Server liquid cooling plate and liquid cooling plate assembly

Abstract

The utility model discloses a server liquid cooling plate and a liquid cooling plate assembly. The server liquid cooling plate comprises a heat dissipation plate and a uniform temperature plate connected to the heat dissipation plate. The uniform temperature plate is used for transferring heat generated by the electronic component to the heat dissipation plate; the uniform-temperature plate comprises a uniform-temperature substrate and a uniform-temperature cover plate covering the upper surface of the uniform-temperature substrate, the lower surface of the uniform-temperature substrate is integrally formed and connected to the upper surface of the heat dissipation plate, and the upper surface of the uniform-temperature cover plate is a heat source surface used for being connected to an electronic component in an attached mode; the left side face of the heat dissipation plate is connected with a first water pipe, the right side face of the heat dissipation plate is connected with a second water pipe, the axis of the first water pipe coincides with the axis of the second water pipe, and the first water pipe and the second water pipe are both in a straight pipe shape and are directly communicated through a connecting channel in the heat dissipation plate. A liquid cooling cavity is formed in the heat dissipation plate, and copper powder is filled in the liquid cooling cavity to form a copper powder layer on the inner wall of the liquid cooling cavity; therefore, the straight-through type structural design of the water pipe is achieved, the heat dissipation performance is improved, the structure is simple and ingenious, and forming and manufacturing are easy.

Description

Technical Field

[0001] The utility model relates to the technical field of server liquid cooling, in particular to a server liquid cooling plate and a liquid cooling plate assembly. Background Technique

[0002] With the rapid development of computer technology, data center servers are being deployed towards high-density or even ultra-high-density to meet high-performance computing services. During the operation of the server, as the power of electronic chips continues to increase, resulting in an increasing heat flux density, heat is concentrated on the surface of the CPU. Traditional air cooling poses a risk of being unable to meet its heat dissipation requirements, and liquid cooling technology has begun to be widely used due to its fast heat dissipation speed, low noise, and stable heat dissipation effect. As the core component of liquid cooling technology, the working principle of the liquid cooling plate is to introduce the coolant into the cold plate through an external liquid distribution pipe and a water nozzle, and the coolant takes away the heat concentrated on the surface of the CPU through forced convection inside the cold plate.

[0003] For example, a connector applied to a server liquid cooling circuit disclosed in Chinese Patent Publication No. CN217951525U includes a liquid cooling plate and a connector provided on the liquid cooling plate. A cavity is provided inside the liquid cooling plate, and the connector is communicated with the cavity. The connector is in a bent circular tube shape, and the two ends of the connector are perpendicular to each other. One end of the connector is vacuum welded to the liquid cooling plate, and the other end of the connector is a bell mouth joint. Although it can improve the fluidity of the coolant and the heat dissipation effect by setting the connector in a bent circular tube shape with the two ends perpendicular to each other, the connector is bent, that is, it still has a fold angle, which will affect the fluidity of the coolant due to the limitation of the fold angle, thereby affecting the heat dissipation effect.

[0004] Therefore, it is necessary to research a new technology to solve the above problems. Content of the Utility Model

[0005] In view of this, aiming at the deficiencies existing in the prior art, the main purpose of the utility model is to provide a server liquid cooling plate and a liquid cooling plate assembly, which realize the straight-through structure design of the water pipe, improve the heat dissipation performance, and have a simple and ingenious structure, which is easy to form and manufacture.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A server liquid cooling plate includes a heat dissipation plate and a temperature equalizing plate connected to the heat dissipation plate; the temperature equalizing plate is used to transfer the heat generated by electronic components to the heat dissipation plate;

[0008] The heat pipe includes a heat pipe substrate and a heat pipe cover plate covering the upper surface of the heat pipe substrate. The lower surface of the heat pipe substrate is integrally formed and connected to the upper surface of the heat dissipation plate. The upper surface of the heat pipe cover plate is a heat source surface for fitting and connecting to electronic components.

[0009] A first water pipe is connected to the left side surface of the heat dissipation plate, and a second water pipe is connected to the right side surface of the heat dissipation plate. The axes of the first water pipe and the second water pipe coincide. Both the first water pipe and the second water pipe are in a straight pipe shape, and the first water pipe and the second water pipe are directly connected through a connection channel inside the heat dissipation plate.

[0010] A liquid cooling cavity is provided inside the heat dissipation plate, and copper powder is filled in the liquid cooling cavity to form a copper powder layer on the inner wall of the liquid cooling cavity.

[0011] As a preferred solution, the copper powder layer is a sintered copper powder layer.

[0012] As a preferred solution, the heat dissipation plate includes a heat dissipation substrate and a heat dissipation cover plate. The lower surface of the heat pipe substrate is integrally formed and connected to the upper surface of the heat dissipation substrate. The liquid cooling cavity is recessed upward from the lower surface of the heat dissipation substrate. The heat dissipation cover plate is connected to the lower surface of the heat dissipation substrate and covers the liquid cooling cavity.

[0013] As a preferred solution, the first water pipe is connected to the left side surface of the heat dissipation substrate, and the second water pipe is connected to the right side surface of the heat dissipation substrate.

[0014] As a preferred solution, the connection channel is formed inside the heat dissipation substrate.

[0015] As a preferred solution, a first groove penetrating the upper and lower sides of the heat pipe substrate is recessed backward from the front side surface of the heat pipe substrate. The first groove penetrates leftward to the left side surface of the heat pipe substrate. Correspondingly, a second groove penetrating the upper and lower sides of the heat pipe cover plate is recessed backward from the front side surface of the heat pipe cover plate. The second groove penetrates leftward to the left side surface of the heat pipe cover plate. The first groove and the second groove are connected, and a part of the heat dissipation plate is exposed in the first groove.

[0016] As a preferred solution, a sealing end is provided on the right inner side wall of the first groove, and the sealing end communicates with the inside of the heat pipe substrate.

[0017] As a preferred solution, the periphery of the heat pipe substrate extends outward beyond the periphery of the heat dissipation plate.

[0018] A liquid cooling plate assembly includes at least two of the server liquid cooling plates. Adjacent two of the server liquid cooling plates are connected through the second water pipe of one server liquid cooling plate and the first water pipe of another server liquid cooling plate.

[0019] As a preferred solution, the second water pipe of one server liquid cooling plate is connected to the first water pipe of another server liquid cooling plate through a connector.

[0020] Compared with the prior art, the present utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solutions, it mainly designs the first water pipe and the second water pipe into straight pipe shapes, and makes the first water pipe and the second water pipe directly communicate through the connection channel in the heat dissipation plate, thereby realizing the direct-through structure design of the water pipe, improving the fluidity of the coolant, and thus improving the heat dissipation performance. Secondly, through the design of the heat pipe, it can transfer the heat generated by the electronic components to the heat dissipation plate through the heat pipe, making the heat conduction more concentrated, rapid and uniform, and the structure is simple and ingenious, easy to mold and manufacture; and, by integrally forming and connecting the lower surface of the heat pipe base plate of the heat pipe to the upper surface of the heat dissipation plate, the heat can be transferred to the maximum extent and the contact resistance can be reduced; in addition, through the setting of the copper powder layer, the heat conduction performance of the heat dissipation plate can be improved.

[0021] To more clearly elaborate on the structural features, technical means, and the specific purposes and functions achieved by the present utility model, the following will further describe the present utility model in detail with reference to the accompanying drawings and specific embodiments. Description of the Drawings

[0022] Figure 1 is a three-dimensional structural schematic diagram of the server liquid cooling plate of the embodiment of the present utility model;

[0023] Figure 2 is another three-dimensional structural schematic diagram of the server liquid cooling plate of the embodiment of the present utility model;

[0024] Figure 3 is a three-dimensional structural schematic diagram of the liquid cooling plate assembly of the embodiment of the present utility model;

[0025] Figure 4 is another three-dimensional structural schematic diagram of the liquid cooling plate assembly of the embodiment of the present utility model.

[0026] Description of the Reference Numerals in the Drawings:

[0027] 10. Heat dissipation plate 11. Heat dissipation substrate

[0028] 12. Heat dissipation cover 20. Heat pipe

[0029] 21. Heat pipe base plate 22. Heat pipe cover

[0030] 23. Heat source surface 24. First groove

[0031] 25. Second groove 26. Sealing end

[0032] 30. First water pipe 40. Second water pipe

[0033] 50. Connector Detailed implementation mode

[0034] Please refer to Figures 1 to 4 as shown, which shows the specific structure of the embodiment of the present utility model.

[0035] A server liquid cooling plate includes a heat dissipation plate 10 and a heat pipe 20 connected to the heat dissipation plate 10; the heat pipe 20 is used to transfer the heat generated by electronic components to the heat dissipation plate 10; the heat pipe 20 includes a heat pipe substrate 21 and a heat pipe cover plate 22 covering the upper surface of the heat pipe substrate 21, the lower surface of the heat pipe substrate 21 is integrally formed and connected to the upper surface of the heat dissipation plate 10, and the upper surface of the heat pipe cover plate 22 is a heat source surface 23 for fitting and connecting to electronic components; here, through the design of the heat pipe 20, it can transfer the heat generated by electronic components to the heat dissipation plate 10 through the heat pipe 20, so that heat conduction is more concentrated, rapid and uniform, and the structure is simple and ingenious, easy to form and manufacture; and, by integrally forming and connecting the lower surface of the heat pipe substrate 21 of the heat pipe 20 to the upper surface of the heat dissipation plate 10, the heat can be transferred to the maximum extent and the contact resistance can be reduced. And, a heat pipe structure is provided in the heat pipe substrate 21, and the heat pipe structure may include a wick, a support structure and a working fluid. The wick can be made of sintered powder, porous foam metal, microchannels, metal mesh and other materials. The support structure is a strip-shaped or cylindrical structure, and the working fluid is acetone. The structural form and working mechanism of the heat pipe 20 belong to the prior art and will not be introduced in detail here. During use, the heat pipe cavity is evacuated.

[0036] A first groove 24 penetrating the upper and lower sides of the heat pipe substrate 21 is recessed backward on the front side surface of the heat pipe substrate 21, and the first groove 24 penetrates leftward to the left side surface of the heat pipe substrate 21. Correspondingly, a second groove 25 penetrating the upper and lower sides of the heat pipe cover plate 22 is recessed backward on the front side surface of the heat pipe cover plate 22, and the second groove 25 penetrates leftward to the left side surface of the heat pipe cover plate 22. The first groove 24 is communicated with the second groove 25, and a part of the heat dissipation plate 10 is exposed in the first groove 24. A sealing end 26 is provided on the right inner side wall of the first groove 24, and the sealing end 26 is communicated with the inside of the heat pipe substrate 21. The sealing end 26 needs to be sealed by welding during subsequent use. The periphery of the heat pipe substrate 21 extends out of the periphery of the heat dissipation plate 10 to increase the size of the heat pipe 20 so that the heat pipe 20 can absorb and transfer more heat.

[0037] A first water pipe 30 is connected to the left side surface of the heat dissipation plate 10, and a second water pipe 40 is connected to the right side surface of the heat dissipation plate 10. The axes of the first water pipe 30 and the second water pipe 40 coincide. Both the first water pipe 30 and the second water pipe 40 are in a straight pipe shape. The first water pipe 30 and the second water pipe 40 are directly connected through a connection channel inside the heat dissipation plate 10, thereby realizing a direct-through structure design of the water pipes, which can improve the fluidity of the coolant and thus improve the heat dissipation performance.

[0038] A liquid cooling cavity is arranged inside the heat dissipation plate 10. The connection channel communicates with the liquid cooling cavity. Copper powder is filled in the liquid cooling cavity to form a copper powder layer on the inner wall of the liquid cooling cavity. The copper powder layer is a sintered copper powder layer. In this way, through the setting of the copper powder layer, the heat conduction performance of the heat dissipation plate 10 can be improved.

[0039] The heat dissipation plate 10 includes a heat dissipation base plate 11 and a heat dissipation cover plate 12. The lower surface of the temperature equalizing base plate 21 is integrally formed and connected to the upper surface of the heat dissipation base plate 11. The liquid cooling cavity is recessed upward from the lower surface of the heat dissipation base plate 11. The heat dissipation cover plate 12 is connected to the lower surface of the heat dissipation base plate 11 and covers the liquid cooling cavity. The first water pipe 30 is connected to the left side surface of the heat dissipation base plate 11, and the second water pipe 40 is connected to the right side surface of the heat dissipation base plate 11. The connection channel is formed inside the heat dissipation base plate 11.

[0040] And, as Figure 3 with Figure 4 shown, a liquid cooling plate assembly includes at least two of the server liquid cooling plates. Adjacent two server liquid cooling plates are connected through the second water pipe 40 of one server liquid cooling plate and the first water pipe 30 of another server liquid cooling plate. A connector 50 is connected between the second water pipe 40 of one server liquid cooling plate and the first water pipe 30 of another server liquid cooling plate. In this way, multiple server liquid cooling plates can be combined to form a modular liquid cooling plate assembly, so that the liquid cooling plate assembly can be applicable to different chips. For example, for use with dual-channel AI chips, only need to arbitrarily combine multiple server liquid cooling plates according to the requirements of the chips to be applied. In actual production and processing, the cost is cheaper and lower than that of an integral liquid cooling plate assembly. And if one server liquid cooling plate is damaged during use, it can be replaced and continue to be used.

[0041] In summary, the key design point of the present utility model is that the first water pipe and the second water pipe are both designed as straight pipes, and the first water pipe and the second water pipe are directly connected through the connection channel in the heat dissipation plate, so as to realize the straight-through structure design of the water pipe, which can improve the fluidity of the coolant, thereby improving the heat dissipation performance. Secondly, through the design of the heat pipe, the heat generated by the electronic components can be transferred to the heat dissipation plate through the heat pipe, making the heat conduction more concentrated, rapid and uniform, and the structure is simple and ingenious, easy to form and manufacture. Moreover, by integrally forming and connecting the lower surface of the heat pipe's heat pipe substrate to the upper surface of the heat dissipation plate, the heat can be transferred to the maximum extent and the contact resistance can be reduced. In addition, through the setting of the copper powder layer, the heat conduction performance of the heat dissipation plate can be improved.

[0042] The above are only the preferred embodiments of the present utility model, and do not impose any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. A server liquid cooling plate, comprising a heat sink and a temperature balancing plate connected to the heat sink; characterized in that: The temperature plate is used to transfer the heat generated by the electronic components to the heat sink; The temperature balancing plate comprises a temperature balancing substrate and a temperature balancing cover plate which is arranged on the upper surface of the temperature balancing substrate, the lower surface of the temperature balancing substrate is integrally formed and connected to the upper surface of the heat dissipation plate, and the upper surface of the temperature balancing cover plate is a heat source surface for being attached and connected to the electronic components; The left side of the heat sink is connected to a first water pipe, and the right side of the heat sink is connected to a second water pipe, the axes of the first water pipe and the second water pipe coincide, the first water pipe and the second water pipe are both straight pipe-shaped, and the first water pipe and the second water pipe are directly connected through a connecting channel in the heat sink; A liquid cooling cavity is arranged in the heat dissipation plate, and copper powder is filled in the liquid cooling cavity to form a copper powder layer on the inner wall of the liquid cooling cavity.

2. A server liquid cooling plate according to claim 1, characterized in that: The copper powder layer is a sintered copper powder layer.

3. A server liquid cooling plate according to claim 1, characterized in that: The heat sink includes a heat sink substrate and a heat sink cover plate. The lower surface of the temperature-averaging substrate is integrally connected to the upper surface of the heat sink substrate. The liquid cooling cavity is recessed upward from the lower surface of the heat sink substrate. The heat sink cover plate is connected to the lower surface of the heat sink substrate and covers the liquid cooling cavity.

4. A server liquid cooling plate according to claim 3, characterized in that: The first water pipe is connected to the left side of the heat dissipation substrate, and the second water pipe is connected to the right side of the heat dissipation substrate.

5. The server liquid cooling plate according to claim 3, characterized in that: The connection channel is formed in the heat dissipation substrate.

6. The server liquid cooling plate according to claim 1, characterized in that: The front side surface of the temperature-averaging substrate is recessed backwards with a first groove that passes through the upper and lower sides of the temperature-averaging substrate, and the first groove passes leftwards to the left side of the temperature-averaging substrate. Correspondingly, the front side surface of the temperature-averaging cover plate is recessed backwards with a second groove that passes through the upper and lower sides of the temperature-averaging cover plate, and the second groove passes leftwards to the left side of the temperature-averaging cover plate. The first groove is connected to the second groove, and part of the heat dissipation plate is exposed in the first groove.

7. A server liquid cooling plate according to claim 6, characterized in that: The right inner side wall of the first groove is provided with a sealing end, and the sealing end is communicated with the interior of the temperature-uniform substrate.

8. The server liquid cooling plate according to claim 6, characterized in that: The peripheral side of the temperature-uniform substrate extends outward from the peripheral side of the heat dissipation plate.

9. A liquid cooling plate assembly, characterized in that: The invention comprises at least two server liquid cooling plates according to any one of claims 1 to 8, wherein two adjacent server liquid cooling plates are connected to the first water pipe of the other server liquid cooling plate through the second water pipe of one server liquid cooling plate.

10. The liquid cooling plate assembly according to claim 9, characterized in that: The second water pipe of one server liquid cooling plate is connected to the first water pipe of another server liquid cooling plate through a connector.

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