Laser processing platform and laser processing equipment

Abstract

The utility model discloses a laser processing platform and a laser processing device, in the laser processing platform, one side of a first bearing platform close to a second bearing platform is provided with at least one first protruding part and at least one first groove, and the first protruding parts and the first grooves are alternately arranged along a second direction. The side, close to the first bearing platform, of the second bearing platform is provided with at least one second protruding part and at least one second groove, and the second protruding parts and the second grooves are alternately arranged in the second direction. Due to the fact that the first protruding parts are embedded into the second grooves in the one-to-one correspondence mode, and the second protruding parts are embedded into the first grooves in the one-to-one correspondence mode, connection between the first bearing platform and the second bearing platform is tighter, and the difficulty of relative displacement between the first bearing platform and the second bearing platform is improved. And therefore, the laser processing platform disclosed by the utility model has higher structure compactness.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing, in particular to a laser processing platform and a laser processing device. Background Art

[0002] With the development and application of laser technology, laser processing devices are more and more widely used in all walks of life.

[0003] In the related art, in order to enable a laser processing device to perform laser processing on multiple workpieces simultaneously, the laser processing platform of the laser processing device includes a plurality of bearing platforms, and at least one workpiece can be placed on each bearing platform, so that a plurality of workpieces can be placed on the entire laser processing platform simultaneously.

[0004] However, since the bearing platforms of the laser processing platform are only simply arranged side by side, relative displacement is likely to occur between the bearing platforms, resulting in a low structural compactness of the entire laser processing platform. Summary of the Utility Model

[0005] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art. In the first aspect, the utility model provides a laser processing platform with higher structural compactness; in the second aspect, the utility model also provides a laser processing device including the laser processing platform of the first aspect of the utility model.

[0006] According to the laser processing platform provided by the first aspect of the embodiments of the utility model, it includes a first bearing platform and a second bearing platform arranged side by side along a first direction. At least one first protrusion and at least one first groove are provided on one side of the first bearing platform close to the second bearing platform. The first protrusions and the first grooves are alternately arranged along a second direction, and a certain angle is spaced between the second direction and the first direction. At least one second protrusion and at least one second groove are provided on one side of the second bearing platform close to the first bearing platform. The second protrusions and the second grooves are alternately arranged along the second direction. The first protrusions are correspondingly embedded in the second grooves one by one, and the second protrusions are correspondingly embedded in the first grooves one by one.

[0007] The laser processing platform described in the present utility model has at least the following beneficial effects: In the laser processing platform of the present application, at least one first protrusion and at least one first groove are provided on one side of the first bearing platform close to the second bearing platform, and the first protrusions and the first grooves are alternately arranged in the second direction. At least one second protrusion and at least one second groove are provided on one side of the second bearing platform close to the first bearing platform, and the second protrusions and the second grooves are alternately arranged in the second direction. Since the first protrusions are respectively embedded in the second grooves, and the second protrusions are respectively embedded in the first grooves, the connection between the first bearing platform and the second bearing platform is made closer, increasing the difficulty of relative displacement between the first bearing platform and the second bearing platform, and making the laser processing platform of the present application have higher structural compactness.

[0008] The laser processing platform according to the first aspect embodiment of the present utility model further includes a first correction plate, which is provided on the first bearing platform and is used to correct and compensate the optical path of the first laser generator corresponding to the first bearing platform.

[0009] According to the first aspect embodiment of the present utility model, the first correction plate is provided at one end of the first bearing platform close to the second bearing platform and is connected to at least one first protrusion.

[0010] The laser processing platform according to the first aspect embodiment of the present utility model further includes a second correction plate, which is provided at one end of the second bearing platform close to the first bearing platform and is connected to at least one second protrusion. The second correction plate is used to correct and compensate the optical path of the second laser generator corresponding to the second bearing platform.

[0011] According to the first aspect embodiment of the present utility model, a plurality of suction holes for sucking workpieces are provided on the bearing surface of the first bearing platform, and the suction holes can be communicated with a vacuum generator.

[0012] According to the first aspect embodiment of the present utility model, the suction hole includes a first section, a second section and a third section that are sequentially communicated, and the cross-sectional dimension of the second section is smaller than the cross-sectional dimensions of the first section and the third section.

[0013] According to the first aspect embodiment of the present utility model, a vacuum chamber is provided inside the first bearing platform, and each suction hole is communicated with the vacuum chamber, and the vacuum chamber is used to be communicated with a vacuum generator.

[0014] According to the laser processing platform described in the first aspect embodiment of the present utility model, the first bearing platform includes a panel and a bottom plate connected to each other. A vacuum chamber is defined between the panel and the bottom plate, and a bearing surface is formed on the side of the panel facing away from the vacuum chamber. A plurality of support columns are provided in the vacuum chamber, and opposite ends of the support columns are respectively connected to the panel and the bottom plate.

[0015] According to the laser processing platform described in the first aspect embodiment of the present utility model, the support column is provided with a first positioning hole, and a second positioning hole penetrating the panel is provided at a position corresponding to the first positioning hole on the bearing surface. The same positioning column is inserted into the corresponding first positioning hole and second positioning hole.

[0016] According to the laser processing equipment provided in the second aspect embodiment of the present utility model, it includes the laser processing platform provided in the first aspect embodiment of the present utility model.

[0017] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present utility model. Description of the Drawings

[0018] The present utility model will be further described below in conjunction with the drawings and embodiments;

[0019] Figure 1 It is a schematic structural diagram of a laser processing platform according to an embodiment of the present utility model;

[0020] Figure 2 is Figure 1 A partial enlarged view of the structure at A of the shown laser processing platform;

[0021] Figure 3 is Figure 1 A schematic structural diagram of the first bearing platform and the second bearing platform of the shown laser processing platform;

[0022] Figure 4 is Figure 3 A cross-sectional view of the shown first bearing platform;

[0023] Figure 5 is Figure 4 A partial enlarged view of the structure at B of the shown first bearing platform.

[0024] Reference Signs:

[0025] First bearing platform 100; First convex portion 101; First groove 102; Vacuum chamber 103; Panel 110; Adsorption hole 111; First section 111a; Second section 111b; Third section 111c; Second positioning hole 112; Bottom plate 120; Support column 121; Reinforcing rib 122; Sealing strip 130;

[0026] Second bearing platform 200; Second convex part 201; Second groove 202;

[0027] First calibration plate 300;

[0028] Second calibration plate 400. Detailed implementation manners

[0029] This part will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the drawings. The function of the drawings is to supplement the description in the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present utility model. However, it should not be construed as a limitation on the protection scope of the present utility model.

[0030] In the description of the present utility model, it should be understood that for the orientation description, such as the upper, lower, front, rear, left, right, etc., the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the present utility model.

[0031] In the description of the present utility model, the meaning of "a number of" is one or more, the meaning of "a plurality of" is two or more, "greater than", "less than", "exceeding", etc. are understood as not including the present number, and "above", "below", "within", etc. are understood as including the present number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0032] In the description of the present utility model, unless otherwise clearly defined, words such as "set", "installed", "connected", etc. should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.

[0033] Next, refer to Figures 1 to 5 to describe in detail the laser processing platform of the present utility model.

[0034] Refer to Figure 1 , the laser processing platform according to some embodiments of the present utility model includes a laser processing platform, which includes a first bearing platform 100 and a second bearing platform 200 arranged side by side in the first direction.

[0035] It should be noted that both the first bearing platform 100 and the second bearing platform 200 can respectively bear the workpieces to be laser processed; when the laser processing platform of the present application is applied to a laser processing device, the laser processing device further includes a first laser generator and a second laser generator. The first laser generator corresponds to the first bearing platform 100 and is used for laser processing of the workpieces on the first bearing platform 100, and the second laser generator corresponds to the second bearing platform 200 and is used for laser processing of the workpieces on the second bearing platform 200.

[0036] It can be understood that since the laser processing platform includes the first bearing platform 100 and the second bearing platform 200, when the laser processing platform of the present application is applied to a laser processing device, the laser processing device can simultaneously perform laser processing on two workpieces, improving the processing efficiency of the laser processing device.

[0037] It should be noted that since the first bearing platform 100 and the second bearing platform 200 are only simply arranged side by side, relative movement is likely to occur between the first bearing platform 100 and the second bearing platform 200 along the second direction, resulting in a relatively low overall compactness of the laser processing platform. Among them, the second direction is at an angle to the first direction.

[0038] Based on the above problems, in some embodiments of the present invention, referring to Figure 3 , on one side of the first bearing platform 100 close to the second bearing platform 200, there is provided a first protrusion 101 and a first groove 102. The first protrusion 101 and the first groove 102 are distributed along the second direction. On one side of the second bearing platform 200 close to the first bearing platform 100, there is provided a second protrusion 201 and a second groove 202. The second protrusion 201 and the second groove 202 are distributed along the second direction. The first protrusion 101 is correspondingly embedded in the second groove 202, and the second protrusion 201 is correspondingly embedded in the first groove 102.

[0039] It can be understood that since the first protrusion 101 is correspondingly embedded in the second groove 202, and the second protrusion 201 is correspondingly embedded in the first groove 102, when relative movement occurs between the first bearing platform 100 and the second bearing platform 200 along the second direction, the first protrusion 101 can abut against the groove wall of the second groove 202, and the second protrusion 201 can abut against the groove wall of the first groove 102 to hinder the relative movement between the first bearing platform 100 and the second bearing platform 200 in the second direction, thereby increasing the difficulty of relative movement between the first bearing platform 100 and the second bearing platform 200 in the second direction, and further improving the overall compactness of the laser processing platform.

[0040] In some other embodiments of the present utility model, a plurality of first protrusions 101 and a plurality of first grooves 102 may also be provided on one side of the first bearing platform 100 close to the second bearing platform 200, and a plurality of second protrusions 201 and a plurality of second grooves 202 may also be provided on one side of the second bearing platform 200 close to the first bearing platform 100. At this time, the first protrusions 101 and the first grooves 102 are alternately arranged along the second direction, the second protrusions 201 and the second grooves 202 are alternately arranged along the second direction, the first protrusions 101 are correspondingly embedded in the second grooves 202 one by one, and the second protrusions 201 are correspondingly embedded in the first grooves 102 one by one.

[0041] In some other embodiments of the present utility model, in addition to the two bearing platforms of the first bearing platform 100 and the second bearing platform 200, according to actual needs, the laser processing platform may further include a third bearing platform, a fourth bearing platform, and even more bearing platforms.

[0042] It should be noted that after the laser processing platform of the present application is applied to a laser processing device, the workpiece to be laser processed needs to be carried on the first bearing platform 100. At the same time, the first laser generator corresponding to the first bearing platform 100 needs to perform laser processing on the workpiece on the first bearing platform 100.

[0043] In order to enable the laser emitted by the first laser generator to accurately fall on the workpiece on the first bearing platform 100, in some embodiments of the present utility model, with reference to Figure 1 , the laser processing platform further includes a first calibration plate 300. The first calibration plate 300 is disposed on the first bearing platform 100 and is used to calibrate and compensate the optical path of the first laser generator corresponding to the first bearing platform 100.

[0044] It should be noted that before the first laser generator processes the workpiece on the first bearing platform 100, in the state where the first laser generator is facing the center of the galvanometer, the first laser generator will process a reference hole on the first calibration plate 300, and the laser processing device will record the first coordinate value of the reference hole. Then, the CCD camera of the laser processing device will take a picture of the reference hole and obtain the second coordinate value of the reference hole. Next, the laser processing device will adjust the position of the first laser generator according to the first coordinate value and the second coordinate value until the deviation between the first coordinate value and the second coordinate value is within a certain range.

[0045] It can be understood that by providing the first correction plate 300 on the first bearing platform 100, after the laser processing platform of the present application is applied to a laser processing device, the first correction plate 300 can correct and compensate the optical path of the first laser generator corresponding to the first bearing platform 100, so that the accuracy of laser processing of the workpiece on the first bearing platform 100 by the first laser generator is higher.

[0046] In a further embodiment of the present utility model, referring to Figure 1 , the first correction plate 300 is provided at one end of the first bearing platform 100 close to the second bearing platform 200 and is connected to at least one first protrusion 101.

[0047] It should be noted that when the sizes of the first bearing platform 100 and the second bearing platform 200 are relatively large, the size of the entire laser processing platform is also relatively large. In this case, when the laser processing platform is applied to a laser processing device, the first laser generator is directly above the middle of the laser processing platform, that is, the first laser generator is directly above the junction of the first bearing platform 100 and the second bearing platform 200.

[0048] In this embodiment, by providing the first correction plate 300 at one end of the first bearing platform 100 close to the second bearing platform 200 and connecting the first correction plate 300 to at least one first protrusion 101, when the laser processing platform of this embodiment is applied to a laser processing device, the horizontal distance between the first correction plate 300 and the first laser generator can be made smaller. When it is necessary to correct and compensate the optical path of the first laser generator, during the process of the first laser generator moving to directly above the first correction plate 300, the horizontal displacement distance of the first laser generator can be made smaller.

[0049] In order to enable the laser emitted by the second laser generator to accurately fall on the workpiece on the second bearing platform 200, in some embodiments of the present utility model, similarly, referring to the figure, the laser processing platform further includes a second correction plate 400. The second correction plate 400 is provided on the second bearing platform 200 and is used to correct and compensate the optical path of the second laser generator corresponding to the second bearing platform 200.

[0050] When the laser processing platform of the present application is applied to a laser processing device, the laser processing device includes a second laser generator corresponding to the second bearing platform 200; when it is necessary to correct and compensate the optical path of the second laser generator, during the process of the second laser generator moving to directly above the second correction plate 400, in order to make the horizontal displacement distance of the second laser generator smaller, in a further embodiment of the present utility model, referring to Figure 1, the second correction plate 400 is disposed at one end of the second bearing platform 200 close to the first bearing platform 100 and is connected to at least one second protrusion 201.

[0051] It should be noted that when the laser processing platform of the present application is applied to a laser processing device, a workpiece needs to be carried on the first bearing platform 100. And in order to improve the processing accuracy of the workpiece on the first bearing platform 100 by the first laser generator, it is necessary to limit and fix the workpiece on the first bearing platform 100. However, whether the workpiece is adhered to the first bearing platform 100 by tape or pressed on the first bearing platform 100 by a pressing block, it will cause great damage to the workpiece, and the tape attached to the workpiece or the pressing block pressed on the workpiece will also affect the processing of the workpiece by the first laser generator.

[0052] Based on the above situation, in some embodiments of the present invention, referring to Figure 2 and Figure 4 , a plurality of adsorption holes 111 for adsorbing the workpiece are provided on the bearing surface of the first bearing platform 100, and the adsorption holes 111 can communicate with a vacuum generator.

[0053] It should be noted that after the laser processing platform of the present application is applied to a laser processing device, each adsorption hole 111 communicates with a vacuum generator. After the workpiece is placed on the bearing surface of the first bearing platform 100, the vacuum generator can evacuate the adsorption holes 111 to firmly adsorb the workpiece on the bearing surface of the first bearing platform 100.

[0054] In a further embodiment of the present invention, in order to enable an effective adsorption force to be generated in the adsorption holes 111 to adsorb and fix the workpiece on the bearing surface, referring to Figure 5 , the adsorption hole 111 includes a first section 111a, a second section 111b, and a third section 111c that are sequentially connected. The cross-sectional dimension of the second section 111b is smaller than the cross-sectional dimensions of the first section 111a and the third section 111c.

[0055] In order to make the adsorption forces generated by the respective adsorption holes 111 on the bearing surface more uniform, in some embodiments of the present invention, referring to Figure 4 and Figure 5 , a vacuum chamber 103 is provided in the first bearing platform 100. Each adsorption hole 111 communicates with the vacuum chamber 103, and the vacuum chamber 103 is used to communicate with a vacuum generator.

[0056] In order to form the vacuum chamber 103 in the first bearing platform 100, in some embodiments of the present invention, referring to Figure 4 and Figure 5, the first carrying platform 100 includes a panel 110 and a bottom plate 120 that are connected to each other. A vacuum chamber 103 is defined between the panel 110 and the bottom plate 120, and a carrying surface is formed on the side of the panel 110 facing away from the vacuum chamber 103.

[0057] It should be noted that since the vacuum chamber 103 is defined by the panel 110 and the bottom plate 120, if there is a large gap at the connection between the panel 110 and the bottom plate 120, it will affect the adsorption effect of the adsorption holes 111 on the workpiece.

[0058] Based on the above problems, in some embodiments of the present invention, referring to Figure 5 , the first carrying platform 100 further includes a sealing strip 130. The sealing strip 130 is provided at the junction of the panel 110 and the bottom plate 120 and is arranged around the vacuum chamber 103.

[0059] It can be understood that by providing the sealing strip 130, the sealing performance of the vacuum chamber 103 can be improved, and further the adsorption effect of the adsorption holes 111 on the workpiece can be improved.

[0060] It should be noted that when the vacuum chamber 103 is in a working state, the inside of the vacuum chamber 103 is in a negative pressure state. At this time, under the action of the external atmospheric pressure, the panel 110 and the bottom plate 120 are prone to sink into the vacuum chamber 103, thereby affecting the overall strength of the first carrying platform 100.

[0061] In order to improve the overall strength of the first carrying platform 100 and reduce the probability of the panel 110 and the bottom plate 120 sinking into the vacuum chamber 103, in some embodiments of the present invention, referring to Figure 4 , a plurality of support columns 121 are provided in the vacuum chamber 103. Opposite ends of the support columns 121 are respectively connected to the panel 110 and the bottom plate 120.

[0062] It can be understood that by providing the support columns 121 in the vacuum chamber 103 and connecting opposite ends of the support columns 121 to the panel 110 and the bottom plate 120 respectively, the support columns 121 can support the panel 110 and the bottom plate 120 to prevent the panel 110 and the bottom plate 120 from sinking into the vacuum chamber 103, and further improve the overall strength of the first carrying platform 100.

[0063] In order to improve the positioning accuracy of the workpiece on the carrying surface, in some embodiments of the present invention, referring to Figure 2 , the support columns 121 are provided with first positioning holes, and second positioning holes 112 penetrating through the panel 110 are provided at positions corresponding to the first positioning holes on the carrying surface. The same positioning column is inserted into the corresponding first positioning hole and the positioning hole.

[0064] It can be understood that for a workpiece provided with positioning holes on itself, the positioning posts can pass through the positioning holes on the workpiece to prevent the workpiece from sliding along the bearing surface, thereby realizing the positioning of the workpiece on the bearing surface; for a workpiece without positioning holes on itself, the positioning posts can abut against the edge of the workpiece to prevent the workpiece from sliding along the bearing surface, thereby realizing the positioning of the workpiece on the bearing surface.

[0065] It can be understood that the positioning posts not only pass through the second positioning holes 112 on the panel 110, but also pass through the first positioning holes on the support posts 121, so that the installation of the positioning posts on the first bearing platform 100 is more firm.

[0066] In some embodiments of the present invention, referring to Figure 4 , reinforcing ribs 122 are provided at both the end of the bottom plate 120 close to the vacuum chamber 103 and the end of the bottom plate 120 far from the vacuum chamber 103.

[0067] It can be understood that the setting of the reinforcing ribs 122 enables the bottom plate 120 to have a certain strength while allowing the thickness of the bottom plate 120 to be set smaller, reducing the overall weight of the bottom plate 120, and thus reducing the overall weight of the first bearing platform 100.

[0068] The specific structure of the second bearing platform 200 refers to the first bearing platform 100.

[0069] According to the laser processing equipment provided by the second aspect embodiment of the present invention, it includes the laser processing platform provided by the first aspect embodiment of the present invention.

[0070] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A laser processing platform, characterized in that: include: The first load-bearing platform; A second supporting platform, the second supporting platform and the first supporting platform are arranged side by side along the first direction, at least one first protrusion and at least one first groove are provided on the side of the first supporting platform close to the second supporting platform, the first protrusion and the first groove are alternately arranged along the second direction, the second direction is spaced at a certain angle from the first direction, at least one second protrusion and at least one second groove are provided on the side of the second supporting platform close to the first supporting platform, the second protrusion and the second groove are alternately arranged along the second direction, the first protrusions are embedded in the second grooves one by one, and the second protrusions are embedded in the first grooves one by one.

2. A laser processing platform according to claim 1, characterized in that: It also includes a first correction plate, which is arranged on the first bearing platform and is used to correct and compensate the optical path of the first laser generator corresponding to the first bearing platform.

3. A laser processing platform according to claim 2, characterized in that: The first correction plate is arranged at one end of the first carrying platform close to the second carrying platform and is connected to at least one of the first protrusions.

4. A laser processing platform according to claim 3, characterized in that: It also includes a second correction plate, which is arranged at one end of the second supporting platform close to the first supporting platform and is connected to at least one of the second protrusions. The second correction plate is used to correct and compensate the optical path of the second laser generator corresponding to the second supporting platform.

5. The laser processing platform according to claim 1, characterized in that: A plurality of adsorption holes for adsorbing workpieces are arranged on the bearing surface of the first bearing platform, and the adsorption holes can be communicated with the vacuum generator.

6. A laser processing platform according to claim 5, characterized in that: The adsorption hole comprises a first section, a second section and a third section which are connected in sequence, and a cross-sectional dimension of the second section is smaller than a cross-sectional dimension of the first section and a cross-sectional dimension of the third section.

7. The laser processing platform according to claim 5, characterized in that: A vacuum cavity is provided in the first carrying platform, each of the adsorption holes is communicated with the vacuum cavity, and the vacuum cavity is used to communicate with the vacuum generator.

8. A laser processing platform according to claim 7, characterized in that: The first supporting platform includes a connected panel and a bottom plate, wherein the vacuum cavity is defined between the panel and the bottom plate, and the side of the panel facing away from the vacuum cavity forms the supporting surface; a plurality of supporting columns are arranged in the vacuum cavity, and opposite ends of the supporting columns are respectively connected to the panel and the bottom plate.

9. A laser processing platform according to claim 8, characterized in that: The support column is provided with a first positioning hole, and a second positioning hole penetrating the panel is provided on the bearing surface at a position corresponding to the first positioning hole. The same positioning column is passed through the corresponding first positioning hole and the second positioning hole.

10. A laser processing device, characterized in that: Comprising the laser processing platform as described in any one of claims 1 to 9.

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