Lower imprint bearing device and vacuum nanoimprint equipment with same
By designing the lower stamping bearing device and vacuum nanoimprinting equipment, the bubble problem and insufficient bonding accuracy during the nanoimprinting process are solved, and bubble-free and accurate glass plate and wafer transfer effect are achieved.
Patent Information
- Application Number
- CN202422201137.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-09
AI Technical Summary
During the nanoimprinting process, when the microstructure patterns of glass plates or hard plates are transferred to the wafer, bubbles are prone to appear, and the accuracy of bonding is poor.
A lower stamping bearing device is designed, including a bearing platform, a lifting ring and a clamping assembly. Through vacuum imprinting technology, the bonding between the glass plate and the wafer is achieved, and the combination of clamping seat and spring is used to achieve precise clamping and flexible load bearing of the wafer.
Bubble-free bonding between the glass plate and the wafer is achieved, which improves the accuracy and effect of transfer and avoids wafer damage.
Smart Images
Figure CN223038294U_ABST
Abstract
Description
Technical Field
[0001] The utility model specifically relates to a lower imprinting carrier device and a vacuum nanoimprinting device with the device. Background Art
[0002] Nanoimprint technology is an advanced processing method for fabricating high-resolution structures at the nanoscale. Its core idea is to transfer nanoscale patterns to the target surface using a template, thereby achieving fine processing of materials. Nanoimprint technology has a wide range of applications, including semiconductor manufacturing, optical element preparation, biomedical sensors, and other fields.
[0003] When the master plate is a glass plate or other hard material plate, the microstructural pattern on the glass plate is transferred to the wafer. However, bubbles are likely to appear during the bonding process between the two, and the bonding accuracy is poor. Summary of the Utility Model
[0004] In order to solve the above technical problems, the utility model provides a lower imprinting carrier device and a vacuum nanoimprinting device with the device.
[0005] In order to achieve the above object, the technical solution of the utility model is as follows:
[0006] The utility model discloses a lower imprinting carrier device, in which a carrier platform, a lifting ring sleeved on the outer peripheral side of the carrier platform, and a plurality of clamping components distributed on the outer peripheral side of the lifting ring are installed in the lower cavity of the lower imprinting carrier device;
[0007] The carrier platform is used for carrying a master plate with a microstructural pattern;
[0008] The lifting ring is in transmission connection with a lifting drive mechanism, and the lifting drive mechanism drives the lifting ring to lift;
[0009] The clamping components are used for clamping the wafer to be imprinted. The clamping components include: a support seat, a sliding seat, a connecting seat, and a clamping seat installed on the cavity wall of the lower cavity;
[0010] A cam rotatably connected thereto is installed on the support seat;
[0011] The sliding seat is arranged above the connecting arm of the lifting ring, and a slope in sliding contact with the cam is provided on the sliding seat;
[0012] The connecting seat is fixedly installed on the lifting ring, and a through hole is provided on the connecting seat;
[0013] The sliding seat, the connecting seat, and the clamping seat are arranged in sequence from outside to inside. The clamping seat is fixedly connected to the sliding seat through a connecting rod passing through the through hole of the connecting seat, and a spring is further installed between the clamping seat and the connecting seat. The spring is sleeved on the connecting rod;
[0014] The lifting drive mechanism is used to drive the lifting ring to move up and down, and under the interaction of the ramp and the cam, the clamping seat can move inward or outward along the radial direction of the lifting ring.
[0015] Based on the above technical solution, the following improvements can be made:
[0016] As a preferred solution, the plurality of clamping assemblies are evenly distributed along the circumference of the lifting ring with the center of the lifting ring as the center.
[0017] As a preferred solution, a plurality of positioning blocks are installed on the lifting ring along its circumference, and the positioning blocks are used to position the side surfaces of the motherboard and the wafer.
[0018] As a preferred solution, a plurality of positioning blocks are evenly distributed along the circumference of the lifting ring with the lifting ring as the center.
[0019] As a preferred solution, a guide shaft is also installed on the wall of the lower cavity. The guide shaft passes through a through hole on the connecting arm of the lifting ring and is used to guide the lifting and lowering of the lifting ring.
[0020] As a preferred solution, the lifting drive mechanism is connected by transmission through a bellows, a lifting shaft and a connecting arm of the lifting ring.
[0021] As a preferred solution, the lifting shaft is transmission-connected to the connecting arm of the lifting ring via a floating joint.
[0022] As a preferred solution, the lifting drive mechanism and the bellows are installed outside the lower stamping bearing device.
[0023] As a preferred solution, the clamping seat has an L-shaped clamping portion.
[0024] The utility model also discloses a vacuum nano-imprinting device, comprising: any of the above-mentioned lower imprinting bearing devices with a lower cavity, an upper imprinting pressure device with an upper cavity, and a vacuum pumping device. When the upper imprinting pressure device and the lower imprinting bearing device are closed, the upper cavity and the lower cavity form a sealed cavity.
[0025] The utility model discloses a lower imprint bearing device and a vacuum nanoimprinting device having the device, which has the following beneficial effects:
[0026] First, the utility model adopts a vacuum embossing method, which can realize the bonding between a glass plate and a wafer or any two hard plates, and transfer the micro-nano structure pattern on one hard plate to another hard plate, and there are no bubbles in the bonding process, and the transfer effect is good.
[0027] Second, the utility model first uses the clamping seat to clamp the wafer, and the lifting drive mechanism drives the lifting ring to descend. Under the action of the ramp and the cam, the sliding seat drives the clamping seat to move outward, so that the wafer is separated from the clamping seat, thereby achieving precise fitting between the wafer and the motherboard.
[0028] Thirdly, the clamping seat of the present utility model is elastically connected to the connecting seat through a spring, achieving flexible loading of the wafer and causing no damage to the wafer. Description of the Drawings
[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.
[0030] Figure 1 Structural schematic diagram of the lower imprinting loading device provided by the embodiment of the present utility model.
[0031] Figure 2 Side view of the lower imprinting loading device provided by the embodiment of the present utility model.
[0032] Figure 3 Top view of the lower imprinting loading device provided by the embodiment of the present utility model.
[0033] Figure 4 is Figure 3 Cross-sectional view in the A-A direction in
[0034] Figure 5 is Figure 3 Cross-sectional view in the B-B direction in
[0035] Figure 6 is Figure 3 Partial enlarged view of part C in
[0036] Figure 7 Partial enlarged view of the clamping assembly provided by the embodiment of the present utility model (the housing of the lower imprinting loading device is hidden in the figure).
[0037] Figure 8 Structural schematic diagram of the support seat provided by the embodiment of the present utility model.
[0038] Figure 9 Cross-sectional view of the connection of the sliding seat, connecting seat and clamping seat provided by the embodiment of the present utility model.
[0039] Wherein: 1 - lower imprinting carrier device, 11 - lower cavity, 12 - carrier platform, 13 - lifting ring, 131 - connecting arm, 132 - positioning block, 14 - clamping assembly, 141 - support seat, 142 - sliding seat, 143 - connecting seat, 144 - clamping seat, 145 - slope, 146 - cam, 147 - clamping portion, 148 - connecting rod, 2 - sealing ring, 3 - wafer, 4 - spring, 5 - guide shaft, 61 - lifting drive mechanism, 62 - bellows, 63 - lifting shaft, 64 - floating joint. Detailed implementation manners
[0040] The preferred implementation manners of the present utility model will be described in detail below with reference to the accompanying drawings.
[0041] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0042] The expression of "including" an element is an "open-ended" expression, which only means that there is a corresponding component or step, and should not be construed as excluding additional components or steps.
[0043] In order to achieve the purpose of the present utility model, in some embodiments of the lower imprinting carrier device and the vacuum nanoimprinting device having the device,
[0044] Such as Figures 1-9 As shown, a carrier platform 12, a lifting ring 13 sleeved on the outer peripheral side of the carrier platform 12, and 4 groups of clamping assemblies 14 distributed on the outer peripheral side of the lifting ring 13 are installed in the lower cavity 11 of the lower imprinting carrier device 1, wherein: the lifting ring 13 and the carrier platform 12 are concentrically arranged.
[0045] The carrier platform 12 is used to carry a master plate with a microstructural pattern, and the master plate can be but is not limited to a glass plate.
[0046] The lifting ring 13 is in transmission connection with the lifting drive mechanism 61, and the lifting drive mechanism 61 drives the lifting ring 13 to lift.
[0047] Each group of clamping assemblies 14 is used to clamp the wafer 3 to be imprinted, and the clamping assembly 14 includes: a support seat 141, a sliding seat 142, a connecting seat 143 and a clamping seat 144 installed on the cavity wall of the lower cavity 11.
[0048] Two cams 146 rotatably connected thereto are installed on the support seat 141.
[0049] The sliding seat 142 is mounted above the connecting arm 131 of the lifting ring 13 . Two slopes 145 that are in sliding contact with the cams 146 are provided on the sliding seat 142 . The two slopes 145 correspond to the two cams 146 one by one.
[0050] The connection seat 143 is fixedly mounted on the lifting ring 13 , and a through hole is provided on the connection seat 143 .
[0051] The sliding seat 142 , the connecting seat 143 and the clamping seat 144 are arranged in sequence from the outside to the inside. The clamping seat 144 is fixedly connected to the sliding seat 142 via a connecting rod 148 passing through the through hole of the connecting seat 143 , and a spring 4 is also installed between the clamping seat 144 and the connecting seat 143 , and the spring 4 is sleeved on the connecting rod 148 .
[0052] The lifting drive mechanism 61 is used to drive the lifting ring 13 to move up and down, and under the interaction of the slope 145 and the cam 146 , the clamping seat 144 can move inward or outward along the radial direction of the lifting ring 13 .
[0053] In order to further optimize the implementation effect of the utility model, in some other embodiments, the other characteristic technologies are the same, and the difference is that the four groups of clamping components 14 are evenly distributed along the circumference of the lifting ring 13 with the center of the lifting ring 13 as the center.
[0054] In order to further optimize the implementation effect of the utility model, in some other embodiments, the other characteristic technologies are the same, the difference is that four positioning blocks 132 are also installed on the lifting ring 13 along its circumference, and the positioning blocks 132 are used to position the sides of the motherboard and the wafer 3.
[0055] It is worth noting that when the lifting drive mechanism 61 drives the lifting ring 13 to descend, the positioning block 132 positions the side surfaces of the plate and the wafer 3 to ensure the accuracy of the fit between the two.
[0056] Furthermore, the four positioning blocks 132 are evenly distributed along the circumference of the lifting ring 13 with the lifting ring 13 as the center.
[0057] In order to further optimize the implementation effect of the utility model, in some other embodiments, the other characteristic technologies are the same, the difference is that a guide shaft 5 is also installed on the wall of the lower cavity 11, and the guide shaft 5 passes through the through hole on the connecting arm 131 of the lifting ring 13, and is used to guide the lifting and lowering of the lifting ring 13.
[0058] In order to further optimize the implementation effect of the utility model, in some other embodiments, the other characteristic technologies are the same, and the difference is that the lifting drive mechanism 61 is connected to the connecting arm 131 of the lifting ring 13 through the bellows 62 and the lifting shaft 63.
[0059] Further, the lifting shaft 63 is drivingly connected to the connecting arm 131 of the lifting ring 13 through a floating joint 64.
[0060] Further, the lifting drive mechanism 61 and the bellows 62 are installed outside the lower imprinting carrier device 1.
[0061] The drive assembly arranged outside can reduce the sealed cavity and shorten the evacuation time. The lifting drive mechanism 61 can be but is not limited to an electric cylinder.
[0062] In order to further optimize the implementation effect of the present utility model, in some other embodiments, the remaining characteristic technologies are the same, and the difference lies in that the clamping seat 144 has an L-shaped clamping portion 147.
[0063] The vacuum nanoimprinting device includes: an upper imprinting pressing device (not shown in the figure) having an upper cavity, a lower imprinting carrier device 1 having a lower cavity 11, and an evacuation device (not shown in the figure). When the upper imprinting pressing device and the lower imprinting carrier device 1 are closed, the upper cavity and the lower cavity 11 form a sealed cavity.
[0064] In some embodiments, the upper imprinting pressing device may have an airbag component for applying a downward pressure to the wafer 3 to make the wafer 3 fit against the glass plate.
[0065] The working process of the vacuum nanoimprinting device of the present utility model is as follows.
[0066] First, the carrier platform 12 carries the master plate with the microstructural pattern.
[0067] Second, the wafer 3 is placed on the 4 clamping seats 144 for lifting.
[0068] Third, the upper imprinting pressing device and the lower imprinting carrier device 1 come into contact, and the upper cavity and the lower cavity 11 form a sealed cavity.
[0069] Fourth, the evacuation device works to make the sealed cavity a vacuum cavity.
[0070] Fifth, the lifting drive mechanism 61 drives the lifting ring 13 to descend, the sliding seat 142 descends, and under the interaction of the slope 145 and the cam 146, the sliding seat 142 drives the clamping seat 144 to move outwards, so that the wafer 3 disengages from the clamping seat 144, and the wafer 3 is accurately fitted to the master plate.
[0071] Sixth, the airbag component in the upper imprinting pressing device moves downward to apply pressure to the wafer 3 to achieve imprinting.
[0072] When the imprinting is completed, the lifting drive mechanism 61 drives the lifting ring 13 to rise, and the sliding seat 142 and the clamping seat 144 return to their initial positions.
[0073] Furthermore, a sealing ring 2 is installed on the contact surface of the upper imprinting pressing device and / or the lower imprinting bearing device 1 to improve the sealing performance between the two.
[0074] The utility model discloses a lower imprinting bearing device and a vacuum nano-imprinting device with the device, which has the following beneficial effects:
[0075] First, the utility model adopts the vacuum imprinting method, which can realize the fitting between the glass plate and the wafer 3 or any two hard plates, transfer the micro-nano structure pattern on one hard plate to another hard plate, and there are no bubbles in the fitting process, and the transfer effect is good.
[0076] Second, the utility model first clamps the wafer 3 by the clamping seat 144, the lifting drive mechanism 61 drives the lifting ring 13 to descend, under the action of the slope 145 and the cam 146, the sliding seat 142 drives the clamping seat 144 to move outwards, so that the wafer 3 is separated from the clamping seat 144, and the precise fitting between the wafer 3 and the mother board is realized.
[0077] Third, the clamping seat 144 of the utility model is elastically connected with the connecting seat 143 through the spring 4, so as to realize the flexible bearing of the wafer 3 and will not damage the wafer 3.
[0078] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front part", "center", "both ends", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.
[0079] In the present utility model, unless otherwise clearly specified and limited, the terms "installation", "setting", "connection", "fixation", "swivel connection", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. Unless otherwise clearly limited, for those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0080] The above has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.
Claims
1. The lower embossing bearing device is characterized in that: A bearing platform, a lifting ring sleeved on the outer periphery of the bearing platform, and a plurality of clamping components distributed on the outer periphery of the lifting ring are installed in the lower cavity of the lower stamping bearing device; The carrying platform is used to carry a motherboard having a microstructure pattern; The lifting ring is in transmission connection with the lifting drive mechanism, and the lifting drive mechanism drives the lifting ring to rise and fall; The clamping assembly is used to clamp the wafer to be imprinted, and the clamping assembly includes: a supporting seat, a sliding seat, a connecting seat and a clamping seat installed on the wall of the lower cavity; A cam rotatably connected to the support seat is mounted on the support seat; The sliding seat is mounted above the connecting arm of the lifting ring, and a slope that is in sliding contact with the cam is provided on the sliding seat; The connecting seat is fixedly mounted on the lifting ring, and a through hole is provided on the connecting seat; The sliding seat, the connecting seat and the clamping seat are arranged in sequence from the outside to the inside, the clamping seat is fixedly connected to the sliding seat by a connecting rod passing through the through hole of the connecting seat, and a spring is also installed between the clamping seat and the connecting seat, and the spring is sleeved on the connecting rod; The lifting drive mechanism is used to drive the lifting ring to move up and down, and under the interaction of the ramp and the cam, the clamping seat can move inward or outward along the radial direction of the lifting ring.
2. The lower imprint bearing device according to claim 1, characterized in that: The plurality of clamping assemblies are evenly distributed along the circumference of the lifting ring with the center of the lifting ring as the center of the circle.
3. The lower imprint bearing device according to claim 1, characterized in that: A plurality of positioning blocks are also installed on the lifting ring along its circumference, and the positioning blocks are used to position the side surfaces of the motherboard and the wafer.
4. The lower imprint bearing device according to claim 3, characterized in that: The plurality of positioning blocks are evenly distributed along the circumference of the lifting ring with the lifting ring as the center.
5. The lower imprint bearing device according to claim 1, characterized in that: A guide shaft is also installed on the wall of the lower cavity. The guide shaft passes through a through hole on the connecting arm of the lifting ring and is used to guide the lifting of the lifting ring.
6. The lower imprint bearing device according to claim 1, characterized in that: The lifting drive mechanism is connected by transmission through a bellows, a lifting shaft and a connecting arm of the lifting ring.
7. The lower imprint bearing device according to claim 6, characterized in that: The lifting shaft is transmission-connected to the connecting arm of the lifting ring through a floating joint.
8. The lower imprint bearing device according to claim 7, characterized in that: The lifting drive mechanism and the bellows are installed outside the lower stamping bearing device.
9. The lower imprint bearing device according to claim 1, characterized in that: The clamping seat has an L-shaped clamping portion.
10. A vacuum nanoimprinting device, characterized in that: include: According to any one of claims 1 to 9, the lower imprint bearing device having a lower mold cavity, the upper imprint pressure device having an upper mold cavity, and the vacuum device, when the upper imprint pressure device and the lower imprint bearing device are closed, the upper mold cavity and the lower mold cavity form a sealed cavity.