inner bottom wall of the annular through groove 14. When the glue coating wheel 404 overlaps with the wafer, glue is coated on the surface of the wafer through the glue coating wheel 404. During the coating process, the wafer rotates. Under the action of the rotational centrifugal force, the excess glue can be thrown out, making the coating effect of the wafer better. When the excess glue is thrown out, it enters the annular liquid collection cavity 13 through the annular through groove 14 and is discharged through the liquid discharge pipe 15. In actual use, a container can be arranged at the end of the liquid discharge pipe 15 to facilitate the collection and recycling of the excess glue.

[0035] As Figure 5 shown, in some embodiments, a rubber ring 16 is arranged on the inner wall of the annular plate 402, and the top of the rubber ring 16 is flush with the inner bottom wall of the annular through groove 14. When the wafer rotates, some glue will flow along the side. By arranging the rubber ring 16, when the wafer is placed into the annular plate 402, the outer edge of the wafer abuts against the inner wall of the rubber ring 16. Without affecting the rotation of the wafer, it can prevent the glue from flowing along the side wall and avoid the glue adhering to the edge, so as to improve the glue coating quality of the wafer.

[0036] As Figure 5 shown, in some embodiments, an annular ring 17 is rotatably arranged on the inner wall of the annular plate 402, and the rubber ring 16 is arranged on the inner wall of the annular ring 17. By rotatably arranging the annular ring 17 and arranging the rubber ring 16 on the annular ring 17, when the wafer is placed into the rubber ring 16, the rubber ring 16 is sleeved on the outer edge of the wafer. As the wafer rotates, the annular ring 17 rotates synchronously, so that the rubber ring 16 can not only block the outer edge side of the wafer to prevent the glue from adhering, but also rotate synchronously with the wafer, reducing the wear between it and the wafer, thereby improving the practicability.

[0037] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A glue coating device for semiconductor production, comprising a frame (1), transmission rollers (2) rotatably arranged at both ends of the frame (1), and a transmission belt (3) driven and wound around the two transmission rollers (2), characterized in that: Also includes: The gluing mechanism (4) comprises a mounting frame (401) arranged on the frame (1), a ring plate (402) being arranged on one side of the mounting frame (401), a casing (403) being arranged on the inner wall of the ring plate (402), a gluing wheel (404) being rotatably arranged inside the casing (403), a glue tank (405) being arranged on the mounting frame (401), and a delivery pipe (406) being connected between the glue tank (405) and the casing (403); A support plate (5) is arranged at the bottom of the frame (1), an electric push rod (6) is arranged on the support plate (5), a piston end of the electric push rod (6) is provided with an adsorption rotating member (7), and the adsorption rotating member (7) is used to adsorb and fix the wafer and drive it to rotate.

2. The semiconductor production glue coating equipment according to claim 1, characterized in that: The adsorption rotating member (7) comprises a U-shaped frame (701) arranged at the piston end of the electric push rod (6); a conduit (702) is rotatably penetrated through the U-shaped frame (701); the top end of the conduit (702) is connected to a suction cup (703); a driven gear (704) is fixedly arranged on the conduit (702); a first motor (705) is arranged on the U-shaped frame (701); and a transmission gear (706) meshing with the teeth of the driven gear (704) is fixedly arranged on the output shaft of the first motor (705).

3. The semiconductor production glue coating equipment according to claim 1, characterized in that: Positioning rods (8) are slidably penetrated on opposite sides of the inner wall of the frame (1), arc-shaped plates (9) are arranged at opposite ends of the two positioning rods (8), and a driving part (10) for driving the two positioning rods (8) to slide synchronously in opposite directions is arranged on the supporting plate (5).

4. The semiconductor production glue coating equipment according to claim 3, characterized in that: The driving part (10) comprises a second motor (1001) arranged on the supporting plate (5), the output shaft of the second motor (1001) is fixedly provided with a circular gear (1002), the free ends of the two positioning rods (8) are both provided with racks (1003), and the two racks (1003) are both meshed with the teeth of the circular gear (1002).

5. The semiconductor production glue coating equipment according to claim 2, characterized in that: The U-shaped frame (701) is provided with a positioning plate (11), the positioning plate (11) is provided with a spring telescopic rod (12), and a ball is rollingly inserted at the free end of the spring telescopic rod (12).

6. The semiconductor production glue coating equipment according to claim 1, characterized in that: An annular liquid collecting chamber (13) is provided inside the annular plate (402), an annular through groove (14) communicating with the annular liquid collecting chamber (13) is provided on the inner wall of the annular plate (402), and a liquid discharge pipe (15) communicating with the annular liquid collecting chamber (13) is provided on the outer surface of the annular plate (402).

7. The semiconductor production glue coating equipment according to claim 6, characterized in that: The inner wall of the ring plate (402) is provided with a rubber ring (16), and the top of the rubber ring (16) is flush with the inner bottom wall of the annular through groove (14).

8. The semiconductor production glue coating equipment according to claim 7, characterized in that: A ring (17) is rotatably arranged on the inner wall of the ring plate (402), and the rubber ring (16) is arranged on the inner wall of the ring (17).

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