Device performance characterization test system
By designing a device performance characterization test system, the problem that the prior art cannot characterize the electrical performance of ultra-widebandgap semiconductor-based devices at high temperatures, high voltages or high currents is solved, and effective characterization and performance testing of these devices are achieved.
Patent Information
- Application Number
- CN202421759326.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-23
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-23
AI Technical Summary
The prior art cannot effectively characterize the electrical performance of ultra-wide bandgap semiconductor-based high-voltage and high-temperature power devices at high temperatures and high voltages or high currents.
A device performance characterization test system is designed, which includes a sample table, a temperature regulation unit and a power supply device. The sample table provides a high temperature environment through heating components, and the power supply device can provide an output voltage of 0 to 12kV and/or an output current of 0 to 50A, meeting the device's test needs at high voltages and high currents in ten thousand volts.
It realizes effective characterization of the electrical performance of the devices to be tested at high temperatures and high voltages or high currents, and meets the application needs of these devices at high temperatures and high voltages or high currents.
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Figure CN223038093U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of device performance testing, and particularly relates to a device performance characterization testing system. Background Art
[0002] In related technologies, ultra-wide bandgap semiconductor-based high-voltage and high-temperature resistant power devices, including aluminum nitride, diamond, and gallium oxide, have significant advantages and broader application prospects in aspects such as breakdown voltage strength, temperature resistance performance, power consumption, switching speed, miniaturization, and radiation resistance. Characterizing the electrical properties of these devices under high temperature, high voltage, or large current is a prerequisite for applying these devices. However, the characterization systems in related technologies cannot characterize the electrical properties of the above-mentioned devices under high temperature, high voltage, or large current. Summary of the Utility Model
[0003] The utility model provides a device performance characterization testing system, which can characterize the electrical properties of a device to be tested under high temperature, high voltage, or large current.
[0004] To achieve the above object, the utility model provides the following technical solutions:
[0005] A device performance characterization testing system includes a sample stage, a temperature adjustment unit, and a power supply device. Among them, the top surface of the sample stage is a bearing surface for bearing a sample to be tested; the temperature adjustment unit includes a first heating component disposed on the sample stage to heat the sample stage, thereby providing a high-temperature environment for the sample to be tested. The power supply device is used to connect with the sample to be tested on the bearing surface, and the power supply device can provide an output voltage of 0 - 12 kV and / or an output current of 0 - 50 A, so that the testing system provided by this application can test and characterize the performance of the sample to be tested under a high voltage of ten thousand volts and / or a large current within 50 A.
[0006] Optionally, the testing system includes a shielding cover and a test chamber that can be closed. The test chamber has a first accommodation space, and the shielding cover is disposed in the first accommodation space; the shielding cover and the bottom plate of the test chamber jointly enclose a second accommodation space, and the sample stage is disposed in the second accommodation space.
[0007] Optionally, the temperature adjustment unit includes a second heating component disposed on the shielding cover.
[0008] Optionally, the sample stage is provided with a through hole, and the temperature adjustment unit includes a refrigerant tank and a delivery pipe. One end of the delivery pipe is connected to the liquid outlet of the refrigerant tank, and the delivery pipe is used to deliver refrigerant to the through hole of the sample stage.
[0009] Optionally, the sample stage includes a support base and a carrier stage disposed on top of the support base, and the top surface of the carrier stage is the bearing surface; the through hole is disposed in the carrier stage, and the through hole is at least partially parallel to the bearing surface.
[0010] Optionally, the refrigerant tank is higher than the through hole.
[0011] Optionally, the delivery pipe includes an inner pipe and an outer pipe sleeved outside the inner pipe. One end of the inner pipe is connected to the liquid outlet of the refrigerant tank, and the inner pipe is used to deliver refrigerant to the through hole of the sample stage.
[0012] Optionally, a first observation window is provided at the top of the test chamber, a second observation window is provided at the top of the shielding cover, and the first observation window, the second observation window and the sample stage are arranged in the direction of gravity.
[0013] Optionally, the second observation window is a radiation-proof window;
[0014] And / or, the first observation window is an ultraviolet light transmissive observation window; the test system further includes an ultraviolet light detector, and the ultraviolet light detector is disposed on a side of the ultraviolet light transmissive observation window away from the sample stage.
[0015] Optionally, the test system includes a driving structure, a first probe arm and a probe group. The first probe arm is at least a pair, and each first probe arm is connected with a probe group; in each pair of first probe arms, the probe group connected to one first probe arm can be connected to the positive pole of the power supply device, and the probe group connected to the other first probe arm can be connected to the negative pole of the power supply device; the driving structure is used to drive the first probe arm so that the probe group can be electrically connected to the sample to be tested;
[0016] The test system further includes a second probe arm and a fiber optic detector unit disposed at one end of the second probe arm. The fiber optic detector unit includes at least one of an ultraviolet fiber optic detector, an infrared fiber optic detector and a visible light fiber optic detector. The driving structure is further used to drive the second probe arm so that the fiber optic detector unit can be close to the sample to be tested.
[0017] Optionally, the test system includes a driving power supply. One end of the driving power supply is used to be connected to the gate of the sample to be tested, and the other end of the driving power supply is used to be connected to the source of the sample to be tested;
[0018] The power supply device includes a first power supply and a second power supply. The output voltage of the first power supply is 0 to 12 kV, and the output voltage of the second power supply is 0 to 3 kV; and / or, the output current of the first power supply is 0 to 1 A, and the output current of the second power supply is 0 to 50 A;
[0019] The first power supply or the second power supply is used to be connected between the source and the drain of the sample to be tested.
[0020] Optionally, the test system includes a vacuum pumping device, and the vacuum pumping device is connected to the test chamber.
[0021] Optionally, liquid nitrogen or liquid helium is stored in the refrigerant tank. Description of the Drawings
[0022] Figure 1 It is a schematic structural diagram of a device performance characterization test system provided by an embodiment of the present invention.
[0023] Reference Signs: 1 - sample stage; 11 - support base; 12 - carrier stage; 121 - carrier stage body; 122 - insulating plate; 2 - power supply device; 3 - refrigerant tank; 4 - delivery pipe; 41 - inner pipe; 42 - outer pipe; 5 - shielding cover; 51 - top plate; 511 - second observation window; 52 - curtain; 6 - test chamber; 61 - cover plate; 611 - first observation window; 62 - bottom plate; 63 - side plate; 7 - vacuum pumping device; 8 - first probe arm; 9 - probe group; 100 - first heating component; 200 - second heating component; 300 - sample to be tested. Detailed Embodiments
[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0025] Figure 1 It is a schematic structural diagram of a device performance characterization test system provided by an embodiment of the present application. As Figure 1As shown, the device performance characterization test system includes a sample stage 1, a temperature adjustment unit and a power supply device 2. Specifically, the top surface of the sample stage 1 is a bearing surface, and the bearing surface is used to bear the sample 300 to be tested. Exemplarily, the sample 300 to be tested can be fixed on the sample stage 1 by a sample clamp or other common clamping tools. The temperature adjustment unit includes a first heating component 100, and the first heating component 100 is arranged on the sample stage 1 to heat the sample stage 1, thereby providing a high temperature environment for the sample to be tested. Exemplarily, the first heating component 100 can be arranged on at least one of the top surface, bottom surface and side surface of the sample stage 1. The power supply device 2 is used to connect to the sample 300 to be tested on the bearing surface, and the power supply device 2 can provide an output voltage of 0 to 12 kV and / or an output current of 0 to 50 A, so that the test system provided in the present application can test and characterize the performance of the sample to be tested at a high voltage of 10,000 volts and / or a large current of less than 50A. Exemplarily, the sample stage 1 is a circular structure with a diameter of 2 inches, and the flatness of the bearing surface of the sample stage 1 is + / - 5 microns.
[0026] Furthermore, the sample stage 1 is provided with a through hole. The temperature regulating unit includes a refrigerant tank 3 and a delivery pipe 4, one end of the delivery pipe 4 is connected to the liquid outlet of the refrigerant tank 3, and the delivery pipe 4 is used to deliver the refrigerant to the through hole of the sample stage 1, so that the test system provided in the present application can achieve rapid cooling of the sample stage 1 and the sample 300 to be tested arranged on the sample stage 1 through refrigerant refrigeration. In addition, when the refrigerant enters the through hole in the sample stage 1, compared with the case where the refrigerant contacts the peripheral surface of the sample stage 1, the distance between the refrigerant in the delivery pipe 4 and the sample placement area of the sample stage 1 is more balanced, so that the temperature of the sample placement area of the sample stage 1 is more balanced.
[0027] In some embodiments, liquid nitrogen or liquid helium is stored in the refrigerant tank 3, so that the sample to be tested can be cooled to -163°C or even lower. In other words, the test system provided by the present application can perform performance tests on the sample to be tested at -163°C or even lower temperatures.
[0028] It is not difficult to understand that the on-off valve is provided at the liquid outlet of the refrigerant tank 3, the delivery pipe 4 is connected to the on-off valve, and the on-off valve is used to control the connection state between the refrigerant tank 3 and the delivery pipe 4. For example: the on-off valve is used to control the opening size of the connection port between the refrigerant tank 3 and the delivery pipe 4.
[0029] Please continue to refer to Figure 1, in a specific implementation, the sample stage 1 includes a support base 11 and a carrier stage 12 disposed on the top of the support base 11. The top surface of the carrier stage 12 is the above-mentioned bearing surface. The through hole is disposed in the carrier stage 12 and at least part of the through hole is parallel to the bearing surface, so that the temperature at each place in the sample placement area of the sample stage 1 is more balanced. In a specific implementation, the cross-section of the through hole in the vertical plane is Z-shaped, and part of the through hole is parallel to the bearing surface.
[0030] In another specific implementation, the through hole is parallel to the bearing surface to facilitate the processing of the through hole. Further, the distance between the through hole and the upper surface of the carrier stage 12 is less than or equal to the distance between the through hole and the lower surface of the carrier stage 12, so that the bearing surface can be cooled more quickly. Exemplarily, the through hole is a straight through hole or a serpentine through hole. Wherein, when the through hole is a serpentine through hole, the contact area between the refrigerant and the sample stage can be increased.
[0031] Of course, in other embodiments, the through hole may also penetrate the carrier stage 12 in other directions. For example, the through hole is inclined with respect to the bearing surface, or the through hole penetrates the carrier stage 12 along the arrangement direction of the carrier stage 12 and the support base 11, etc.
[0032] During specific implementation, the carrier stage 12 may include a carrier stage body 121 and an insulating plate 122. The carrier stage body 121 is disposed on the support base 11, and the insulating plate 122 is disposed on the surface of the carrier stage body 121 facing away from the support base 11. The surface of the insulating plate 122 facing away from the carrier stage body 121 is the above-mentioned bearing surface. Exemplarily, the through hole is disposed in the carrier stage body 121, and the insulating plate 122 can withstand a high voltage of 12 kV. For example, the insulating plate 122 is a ceramic insulating plate or other high-voltage resistant insulating plates. High-voltage protection is carried out through the insulating plate 122, which is more cost-saving compared to the high-voltage resistant design of the entire sample stage 1.
[0033] Please continue to refer to Figure 1 , in some embodiments, the refrigerant tank 3 is higher than the through hole, so that when the on-off valve at the liquid outlet of the refrigerant tank 3 is in the open state, the refrigerant in the refrigerant tank 3 can enter the delivery pipe 4 under the action of gravity, without the need to additionally provide delivery equipment such as a delivery pump, which can save the cost of the test system.
[0034] Of course, in other implementations, the refrigerant tank 3 may also be lower than the through hole. In this case, the test system may include a delivery pump. The inlet of the delivery pump is connected to the liquid outlet of the refrigerant tank 3, and the outlet of the delivery pump is connected to the delivery pipe 4.
[0035] When specifically setting the above-mentioned delivery pipe 4, the delivery pipe 4 may include an inner pipe 41 and an outer pipe 42 fixedly sleeved outside the inner pipe 41. Among them, the outer pipe 42 is fixedly sleeved outside the inner pipe 41, that is to say, the outer pipe 42 is sleeved outside the inner pipe 41 and fixedly connected to the inner pipe 41. Further, one end of the inner pipe 41 is connected to the liquid outlet of the refrigerant tank 3, and the inner pipe 41 is used to deliver the refrigerant to the through hole of the sample stage. The setting of the outer pipe 42 is conducive to maintaining the temperature of the refrigerant in the inner pipe 41 and reducing energy loss.
[0036] The other end of the through hole on the sample stage may be connected with a discharge pipe, and the refrigerant output from the through hole of the sample stage can be discharged through the discharge pipe and the exhaust port of the test chamber 6.
[0037] In some other embodiments, the delivery pipe passes through the through hole on the sample stage, and the part of the inner pipe 41 located downstream of the through hole communicates with the outer pipe 42, so that the refrigerant can be discharged through the outer pipe 42 or discharged through the inner pipe 41 and the outer pipe 42 simultaneously after flowing through the sample stage 1, which is conducive to accelerating the discharge of the refrigerant. Exemplarily, a section of the delivery pipe 4 located downstream of the sample stage 1 is located on the bottom plate 62 of the test chamber 6. Taking the section of the delivery pipe 4 located on the bottom plate 62 of the test chamber 6 as the discharge section, the discharge section is connected to the exhaust port of the test chamber 6, so that the refrigerant flowing through the sample stage 1 is discharged outside the test chamber 6 through the exhaust port. At the discharge section, through holes are provided on the side wall of the inner pipe 41, and the inner pipe 41 communicates with the outer pipe 42 through the above through holes.
[0038] Please continue to refer to Figure 1 , the test system includes a test chamber 6 and a shielding cover 5. Specifically, the test chamber 6 is a closable structure and forms a first accommodation space. The test system includes a vacuum pumping device 7, and the vacuum pumping device 7 is connected to the test chamber 6 and is used to pump the test chamber 6 to a vacuum. The shielding cover 5 is arranged in the first accommodation space. The shielding cover 5 and the bottom plate 62 of the test chamber 6 jointly enclose a second accommodation space, and the sample stage 1 is arranged in the second accommodation space. The shielding cover 5 further encloses the sample stage 1 in the second accommodation space. The setting of the shielding cover 5 is conducive to the temperature stability and uniformity of the environment where the sample stage 1 is located and is conducive to saving energy.
[0039] Exemplarily, the shielding cover 5 may include a top plate 51 and a surrounding curtain 52. The top plate 51 is arranged on the test chamber 6 through a support structure, and the top plate 51 is located above the sample stage 1 and has a preset distance from the bearing surface of the sample stage 1. The surrounding curtain 52 includes a plurality of sheets arranged along the circumference of the top plate 51, and the plurality of surrounding curtains 52 jointly separate the inside and outside of the shielding cover 5.
[0040] The test system may further include a video microscope, and the video microscope is located in the second accommodation space and is used to observe the Pad (pad) position of the sample to be tested on the sample stage 1.
[0041] In some embodiments, a first observation window 611 is provided at the top of the test chamber 6, and a second observation window 511 is provided at the top of the shielding cover 5. The first observation window 611, the second observation window 511, and the sample stage 1 are arranged in the direction of gravity, so that a user can observe the situation of the sample to be tested on the sample stage 1 from the outside. Exemplarily, the second observation window 511 can be provided on the top plate 51 of the shielding cover 5; the test chamber 6 includes a bottom plate 62 and a cover plate 61 arranged opposite to each other, and further includes side plates 63 connected between the cover plate 61 and the bottom plate 62, and the cover plate 61 is provided with the above-mentioned first observation window 611.
[0042] Further, in some embodiments, the second observation window 511 is a radiation-proof window, so as to reduce the possibility of personnel outside the test chamber 6 being irradiated.
[0043] In some embodiments, the first observation window 611 is an ultraviolet light transmissive observation window. The test system further includes an ultraviolet light detector, and the ultraviolet light detector is arranged on the side of the ultraviolet light transmissive observation window away from the sample stage 1, so as to be able to detect the situation of the ultraviolet light released during the test of the sample to be tested.
[0044] Exemplarily, both the first observation window 611 and the second observation window 511 can be circular structures with a diameter of 2 inches or 4 inches. Of course, according to actual needs, the first observation window 611 and the second observation window 511 can also be of other shapes and sizes. For example: the first observation window 611 and the second observation window 511 can also both be square. The test chamber 6 has at least one air extraction port and at least one rapid vacuum-breaking air inlet. The vacuum pumping device 7 includes a dry pump and / or a molecular pump, and the dry pump and / or the molecular pump are connected to the above-mentioned air extraction port, and can make the vacuum degree of the test chamber 6 reach 5×10 -4 Pa.
[0045] Please continue to refer to Figure 1 , the test system includes a driving structure (not shown in the figure), a first probe arm 8, and a probe group 9. There is at least one pair of first probe arms 8, and each first probe arm 8 is connected with a probe group 9. The probe group 9 connected to one of the first probe arms 8 in each pair of first probe arms 8 can be connected to the positive pole of the power supply device 2, and the probe group 9 connected to the other first probe arm 8 can be connected to the negative pole of the power supply device 2. The driving structure is used to drive the first probe arm 8 so that the probe group 9 can be electrically connected to the sample to be tested 300. In some embodiments, the test system further includes a second probe arm (not shown in the figure) and an optical fiber detector unit arranged at one end of the second probe arm. The optical fiber detector unit includes at least one of an ultraviolet optical fiber detector, an infrared optical fiber detector, and a visible light optical fiber detector. The driving structure is also used to drive the second probe arm so that the optical fiber detector unit can approach the sample to be tested. Among them, the specific setting of the driving structure can refer to the prior art.
[0046] It is not difficult to understand that ultraviolet fiber detectors, infrared fiber detectors, and visible light fiber detectors are all connected to a spectral analysis instrument, etc. through optical fibers. After the ultraviolet fiber detector approaches the sample to be tested under the action of the driving structure, it can detect the situation of ultraviolet light released during the testing process of the sample to be tested; after the infrared fiber detector approaches the sample to be tested under the action of the driving structure, it can detect the situation of infrared light released during the testing process of the sample to be tested; after the visible light fiber detector approaches the sample to be tested under the action of the driving structure, it can detect the situation of visible light released during the testing process of the sample to be tested. When it is necessary to detect the situation of visible light released during the testing process of the sample to be tested, the first observation window 611 of the test chamber 6 can be blocked to create a dark environment.
[0047] For ease of understanding, hereinafter, the first probe arm 8 and the second probe arm will be collectively referred to as the probe arm. Specifically, when implemented, through holes for the corresponding probe arms to pass through are provided on the side wall of the test chamber 6, and the probe arm can be inserted into the second accommodation space between two adjacent curtain sheets 52, or multiple curtain sheets 52 are provided with a plurality of probe arm interfaces for installing the probe arm. Exemplarily, the test system includes six probe arms, and multiple curtain sheets 52 are provided with six probe arm interfaces in total. The probe arm adopts a vacuum bellows structure, and the probe arm can move along the XYZ three axes with the center of the bearing surface of the sample stage 1 as the origin under the drive of the driving structure.
[0048] Exemplarily, taking the first probe arm 8 as an example, the moving range of the first probe arm 8 in the X-axis and Y-axis directions is both -30 mm to 30 mm, and the moving range in the Z-axis direction is 0 to 30 mm. The probe group 9 is electrically connected to the sample 300 to be tested by moving the first probe arm. The moving accuracy of the probe arm can reach 2 microns.
[0049] Specifically, a high-voltage and high-current interface probe fixture is provided at one end of the first probe arm 8 close to the sample stage 1, and this probe fixture can withstand a voltage of 12 kV. The probe group 9 includes at least one probe, and can also include multiple probes. When the probe group 9 includes multiple probes, it can achieve high temperature resistance (for example: 823 K) and high current resistance. When implemented, the probe group 9 can be selected according to the actual situation. For example: when the current provided by the power supply device 2 is a large current of 50 A, the probe group 9 can include multiple probes for current shunting. Exemplarily, the voltage provided by the power supply device 2 is 3 kV and the current is 50 A, and the probe group 9 includes multiple probes.
[0050] When specifically setting the above-mentioned power supply device 2, in some embodiments, the test system includes a driving power supply. One end of the driving power supply is used to connect to the gate of the sample to be tested, and the other end of the driving power supply is used to connect to the source of the sample to be tested, so that the source and drain of the test sample can be conducted. In a specific implementation, the output voltage of the driving power supply is +50V or -50V; in another specific implementation, the output current of the driving power supply can be 0 to 1A; in another specific implementation, the output voltage of the driving power supply is +50V or -50V, and the output current of the driving power supply can be 0 to 1A. It should be understood that when the sample to be tested is an NMOS, the output voltage of the driving power supply is +50V, and when the sample to be tested is a PMOS, the output voltage of the driving power supply is -50V.
[0051] The power supply device includes a first power supply and a second power supply. The first power supply or the second power supply is used to connect between the source and drain of the sample to be tested. That is to say, selectively connect the first power supply or the second power supply between the source and drain of the sample to be tested. Further, the output voltage of the first power supply is 0 to 12kV, and the output voltage of the second power supply is 0 to 3kV; and / or, the output current of the first power supply is 0 to 1A, and the output current of the second power supply is 0 to 50A. In specific implementation, select the power supply connected to the first probe arm 8 according to actual needs.
[0052] Exemplarily, the driving power supply, the first power supply, and the second power supply are all programmable DC regulated power supplies for applying voltage and current to the sample to be tested. For the convenience of power supply management, the driving power supply and the power supply device (that is, the first power supply and the second power supply) can be integrated into one; of course, the driving power supply, the first power supply, and the second power supply can also be of separate structures and are set separately. The programmable DC regulated power supply adopts the working principle of PWM high-frequency switching power supply inside and uses IGBT modules, which has characteristics such as high efficiency, high precision, and high stability. The voltage and current values are continuously adjustable from zero to the rated value, with automatic conversion between constant voltage and constant current, and can be arbitrarily selected within the rated range and the limit protection point. The LED digital tube displays voltage and current simultaneously. The output power of the driving power supply is 50W, the programming accuracy of the voltage output is 0.02% of the rated output voltage + 4mV, and the programming accuracy of the current output is 0.05% of the output current + 2uA. The output power of the first power supply is 40kW, the programming accuracy of the voltage output is 0.1% of the rated output voltage, and the programming accuracy of the current output is 0.2% of the output current + 0.2% of the rated output current; the output power of the second power supply is 150kW, the programming accuracy of the voltage output is 0.1% of the rated output voltage, and the programming accuracy of the current output is 0.2% of the output current + 0.2% of the rated output current.
[0053] In some embodiments, the temperature regulation unit further includes a second heating component 200, which is disposed on the shielding cover 5. Having heating components on both the sample stage 1 and the shielding cover 5 is conducive to the more rapid heating of the sample to be tested. Exemplarily, the power of the first heating component 100 can be 600 W, and the power of the second heating component 200 can be 200 W; both the first heating component 100 and the second heating component 200 can be heating wires heated by direct current. In this solution, the temperature of the bearing surface of the sample stage 1 can be jointly regulated by refrigerant cooling and the heating component, thereby providing a test environment of -163 to 550 °C for the sample to be tested. In some embodiments, the heating-up time of the sample stage 1 from -163 °C to room temperature is less than 60 min, the heating-up time from room temperature to 150 °C is less than 60 min, the heating-up time from room temperature to 550 °C is less than 120 min, and the cooling-down time from normal temperature to -163 °C is less than 50 min.
[0054] It is not difficult to understand that the temperature regulation unit includes a control unit. Temperature sensors are provided at both the sample stage 1 and the shielding cover 5. The first heating component 100, the second heating component 200, the on-off valve controlling the connection state of the control refrigerant tank 3 and the delivery pipe 4, and each temperature sensor are electrically connected to the control unit, so as to be able to achieve accurate high and low temperature control functions, and the control accuracy can reach ±0.1 K. It is not difficult to understand that when the test system includes a delivery pump, the delivery pump is also electrically connected to the control unit.
[0055] In some embodiments, the test system includes a data analysis device, which is electrically connected to the probe groups 9 on each pair of first probe arms 8. The data analysis device is used to analyze the I (current)-V (voltage) characteristics of the sample to be tested 300 under the conditions of 0 to 12 kV drain-source voltage in the temperature range of -163 to 550 °C, and the I-V characteristics of the sample to be tested 300 under the conditions of 0 to 50 A drain-source current in the temperature range of -163 to 550 °C.
[0056] The sample to be tested 300 mentioned in this embodiment includes, but is not limited to, ultra-wide bandgap semiconductor-based high-voltage and high-temperature resistant power devices including aluminum nitride, diamond, and gallium oxide.
[0057] In summary, this embodiment designs a system that can provide a vacuum and variable temperature environment, and characterize the electrical properties (such as I-V characteristics under corresponding conditions) and reliability of ultra-high voltage and large current samples to be tested 300 (such as power devices) in the voltage range of 0 to 12 kV, current range of 0 to 50 A, and temperature range of -163 to 550 °C. In addition, the test system provided in this embodiment can perform high-temperature annealing of the sample to be tested 300 at 550 °C, apply a high voltage of 11 kV for a long time, and measure the characteristic changes of the sample to be tested 300, and measure the light radiation caused by defects in the sample to be tested 300 under pressurized conditions.
[0058] Taking the test sample 300 including MOS as an example, the following will introduce the specific test steps of a test system provided in this embodiment. Exemplarily, the test steps of this test system are as follows: Figure 1 In Step 1, open the cover plate 61 of the test chamber 6 and the top plate 51 of the shielding cover 5, and fix the test sample 300 on the sample stage 1 through the sample clamp.
[0059] In Step 2, connect one end of the driving power supply to the gate of the corresponding MOS of the test sample 300, and connect the other end of the driving power supply to the source of the above MOS; make the driving structure drive the first probe arm 8 to move. Under the guidance of the video microscope, make one probe group 9 contact the source Pad of the above MOS, and make the other probe group 9 contact the drain Pad of the MOS of the test sample 300 to ensure good electrical connection.
[0060] In Step 3, turn on the vacuum device 7 to make the first accommodation space reach a preset vacuum degree, such as 5×10
[0061] Pa. -4 Pa.
[0062] In Step 4, turn on the temperature adjustment unit to make the sample stage 1, the curtain 52 and the first probe arm 8 reach a preset temperature, such as the sample stage 1 is -163°C, the curtain 52 is -163°C, and the first probe arm 8 is -163°C.
[0063] In Step 5, turn on the corresponding power supply to apply a high voltage and a large current to the test sample 300, such as 3 kV voltage and 50 A current.
[0064] In Step 6, the data analysis device collects the voltage and current information of the test sample 300 through the probe group and conducts I-V electrical characteristic analysis.
[0065] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.
Claims
1. A device performance characterization test system, characterized in that: It includes a sample stage, a temperature adjustment unit and a power supply device, wherein the top surface of the sample stage is a bearing surface, and the bearing surface is used to bear the sample to be tested; the temperature adjustment unit includes a first heating component, and the first heating component is arranged on the sample stage; the power supply device is used to connect with the sample to be tested on the bearing surface, and the power supply device can provide an output voltage of 0 to 12 kV and / or an output current of 0 to 50 A.
2. The device performance characterization test system according to claim 1, characterized in that: It comprises a shielding cover and a closable test chamber, wherein the test chamber has a first accommodating space, and the shielding cover is arranged in the first accommodating space; the shielding cover and the bottom plate of the test chamber jointly enclose a second accommodating space, and the sample stage is arranged in the second accommodating space.
3. The device performance characterization test system according to claim 2, characterized in that: The temperature regulating unit comprises a second heating component, and the second heating component is arranged on the shielding cover.
4. The device performance characterization test system according to any one of claims 1 to 3, characterized in that: The sample stage is provided with a through hole, and the temperature adjustment unit includes a refrigerant tank and a delivery pipe, one end of the delivery pipe is connected to the liquid outlet of the refrigerant tank, and the delivery pipe is used to deliver the refrigerant to the through hole of the sample stage.
5. The device performance characterization test system according to claim 4, characterized in that: The sample stage includes a support seat and a bearing platform arranged on the top of the support seat, and the top surface of the bearing platform is the bearing surface; the through hole is arranged on the bearing platform, and the through hole is at least partially parallel to the bearing surface.
6. The device performance characterization test system according to claim 4, characterized in that: The refrigerant tank is higher than the through hole.
7. The device performance characterization test system according to claim 4, characterized in that: The delivery tube includes an inner tube and an outer tube fixedly sleeved on the outer side of the inner tube. One end of the inner tube is connected to the liquid outlet of the refrigerant tank, and the inner tube is used to deliver the refrigerant to the through hole of the sample stage.
8. The device performance characterization test system according to claim 2 or 3, characterized in that: A first observation window is disposed on the top of the test chamber, a second observation window is disposed on the top of the shielding cover, and the first observation window, the second observation window and the sample stage are arranged along the direction of gravity.
9. The device performance characterization test system according to claim 8, characterized in that: The second observation window is a radiation protection window; And / or, the first observation window is an ultraviolet light transmission observation window; the testing system further comprises an ultraviolet light detector, and the ultraviolet light detector is arranged on a side of the ultraviolet light transmission observation window away from the sample stage.
10. The device performance characterization test system according to any one of claims 1 to 3, characterized in that: The test system comprises a driving structure, a first probe arm and a probe group, wherein the first probe arm is at least a pair, and each of the first probe arms is connected to a probe group; in each pair of the first probe arms, one of the probe groups connected to the first probe arm can be connected to the positive electrode of the power supply device, and the other of the probe groups connected to the first probe arm can be connected to the negative electrode of the power supply device; the driving structure is used to drive the first probe arm so that the probe group can be electrically connected to the sample to be tested; The testing system also includes a second probe arm and a fiber optic detector unit arranged at one end of the second probe arm, the fiber optic detector unit includes at least one of an ultraviolet fiber optic detector, an infrared fiber optic detector and a visible light fiber optic detector, and the driving structure is also used to drive the second probe arm so that the fiber optic detector unit can approach the sample to be tested.
11. The device performance characterization test system according to claim 1 or 2, characterized in that: It includes a driving power supply, one end of which is used to connect to the gate of the sample to be tested, and the other end of which is used to connect to the source of the sample to be tested; The power supply device comprises a first power supply and a second power supply, the output voltage of the first power supply is 0-12 kV, and the output voltage of the second power supply is 0-3 kV; and / or, the output current of the first power supply is 0-1 A, and the output current of the second power supply is 0-50 A; The first power source or the second power source is used to be connected between a source and a drain of a sample to be tested.
12. The device performance characterization test system according to claim 2 or 3, characterized in that: The testing system comprises a vacuum pumping device connected to the testing chamber.
13. The device performance characterization test system according to claim 4, characterized in that: The refrigerant tank stores liquid nitrogen or liquid helium.