Positioning and locking device for polycrystalline silicon ingot cutting
By designing a positioning locking device for cutting polycrystalline silicon ingots, the positioning mechanism and positioning locking assembly are used to place and fix the polycrystalline silicon ingots at a limit position, the problem of displacement during the cutting process of polycrystalline silicon ingots in the prior art is solved, and the cutting quality and efficiency are improved.
Patent Information
- Application Number
- CN202421979324.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-15
AI Technical Summary
The existing polycrystalline silicon ingot cutting devices cannot effectively place the polycrystalline silicon ingots, resulting in easy displacement during the cutting process, affecting the cutting quality.
A positioning locking device for cutting polycrystalline silicon ingots is designed, including a cutting positioning mechanism, a processing table, a control panel, a support seat, a collection box, a placement groove, a square silicon ingot, a cutting groove, a positioning locking assembly, a fixing frame and a cutting adjustment assembly. Through the arrangement of these components, the polycrystalline silicon ingot can be placed in a limit position, and the positioning locking components can be top-held, press-held and clamped to ensure the stability of the polycrystalline silicon ingot during the cutting process.
This device can effectively stabilize the limiting polycrystalline silicon ingots, avoid shifting during the cutting process, and improve the quality and efficiency of polycrystalline silicon ingot cutting processing.
Smart Images

Figure CN223030102U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of polysilicon ingot cutting, in particular to a positioning and locking device for polysilicon ingot cutting. Background Technique
[0002] A polysilicon ingot is made of a non-ferrous metal polysilicon material, which is loaded into a square quartz crucible and placed in a polycrystalline ingot casting furnace. It is refined at a high temperature of 1600 degrees for about 60 hours. After forming, a product called a polysilicon ingot is produced. After the polysilicon ingot is taken out of the furnace, it needs to be squared and sliced. Before squaring, the square crucible and impurities on the outer surface of the polysilicon ingot need to be cleaned. Manual grinding has low efficiency, is not environmentally friendly, harms the workers' bodies, and a large amount of good polysilicon will be ground off. After years of research and design, our company has produced a fully automatic polysilicon ingot sandblasting device, which has the effects of high efficiency, environmental protection, and no pollution.
[0003] At present, Chinese Patent No. CN201220180990.8 discloses a locking device for a positioning crystal holder for polysilicon ingot cutting. This locking device can make the end of the locking screw closely fit with the outer end face of the polysilicon ingot, without causing false pressing, play the most effective stabilizing role for the polysilicon ingot, have accurate positioning, and will not affect the wire cutting process.
[0004] In the processing of existing polysilicon ingots, the polysilicon ingot needs to be cut. The above-mentioned comparative document can play the most effective stabilizing role for the polysilicon ingot, have accurate positioning, and will not affect the wire cutting process. However, the above device cannot well limit the placement of the polysilicon ingot, is not conducive to the installation and fixation of the polysilicon ingot, and is prone to displacement during the cutting process of the polysilicon ingot, affecting the quality of polysilicon cutting. Therefore, we need to provide a positioning and locking device for polysilicon ingot cutting. Content of the Utility Model
[0005] The utility model provides a positioning and locking device for polysilicon ingot cutting, which has the advantage of being able to stably limit and cut the polysilicon ingot, thus solving the problems raised in the above background technique.
[0006] To achieve the above object, the utility model is realized by the following technical solutions: A positioning and locking device for cutting polysilicon ingots, comprising: a cutting positioning mechanism, the cutting positioning mechanism includes a processing table, a control panel is installed on the surface of the processing table, a support seat is fixedly connected to the bottom of the processing table, a collection box is slidably arranged inside the support seat, a placement groove is opened on the top of the processing table, a square silicon ingot is arranged on the surface of the placement groove, a cutting groove is opened on the top of the processing table, positioning and locking components are fixedly installed on both sides of the top of the processing table, and a fixing frame is fixedly connected to the top of the processing table, and a cutting adjustment component is fixedly installed on the surface of the fixing frame.
[0007] As a positioning and locking device for cutting polysilicon ingots of the utility model, the positioning and locking component includes a fixed seat, an electric control telescopic rod, a displacement adjustment controller, a mounting seat, a pushing and positioning member, a pressing and positioning member and a clamping and locking member. The fixed seat is fixedly installed on the processing table, the electric control telescopic rod is fixedly installed inside the fixed seat, the displacement adjustment controller is installed on the surface of the fixed seat, the mounting seat is fixedly connected to the output end of the electric control telescopic rod, and the bottom of the mounting seat is slidably connected to the processing table. The pushing and positioning member is fixedly installed on one side of the mounting seat, the pressing and positioning member is fixedly installed on the top of the mounting seat, and the clamping and locking member is installed inside the mounting seat.
[0008] As a positioning and locking device for cutting polysilicon ingots of the utility model, the cutting adjustment component includes a linear electric control guide rail, a connecting seat, an electric control lifting rod, a silicon wafer cutter and a cutting controller. The linear electric control guide rail is fixedly installed on the fixing frame, the connecting seat is installed on the linear electric control guide rail, the electric control lifting rod is fixedly installed at the bottom of the connecting seat, the silicon wafer cutter is fixedly installed at the output end of the electric control lifting rod, and the cutting controller is installed on the surface of the connecting seat.
[0009] As a positioning and locking device for cutting polysilicon ingots of the utility model, the pushing and positioning member includes a servo electric cylinder, a pushing controller and a pushing top plate. The servo electric cylinder is fixedly installed on one side of the mounting seat, and the number of servo electric cylinders is two. The pushing controller is installed on the surface of the mounting seat, and the pushing top plate is fixedly installed at the output end of the servo electric cylinder.
[0010] As a positioning and locking device for cutting polysilicon ingots of the utility model, the pressing and positioning member includes a mounting frame, a rotating rod, a servo motor, a pressing controller, a folding plate and a pressing arc plate. The mounting frame is fixedly installed on the mounting seat, the rotating rod is rotatably installed on the mounting frame, the servo motor is fixedly installed on the mounting seat, the pressing controller is installed on the servo motor, the folding plate is fixedly connected to the rotating rod, and the pressing arc plate is fixedly installed at one end of the folding plate.
[0011] As a positioning and locking device for cutting polysilicon ingots of the present utility model, the clamping and locking member includes an electric control bidirectional telescopic rod, a clamping controller, a folding rod and a locking clamping plate. The electric control bidirectional telescopic rod is fixedly installed in the mounting seat. The clamping controller is installed on the mounting seat, and the clamping controller is electrically connected to the electric control bidirectional telescopic rod. The folding rod is fixedly connected to both ends of the electric control bidirectional telescopic rod. The locking clamping plate is fixedly installed at one end of the folding rod.
[0012] The present utility model provides a positioning and locking device for cutting polysilicon ingots, which has the following beneficial effects:
[0013] Through the settings of the cutting positioning mechanism, the processing table, the control panel, the support seat, the collection box, the placement groove, the square silicon ingot, the cutting groove, the positioning and locking assembly, the fixing frame and the cutting adjustment assembly, the positioning and locking device for cutting polysilicon ingots can limit and place the polysilicon ingot, which is beneficial to position and lock the polysilicon ingot, and is convenient for corresponding jacking, pressing and clamping fixation of the polysilicon ingot. Therefore, the polysilicon ingot can be stably installed, and the quality of polysilicon cutting and processing can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is a three-dimensional structural diagram of the present utility model;
[0015] Figure 2 is a side view of the three-dimensional structure of the present utility model;
[0016] Figure 3 is a first partial three-dimensional structure diagram of the present utility model;
[0017] Figure 4 is a second partial three-dimensional structure diagram of the present utility model;
[0018] Figure 5 is a third partial three-dimensional structure diagram of the present utility model;
[0019] Figure 6 is a fourth partial three-dimensional structure diagram of the present utility model;
[0020] Figure 7 is a partial structural sectional view of the present utility model;
[0021] Figure 8 is a fifth partial three-dimensional structure diagram of the present utility model.
[0022] In the figure: 1. Cutting positioning mechanism; 101. Processing table; 102. Control panel; 103. Support base; 104. Collection box; 105. Placing groove; 106. Square silicon ingot; 107. Cutting groove; 108. Positioning and locking assembly; 10801. Fixed seat; 10802. Electric control telescopic rod; 10803. Transfer controller; 10804. Mounting seat; 10805. Pushing and holding positioning member; 1080501. Servo electric cylinder; 1080502. Pushing and holding controller; 1080503. Pushing and holding top plate; 10806. Pressing and holding positioning member; 1080601. Mounting frame; 1080602. Rotating rod; 1080603. Servo motor; 1080604. Pressing and holding controller; 1080605. Folding plate; 1080606. Pressing and holding arc plate; 10807. Clamping and locking member; 1080701. Electric control bidirectional telescopic rod; 1080702. Clamping controller; 1080703. Folding rod; 1080704. Locking clamping plate; 109. Fixed frame; 110. Cutting adjustment assembly; 11001. Linear electric control guide rail; 11002. Connecting seat; 11003. Electric control lifting rod; 11004. Wafer cutter; 11005. Cutting controller. Specific implementation manner
[0023] Next, the technical solutions in the embodiments of the present utility will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility. Obviously, the described embodiments are only a part of the embodiments of the present utility, rather than all the embodiments. Based on the embodiments of the present utility, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility.
[0024] Please refer to Figures 1 - 8, the present utility model provides a technical solution: a positioning and locking device for cutting polysilicon ingots, including a cutting positioning mechanism 1. The cutting positioning mechanism 1 includes a processing table 101. A control panel 102 is installed on the surface of the processing table 101. A support base 103 is fixedly connected to the bottom of the processing table 101. A collection box 104 is slidably arranged inside the support base 103. A placement groove 105 is opened at the top of the processing table 101. A square silicon ingot 106 is arranged on the surface of the placement groove 105. A cutting groove 107 is opened at the top of the processing table 101. Positioning and locking components 108 are fixedly installed on both sides of the top of the processing table 101. A fixing frame 109 is fixedly connected to the top of the processing table 101. A cutting adjustment component 110 is fixedly installed on the surface of the fixing frame 109. Through the settings of the cutting positioning mechanism 1, the processing table 101, the control panel 102, the support base 103, the collection box 104, the placement groove 105, the square silicon ingot 106, the cutting groove 107, the positioning and locking components 108, the fixing frame 109 and the cutting adjustment component 110, the polysilicon ingot can be limited and placed, which is beneficial to positioning and locking the polysilicon ingot, facilitating corresponding holding, pressing and clamping fixation of the polysilicon ingot, so as to stably install the polysilicon ingot and improve the quality of polysilicon cutting processing.
[0025] Please refer to Figure 4 , the positioning and locking component 108 includes a fixed seat 10801, an electric control telescopic rod 10802, a movement adjustment controller 10803, a mounting seat 10804, a pushing and positioning member 10805, a pressing and positioning member 10806 and a clamping and locking member 10807. The fixed seat 10801 is fixedly installed on the processing table 101. The electric control telescopic rod 10802 is fixedly installed inside the fixed seat 10801. The movement adjustment controller 10803 is installed on the surface of the fixed seat 10801. The mounting seat 10804 is fixedly connected to the output end of the electric control telescopic rod 10802, and the bottom of the mounting seat 10804 is slidably connected to the processing table 101. The pushing and positioning member 10805 is fixedly installed on one side of the mounting seat 10804. The pressing and positioning member 10806 is fixedly installed on the top of the mounting seat 10804. The clamping and locking member 10807 is installed inside the mounting seat 10804. Through the settings of the fixed seat 10801, the electric control telescopic rod 10802, the movement adjustment controller 10803, the mounting seat 10804, the pushing and positioning member 10805, the pressing and positioning member 10806 and the clamping and locking member 10807, the square silicon ingot 106 can be positioned and locked, which is beneficial to stabilizing the cut polysilicon ingot and ensuring the quality of polysilicon ingot cutting processing.
[0026] Please refer to Figure 8, the cutting adjustment assembly 110 includes a linear electric control rail 11001, a connecting seat 11002, an electric control lifting rod 11003, a silicon wafer cutter 11004, and a cutting controller 11005. The linear electric control rail 11001 is fixedly installed on the fixing frame 109. The connecting seat 11002 is installed on the linear electric control rail 11001. The electric control lifting rod 11003 is fixedly installed at the bottom of the connecting seat 11002. The silicon wafer cutter 11004 is fixedly installed at the output end of the electric control lifting rod 11003. The cutting controller 11005 is installed on the surface of the connecting seat 11002. Through the settings of the linear electric control rail 11001, the connecting seat 11002, the electric control lifting rod 11003, the silicon wafer cutter 11004, and the cutting controller 11005, it is possible to conveniently cut and process the polysilicon ingot, improving the cutting efficiency of the polysilicon ingot.
[0027] Please refer to Figure 5 , the pushing and holding positioning member 10805 includes a servo electric cylinder 1080501, a pushing and holding controller 1080502, and a pushing and holding top plate 1080503. The servo electric cylinder 1080501 is fixedly installed on one side of the mounting seat 10804, and the number of servo electric cylinders 1080501 is two. The pushing and holding controller 1080502 is installed on the surface of the mounting seat 10804. The pushing and holding top plate 1080503 is fixedly installed at the output end of the servo electric cylinder 1080501. Through the settings of the servo electric cylinder 1080501, the pushing and holding controller 1080502, and the pushing and holding top plate 1080503, it is possible to push and hold and limit the polysilicon ingot, which is beneficial to pushing and holding and fixing the polysilicon ingot, improving the stability of the subsequent processing of the polysilicon ingot.
[0028] Please refer to Figure 6 , the pressing and holding positioning member 10806 includes a mounting frame 1080601, a rotating rod 1080602, a servo motor 1080603, a pressing and holding controller 1080604, a folding plate 1080605, and a pressing and holding arc plate 1080606. The mounting frame 1080601 is fixedly installed on the mounting seat 10804. The rotating rod 1080602 is rotatably installed on the mounting frame 1080601. The servo motor 1080603 is fixedly installed on the mounting seat 10804. The pressing and holding controller 1080604 is installed on the servo motor 1080603. The folding plate 1080605 is fixedly connected to the rotating rod 1080602. The pressing and holding arc plate 1080606 is fixedly installed at one end of the folding plate 1080605. Through the settings of the mounting frame 1080601, the rotating rod 1080602, the servo motor 1080603, the pressing and holding controller 1080604, the folding plate 1080605, and the pressing and holding arc plate 1080606, it is possible to press and hold the polysilicon ingot, which is beneficial to pressing and holding and stabilizing the polysilicon ingot, reducing the situation of the polysilicon ingot shaking up and down.
[0029] Please refer to Figure 7 As shown in Figure 7 , the clamping and locking member 10807 includes an electric control bidirectional telescopic rod 1080701, a clamping controller 1080702, a folding rod 1080703 and a locking clamping plate 1080704. The electric control bidirectional telescopic rod 1080701 is fixedly installed in the mounting seat 10804. The clamping controller 1080702 is installed on the mounting seat 10804, and the clamping controller 1080702 is electrically connected to the electric control bidirectional telescopic rod 1080701. The folding rod 1080703 is fixedly connected to both ends of the electric control bidirectional telescopic rod 1080701. The locking clamping plate 1080704 is fixedly installed at one end of the folding rod 1080703. Through the settings of the electric control bidirectional telescopic rod 1080701, the clamping controller 1080702, the folding rod 1080703 and the locking clamping plate 1080704, the two ends of the polysilicon ingot can be locked and positioned, which is beneficial to maintaining the overall stability of the polysilicon ingot and improving the quality of the cutting and processing of the polysilicon ingot.
[0030] During use, first, the staff moves the square silicon ingot 106 to be cut and processed to the placement groove 105, then centers the square silicon ingot 106, and then starts the positioning and locking assembly 108 to work through the control panel 102. At this time, the electric control telescopic rod 10802 is controlled by the transfer controller 10803 to extend, and then drives the mounting seat 10804 to move towards the square silicon ingot 106, so that the pushing and positioning member 10805 contacts the surface of the square silicon ingot 106. Then, the servo cylinder 1080501 is controlled by the pushing controller 1080502 to drive the pushing top plate 1080503 to extend and fine-tune, so that the pushing top plate 1080503 closely adheres to both sides of the square silicon ingot 106, thereby performing a top-holding limit on the square silicon ingot 106. Then, the servo motor 1080603 is controlled by the pressing controller 1080604 to work, and then drives the rotating rod 1080602 to rotate, thereby driving the pressing arc plate 1080606 to press on the top of the square silicon ingot 106 to perform a pressing limit on the square silicon ingot 106. Subsequently, the electric control bidirectional telescopic rod 1080701 is controlled by the clamping controller 1080702 to contract, and then the two ends of the electric control bidirectional telescopic rod 1080701 drive the two locking clamping plates 1080704 to move towards each other, so as to clamp and lock the two ends of the square silicon ingot 106 through the locking clamping plates 1080704;
[0031] After the square silicon ingot 106 is positioned and locked, the cutting adjustment assembly 110 is started to work through the control panel 102. At this time, the cutting controller 11005 controls the electric lifting rod 11003 to drive the silicon wafer cutter 11004 to move downward, and then the cutting controller 11005 starts the silicon wafer cutter 11004 to work, so as to cut the square silicon ingot 106. And the cutting controller 11005 controls the linear electric guide rail 11001 to drive the silicon wafer cutter 11004 to move, so as to realize the moving cutting of the square silicon ingot 106. Then, the waste chips generated by the cutting of the square silicon ingot 106 fall into the collection box 104 through the cutting groove 107 for collection. Finally, the staff can remove the collection box 104 from the support base 103 for cleaning.
[0032] The above is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.
Claims
1. A positioning and locking device for cutting polycrystalline silicon ingots, characterized in that: include: A cutting positioning mechanism (1), the cutting positioning mechanism (1) comprising a processing table (101), a control panel (102) being installed on the surface of the processing table (101), a support seat (103) being fixedly connected to the bottom of the processing table (101), a collection box (104) being slidably arranged on the inner side of the support seat (103), a placement groove (105) being provided on the top of the processing table (101), a square silicon ingot (106) being arranged on the surface of the placement groove (105), a cutting groove (107) being provided on the top of the processing table (101), positioning locking assemblies (108) being fixedly installed on both sides of the top of the processing table (101), a fixing frame (109) being fixedly connected to the top of the processing table (101), and a cutting adjustment assembly (110) being fixedly installed on the surface of the fixing frame (109).
2. A positioning and locking device for cutting a polycrystalline silicon ingot according to claim 1, characterized in that: The positioning and locking assembly (108) comprises a fixed seat (10801), an electrically controlled telescopic rod (10802), a displacement controller (10803), a mounting seat (10804), a pushing positioning member (10805), a pressing positioning member (10806) and a clamping and locking member (10807); the fixed seat (10801) is fixedly mounted on the processing table (101); the electrically controlled telescopic rod (10802) is fixedly mounted inside the fixed seat (10801); and the displacement controller (10803) The mounting seat (10804) is fixedly connected to the output end of the electric telescopic rod (10802), and the bottom of the mounting seat (10804) is slidably connected to the processing table (101). The pushing and positioning member (10805) is fixedly installed on one side of the mounting seat (10804), the pressing and positioning member (10806) is fixedly installed on the top of the mounting seat (10804), and the clamping and locking member (10807) is installed inside the mounting seat (10804).
3. The positioning and locking device for cutting a polycrystalline silicon ingot according to claim 1, characterized in that: The cutting adjustment assembly (110) comprises a linear electric control guide rail (11001), a connecting seat (11002), an electric control lifting rod (11003), a silicon wafer cutter (11004) and a cutting controller (11005), wherein the linear electric control guide rail (11001) is fixedly mounted on a fixing frame (109), the connecting seat (11002) is mounted on the linear electric control guide rail (11001), the electric control lifting rod (11003) is fixedly mounted on the bottom of the connecting seat (11002), the silicon wafer cutter (11004) is fixedly mounted on the output end of the electric control lifting rod (11003), and the cutting controller (11005) is mounted on the surface of the connecting seat (11002).
4. A positioning and locking device for cutting a polycrystalline silicon ingot according to claim 2, characterized in that: The pushing and positioning component (10805) includes a servo electric cylinder (1080501), a pushing and holding controller (1080502) and a pushing and holding top plate (1080503), wherein the servo electric cylinder (1080501) is fixedly mounted on one side of a mounting seat (10804), and the number of the servo electric cylinders (1080501) is two, the pushing and holding controller (1080502) is mounted on the surface of the mounting seat (10804), and the pushing and holding top plate (1080503) is fixedly mounted on the output end of the servo electric cylinder (1080501).
5. The positioning and locking device for cutting a polycrystalline silicon ingot according to claim 2, characterized in that: The holding and positioning member (10806) comprises a mounting frame (1080601), a rotating rod (1080602), a servo motor (1080603), a holding controller (1080604), a folding plate (1080605) and a holding arc plate (1080606), wherein the mounting frame (1080601) is fixedly mounted on the mounting seat (10804), and the rotating rod (1080602) is rotatably mounted on the mounting seat (10804). The servo motor (1080603) is fixedly mounted on the mounting bracket (10804), the holding controller (1080604) is mounted on the servo motor (1080603), the folding plate (1080605) is fixedly connected to the rotating rod (1080602), and the holding arc plate (1080606) is fixedly mounted on one end of the folding plate (1080605).
6. A positioning and locking device for cutting a polycrystalline silicon ingot according to claim 2, characterized in that: The clamping and locking component (10807) includes an electrically controlled two-way telescopic rod (1080701), a clamping controller (1080702), a folding rod (1080703) and a locking splint (1080704); the electrically controlled two-way telescopic rod (1080701) is fixedly installed in a mounting seat (10804); the clamping controller (1080702) is installed on the mounting seat (10804); the clamping controller (1080702) is electrically connected to the electrically controlled two-way telescopic rod (1080701); the folding rod (1080703) is fixedly connected to both ends of the electrically controlled two-way telescopic rod (1080701); and the locking splint (1080704) is fixedly installed at one end of the folding rod (1080703).
Citation Information
Patent Citations
Positioning crystal holder locking device for cutting polycrystal silicon ingots
CN202607868U