Full-automatic burning equipment

Abstract

The full-automatic burning equipment comprises a placing platform, a material placing disc, a cover tape tearing assembly, a movable burning assembly, a suction nozzle assembly, a cover tape film placing piece, a cover tape film sealing piece, a carrier tape assembly, a material collecting disc and a chip carrier tape, and the movable burning assembly comprises a base, a mounting base, a motor, a movable base, a sliding rail, a burning base and a burning platform. The motor drives the burning platform to burn the chip; the suction nozzle assembly comprises a lifting suction nozzle carrier, a vacuum negative pressure opening and a suction nozzle, and the suction nozzle adsorbs the chip to be burnt to the burning platform and adsorbs the burnt chip to the carrier tape. According to the full-automatic burning equipment, a to-be-burnt chip carrier tape is wound on the discharging disc, during burning, the carrier tape assembly drives the carrier tape to move on the placing platform, the cover tape tearing assembly tears down the cover tape, the suction nozzle adsorbs the to-be-burnt chip to the burning platform for burning, the burnt chip is adsorbed to the carrier tape, then the carrier tape is covered with the cover tape, and then film sealing is conducted. And finally, rolling is performed, so that the burning equipment is simple in structure, and the burning process is simple.

Description

Technical Field

[0001] The utility model relates to the technical field of burners, and particularly relates to a full-automatic burning device. Background Art

[0002] The production of IC chips has multiple manufacturing processes. Burning is one of the processes in chip manufacturing. Burning refers to importing a pre-set program into the IC chip. Generally, the data area of the IC chips purchased by manufacturers is blank. In order to enable the IC chip to perform operations according to the functions designed by the manufacturer, programmers will write the program in advance and then write the control program and data into the IC chip using an IC chip burner. This is a necessary process more important than the test of IC chips and is generally executed and completed by the final electronic product manufacturer; the burning of IC chips requires the use of special burning equipment. At present, most of the burning equipment on the market is semi-automatic burning equipment. Among them, the functions of semi-automatic burning equipment are relatively single. Most of them need to rely on manual operation to load and unload chips, which consumes a lot of manpower, and will result in low matching accuracy between the IC chip and the burning seat, easily bending the pins of the IC chip and causing poor burning of the IC chip, resulting in problems such as low production efficiency and qualification rate. At the same time, this kind of manual operation will cause the operator to be over-fatigued, and it is easy to have misoperations such as mixing materials, misalignment, and mixing unburned IC chips during the burning process, making it difficult to ensure the quality of the burned IC chips. The semi-automatic burning equipment has a low degree of automation, low production efficiency, and it is difficult to guarantee the quality of products.

[0003] For example, the Chinese invention patent with the authorization announcement number CN116553272B and the patent name of "An Automatic Uncapping and Programming Integrated Machine for Semiconductor Devices" realizes the automatic programming of semiconductor devices, improves production efficiency, reduces manpower and time. Specifically, it includes a transportation plane and a placement platform; a uncapping structure and a programming mechanism are successively arranged on the transportation plane. The transportation plane is used to transport capping tapes, and the inside of the capping tapes is used to evenly place the chip carrier tapes to be programmed. The placement platform is used to support the transportation plane, and the included angle between the transportation plane and the placement platform is an acute angle. When a chip needs to be programmed, the operator tears the starting end of the capping film of the capping tape, and then the capping tape moves on the transportation plane. The capping film is successively separated on the uncapping round rod. The starting end of the capping film is fixed on the uncapping reel, and the uncapping reel winds the capping film, causing the capping film to move in the direction opposite to that of the capping tape. When the chip loaded on the capping tape moves directly below the programming board, the lifting assembly drives the programming board to descend, and the programming probe contacts the pins of the chip, importing the program into the chip. After programming is completed, the lifting assembly drives the programming board to rise, and the capping tape moves to the next process, realizing the automatic programming of the chip, improving production efficiency, reducing the consumption of labor and time costs. At the same time, this solution does not require using a manipulator to take out the chip from the capping tape and then put it into the programming seat for programming, simplifying the process and making the structure of the programming device simpler, reducing the cost of equipment production. In addition, since the included angle between the transportation plane and the placement platform is 30°, due to the gravity factor, the chips in the capping tape will tend to the side with a lower position, making the position of each chip in the capping tape consistent, and avoiding the problem that the programming probe fails to contact the pins of the chip properly, resulting in the failure of importing the program into the chip. Although this device realizes automatic feeding, programming and packaging, the overall structure of this device is relatively complex and the production efficiency is low. Summary of the Utility Model

[0004] The purpose of the present utility model is to provide a fully automatic programming device to solve the technical problem of the complex structure of the existing fully automatic programming devices.

[0005] A fully automatic programming device of the present utility model includes a placement platform, a feeding tray, a capping tape tearing assembly, a moving programming assembly, a suction nozzle assembly, a capping tape film releasing member, a capping tape film sealing member, a carrier tape assembly and a receiving tray successively arranged on the placement platform. It also includes a chip carrier tape to be programmed placed in the feeding tray. The feeding tray and the receiving tray are respectively arranged at both ends of the placement platform. The capping tape tearing assembly is erected on the placement platform and is located above the chip carrier tape to be programmed. The suction nozzle assembly is arranged on the opposite side of the moving programming assembly. A carrier tape bearing main body and a carrier tape bearing auxiliary body are arranged on the surface of the placement platform. The chip carrier tape to be programmed passes between the carrier tape bearing main body and the carrier tape bearing auxiliary body;

[0006] The mobile programming component is disposed on the carrier tape supporting sub-body. The mobile programming component includes a base, a mounting seat, a motor, a moving seat, a slide rail, a programming seat, and a programming platform. The mounting seat is disposed outside the base. The slide rail is disposed on the surface of the base. The motor is mounted on the mounting seat. The motor is connected to the programming platform. The programming seat is disposed on the programming platform.

[0007] The nozzle assembly is disposed on the carrier tape supporting main body. The nozzle assembly includes a lifting nozzle carrier, a vacuum negative pressure port, and a nozzle. The lifting nozzle carrier is mounted on the carrier tape supporting main body. The vacuum negative pressure port is disposed on one side of the lifting nozzle carrier. The nozzle is disposed below the vacuum negative pressure port and communicated therewith, and corresponds to the programming seat.

[0008] Preferably, the cover tape sealing member includes a lifting cover tape frame and a sealing member disposed inside the lifting cover tape frame. A heating device is disposed in the middle of the sealing member.

[0009] Preferably, the carrier tape assembly includes a driving motor and a carrier tape gear. The output shaft of the driving motor is connected to the carrier tape gear. The chip carrier tape after programming is placed on the carrier tape gear and transmitted to the take-up reel in the take-up tray for winding.

[0010] Preferably, between the carrier tape supporting main body and the carrier tape supporting sub-body, a cover tape pressing member is disposed below the cover tape film releasing member. The cover tape passes through from the reel on the cover tape tearing assembly to the cover tape film releasing member, then passes from one side of the cover tape pressing member to the other side, and reaches above the cover tape sealing member.

[0011] Preferably, a flexible hose lighting lamp is further disposed on the placement platform, and the flexible hose lighting lamp corresponds to the mobile programming component.

[0012] Preferably, a control panel and a human-computer interaction interface are disposed on the surface of the placement platform.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] For this fully automatic programming device, the chip carrier tape to be programmed is wound on the unwinding reel. During programming, the carrier tape assembly drives the programmed chip carrier tape to move on the placement platform. The cover tape tearing assembly tears off the cover tape. The nozzle adsorbs the chip to be programmed onto the programming platform for programming, re-adsorbs the programmed chip onto the carrier tape, then covers the cover tape on the chip carrier tape through the cover tape film releasing member, and simultaneously seals the cover tape through the cover tape sealing member. Finally, the take-up tray winds it up, ensuring that the overall structure of the programming device is simple, the programming process is simple, and the production efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The following further describes the present utility model in conjunction with the drawings and embodiments:

[0016] Figure 1It is a schematic three-dimensional structure diagram of an embodiment of a fully automatic programming device of the present utility model;

[0017] Figure 2 It is a schematic partial structure diagram of an embodiment of a fully automatic programming device of the present utility model.

[0018] In the figure: 100, placing platform; 101, carrier tape carrying main body; 102, carrier tape carrying auxiliary body; 1, loading tray; 2, cover tape tearing assembly; 3, moving programming assembly; 31, base; 32, mounting seat; 33, motor; 34, moving seat; 35, slide rail; 36, programming seat; 37, programming platform; 4, nozzle assembly; 41, lifting nozzle carrier; 42, vacuum negative pressure port; 43, nozzle; 5, cover tape film releasing member; 6, cover tape film sealing member; 61, lifting cover tape frame; 62, film sealing member; 63, heating device; 7, carrier tape assembly; 71, driving motor; 72, carrier tape gear; 8, unloading tray; 9, chip carrier tape; 10, cover tape pressing member; 11, cover tape; 12, flexible tube lighting lamp; 13, control panel; 14, human-machine interaction interface. Specific embodiments

[0019] This part will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the drawings. The function of the drawings is to supplement the description in the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but it should not be construed as a limitation on the protection scope of the present utility model.

[0020] As Figure 1-2 shown, a fully automatic programming device of the present utility model includes a placing platform 100, a loading tray 1, a cover tape tearing assembly 2, a moving programming assembly 3, a nozzle assembly 4, a cover tape film releasing member 5, a cover tape film sealing member 6, a carrier tape assembly 7, and an unloading tray 8 that are sequentially arranged on the placing platform 100. It further includes a chip carrier tape 9 to be programmed placed in the loading tray. The loading tray 1 and the unloading tray 8 are respectively arranged at both ends of the placing platform. The cover tape tearing assembly 2 is erected on the placing platform 100 and is located above the chip carrier tape to be programmed. The nozzle assembly 4 is arranged on the opposite side of the moving programming assembly 3. The surface of the placing platform 100 is provided with a carrier tape carrying main body 101 and a carrier tape carrying auxiliary body 102. The chip carrier tape 9 to be programmed passes between the carrier tape carrying main body 101 and the carrier tape carrying auxiliary body 102.

[0021] A full-automatic programming device of the utility model includes a placement platform 100, a loading tray 1 arranged on the placement platform, a cover tape tearing assembly 2, a moving programming assembly 3, a nozzle assembly 4, a cover tape film releasing member 5, a cover tape film sealing member 6, a carrier tape assembly 7, a receiving tray 8, and a chip carrier tape to be programmed 9. Among them, the loading tray 1 and the receiving tray 8 are respectively arranged at the left and right ends of the placement platform. The loading tray 1 is used for winding the chip carrier tape 9 to be programmed; the receiving tray 8 is used for winding the programmed chip carrier tape; the cover tape tearing assembly 2 and the cover tape film releasing member 5 are used for winding the cover tape torn from the chip carrier tape to be programmed; the moving programming assembly 3 and the nozzle assembly 4 are used for programming and moving the chips; the cover tape film sealing member 6 is used for bonding the programmed chip carrier tape and the cover tape together through high temperature to achieve the effect of chip encapsulation; the carrier tape assembly 7 is used for driving the chip carrier tape to move on the platform; the receiving tray 8 is used for winding and placing the programmed chip carrier tape. In addition, a carrier tape bearing main body 101 and a carrier tape bearing auxiliary body 102 are also arranged on the surface of the placement platform 100. The chip carrier tape 9 to be programmed and the programmed chip carrier tape pass between the carrier tape bearing main body 101 and the carrier tape bearing auxiliary body 102. Carrier tape pressing members should also be arranged on the carrier tape bearing main body 101 and the carrier tape bearing auxiliary body 102 for limiting the position of the chip carrier tape. The setting positions and quantities of the carrier tape pressing members can be set according to the characteristics of the device and are not limited here.

[0022] The moving programming assembly 3 of the full-automatic programming device is arranged on the carrier tape bearing auxiliary body 102. The moving programming assembly 3 includes a base 31, a mounting seat 32, a motor 33, a moving seat 34, a slide rail 35, a programming seat 36, and a programming platform 37. The mounting seat 32 is arranged on the outside of the base 31. The slide rail 35 is arranged on the surface of the base 31. The motor 33 is installed on the mounting seat 32. The motor 33 is connected to the programming platform 37. The programming seat 36 is arranged on the programming platform 37.

[0023] The moving programming assembly 3 is used for moving the chips. The base 31 is installed on the carrier tape bearing auxiliary body 102. An installation seat 32, a motor 33, a moving seat 34, a slide rail 35, a programming seat 36, and a programming platform 37 are also arranged on the base 31. During the programming operation, the electric motor 33 is used to drive the programming platform 37 to move back and forth on the base 31. Since the programming seat 36 is installed on the programming platform 37, the chips on the programming seat 36 can be programmed.

[0024] The nozzle assembly 4 of the full-automatic programming device is arranged on the carrier tape bearing main body 101. The nozzle assembly 4 includes a lifting nozzle carrier 41, a vacuum negative pressure port 42, and a nozzle 43. The lifting nozzle carrier 41 is installed on the carrier tape of the placement platform 100 on the carrier tape bearing main body 101. The vacuum negative pressure port 42 is arranged on one side of the lifting nozzle carrier 41. The nozzle 43 is arranged below the vacuum negative pressure port 42 and communicated with it, and corresponds to the programming seat 36.

[0025] The nozzle assembly 4 is used to move the chips and includes a lifting nozzle carrier 41, a vacuum negative pressure port 42, and a nozzle 43. A motor driving member is provided at the lower end of the lifting nozzle carrier 41 for driving the vacuum negative pressure port 42 and the nozzle 43 to move up and down. Among them, the vacuum negative pressure port 42 is externally connected to a vacuum negative pressure pipe and communicated with the lower nozzle 43. The nozzle 43 is used to adsorb the chips on the carrier tape 9 of the chips to be programmed onto the programming seat 36. At the same time, it can also adsorb the programmed chips onto the carrier tape of the programmed chips. It should be noted that the carrier tape 9 of the chips to be programmed and the carrier tape of the programmed chips are the same carrier tape.

[0026] In a preferred embodiment, referring to Figure 1 and 2 , the cover tape sealing member 6 of the fully automatic programming device includes a lifting cover tape frame 61 and a sealing member 62 provided inside the lifting cover tape frame. A heating device 63 is provided in the middle of the sealing member 62. The carrier tape assembly 7 includes a driving motor 71 and a carrier tape gear 72. The output shaft of the driving motor 71 is connected to the carrier tape gear 72. The carrier tape of the programmed chips is placed on the carrier tape gear 72 and transmitted to the take-up reel 8 for winding. The lifting cover tape frame 61 drives the sealing member 62 to move up and down to bond the carrier tape of the programmed chips with the cover tape. The driving motor 71 of the carrier tape assembly 7 is used to drive the carrier tape gear 72 to drive the carrier tape thereon to move. The carrier tape gear 72 can be provided on its outer side or on its side. The gear thereon meshes with the holes on the back of the carrier tape for driving the carrier tape of the chips.

[0027] In a preferred embodiment, referring to Figure 1 and 2 , between the carrier tape bearing main body 101 and the carrier tape bearing sub-body 102 of the fully automatic programming device, a cover tape pressing member 10 is provided below the cover tape film releasing member 5. The cover tape 11 passes out from the reel on the cover tape tearing assembly 2 to the cover tape film releasing member 5, then passes through from one side of the cover tape pressing member 10 to the other side, and reaches above the cover tape sealing member 6. A flexible hose lighting lamp 12 is also provided on the placing platform 100, and the flexible hose lighting lamp 12 corresponds to the moving programming assembly 3. The surface of the placing platform 100 is provided with a control panel 13 and a human-machine interaction interface 14.

[0028] The cover tape pressing member 10 is used to press the cover tape 11 on the carrier tape of the programmed chips, facilitating the subsequent cover tape sealing action. By re-bonding the previously torn cover tape 11 with the carrier tape of the chips, the encapsulation of the chips is completed, and then it is continuously wound onto the empty take-up reel 8 to ensure the full automation of the programming device. By providing the flexible hose lighting lamp 12 on the placing platform 100 and corresponding it to the moving programming assembly 3, it is convenient to observe the programming process and ensure the quality of the programmed chips.

[0029] The working principle of the fully automatic programming device is as follows:

[0030] Programming: Place the chip carrier tape 9 to be programmed on the feeding tray 1. Driven by the carrier tape gear 72, the chips on the chip carrier tape to be programmed are conveyed to the working position of the nozzle assembly 4. The vacuum negative pressure port 42 on the nozzle assembly 4 generates vacuum negative pressure, and the nozzle 43 sucks up the chip and rises to a specified height. At this time, the programming platform 37 on the moving programming assembly 3 moves to the descending position of the nozzle 43 through the motor 33. After reaching the specified position, the nozzle 43 starts to descend. After descending to a height where it can contact the programming platform 37, the vacuum negative pressure of the nozzle 43 is cut off, and the nozzle 43 continues to apply pressure downward. At this time, the moving programming platform 37 starts to initiate the programming process flow. Until the programming process ends, at this time, the nozzle 43 starts to generate vacuum negative pressure, sucks up the chip and starts to rise. After the nozzle 43 rises to the specified height, the programming platform 37 starts to return to its original origin position, waiting for the next test signal.

[0031] Cover Tape Sealing: When it is confirmed that the moving programming platform 37 has returned to the origin and there is no malfunction, the nozzle 43 starts to descend to the height position when it originally sucked up the chip, and the vacuum negative pressure is cut off. The chip is placed back into the original carrier tape. Then the nozzle 43 starts to rise a small specified distance to avoid the height of the carrier tape. The carrier tape gear 72 starts to rotate. Through the transmission of the carrier tape gear 72, the cover tape 11 and the programmed chip are conveyed together to the lower part of the cover tape sealing member 6. Since a heating device 63 is provided inside the sealing member 62, the temperature starts to rise when the machine is turned on. When the temperature reaches the set value, the device is allowed to start. When the programmed chip is conveyed to the lower part of the cover tape sealing member 6, the lifting cover tape frame 61 starts to drive the sealing member 62 to descend downward to the position where the carrier tape and the cover tape are attached, and continues to apply pressure downward. After waiting for 2 - 3 seconds, the cover tape and the carrier tape are adhered together by high temperature, achieving the effect of chip encapsulation.

[0032] Rewinding: After encapsulation, the cover tape sealing member 6 starts to rise to its original position, the carrier tape gear 72 starts to rotate, and at the same time, the motor on the take-up tray 8 starts to rotate, winding the encapsulated chip and the carrier tape onto the empty tray 4. Thus, one process of programming is completed.

[0033] The above has described the embodiments of the present invention in detail with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art in the said technical field, various changes can be made without departing from the purpose of the present invention.

Claims

1. Fully automatic burning equipment, characterized by: The device comprises a placing platform, a material discharging tray, a cover tape tearing assembly, a movable burning assembly, a nozzle assembly, a cover tape film discharging member, a cover tape sealing member, a tape carrier assembly and a material receiving tray, and further comprises a chip carrier tape to be burned placed in the material discharging tray, wherein the material discharging tray and the material receiving tray are respectively arranged at two ends of the placing platform, the cover tape tearing assembly is mounted on the placing platform and is located above the chip carrier tape to be burned, the nozzle assembly is arranged on the opposite side of the movable burning assembly, a tape carrier body and a tape carrier sub-body are arranged on the surface of the placing platform, and the chip carrier tape to be burned passes between the tape carrier body and the tape carrier sub-body; The mobile burning assembly is arranged on the carrier bearing sub-body, and the mobile burning assembly comprises a base, a mounting seat, a motor, a movable seat, a slide rail, a burning seat and a burning platform, wherein the mounting seat is arranged on the outer side of the base, the slide rail is arranged on the surface of the base, the motor is arranged on the mounting seat, the motor is connected to the burning platform, and the burning seat is arranged on the burning platform; The suction nozzle assembly is arranged on the carrier body, and the suction nozzle assembly includes a lifting suction nozzle carrier, a vacuum negative pressure port and a suction nozzle. The lifting suction nozzle carrier is installed on the carrier body, the vacuum negative pressure port is arranged on one side of the lifting suction nozzle carrier, and the suction nozzle is arranged below the vacuum negative pressure port and is connected with the vacuum negative pressure port, and corresponds to the burning seat.

2. The fully automatic burning device as claimed in claim 1, characterized in that: The cover tape film sealing component comprises a lifting cover tape frame and a film sealing component arranged in the lifting cover tape frame, and a heating device is arranged in the middle of the film sealing component.

3. The fully automatic burning device as claimed in claim 1, characterized in that: The carrier tape assembly comprises a driving motor and a carrier tape gear, wherein the output shaft of the driving motor is connected to the carrier tape gear, and the chip carrier tape after burning is placed on the carrier tape gear and is transferred to the receiving tray for winding.

4. The fully automatic burning device as claimed in claim 1, characterized in that: A cover tape pressing piece is provided below the cover tape film placing piece between the carrier tape bearing body and the carrier tape bearing sub-body. The cover tape passes from the reel on the cover tape tearing assembly to the cover tape film placing piece, and then passes from one side of the cover tape pressing piece to the other side to the top of the cover tape film sealing piece.

5. The fully automatic burning device as claimed in claim 1, characterized in that: The placing platform is also provided with a hose lighting lamp, and the hose lighting lamp corresponds to the mobile burning component.

6. The fully automatic burning device as claimed in claim 1, characterized in that: A control panel and a human-computer interaction interface are provided on the surface of the placement platform.

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