Novel grinding equipment wafer ring fixing device
By designing new fixing modules and sensors in the wafer ring fixing system, the problems of loose brackets and one-time input of multiple chip rings are solved, achieving higher installation accuracy and safety.
Patent Information
- Application Number
- CN202421825128.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-31
AI Technical Summary
When the existing wafer ring fixing system faces a large-weight chip ring stack, the bracket is prone to loosening, resulting in inaccurate position of the chip ring and increasing the alarm frequency during input; at the same time, the existing system has only detection in terms of detection, which cannot avoid quality and equipment damage caused by the one-time input of multiple chip rings.
A wafer ring fixing device for a new type of grinding equipment is designed, including a base, symmetrically arranged No. 1 and No. 2 fixing modules, limiting modules and opposing sensors. The stable installation of the bracket is achieved through the mortise and tenon structure to ensure accuracy and firmness, and the number of sheet rings is detected through the sensor to avoid multiple sheet rings being put into one.
It improves the installation accuracy, firmness and durability of the bracket, reduces the alarm frequency when the plate ring is put into, and effectively avoids the quality and equipment damage caused by the one-time input of multiple plate rings.
Smart Images
Figure CN223029399U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor packaging, in particular to the field of wafer grinding technology, and specifically relates to a wafer ring fixing device for a new grinding device. Background Art
[0002] In the grinding process in the field of semiconductor packaging, a wafer ring is used to fix the ground wafer. For a fully automatic grinding machine, there is a special wafer ring fixing system for storing and feeding the wafer ring.
[0003] Due to the stacking of wafer rings, the weight is relatively large. The original wafer ring fixing system of the equipment uses screws and welding for treatment, and the brackets often become loose. After loosening, the position accuracy of the wafer ring decreases, resulting in more alarms when the wafer ring is fed.
[0004] In addition, when the wafer ring is fed, multiple wafer rings are often fed at one time. However, the existing wafer ring fixing system only has a presence or absence detection in terms of detection. By the vacuum state of the wafer ring grasping arm, it detects whether a wafer ring is grasped. Due to the adhesion between wafer rings, it poses a greater quality hazard to the subsequent production process, resulting in quality problems and mechanical damage to the equipment. Summary of the Invention
[0005] In view of the above-mentioned disadvantages of the prior art, the purpose of the utility model is to provide a wafer ring fixing device for a new grinding device to solve the difficulties of the prior art.
[0006] To achieve the above-mentioned purpose and other related purposes, the utility model provides a wafer ring fixing device for a new grinding device, including:
[0007] A base 1, and the base 1 is installed on the grinding device;
[0008] A first fixing module 2, and the first fixing module 2 is installed on the base 1. There are a pair of the first fixing modules 2 on the base 1, and they are symmetrically arranged;
[0009] A second fixing module 3, and the second fixing module 3 is installed on the base 1. There are a pair of the second fixing modules 3 on the base 1, and they are symmetrically arranged. The connection line of a pair of the second fixing modules 3 is perpendicular to the connection line of a pair of the first fixing modules 2;
[0010] The first fixing module 2 and the second fixing module 3 are arranged at equal intervals and spaced apart. Along the clockwise direction, a structure for installing the wafer ring is formed by the first fixing module 2 and the second fixing module 3;
[0011] A limiting module 4, and the limiting module 4 is also installed on the base 1 and is snapped into the positioning groove 11 of the wafer ring;
[0012] The opposed sensor 5 is also installed on the base 1, and is respectively arranged on both sides of the wafer ring. The installation height of the opposed sensor 5 is higher than the top of the finally installed multiple wafer rings.
[0013] According to the preferred solution, the heights of the first fixing module 2 and the second fixing module 3 are both higher than the top of the finally installed multiple wafer rings.
[0014] According to the preferred solution, both the first fixing module 2 and the second fixing module 3 include:
[0015] A base 6, on which a support rod mounting hole 7 and a connection hole 8 are provided. The connection holes 8 are respectively arranged on both sides of the support rod mounting hole 7;
[0016] A bolt 9, which is installed on the base 1 through the connection hole 8;
[0017] A support rod 10, which is installed on the base 6 by passing through the bottom of the support rod mounting hole 7. A lower limit hole 702 corresponding to the support rod 10 is provided in the base 6.
[0018] According to the preferred solution, one or two groups of the first fixing module 2 and the second fixing module 3 are provided on each side.
[0019] According to the preferred solution, the support rod 10 is provided with a T-shaped structure, including a support rod head 101 and a support rod body 102. The outer diameter of the support rod head 101 is larger than the outer diameter of the support rod body 102;
[0020] The support rod mounting hole 7 is provided with a T-shaped structure consistent with the direction of the support rod 10, and successively includes an upper mounting hole 701 and a lower limit hole 702 from top to bottom. The inner diameter of the upper mounting hole 701 is larger than the inner diameter of the lower limit hole 702;
[0021] The outer diameter of the support rod body 102 is the same as the inner diameter of the upper mounting hole 701;
[0022] The outer diameter of the support rod head 101 is the same as the inner diameter of the lower limit hole 702.
[0023] According to the preferred solution, the support rod 10 is turned out by a lathe from a whole piece of material, and the surface is smooth.
[0024] According to the preferred solution, the height of the lower limit hole 702 is greater than the height of the support rod head 101.
[0025] According to the preferred solution, both the lower limit hole 702 and the support rod head 101 adopt a circular structure.
[0026] According to the preferred solution, a pair of the support rods 10 are arranged inside the second fixing module 3, and are respectively arranged on both sides of the base 6;
[0027] Correspondingly, there are two pairs of the connecting holes 8, which are arranged at equal intervals on one side of the base 6 away from the support rods 10.
[0028] According to the preferred solution, after installation, the top of the bolt 9 is not higher than the top of the base 6.
[0029] According to the preferred solution, the bolt 9 is a countersunk head bolt.
[0030] According to the preferred solution, the limiting module 4 includes a mounting seat 401 and a limiting block 402. The mounting seat 401 is mounted on the base 1, and the limiting block 402 is mounted on the mounting seat 401. One end of the limiting block 402 is arranged to match the structure of the positioning groove 11.
[0031] According to the preferred solution, there is one or two groups of the limiting module 4 arranged corresponding to the structure of the sheet ring positioning groove 11.
[0032] The utility model realizes stable installation with the base through the first fixing module and the second fixing module, uses the mortise and tenon structure to achieve the fit between structures, ensures the installation accuracy, firmness and durability of the bracket, and at the same time uses the sensor to avoid the quality and safety hazards caused by the one-time input of multiple sheet rings.
[0033] In the following, the optimal embodiments of implementing the utility model will be described in more detail with reference to the drawings, so as to easily understand the features and advantages of the utility model. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] Figure 1 Shows a three-dimensional structural schematic diagram of the utility model;
[0035] Figure 2 Shows a usage state diagram of the utility model;
[0036] Figure 3 Shows an enlarged three-dimensional structural schematic diagram of the first fixing module in the utility model;
[0037] Figure 4 Shows an enlarged three-dimensional structural schematic diagram of the base in the utility model;
[0038] Figure 5 Shows an enlarged three-dimensional structural schematic diagram of the base inside the second fixing module in the utility model;
[0039] Figure 6 Shows an enlarged three-dimensional structural schematic diagram of the support rod in the utility model;
[0040] LABEL DESCRIPTION
[0041] 1. Base; 2. First fixing module; 3. Second fixing module; 4. Limiting module, 401. Mounting base, 402. Limiting block; 5. Through-beam sensor; 6. Base; 7. Support rod mounting holes, 701. Upper mounting hole, 702. Lower limiting hole; 8. Connecting hole; 9. Bolt; 10. Support rod, 101. Support rod head, 102. Support rod body; 11. Positioning groove. Detailed implementation manners
[0042] In order to make the objectives, technical solutions and advantages of the technical solutions of the present utility model clearer, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the specific embodiments of the present utility model. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0043] Compared with the embodiments shown in the accompanying drawings, the feasible implementation solutions within the protection scope of the present utility model may have fewer components, have other components not shown in the accompanying drawings, different components, differently arranged components or differently connected components, etc. In addition, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.
[0044] Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art to which the present utility model belongs. The "first", "second" and similar terms used in the specification and claims of the present utility model patent application do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, terms such as "a" or "an" do not necessarily denote a quantity limitation. The terms "comprising" or "including" and similar terms mean that the elements or items appearing before the term cover the elements or items listed after the term and their equivalents, without excluding other elements or items. The terms "connected" or "coupled" and similar terms are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
[0045] The present utility model provides a wafer ring fixing device for a new grinding equipment, which is used in the grinding process of the semiconductor packaging field. The present utility model does not limit the type of wafers, but the structure of the wafer ring fixing device of the new grinding equipment is particularly suitable for the wafers after grinding.
[0046] Generally speaking, the wafer ring fixing device for the new grinding equipment proposed by the present utility model mainly includes a base 1, a first fixing module 2, a second fixing module 3, a limiting module 4 and an opposed sensor 5. Among them, reference can be made to Figure 1 , which shows the layout relationship of the base 1, the first fixing module 2, the second fixing module 3, the limiting module 4 and the opposed sensor 5.
[0047] For the purpose of improving and enhancing the stability of the fixing bracket, to solve the problems in the background technology that due to the stacking of wafer rings with a relatively large weight, the original wafer ring fixing system of the equipment used screws and welding for treatment, and the bracket often became loose. After becoming loose, the position accuracy of the wafer rings decreased, resulting in more alarms when the wafer rings were put in; in addition, when the wafer rings were put in, multiple wafer rings were often put in at one time. However, the existing wafer ring fixing system only had presence or absence detection, and detected whether a wafer ring was grabbed through the vacuum state of the wafer ring grasping arm. Due to the adhesion between wafer rings, it caused relatively large quality hidden dangers to the subsequent production process, resulting in quality problems and mechanical damage to the equipment. Therefore, in the technical solution provided in this embodiment, the stable installation with the base 1 is achieved through the first fixing module 2 and the second fixing module 3, and the fit between structures is realized by using the mortise and tenon structure to ensure the installation accuracy, firmness and durability of the bracket, and at the same time, sensors are used to avoid the quality and safety hidden dangers caused by the one-time input of multiple wafer rings.
[0048] Specifically, as Figure 1 shown, the base 1 is installed on the grinding equipment. A pair of first fixing modules 2 and a pair of second fixing modules 3 are installed on the base 1. They are relatively and symmetrically arranged in pairs, and the connection line of the pair of second fixing modules 3 is perpendicular to the connection line of the pair of first fixing modules 2.
[0049] In order to achieve the installation of the wafer rings, in the overall layout, the first fixing module 2 and the second fixing module 3 are arranged at equal intervals and with intervals, and along the clockwise direction, an annular structure for installing the wafer rings is formed by the first fixing module 2 and the second fixing module 3; in addition, the heights of the first fixing module 2 and the second fixing module 3 are both higher than the top after the final installation of multiple wafer rings.
[0050] As described above, in this embodiment, the structures inside the first fixing module 2 and the second fixing module 3 both adopt mortise and tenon structures to achieve the fit between structures. For this purpose, each of the first fixing module 2 and the second fixing module 3 includes a base 6, a bolt 9, and a support rod 10. Among them, a support rod mounting hole 7 and a connection hole 8 are formed on the base 6. The connection holes 8 are respectively arranged on both sides of the support rod mounting hole 7 and are used for the bolt 9 that fixes and connects the base 6 to the base 1 to pass through the connection hole 8 and be installed on the base 1. Since the chip ring obtains sufficient support area when installed on the base 6, after installation, the top of the bolt 9 is not higher than the top of the base 6. The bolt 9 preferably adopts a countersunk head bolt;
[0051] Specifically, the lower limit hole 702 is used to limit and stabilize the structure between the support rod 10 and the support rod mounting hole 7. Specifically, the support rod 10 is arranged in a T-shaped structure, including a support rod head 101 and a support rod body 102. The outer diameter of the support rod head 101 is larger than the outer diameter of the support rod body 102; correspondingly, the support rod mounting hole 7 is arranged in a T-shaped structure consistent with the direction of the support rod 10, and sequentially includes an upper mounting hole 701 and a lower limit hole 702 from top to bottom. The inner diameter of the upper mounting hole 701 is larger than the inner diameter of the lower limit hole 702. During installation and mating, the outer diameter of the support rod body 102 is the same as the inner diameter of the upper mounting hole 701, and the outer diameter of the support rod head 101 is the same as the inner diameter of the lower limit hole 702; when installing, the support rod 10 passes through from the bottom of the support rod mounting hole 7 and is installed on the base 6. Due to the cooperation of the structural dimensions, the support rod head 101 can only be installed in the lower limit hole 702, and the installed support rod body 102 will not loosen abnormally due to the large weight of the wafer chip ring.
[0052] In addition, to avoid friction during the installation process and the increase in installation difficulty caused by the existence of tolerances, both the lower limit hole 702 and the support rod head 101 of the structure adopt circular structures. In terms of size, the height of the lower limit hole 702 is greater than the height of the support rod head 101; moreover, the support rod 10 is turned out by a lathe from a whole piece of material, and the surface is smooth, which is convenient for the installation of the support rod mounting hole 7 and can also avoid friction during the installation of multiple chip rings sleeved.
[0053] On this basis, since there are planes around the structure of the chip ring, in this embodiment, according to the different plane structure sizes, on the basis of the first fixing module 2, a pair of support rods 10 are arranged inside the second fixing module 3, which are respectively arranged on both sides of the base 6. Correspondingly, there are two pairs of connection holes 8, which are arranged at equal intervals on the side of the base 6 away from the support rod 10;
[0054] In addition, for chip ring structures of different widths, two groups are arranged on each side of the first fixing module 2 and the second fixing module 3 to increase the contact area with the bottom surface of the chip surface.
[0055] Considering that the chip rings need to be prevented from moving after installation and the installation directions of multiple chip rings are consistent, a limit module 4 is installed on the base 1 and can be snapped into the positioning groove 11 of the chip ring. The limit module 4 includes a mounting base 401 and a limit block 402. The mounting base 401 is installed on the base 1, and the limit block 402 is installed on the mounting base 401. One end of the limit block 402 is configured to match the structure of the positioning groove 11. During installation, the limit block 402 is snapped into the corresponding positioning groove 11.
[0056] Preferably, in order to identify whether multiple chip rings are inserted at one time, in this embodiment, a pair of photoelectric sensors are also installed on both sides of the chip ring respectively. The installation height of the pair of photoelectric sensors 5 is higher than the top of the finally installed multiple chip rings. By changing the light shielding rate of the sensors due to the thickness differences of different numbers, the detection of two or more chip rings is achieved. In this way, the quality and safety hazards caused by the one-time insertion of multiple chip rings can be avoided.
[0057] The above embodiments are only illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.
Claims
1. A novel wafer ring fixing device for grinding equipment, characterized in that: include: A base (1), wherein the base (1) is mounted on the grinding device; A first fixing module (2), the first fixing module (2) being mounted on the base (1), and a pair of the first fixing modules (2) being arranged on the base (1) and symmetrically arranged; A second fixing module (3), the second fixing module (3) being mounted on the base (1), a pair of the second fixing modules (3) being arranged on the base (1) and being symmetrically arranged, and a line connecting the pair of the second fixing modules (3) and a line connecting the pair of the first fixing modules (2) being arranged perpendicular to each other; The first fixing module (2) and the second fixing module (3) are arranged at equal intervals and in a spaced relationship, and along the clockwise direction, a mounting ring structure is formed by the first fixing module (2) and the second fixing module (3); A limiting module (4), the limiting module (4) is also mounted on the base (1) and is inserted into the positioning groove (11) of the sheet ring; A counter-beam sensor (5) is also installed on the base (1), and is respectively arranged on both sides of the sheet ring. The installation height of the counter-beam sensor (5) is higher than the top of the multiple sheet rings after they are finally installed.
2. The novel wafer ring fixing device for grinding equipment according to claim 1 is characterized in that: The first fixing module (2) and the second fixing module (3) both include: A base (6), wherein the base (6) is provided with a support rod mounting hole (7) and a connection hole (8), and the connection holes (8) are respectively arranged on both sides of the support rod mounting hole (7); A bolt (9), wherein the bolt (9) passes through the connecting hole (8) and is installed on the base (1); A support rod (10), wherein the support rod (10) passes through the bottom of the support rod mounting hole (7) and is mounted on the base (6), and a lower limit hole (702) is provided in the base (6) corresponding to the support rod (10).
3. The novel wafer ring fixing device for grinding equipment according to claim 2 is characterized in that: The support rod (10) is arranged in a T-shaped structure, comprising a support rod head (101) and a support rod shaft (102), wherein the outer diameter of the support rod head (101) is greater than the outer diameter of the support rod shaft (102); The support rod mounting hole (7) is arranged in a T-shaped structure in the same direction as the support rod (10), and comprises an upper mounting hole (701) and a lower limit hole (702) from top to bottom, and the inner diameter of the upper mounting hole (701) is larger than the inner diameter of the lower limit hole (702); The outer diameter of the support rod body (102) is the same as the inner diameter of the upper mounting hole (701); The outer diameter of the support rod head (101) is the same as the inner diameter of the lower limit hole (702).
4. The novel wafer ring fixing device for grinding equipment according to claim 3 is characterized in that: The height of the lower limit hole (702) is greater than the height of the support rod head (101).
5. The novel wafer ring fixing device for grinding equipment according to claim 4 is characterized in that: A pair of support rods (10) are arranged in the second fixing module (3), and are respectively arranged on two sides of the base (6); Two pairs of corresponding connection holes (8) are provided and are arranged at equal intervals on a side of the base (6) away from the support rod (10).
6. The novel wafer ring fixing device for grinding equipment according to claim 5 is characterized in that: After installation, the top of the bolt (9) is not higher than the top of the base (6).
7. The novel wafer ring fixing device for grinding equipment according to claim 6 is characterized in that: The limit module (4) comprises a mounting seat (401) and a limit block (402); the mounting seat (401) is mounted on the base (1); the limit block (402) is mounted on the mounting seat (401); one end of the limit block (402) matches the structural setting of the positioning groove (11).