Push-pull valve body for silicon wafer electroplating and electroplating equipment
By designing a push-pull valve body for silicon wafer electroplating, the problem of residual plating solution and difficult crystals is solved, and the stability of electroplating process parameters and convenient cleaning of equipment is achieved.
Patent Information
- Application Number
- CN202422008569.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-19
AI Technical Summary
In the existing electroplating technology, the residues and crystals of the electroplating solution in the process tank are difficult to effectively clean, resulting in scratching the battery cells during the next electroplating, affecting product quality, and the water refluxed after cleaning affects the electroplating process parameters.
A push-pull valve body for silicon wafer electroplating is designed, including a box, push-pull unit, collection chamber and drainage unit. The valve core is quickly responded and precisely positioned through the telescopic rod driven by the cylinder, and the upper connecting ring and collection chamber are used to realize the diversion and collection of liquids, and the cleaned waste liquid is discharged to a special recycling tank through the drainage pipe.
Effective diverting and cleaning of the electroplating solution is achieved, avoiding the damage of the residual plating solution and crystals to the battery cells, ensuring the stability of the electroplating process parameters, and simplifying the cleaning and maintenance of the equipment.
Smart Images
Figure CN223033489U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of electroplating, and particularly relates to a push-pull valve body and an electroplating device for silicon wafer electroplating. Background Art
[0002] With the increasing demand for renewable energy, the solar energy industry has developed rapidly, and the manufacturing technology of solar cells has become the key to the industry's development. In the manufacturing process of solar cells, the electroplating process is widely used because it can improve the conductivity and durability of the cells. However, there are some problems to be solved urgently in the existing electroplating technology.
[0003] Such as Figure 1 FIG. shows an electroplating device in the prior art. Among them, 1 represents a process tank, 2 represents an auxiliary tank, and 3 represents a hose. The process tank 1 is connected to the auxiliary tank 2 in a reflux manner through the hose 3. The electroplating reaction takes place in the process tank 1, and the electroplating solution flows back to the auxiliary tank 2 through the hose 3. However, after batch electroplating, there is often electroplating solution residue on the inner surface of the process tank 1 and the rollers in the tank. These residual electroplating solutions form crystals after evaporation. If not completely dissolved, they will scratch the solar cells during the next electroplating, affecting the product quality.
[0004] Currently, the best method to clean the rollers and the inner surface of the process tank 1 is to spray deionized water with a high-pressure water gun. The water after cleaning will flow back into the auxiliary tank 2, resulting in a decrease in the concentration of metal ions and additives in the electroplating solution, and further affecting the electroplating process parameters. In addition, due to the extremely limited space between the process tank 1 and the auxiliary tank 2, there is only a space of 60 mm in height, which further increases the difficulty of cleaning and crystal management. Therefore, an improved technical solution is needed to address the above deficiencies in the prior art.
[0005] Therefore, an improved technical solution is needed to address the above deficiencies in the prior art.
[0006] It should be noted that the above introduction of the technical background is only for the convenience of clearly and completely explaining the technical solutions of the present application and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well-known to those skilled in the art just because these solutions are described in the background art part of the present application. Summary of the Utility Model
[0007] In view of the above-mentioned deficiencies of the prior art, the purpose of the present utility model is to provide a push-pull valve body and an electroplating device for silicon wafer electroplating, which are used to solve the problems that the electroplating device in the prior art cannot achieve liquid diversion and the liquid after cleaning and crystallization flows back to the auxiliary tank, affecting the electroplating process parameters.
[0008] To achieve the above and other related objectives, the present utility model provides a push-pull valve body for silicon wafer electroplating, and the push-pull valve body includes:
[0009] A box body, which includes a main box body and a sub-box body. An upper connecting ring is installed at the top end of the main box body, and a lower connecting port corresponding to and communicating with the upper connecting ring is opened at the bottom end of the main box body. The sub-box body is fixedly connected to the main box body through a partition board;
[0010] A push-pull unit, which includes a cylinder and a valve core. The cylinder is installed inside the sub-box body, and the telescopic rod of the cylinder penetrates through the partition board and extends into the main box body; the valve core is arranged in the main box body, and one end of the valve core adjacent to the partition board is installed at the extending end of the telescopic rod through a connecting piece, and the telescopic rod drives the valve core to move back and forth in the main box body;
[0011] A collection cavity is opened on the upper end surface of the valve core. When the valve core moves to directly below the upper connecting ring, the opening end of the collection cavity communicates with the upper connecting ring, and the liquid flowing down from the upper connecting ring is collected in the collection cavity;
[0012] A liquid discharge unit, which includes a liquid discharge channel and a liquid discharge pipe. The inlet end of the liquid discharge channel is communicated with the bottom end of the collection cavity. At least one liquid discharge pipe is provided, and the inlet end of the liquid discharge pipe is communicated with the outlet end of the liquid discharge channel. The liquid collected in the collection cavity flows into the liquid discharge channel and is discharged to a recovery tank through the liquid discharge pipe.
[0013] Preferably, the upper connecting ring is in a funnel shape, and the large-diameter end of the upper connecting ring protrudes from the top end surface of the main box body.
[0014] Preferably, in the vertical direction, the small-diameter end of the upper connecting ring is located above the valve core.
[0015] Preferably, there is a clearance fit between the valve core and the side wall of the main box body.
[0016] Preferably, the collection cavity is in a conical shape, and the diameter of the opening end of the collection cavity is not less than the caliber size of the small-diameter end of the upper connecting ring.
[0017] Preferably, the liquid discharge channel includes a first liquid discharge hole and a second liquid discharge hole. The first liquid discharge hole penetrates through one end of the valve core adjacent to the partition board and extends to the bottom end of the collection cavity, and the first liquid discharge hole communicates with the bottom end of the collection cavity;
[0018] The second liquid discharge hole penetrates through both ends of the valve core and intersects with the first liquid discharge hole, and plug heads are installed at both opening ends of the second liquid discharge hole.
[0019] Preferably, there are two drain pipes, and the two drain pipes are arranged parallel to each other and opposite to each other. The inlet ends of the two drain pipes are both communicated with the second drain hole, and the outlet ends of the two drain pipes sequentially penetrate through the partition plate and the end of the auxiliary box body away from the partition plate.
[0020] Preferably, the connecting member is a floating joint. One end of the floating joint is connected to the telescopic rod, and the other end of the floating joint is installed at the opening where the first drain hole penetrates through the valve core.
[0021] Preferably, a diaphragm pump is connected to the outlet end of the drain pipe. The liquid inlet of the diaphragm pump is connected to the outlet end of the drain pipe, and the diaphragm pump discharges the liquid collected in the collection chamber to the recovery tank through the drain pipe.
[0022] An electroplating device includes the above-mentioned push-pull valve body for silicon wafer electroplating.
[0023] As described above, the push-pull valve body for silicon wafer electroplating and the electroplating device of the present invention have the following beneficial effects:
[0024] The push-pull valve body in the present invention is used for connecting the process tank and the auxiliary tank in the electroplating device, and can be used for discharging liquid in both the cleaning state and the electroplating state of the electroplating device. The waste liquid generated after cleaning is discharged to a special recovery tank through electrical control, so as not to affect the electroplating process parameters; the telescopic rod driven by the cylinder realizes the quick response and precise positioning of the valve core, and realizes the quick switching of the position of the valve core. The setting of the floating joint can be used to compensate for the eccentric error between the cylinder and the valve core to prevent the telescopic rod from getting stuck during the process of driving the valve core to move; the partition plate realizes the isolation between the main box body and the auxiliary box body to prevent cross-contamination; the design of the drain pipeline ensures the smooth discharge of the liquid and avoids the retention of the liquid in the collection chamber.
[0025] At the same time, the push-pull valve body in the present invention has the characteristics of small volume, easy control and easy cleaning, and can be widely used in electroplating and process equipment with easily crystallized solutions. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It shows a schematic structural diagram of an electroplating device in the prior art.
[0027] Figure 2 It shows a three-dimensional structural diagram of the push-pull valve body in the present invention in the electroplating state.
[0028] Figure 3 It shows Figure 2 The top view structural diagram of.
[0029] Figure 4Shown as Figure 3 Schematic cross-sectional structure view along the A-A' direction.
[0030] Figure 5 Shown as Figure 2 Front view structure schematic diagram of
[0031] Figure 6 Shown as Figure 5 Schematic cross-sectional structure view along the B-B' direction.
[0032] Figure 7 Shown as a partial cross-sectional three-dimensional structure schematic diagram of the push-pull valve body of the present utility model in the cleaning state.
[0033] Figure 8 Shown as Figure 7 Top view structure schematic diagram of
[0034] Figure 9 Shown as Figure 8 Schematic cross-sectional structure view along the C-C' direction.
[0035] Component label description
[0036] 1 Process tank
[0037] 2 Auxiliary tank
[0038] 3 Hose
[0039] 10 Main box body
[0040] 101 Upper connecting ring
[0041] 102 Lower connection port
[0042] 20 Sub-box body
[0043] 30 Partition board
[0044] 40 Cylinder
[0045] 401 Telescopic rod
[0046] 50 Floating joint
[0047] 60 Valve core
[0048] 70 Collection chamber
[0049] 80 Drainage channel
[0050] 801 First drain hole
[0051] 802 Second drain hole
[0052] 90 Drain pipe Detailed implementation mode
[0053] The following describes each of the following embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Those familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. When detailing the embodiments of the present application, for ease of explanation, the cross-sectional views showing the device structure will be enlarged locally out of the general proportion, and the schematic diagrams are only examples and should not limit the scope of protection of the present application here. In addition, in actual production, three-dimensional spatial dimensions including length, width, and depth should be included.
[0054] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected and the relative position relationship after connection remains unchanged. It should be understood that when component A is fixedly connected to component C through component B, a change in the relative position relationship due to the deformation of component A, component B, and component C itself is allowed. "Rotational connection" means that the two are connected and can rotate relative to each other after connection. "Sliding connection" means that the two are connected and can slide relative to each other after connection. Among them, the two components being integrated through an integrated molding process means that during the process of forming one of the two components, the component is connected to the other component together without the need to connect the two components through additional processing methods (such as bonding, welding, snap connection, screw connection).
[0055] The orientation terms mentioned in the embodiments of the present application, such as "upper", "lower", "side", "top", "bottom", etc., are only references to the directions in the accompanying drawings. Therefore, the orientation terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation on the embodiments of the present application.
[0056] The term "plurality" means at least two. The term "above" includes the number itself. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as implying or indicating relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include one or more of such features.
[0057] Refer to Figure 1 Fig. Figure 1 is a schematic structural diagram of an electroplating device in the prior art, mainly including a process tank 1, an auxiliary tank 2 and a hose 3. The process tank 1 is connected to the auxiliary tank 2 through the hose 3. The electroplating reaction takes place in the process tank 1, and the electroplating solution flows back to the auxiliary tank 2 through the hose 3. However, after batch electroplating, there is often electroplating solution residue on the inner surface of the process tank 1 and the rollers in the tank. These residual electroplating solutions form crystals after evaporation. When deionized water is sprayed with a high-pressure water gun, the water after cleaning will flow back into the auxiliary tank 2, resulting in a decrease in the concentration of metal ions and additives in the electroplating solution, and thus affecting the electroplating process parameters.
[0058] Based on this, the present utility model designs a special push-pull valve body to replace the hose 3. When electroplating, the electroplating solution can flow back to the auxiliary tank 2 normally. When cleaning the crystals or the process tank 1, the deionized water for cleaning will be diverted to a special recovery tank to prevent the deionized water from entering the auxiliary tank 2 and affecting the concentration of the electroplating solution.
[0059] Based on the problems existing in the above prior art, please refer to Figures 2 - 9 , the present utility model provides a push-pull valve body for silicon wafer electroplating. The push-pull valve body includes a box body, a push-pull unit, a collection chamber 70 and a liquid discharge unit. Among them, the box body includes a main box body 10 and a sub-box body 20. An upper connection ring 101 is installed at the top end of the main box body 10, and a lower connection port 102 corresponding to and communicating with the upper connection ring 101 is opened at the bottom end of the main box body 10. The sub-box body 20 is fixedly connected to the main box body 10 through a partition plate 30. The push-pull unit includes a cylinder 40 and a valve core 60. The cylinder 40 is installed inside the sub-box body 20, and the telescopic rod 401 of the cylinder 40 passes through the partition plate 30 and extends into the main box body 10. The valve core 60 is arranged in the main box body 10. One end of the valve core 60 adjacent to the partition plate 30 is installed at the extended end of the telescopic rod 401 through a connecting piece, and the telescopic rod 401 drives the valve core 60 to move back and forth in the main box body 10. The collection chamber 70 is opened on the upper end surface of the valve core 60. When the valve core 60 moves directly below the upper connection ring 101, the open end of the collection chamber 70 communicates with the upper connection ring 101, and the liquid flowing down from the upper connection ring 101 is collected in the collection chamber 70. The liquid discharge unit includes a liquid discharge channel 80 and a liquid discharge pipe 90. The inlet end of the liquid discharge channel 80 is communicated with the bottom end of the collection chamber 70. At least one liquid discharge pipe 90 is provided, and the inlet end of the liquid discharge pipe 90 is communicated with the outlet end of the liquid discharge channel 80. The liquid collected in the collection chamber 70 flows into the liquid discharge channel 80 and is discharged to the recovery tank through the liquid discharge pipe 90.
[0060] Specifically, the push-pull valve body in the present utility model is used for the connection between the process tank and the auxiliary tank in the electroplating equipment, and can be used for the liquid discharge in both the cleaning and electroplating working states of the electroplating equipment. Refer to Figures 7 - 9, when in the cleaning state, the telescopic rod 401 drives the valve core 60 to move to directly below the upper connecting ring 101 through the connecting piece. The waste liquid after cleaning flows into the collection cavity 70 through the upper connecting ring 101, and then through the drain channel 80 at the bottom of the collection cavity 70 and out through the drain pipe 90 into a dedicated recovery tank, thus not affecting the electroplating process parameters; refer to Figures 2 - 6 , when in the electroplating working state, the telescopic rod 401 drives the valve core 60 away from the lower cavity of the upper connecting ring 101, and the liquid flowing down from the upper connecting ring 101 is directly diverted through the lower connection port 102. At the same time, the telescopic rod 401 driven by the cylinder 40 realizes the quick response and precise positioning of the valve core 60, and realizes the quick switching of the position of the valve core 60.
[0061] Preferably, the cylinder 40 is a cylinder 40 made of titanium, and the outer part of the telescopic rod 401 is plated with a titanium metal layer or coated with a Halar coating.
[0062] As an example, refer to Figure 4 , the upper connecting ring 101 is in a funnel shape, and the large-diameter end of the upper connecting ring 101 protrudes from the top surface of the main box body 10.
[0063] Specifically, the connection method between the upper connecting ring 101 and the upper end surface of the main box body 10 is not overly restricted here, but the upper connecting ring 101 is communicated with the inner cavity of the main box body 10. The part of the large-diameter end of the upper connecting ring 101 protruding from the main box body 10 is used to connect with the process tank of the electroplating equipment, and the liquid in the process tank is diverted down through the upper connecting ring 101.
[0064] As an example, in the vertical direction, the small-diameter end of the upper connecting ring 101 is located above the valve core 60.
[0065] Specifically, refer to Figure 7 and Figure 9 , when the valve core 60 moves to directly below the upper connecting ring 101, the opening end of the collection cavity 70 opened at the top of the valve core 60 just communicates with the small-diameter end of the upper connecting ring 101, and the small-diameter end of the upper connecting ring 101 just fits with the top of the valve core 60, or there can be a certain gap.
[0066] As an example, both the valve core 60 and the side wall of the main box body 10 are in clearance fit.
[0067] Specifically, there is a certain gap or gap tolerance range between the valve core 60 and the upper end surface, lower end surface, and the inner walls on both sides of the main box body 10, so that the valve core 60 can move relatively in the main box body 10.
[0068] As an example, refer to Figures 7 - 9 , the collection cavity 70 is in a conical shape, and the diameter of the opening end of the collection cavity 70 is not less than the caliber size of the small-diameter end of the upper connecting ring 101.
[0069] Specifically, the diameter of the open end of the collection chamber 70 is not less than the caliber of the small-diameter end of the upper connecting ring 101, so as to facilitate the collection chamber 70 to completely collect the liquid flowing down from the upper connecting ring 101, and it is set in a conical shape to facilitate the rapid discharge of the collected liquid.
[0070] As an example, the liquid discharge channel 80 includes a first liquid discharge hole 801 and a second liquid discharge hole 802. The first liquid discharge hole 801 penetrates through one end of the valve core 60 adjacent to the partition plate 30 and extends to the bottom end of the collection chamber 70, and the first liquid discharge hole 801 communicates with the bottom end of the collection chamber 70; the second liquid discharge hole 802 penetrates through both ends of the valve core 60 and is arranged intersecting with the first liquid discharge hole 801, and plug heads are installed at both open ends of the second liquid discharge hole 802.
[0071] Specifically, referring to Figure 6 、 Figure 8 , the second liquid discharge hole 802 is arranged intersecting with the first liquid discharge hole 801, and the liquid in the collection chamber 70 flows out through the first liquid discharge hole 801, and then is divided into two at the intersection and flows to the left and right ends of the second liquid discharge hole 802.
[0072] As an example, two drain pipes 90 are provided, and the two drain pipes 90 are arranged parallel and opposite to each other. The inlet ends of the two drain pipes 90 are both communicated with the second liquid discharge hole 802, and the outlet ends of the two drain pipes 90 sequentially penetrate through the partition plate 30 and the end of the auxiliary box body 20 away from the partition plate 30.
[0073] Specifically, referring to Figure 6 , the inlet ends of the two drain pipes 90 are both connected to the valve core 60 and communicated with the second liquid discharge hole 802. The other ends of the two drain pipes 90 penetrate through the partition plate 30 and extend into the auxiliary box body 20, and penetrate through the end of the auxiliary box body 20 away from the partition plate 30. The setting of the two drain pipes 90, on the one hand, plays a guiding role to ensure that the telescopic rod 401 drives the valve core 60 to move along the axial direction of the telescopic rod 401, and on the other hand, can smoothly and quickly discharge the liquid in the collection chamber 70 to the recovery tank outside the box body.
[0074] As an example, the connecting member is a floating joint 50. One end of the floating joint 50 is connected to the telescopic rod 401, and the other end of the floating joint 50 is installed at the opening where the first liquid discharge hole 801 penetrates through the valve core 60.
[0075] Specifically, referring to Figure 6 , the setting of the floating joint 50 can be used to compensate for the eccentric error between the cylinder 40 and the valve core 60 to prevent the telescopic rod 401 from getting stuck during the process of driving the valve core 60 to move; in addition, the connection between the floating joint 50 and the valve core 60 is preferably to install the floating joint 50 at the opening where the first liquid discharge hole 801 penetrates through the valve core 60, and the connection between the two can be a threaded connection, which is not limited too much here.
[0076] As an example, a diaphragm pump is connected to the outlet end of the liquid discharge pipe 90. The inlet of the diaphragm pump is connected to the outlet end of the liquid discharge pipe 90. The diaphragm pump discharges the liquid collected in the collection chamber 70 to the recovery tank through the liquid discharge pipe 90.
[0077] Specifically, when the diaphragm pump is turned on, a negative pressure is generated in the liquid discharge pipe 90. Since the collection chamber 70 of the valve core 60 is conical, the negative pressure diverts the collected liquid through the first liquid discharge hole 801 to both sides of the second liquid discharge hole 802, and then enters the diaphragm pump through the liquid discharge pipe 90, and then discharges it to the special recovery tank.
[0078] The present invention also provides an electroplating device, which includes the above-mentioned push-pull valve body for silicon wafer electroplating.
[0079] Specifically, the electroplating device further includes a process tank 1 and an auxiliary tank 2. The push-pull valve body in the present invention is located between the process tank 1 and the auxiliary tank 2. The upper connecting ring 101 has a flange protruding from the top surface of the main box body 10, and this flange is connected to the bottom end of the process tank. The lower connection port 102 is connected to the auxiliary tank in a communicating manner, so that the electroplating device in the present invention can be used for liquid diversion and discharge in both the cleaning and electroplating working states.
[0080] In summary, the push-pull valve body in the present invention is used for the connection between the process tank and the auxiliary tank in the electroplating device, and can be used for liquid discharge in both the cleaning and electroplating working states of the electroplating device. The waste liquid generated after cleaning is discharged to the special recovery tank through electrical control, so as not to affect the electroplating process parameters; the quick response and precise positioning of the valve core are realized through the telescopic rod driven by the cylinder, and the position of the valve core can be quickly switched. The setting of the floating joint can be used to compensate for the eccentric error between the cylinder and the valve core to prevent the telescopic rod from getting stuck during the process of driving the valve core to move; the isolation between the main box body and the sub-box body is realized through the isolation plate to prevent cross-contamination; the design of the liquid discharge pipeline ensures the smooth discharge of the liquid and avoids the retention of the liquid in the collection chamber. At the same time, the push-pull valve body in the present invention has the characteristics of small volume, easy control, and easy cleaning, and can be widely used in electroplating and process equipment with easily crystallizable solutions. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.
[0081] The above description is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application; without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. The structural member materials, dimensions, shapes, etc. mentioned in the embodiments of the present application are all illustrative descriptions and do not form strict limitations or absolute limitations. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims
1. A push-pull valve body for silicon wafer electroplating, characterized in that: The push-pull valve body comprises: A box body, the box body comprises a main box body and a sub-box body, the top of the main box body is provided with an upper connecting ring, the bottom of the main box body is provided with a lower connecting port corresponding to and communicating with the upper connecting ring, and the sub-box body is fixedly connected to the main box body through an isolation plate; A push-pull unit, the push-pull unit comprising a cylinder and a valve core, the cylinder being installed inside the auxiliary box, the telescopic rod of the cylinder penetrating the isolation plate and extending into the main box; the valve core being arranged in the main box, one end of the valve core adjacent to the isolation plate being installed on the extended end of the telescopic rod through a connector, the telescopic rod driving the valve core to move back and forth in the main box; A collecting chamber, wherein the collecting chamber is opened on the upper end surface of the valve core, and when the valve core moves to the position directly below the upper connecting ring, the opening end of the collecting chamber is communicated with the upper connecting ring, and the liquid flowing down from the upper connecting ring is collected in the collecting chamber; A drainage unit, wherein the drainage unit comprises a drainage channel and a drainage pipe, wherein the inlet end of the drainage channel is connected to the bottom end of the collecting chamber, and at least one drainage pipe is provided, wherein the inlet end of the drainage pipe is connected to the outlet end of the drainage channel, and the liquid fluid collected in the collecting chamber is discharged to a recovery tank through the drainage pipe in the drainage channel.
2. The push-pull valve body for silicon wafer electroplating according to claim 1, characterized in that: The upper connecting ring is funnel-shaped, and the large-diameter end of the upper connecting ring protrudes from the top end surface of the main box body.
3. The push-pull valve body for silicon wafer electroplating according to claim 1, characterized in that: In the vertical direction, the small diameter end of the upper connecting ring is located above the valve core.
4. The push-pull valve body for silicon wafer electroplating according to claim 1, characterized in that: The valve core and the side wall of the main box body are both clearance-fitted.
5. The push-pull valve body for silicon wafer electroplating according to claim 1, characterized in that: The collecting chamber is conical, and the diameter of the opening end of the collecting chamber is not less than the caliber of the small-diameter end of the upper connecting ring.
6. The push-pull valve body for silicon wafer electroplating according to claim 1, characterized in that: The drainage channel includes a first drainage hole and a second drainage hole, the first drainage hole penetrates one end of the valve core adjacent to the isolation plate and extends to the bottom end of the collecting chamber, and the first drainage hole is communicated with the bottom end of the collecting chamber; The second liquid discharge hole passes through two ends of the valve core and is arranged to intersect with the first liquid discharge hole. Both open ends of the second liquid discharge hole are equipped with plugs.
7. The push-pull valve body for silicon wafer electroplating according to claim 6, characterized in that: There are two drainage pipes, which are arranged parallel to each other, the inlet ends of the two drainage pipes are connected to the second drainage hole, and the outlet ends of the two drainage pipes pass through the isolation plate and one end of the auxiliary box away from the isolation plate in sequence.
8. The push-pull valve body for silicon wafer electroplating according to claim 6, characterized in that: The connecting piece is a floating joint, one end of which is connected to the telescopic rod, and the other end of which is installed at an opening of the first drainage hole penetrating the valve core.
9. The push-pull valve body for silicon wafer electroplating according to claim 1, characterized in that: The outlet end of the liquid discharge pipe is connected to a diaphragm pump, the liquid inlet of the diaphragm pump is connected to the outlet end of the liquid discharge pipe, and the diaphragm pump discharges the liquid collected in the collection chamber to a recovery tank through the liquid discharge pipe.
10. An electroplating device, characterized in that: The electroplating equipment comprises a push-pull valve body for silicon wafer electroplating as described in any one of claims 1 to 9 above.