Semiconductor refrigeration and dehumidification chopstick holder machine
By designing a semiconductor refrigeration and dehumidification chopstick drum machine in a tableware dehumidifier, dehumidification and heating tableware is used to dehumidify and heat the tableware, the problem of difficult tableware drying in humid environments is solved, and the effect of rapid heating, low energy consumption and good drying is achieved.
Patent Information
- Application Number
- CN202422063411.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-23
AI Technical Summary
The prior art is difficult to effectively dehumidify tableware in humid environments, resulting in mold or heating time for a long time and high energy consumption.
A semiconductor refrigeration and dehumidification chopstick drum machine is designed to dehumidify the air through dehumidification components, and further dehumidify and heat the tableware using the heated dry air to keep the tableware dry.
It achieves rapid heating, low energy consumption, ensures the dryness of chopsticks, avoids mold, and improves the maintenance conditions of tableware.
Smart Images
Figure CN223036760U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of tableware dehumidification, and particularly relates to a semiconductor refrigeration dehumidification chopstick holder machine. Background Art
[0002] Tableware refers to non-edible tools that directly contact food during meals, including utensils and tools for assisting in food distribution or ingesting food. Such products are eating utensils, such as bowls, chopsticks, spoons, etc., including sets, metal utensils, ceramic tableware, tea sets, wine sets, glassware, paper utensils, plastic utensils, various container tools with different uses, hand-held utensils, and other utensils.
[0003] In the prior art, tableware dehumidification is generally achieved by heating or placing it in a ventilated place. However, in a humid environment, the tableware placed in a ventilated place is always surrounded by humid air, making it difficult for the tableware to be in a dry environment, resulting in the tableware getting moldy. Or heating takes a long time to dry the tableware, resulting in high energy consumption. Content of the Utility Model
[0004] To solve the deficiencies of the above-mentioned prior art, the utility model provides a semiconductor refrigeration dehumidification chopstick holder machine. By designing a dehumidification component, the dehumidification component is used to dehumidify the air, and the dehumidified and heated air is used to further dehumidify and heat the tableware placed in the storage component, so that the tableware remains dry, and rapid heating is achieved with low energy consumption. It can ensure the dryness of chopsticks, avoid the problem of chopsticks getting moldy, and is beneficial to a healthy life.
[0005] The technical effects to be achieved by the utility model are realized through the following aspects:
[0006] In the first aspect, the utility model provides a semiconductor refrigeration dehumidification chopstick holder machine, including
[0007] A housing, the housing is provided with an air inlet, a dehumidification chamber corresponding to the air inlet, and a storage chamber communicated with the dehumidification chamber through a through hole; a first air outlet is provided at a position of the storage chamber far from the through hole;
[0008] A dehumidification component, connected to the housing and disposed in the dehumidification chamber corresponding to the air inlet, the dehumidification component is provided with a second air outlet corresponding to the through hole; and
[0009] A storage component, connected to the housing and disposed in the storage chamber, the storage component is used for placing tableware.
[0010] In some implementation manners, the dehumidification component includes:
[0011] A refrigeration component, the refrigeration component is disposed corresponding to the air inlet;
[0012] A semiconductor refrigeration chip, which is connected to a side of the refrigeration component away from the air inlet; and
[0013] A heating component, which is arranged in parallel with the refrigeration component and is connected to a side of the semiconductor refrigeration chip away from the refrigeration component.
[0014] In some implementation manners, the refrigeration component includes:
[0015] A refrigeration conduction block, which is connected to the semiconductor refrigeration chip and is arranged corresponding to the air inlet;
[0016] A water receiving tank, which is connected to the lower end of the refrigeration conduction block; and
[0017] A first drain pipe, which is communicated with the water receiving tank and passes through the housing through the storage cavity.
[0018] In some implementation manners, the heating component includes a heating conduction block and a fan. The heating conduction block is connected to the semiconductor refrigeration chip, and the heating conduction block is arranged corresponding to the second air outlet. The fan is arranged on a side of the heating conduction block away from the semiconductor refrigeration chip.
[0019] In some implementation manners, the storage component includes a placement box arranged in the storage cavity and connected to the housing and a second drain pipe, and the second drain pipe is communicated with the placement box.
[0020] In some implementation manners, the second drain pipe is arranged in the storage cavity and is communicated with the first drain pipe.
[0021] In some implementation manners, two or more placement boxes are provided.
[0022] In some implementation manners, the housing includes a main body and a housing cover, and one side of the housing cover is hingedly connected to the main body.
[0023] In some implementation manners, a wall hanging hole is provided on a side of the main body facing away from the housing cover.
[0024] In some implementation manners, two or more wall hanging holes are provided.
[0025] In summary, the present utility model has at least the following advantages:
[0026] 1. The semi - conductor refrigeration and dehumidification chopstick holder machine provided by the present utility model designs a dehumidification component. The dehumidification component is used to dehumidify the air, that is, to dehumidify the external space where the product is placed, realizing the conversion of humid air into dry air. After heating the dry air, it is blown into the tableware placed in the placement component to further dehumidify and heat the chopsticks, so that the chopsticks remain dry.
[0027] 2. For the semi - conductor refrigeration and dehumidification chopstick holder machine provided by the present utility model, since the air entering the placement component is first dehumidified to reduce the water content in the air, and then the dehumidified air is heated and the chopsticks in the placement component are dried and dehumidified, the heating time is shorter, thus achieving high heating efficiency and effectively reducing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 It is a schematic structural diagram of the dehumidification device in Embodiment 1.
[0029] Figure 2 It is a schematic structural diagram of the dehumidification device in Embodiment 2.
[0030] Figure 3 It is a schematic structural diagram of the housing in Embodiment 2.
[0031] Markings in the figure:
[0032] 1. Housing, 11. Air inlet, 12. Dehumidification chamber, 13. Placement chamber, 14. First air outlet, 15. Through - hole, 16. Main body, 17. Shell cover; 2. Dehumidification component, 21. Second air outlet, 22. Refrigeration component, 221. Refrigeration conduction block, 222. Water receiving tank, 223. First drain pipe, 23. Semiconductor refrigeration chip, 24. Heating component, 241. Heating conduction block, 242. Fan; 3. Placement component, 31. Placing box, 32. Second drain pipe. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0033] To make the purpose, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. The described embodiments are part of the embodiments of the present utility model, not all of the embodiments.
[0034] Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the claimed present utility model, but merely represents the selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.
[0035] Embodiment 1:
[0036] Please refer to the attached Figure 1 For the semi - conductor refrigeration and dehumidification chopstick holder machine of the present utility model, it includes a housing 1, a dehumidification component 2 and a storage component 3. The housing 1 is provided with an air inlet 11, a dehumidification chamber 12 corresponding to the air inlet 11, and a storage chamber 13 communicated with the dehumidification chamber 12 through a through - hole 15; a first air outlet 14 is provided at a position of the storage chamber 13 far from the through - hole 15; the dehumidification component 2 is connected to the housing 1 and is disposed in the dehumidification chamber 12 corresponding to the air inlet 11, and the dehumidification component 2 is provided with a second air outlet 21 corresponding to the through - hole 15; and the storage component 3 is connected to the housing 1 and is disposed in the storage chamber 13, and the storage component 3 is used for placing tableware.
[0037] Among them, the air inlet 11 is used for the air around the dehumidification device to enter. The dehumidification chamber 12 is an area for dehumidifying the air and heating the dry air. The storage chamber 13 is an area for placing the storage component 3 and through which the processed air passes. The through - hole 15 is used for transmitting the heated dry air to the storage chamber 13. The first air outlet 14 is used for transmitting the heated dry air to the outside of the storage chamber 13. The second air outlet 21 is the outlet for the heated dry air produced by the dehumidification component 2.
[0038] The dehumidification component 2 is used for dehumidifying the humid air, heating the dehumidified dry air and heating and dehumidifying the tableware in the storage component 3 to ensure the dryness of the tableware. The storage component 3 is used for placing tableware.
[0039] In the semi - conductor refrigeration and dehumidification chopstick holder machine of this embodiment, the operation process is as follows: Put the tableware into the storage component 3. The air around the dehumidification device enters the dehumidification chamber 12 through the air inlet 11. The dehumidification component 2 dehumidifies the air, thereby reducing the water content in the air to obtain dry air, and then heats it, so that the heated dry air flows from the second air outlet 21 through the through - hole 15 to the storage chamber 13, thereby heating and drying the tableware located in the storage component 3. The heated dry air flows out from the first air outlet 14 after passing through the tableware, realizing the function of dehumidifying the tableware and keeping the tableware dry. It can greatly avoid the phenomenon of chopsticks getting moldy and ensure the quality and durability of the chopsticks.
[0040] In addition, since the semi - conductor refrigeration and dehumidification chopstick holder machine in this embodiment first dehumidifies the air entering the storage component 3 to make the air have less water content, then heats the dehumidified air and dries and dehumidifies the tableware in the storage component 3. Compared with the prior art, the heating time is shorter, and thus the heating efficiency is high, and the energy consumption can be effectively reduced.
[0041] Embodiment 2:
[0042] The difference between this embodiment and Embodiment 1 is as follows. Please refer to Figure 2, the dehumidifying component 2 of this embodiment includes a refrigeration assembly 22, a thermoelectric cooler 23, and a heating assembly 24. The refrigeration assembly 22 is arranged corresponding to the air inlet 11; the thermoelectric cooler 23 is connected to the side of the refrigeration assembly 22 away from the air inlet 11; and the heating assembly 24 is arranged in parallel with the refrigeration assembly 22 and is connected to the side of the thermoelectric cooler 23 away from the refrigeration assembly 22.
[0043] Among them, the refrigeration assembly 22 is used to cool and dehumidify the air entering the dehumidification chamber 12 from the air inlet 11, thereby intercepting the moisture contained in the air, and then obtaining dry air.
[0044] The heating assembly 24 is used to heat the dry air passing through the refrigeration assembly 22, and then obtain high-temperature dry air to perform dehumidification operation on the tableware.
[0045] The semiconductor material of the thermoelectric cooler 23 has the characteristic of self-contained thermoelectric effect. After the power is turned on, as long as the current passes through the semiconductor material, the effect of one end getting cold and the other end getting hot can be achieved. The better the heat dissipation effect of the heating assembly 24, the better the refrigeration effect of the refrigeration assembly 22. They complement each other and achieve each other.
[0046] Specifically, the refrigeration assembly 22 includes a refrigeration conduction block 221, a water receiving tank 222, and a first drain pipe 223. The refrigeration conduction block 221 is connected to the thermoelectric cooler 23 and is arranged corresponding to the air inlet 11; the water receiving tank 222 is connected to the lower end of the refrigeration conduction block 221; and the first drain pipe 223 is connected to the water receiving tank 222 in communication, and the first drain pipe 223 passes through the housing 1 through the storage cavity 13.
[0047] Through the setting of the above refrigeration assembly 22, the air entering the dehumidification chamber 12 from the air inlet 11 comes into contact with the refrigeration conduction block 221. Since the moisture in the air condenses into water droplets after encountering the refrigeration conduction block 221, the water droplets flow into the water receiving tank 222 and are discharged through the first drain pipe 223, thereby obtaining dry gas.
[0048] In addition, the heating assembly 24 includes a heating conduction block 241 and a fan 242. The heating conduction block 241 is connected to the thermoelectric cooler 23, and the heating conduction block 241 is arranged corresponding to the second air outlet 21, and the fan 242 is arranged on the side of the heating conduction block 241 away from the thermoelectric cooler 23.
[0049] First, the fan 242 rotates to generate a force on the dry air, thereby forming an air flow; second, the product structure design has only one flow loop, such as Figure 2It flows in the direction indicated by the arrow in , so that after the dry air passes through the heat conduction block 241, it becomes high-temperature dry gas. The fan 242 pressurizes it and blows it from the through hole 15 into the placement cavity, so that the moisture inside the placement cavity is discharged through the placement member 3 and the first air outlet 14, and the high-temperature dry air finally blows from the through hole 15 to the placement member 3 and is discharged from the first air outlet 14. It circulates continuously in a space, so as to achieve the dual functions of dehumidifying the external air and keeping the tableware dry.
[0050] In the dehumidification component 2 of this embodiment, the refrigeration conduction block 221 is used to remove the moisture in the air, thereby obtaining dry air, and then the heat conduction block 241 is used to heat it to obtain high-temperature dry air, and then the tableware is dehumidified to keep the tableware dry. And because the water content of the air is small after passing through the refrigeration conduction block 221, the heating time of the heat conduction block 241 for it is relatively short, so as to achieve high heating efficiency and effectively reduce energy consumption.
[0051] In addition, the structure of the semiconductor refrigeration dehumidifying chopstick holder machine in this embodiment is ingeniously designed. By controlling the air flow direction through each chamber and air outlet, and setting each component and chamber accordingly, not only can the corresponding functions be realized, but also the simplicity and compactness of the structure can be ensured, and the device is easy to manufacture.
[0052] In some embodiments, the placement member 3 includes a placement box 31 disposed in the placement cavity 13 and connected to the housing 1, and a second drain pipe 32. The second drain pipe 32 is communicated with the placement box 31. Through this setting, the placement box 31 is used to place tableware, and the second drain pipe 32 is used to drain the moisture in the placement box 31, so as to keep the inside of the placement box 31 dry.
[0053] In some embodiments, the second drain pipe 32 is disposed in the placement cavity 13, and the second drain pipe 32 is communicated with the first drain pipe 223. The water in the second drain pipe 32 can be converged into the first drain pipe 223 and discharged, so that the structural design between the second drain pipe 32 and the housing 1 can be reduced, and the design of one water outlet can be reduced, making the structure simpler, and it can ensure more concentrated drainage and avoid multiple water outlets, which is not conducive to use.
[0054] Preferably, two or more placement boxes 31 are provided. Through the setting of the placement box 31, different tableware can be placed in different placement boxes 31 respectively, which is convenient for sorting and placing.
[0055] In some embodiments, please refer to the attached Figure 3, the housing 1 includes a main body 16 and a housing cover 17, and one side of the housing cover 17 is hingedly connected to the main body 16. Through the arrangement of the housing 1, when it is necessary to place tableware into the placement box 31, the housing cover 17 can be opened for operation. When dehumidification is required, the housing cover 17 can be closed to form a corresponding chamber and perform dehumidification operations on it. The structure is simple and it is convenient and fast to take and place tableware.
[0056] In some embodiments, a wall hanging hole is provided on the side of the main body 16 facing away from the housing cover 17. Through the arrangement of the wall hanging hole, the main body 16 can be hung on the wall by a hook, which can make full use of the space, avoid occupying the area of the tabletop or the ground, and has a high space utilization rate. Preferably, there are 4 wall hanging holes to ensure the stability of the chopstick holder machine placement.
[0057] Embodiment 3:
[0058] On the basis of the above embodiments, this embodiment provides a tableware dehumidifier, including the semiconductor refrigeration dehumidification chopstick holder machine as described above.
[0059] The tableware dehumidifier in this embodiment can ensure the dryness of tableware. Especially in the humid environment in the south, it can greatly avoid the phenomenon of mildew and ensure the quality and durability of tableware.
[0060] In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0061] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of this invention is usually placed. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.
[0062] In addition, the terms "horizontal", "vertical", "overhanging", etc. do not require the components to be absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.
[0063] In the present utility model, unless otherwise clearly specified and defined, the first feature being above or below the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being above, over, and on top of the second feature includes the first feature being directly above and diagonally above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being below, under, and beneath the second feature includes the first feature being directly below and diagonally below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.
[0064] Although the description of the present utility model is made in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications, and variations based on the above content. Therefore, all such substitutions, improvements, and variations are included within the spirit and scope of the appended claims.
Claims
1. A semiconductor refrigeration and dehumidification chopstick tube machine, characterized in that: include: A shell, wherein the shell is provided with an air inlet, a dehumidification chamber is provided corresponding to the air inlet, and a storage chamber is provided in communication with the dehumidification chamber through a through hole; The storage cavity is provided with a first air outlet away from the through hole; A dehumidification component is connected to the shell and is arranged in the dehumidification chamber corresponding to the air inlet, and the dehumidification component is provided with a second air outlet corresponding to the through hole; as well as A storage component, connected to the housing and disposed in the storage cavity, the storage component being used to place tableware; The dehumidification component comprises: A refrigeration component, the refrigeration component is arranged corresponding to the air inlet; A semiconductor refrigeration sheet, the semiconductor refrigeration sheet being connected to a side of the refrigeration component away from the air inlet; and A heating component is arranged in parallel with the cooling component and connected to a side of the semiconductor cooling plate away from the cooling component.
2. The semiconductor refrigeration and dehumidification chopstick tube machine according to claim 1, characterized in that: The refrigeration assembly comprises: A refrigeration conduction block, the refrigeration conduction block is connected to the semiconductor refrigeration sheet and is arranged corresponding to the air inlet; a water receiving trough connected to the lower end of the refrigeration conduction block; and A first drain pipe is communicated with the water receiving trough and passes through the storage cavity and out of the shell.
3. The semiconductor refrigeration and dehumidification chopstick tube machine according to claim 1, characterized in that: The heating component includes a heating conduction block and a fan. The heating conduction block is connected to the semiconductor refrigeration plate, and the heating conduction block is arranged corresponding to the second air outlet. The fan is arranged on a side of the heating conduction block away from the semiconductor refrigeration plate.
4. The semiconductor refrigeration and dehumidification chopstick tube machine according to claim 2, characterized in that: The storage component includes a storage box which is arranged in the storage cavity and connected to the shell, and a second drainage pipe, and the second drainage pipe is connected to the storage box.
5. The semiconductor refrigeration and dehumidification chopstick tube machine according to claim 4, characterized in that: The second drain pipe is disposed in the storage cavity, and the second drain pipe is communicated with the first drain pipe.
6. The semiconductor refrigeration and dehumidification chopstick tube machine according to claim 4, characterized in that: The placement boxes are provided with two or more.
7. The semiconductor refrigeration and dehumidification chopstick tube machine according to any one of claims 1 to 6, characterized in that: The shell comprises a main body and a shell cover, and one side of the shell cover is hingedly connected to the main body.
8. The semiconductor refrigeration and dehumidification chopstick tube machine according to claim 7, characterized in that: A wall hanging hole is arranged on a side of the main body facing away from the shell cover.
9. The semiconductor refrigeration and dehumidification chopstick tube machine according to claim 8, characterized in that: The wall hanging holes are provided with two or more.