Unsealing device for FCBGA packaged semiconductor device
By designing an open sealing device for FCBGA packaged semiconductor devices, using a combination of heating and four-turn centering chucks, the problem of difficult to effectively remove substrates and protect chip integrity in the prior art during destructive physical analysis and failure analysis, achieving efficient and stable device open sealing and analysis.
Patent Information
- Application Number
- CN202420692539.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-04-07
AI Technical Summary
In the prior art, during the destructive physical analysis and failure analysis of FCBGA packaged semiconductor devices, it is difficult to effectively remove the substrate and protect the chip from completeness, resulting in the chip being easily broken and affecting subsequent experiments.
An open sealing device including a heating device, a bracket, a base, a device placing table and a four-turn centering chuck is designed. The soldering between the chip and the substrate is melted by the heating device, and the four-turn centering chuck extruded and cut the gap between the chip and the substrate from multiple directions to achieve uniform stress and effective separation.
The device can maximize the integrity of the internal chips of the device, improve work efficiency, and ensure efficient and smooth progress of destructive physical analysis and failure analysis.
Smart Images
Figure CN223028087U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of opening technology for destructive physical analysis and failure analysis tests of electronic components, and particularly relates to an opening device for FCBGA packaged semiconductor devices. Background Art
[0002] FCBGA packaging is widely used in integrated circuits, especially in high-performance processors, graphics processors, network chips, communication devices and other fields, with excellent performance such as high connection density and high heat management. This packaged chip uses flip-chip technology, where the metal contacts of the chip are connected to solder ball pads, and the solder ball pads are connected to the solder balls on the packaging substrate through solder ball fusion. The chip forms an electrical connection through the solder ball pads between the solder balls and the substrate.
[0003] FCBGA packaged semiconductor devices, such as Figure 1 shown, mainly include a chip 24, a metal cover 25, solder balls 26 and a substrate 27. The chip 24 is disposed between the metal cover 25 and the substrate 27 and is connected to the substrate 27 by welding. The substrate 27 is connected to other structures by welding, and the metal cover 25 and the substrate 27 are connected by gluing.
[0004] During the application process in the military field with high-intensity working condition requirements, there are situations where devices need to be subjected to destructive physical analysis and failure analysis, and it is necessary to remove the substrate 27 of the device to expose the internal chip 24 information. The main existing method for removing the substrate of FCBGA packaged semiconductor devices with a metal cover is manual removal. The operator inserts a sharp tool into the gap between the substrate 27 and the metal cover 25 to pry open the substrate, so that the chip 24 is separated from the substrate 27, showing the internal structure of the chip 24. During this process, due to the uneven force on the chip 24, it is easy to break, affecting the subsequent experiments. Summary of the Utility Model
[0005] Aiming at the deficiencies of the prior art, the utility model provides an opening device for FCBGA packaged semiconductor devices, which maximally protects the integrity of the internal chips of the devices. It has a simple structure and stable clamping, and is a device for removing the packaging substrate of FCBGA packaged semiconductor devices with metal covers that is beneficial to improving work efficiency on the basis of protecting the internal structure, enabling the destructive physical analysis and failure analysis of this type of device to be carried out efficiently and smoothly.
[0006] To achieve the above object, the utility model discloses the following technical solutions:
[0007] An opening device for FCBGA packaged semiconductor devices, which includes a heating device, a bracket, a base, a device placement table, and a four-rotation centering chuck; the four-rotation centering chuck is arranged above the base, the device placement table is arranged inside the four-rotation centering chuck, the bracket is arranged on one side of the four-rotation centering chuck, and the heating device is arranged above the four-rotation centering chuck through the bracket; the four-rotation centering chuck includes a housing, a base, and a cutter, the housing and the base are combined into a cylindrical structure, and multiple groups of cutters are evenly arranged inside the cylindrical structure; a groove is formed on the upper surface of the housing, and the cutter is arranged inside the groove; the cutter includes a tool holder, a blade, a rotating motor, a transmission shaft, a support bearing, and a support seat, one end of the transmission shaft is connected to the output end of the rotating motor, the first end of the tool holder is movably connected to the side wall of the transmission shaft, and the blade is fixedly connected to the second end of the tool holder; the first end of the support seat is connected to the base, and the second end of the support seat is connected to the transmission shaft through the support bearing; the support bearing is sleeved on the transmission shaft, the outer surface of the outer ring of the support bearing is connected to the second end of the support seat through a bearing support, and the inner surface of the inner ring of the support bearing is connected to the side wall of the transmission shaft.
[0008] Preferably, the heating device includes a blowing component and a heating plate, the blowing component is arranged above the device placement table through a bracket, and the heating plate is arranged on the upper surface of the device placement table.
[0009] Preferably, the groove includes a first groove, a second groove, a third groove, and a fourth groove, the rotating motor is installed in the first groove, the support seat is arranged in the second groove, the transmission shaft is arranged in the third groove, the tool holder is arranged in the fourth groove, and a guiding protrusion is arranged on the side surface of the fourth groove; the first groove, the second groove, the third groove, and the fourth groove are all interconnected.
[0010] Preferably, multiple groups of the cutters are arranged evenly in a circle, the device placement table is located at the center of the circle formed by the circumferences of multiple groups of the cutters, and the cutting end of the blade faces upward above the device placement table, and the device placement table is of a telescopic table structure.
[0011] Preferably, a first threaded section, a second threaded section, and a smooth section are arranged on the side wall of the transmission shaft, and the thread rotation directions of the first threaded section and the second threaded section are the same; the smooth section is located between the first threaded section and the second threaded section, and the support bearing is sleeved on the smooth section.
[0012] Preferably, the first end of the tool holder is provided with a groove structure matching the threads of the first threaded section and the second threaded section; and a guiding groove matching the guiding protrusion is arranged on the side surface of the tool holder.
[0013] Preferably, a power interface is provided on the side of the housing. The power supply of the rotating motor is connected to the power interface, and the power interface is connected to an external power supply.
[0014] Preferably, the multiple groups of cutting tools are four groups of cutting tools, and the four groups of cutting tools are evenly arranged on the circumference of the device placement table with the device placement table as the center.
[0015] Compared with the prior art, the present utility model has the following beneficial effects:
[0016] The device of the present utility model first heats the FCBGA packaged semiconductor device through a heating device, so that the soldering between the chip and the substrate will melt appropriately. Then, the chip and the substrate are cut and separated through a four-rotating centering chuck, enabling effective separation; the four-rotating centering chuck squeezes the gap between the chip and the substrate from multiple directions simultaneously, making the force evenly distributed and preventing damage to the chip; moreover, the device placement table provided on the four-rotating centering chuck is of a telescopic table structure, which can meet the division of FCBGA packaged semiconductor devices of different models. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 Schematic diagram of FCBGA packaging with a metal cover plate;
[0018] Figure 2 Schematic diagram of the overall structure of the opening device for FCBGA packaged semiconductor devices of the present utility model;
[0019] Figure 3 Schematic diagram of the structure of the four-rotating centering chuck of the opening device for FCBGA packaged semiconductor devices of the present utility model;
[0020] Figure 4 Cross-sectional view of the assembled cutting tool and the housing of the opening device for FCBGA packaged semiconductor devices of the present utility model;
[0021] Figure 5 Schematic diagram of the structure of the cutting tool of the opening device for FCBGA packaged semiconductor devices of the present utility model;
[0022] Figure 6 Cross-sectional view of the groove of the housing of the opening device for FCBGA packaged semiconductor devices of the present utility model.
[0023] Some of the drawings in the drawings are described as follows:
[0024] 1 - Blowing assembly, 2 - Heating plate, 3 - Bracket, 4 - Base, 5 - Device placement table, 6 - Four-rotating centering chuck,
[0025] 7 - housing, 8 - base, 9 - tool holder, 10 - blade, 11 - rotating motor, 12 - transmission shaft, 14 - support base, 15 - first groove, 16 - second groove, 17 - third groove, 18 - fourth groove, 19 - first threaded section, 20 - second threaded section, 21 - smooth section, 22 - guiding projection, 23 - guiding groove, 24 - chip, 25 - metal cover plate, 26 - solder ball, 27 - substrate, 28 - temperature controller, 29 - power interface, 30 - cutting tool. Detailed implementation mode
[0026] The exemplary embodiments, features and aspects of the present utility model will be described in detail below with reference to the accompanying drawings. The same reference numerals in the drawings denote elements having the same or similar functions. Although various aspects of the embodiments are shown in the drawings, the drawings do not have to be drawn to scale unless otherwise specified.
[0027] The present utility model provides a device for opening a FCBGA packaged semiconductor device, as Figure 2-6 shown, which includes a heating device, a bracket 3, a base 4, a device placement table 5 and a four - rotation centering chuck 6; the heating device is arranged above the four - rotation centering chuck 6, the four - rotation centering chuck 6 is arranged above the base 4, the device placement table 5 is arranged inside the four - rotation centering chuck 6, the bracket 3 is arranged on one side of the four - rotation centering chuck 6, and the heating device is arranged above the four - rotation centering chuck 6 through the bracket 3.
[0028] The four - rotation centering chuck 6 includes a housing 7, a base 8 and a cutting tool 30. The housing 7 and the base 8 are combined into a cylindrical structure, and multiple groups of cutting tools 30 are evenly arranged inside the cylindrical structure; a groove is opened on the upper surface of the housing 7, and the cutting tool 30 is arranged inside the groove.
[0029] The cutting tool 30 includes a tool holder 9, a blade 10, a rotating motor 11, a transmission shaft 12, a support bearing and a support base 14. One end of the transmission shaft 12 is connected to the output end of the rotating motor 11, the first end of the tool holder 9 is movably connected to the side wall of the transmission shaft 12, and the blade 10 is fixedly connected to the second end of the tool holder 9 through multiple groups of bolts; the first end of the support base 14 is connected to the base 8, and the second end of the support base 14 is connected to the transmission shaft 12 through the support bearing; the support bearing is sleeved on the transmission shaft 12, the outer surface of the outer ring of the support bearing is connected to the second end of the support base 14 through a bearing support, and the inner surface of the inner ring of the support bearing is connected to the side wall of the transmission shaft 12.
[0030] The heating device includes a temperature controller 28, a blowing assembly 1 and a heating plate 2. The blowing assembly 1 is arranged above the device placement table 5 through the bracket 3, the heating plate 2 is arranged on the upper surface of the device placement table 5, and a temperature sensor is also arranged on the heating plate 2. The temperature controller 28 is electrically connected to the blowing assembly 1 and the heating plate 2.
[0031] The temperature controller 28 can control the air outlet temperature, heating temperature, air blowing and heating time of the air blowing assembly 1 and the heating plate 2, and can also monitor the temperature through the temperature sensor on the heating plate 2.
[0032] The groove includes a first groove 15, a second groove 16, a third groove 17 and a fourth groove 18. The motor is installed in the first groove 15, the support seat 14 is arranged in the second groove 16, the transmission shaft 12 is arranged in the third groove 17, the tool holder 9 is arranged in the fourth groove 18, and a guiding protrusion 22 is arranged on the side surface of the fourth groove 18; the first groove 15, the second groove 16, the third groove 17 and the fourth groove 18 communicate with each other.
[0033] The device placement table 5 is located at the central position surrounded by multiple groups of cutting tools 30, and the cutting end of the blade 10 is aligned above the device placement table 5. The device placement table 5 is of a telescopic table structure. The device placement table 5 includes a first load-bearing table and a second load-bearing table. The second load-bearing table is arranged inside the first weighing table. When the height of the device is small, the second weighing table will extend upward, so that the overall height of the entire device placement table 5 will increase; when the device is small, the second weighing table will shrink inside the first load-bearing table or half of its body will shrink inside the first load-bearing table to meet the cutting requirements of the device.
[0034] Four groups of cutting tools 30 are evenly arranged on the circumference of the device placement table 5 with the device placement table 5 as the center.
[0035] A first thread section 19, a second thread section 20 and a smooth section 21 are arranged on the side wall of the transmission shaft 12. The thread rotation directions of the first thread section 19 and the second thread section 20 are the same; the smooth section 21 is located between the first thread section 19 and the second thread section 20, and the support bearing is sleeved on the smooth section 21. In this way, when the transmission shaft 12 rotates, it can rotate without being restricted by the support seat 14, and thus drive the rotation of the upper tool holder 9 through the rotation of the first thread and the second thread.
[0036] A groove structure matching the threads of the first thread section 19 and the second thread section 20 is arranged at the first end of the tool holder 9; and a guiding groove 23 matching the guiding protrusion 22 is arranged on the side surface of the tool holder 9, so that the tool holder 9 does not shift during movement and the cutting direction is confirmed.
[0037] A power interface 29 is arranged on the side surface of the housing 7. The power supplies of the rotating motor 11 are all connected to the power interface 29, and the power interface is connected to an external power supply. The external power supply can be a generator, or a DC power supply or a storage device such as a battery.
[0038] When the utility model works, first measure the size of the device, calculate the tool entry position according to the length, width and height of the device, select the thickness of the blade 10 and the length of the cutting edge, and adjust the relative position of the blade 10 on the tool rest 9 according to the scale, and adjust the height of the device placement table 5. Place the device to be tested on the device placement table 5, place the substrate 27 with the solder balls 26 upward, and turn on the power supply to start the heating device. Set the heating temperature and heating time. When the surface temperature of the device reaches more than 183 degrees, energize the rotating motor 11, and gradually insert the cutting edge into the gap between the substrate 27 and the chip 24. The solder alloy between the chip 24 and the gasket and the solder on the solder ball 26 gasket and the substrate 27 start to melt and turn into a molten state. The blade 10 is inserted into the device from multiple directions with the same force to peel off the substrate 27 and the chip 24. After continuous heating until all four corners are separated, release the device for observation to confirm the completion of the opening work of the FCBGA packaged semiconductor device.
[0039] The embodiments described above are only descriptions of the preferred embodiments of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention shall fall within the protection scope determined by the claims of the present invention.
Claims
1. A decapsulation device for a FCBGA packaged semiconductor device, characterized in that: It includes a heating device, a bracket, a base, a device placement table and a four-turn centering chuck; The four-turn centering chuck is arranged above the base, the device placement platform is arranged inside the four-turn centering chuck, the bracket is arranged on one side of the four-turn centering chuck, and the heating device is arranged above the four-turn centering chuck through the bracket; The four-turn centering chuck comprises a shell, a base and a cutter, wherein the shell and the base are combined into a cylindrical structure, and a plurality of sets of cutters are evenly arranged inside the cylindrical structure; a groove is formed on the upper surface of the shell, and the cutter is arranged inside the groove; The tool comprises a tool holder, a blade, a rotating motor, a transmission shaft, a support bearing and a support seat, one end of the transmission shaft is connected to the output end of the rotating motor, the first end of the tool holder is movably connected to the side wall of the transmission shaft, and the blade is fixedly connected to the second end of the tool holder; The first end of the support seat is connected to the base, and the second end of the support seat is connected to the transmission shaft through the support bearing.
2. The unsealing device for FCBGA packaged semiconductor devices according to claim 1, characterized in that: The heating device comprises a blowing assembly and a heating plate. The blowing assembly is arranged above the device placement table through a bracket, and the heating plate is arranged on the upper surface of the device placement table.
3. The unsealing device for FCBGA packaged semiconductor devices according to claim 1, characterized in that: The groove includes a first groove, a second groove, a third groove and a fourth groove, the rotating motor is installed in the first groove, the support seat is arranged in the second groove, the transmission shaft is arranged in the third groove, the tool holder is arranged in the fourth groove, and a guide protrusion is arranged on the side of the fourth groove; the first groove, the second groove, the third groove and the fourth groove are all connected to each other.
4. The unsealing device for FCBGA packaged semiconductor devices according to claim 1, characterized in that: The multiple groups of knives are evenly arranged in a circle, the device placement table is located at the center of the circle formed by the multiple groups of knives, and the cutting end of the blade faces the top of the device placement table. The device placement table is a telescopic table structure.
5. The unsealing device for FCBGA packaged semiconductor devices according to claim 3, characterized in that: The side wall of the transmission shaft is provided with a first thread segment, a second thread segment and a smooth segment, the thread rotation direction of the first thread segment is consistent with that of the second thread segment; the smooth segment is located between the first thread segment and the second thread segment, and the support bearing is sleeved on the smooth segment.
6. The unsealing device for FCBGA packaged semiconductor devices according to claim 5, characterized in that: The first end of the tool holder is provided with a groove structure matching the threads of the first thread segment and the second thread segment; and the side surface of the tool holder is provided with a guide groove matching the guide protrusion.
7. The unsealing device for FCBGA packaged semiconductor devices according to claim 1, characterized in that: A power interface is provided on the side of the shell, the power supply of the rotating motor is connected to the power interface, and the power interface is connected to an external power source.
8. The unsealing device for FCBGA packaged semiconductor devices according to claim 4, characterized in that: The multiple groups of cutting tools are four groups of cutting tools, and the four groups of cutting tools are evenly arranged on the circumference of the device placement table with the device placement table as the center.
9. The unsealing device for FCBGA packaged semiconductor devices according to claim 1, characterized in that: The support bearing is sleeved on the transmission shaft, the outer surface of the outer ring of the support bearing is connected to the second end of the support seat through a bearing support, and the inner surface of the inner ring of the support bearing is connected to the side wall of the transmission shaft.