High-precision alloy chip resistor with coating layer on side surface

Abstract

The utility model discloses a high-precision alloy chip resistor with a coating layer on the side surface, which comprises a resistance layer, the top of the resistance layer is provided with an insulating layer, the bottom of the resistance layer is provided with an electrode layer, the electrode layer is coated with an outer welding layer, and the side surface of the resistance layer is coated with an isolating layer for insulation and heat insulation. According to the utility model, the isolating layer is coated on the side surface of the resistive layer to insulate heat and insulate other elements in a circuit, so that the environmental pollution and high-temperature oxidation of the resistive layer are reduced, and the long-term reliability and stability of the resistor are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a high-precision alloy chip resistor with a coating layer on the side surface. Background Art

[0002] With the continuous development of electronic circuit technologies in the three major fields of automotive electronics, new energy, and smart meters, as well as in the aerospace and military fields, the demand for high-precision resistors has been on the rise. The application environmental conditions of resistors have increasingly higher requirements for the reliability and stability of resistors. To adapt to the development of circuit integration and planarization, the space utilization rate of PCB boards has been improved, the spacing between components has been reduced, surface mount resistors are bound to follow this trend, and resistors tend to be miniaturized, and are required to have good electrical insulation and heat resistance.

[0003] For traditional resistors, only the electrodes are wrapped with an external solder layer, and the side surfaces of the resistor layers are exposed to the application environment. There are situations such as high temperature and high humidity, and thermal oxygen aging in the application environment of the resistor, which can cause the resistor layers to be contaminated and oxidized by the environment, affecting the long-term reliability and stability of the resistors. Summary of the Invention

[0004] Aiming at the above problems of existing resistors, the present invention aims to provide a high-precision alloy chip resistor with a coating layer on the side surface, which has high stability and a long service life.

[0005] The specific technical solutions are as follows:

[0006] A high-precision alloy chip resistor with a coating layer on the side surface includes a resistor layer. An insulating layer is provided on the top of the resistor layer, and an electrode layer is provided on the bottom. The electrode layer is coated with an external solder layer, and an isolation layer for insulation and heat insulation is coated on the side surface of the resistor layer.

[0007] As a further improvement and optimization of this solution, the isolation layer extends to the side surface of the insulating layer.

[0008] As a further improvement and optimization of this solution, the isolation layer is a polymer material.

[0009] As a further improvement and optimization of this solution, the material of the isolation layer is epoxy resin / acrylic resin / polyurethane.

[0010] As a further improvement and optimization of this solution, the electrode layer includes two electrodes, and the two electrodes are respectively arranged on both sides of the bottom of the resistor layer. The outside of each electrode is coated with the external solder layer.

[0011] As a further improvement and optimization of this solution, the external solder layer is a single-layer or multi-layer solder layer.

[0012] As a further improvement and optimization of this solution, a protective layer is covered on the bottom of the resistance layer and the top of the insulating layer, both located between the two electrodes, for isolating the external environment.

[0013] As a further improvement and optimization of this solution, the material of the protective layer can be epoxy resin / acrylic resin / polyurethane.

[0014] As a further improvement and optimization of this solution, the insulating layer and the resistance layer are connected through an adhesive layer.

[0015] As a further improvement and optimization of this solution, a notch is provided at the bottom of the resistance layer, and the notch is located between the two electrodes.

[0016] The positive effects of the above technical solution compared with the prior art are as follows:

[0017] (1) In the present utility model, by coating an isolation layer on the side of the resistance layer for heat insulation and insulation from other components in the circuit, the pollution and high-temperature oxidation of the resistance layer by the environment are reduced, thereby improving the long-term reliability and stability of the resistor.

[0018] (2) In the present utility model, a polymer material with corrosion resistance, good chemical resistance, and strong adhesion to metals is used as the isolation layer, which has a good effect on preventing oxidation and pollution of the resistance layer. At the same time, the polymer material has good heat resistance and electrical insulation, and can block the influence of heat from other components in the circuit on the resistor. Description of the Drawings

[0019] Figure 1 It is a cross-sectional view of the first embodiment of a high-precision alloy chip resistor with a coating layer on the side of the present utility model;

[0020] Figure 2 It is a cross-sectional view of the second embodiment of a high-precision alloy chip resistor with a coating layer on the side of the present utility model;

[0021] In the drawings: 1. Resistance layer; 2. Insulating layer; 3. Adhesive layer; 4. Protective layer; 5. Electrode; 6. External solder layer; 7. Isolation layer; 11. Notch. Detailed Embodiments

[0022] Next, the technical solution of the present utility model will be clearly and completely described in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0023] In the description of the present utility model, it should be noted that when terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present utility model. In addition, when terms such as "first", "second", "third" appear, they are only for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0024] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, when terms such as "installation", "connection", "coupling" are used, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0025] Figure 1 It is a sectional view of the first embodiment of a high-precision alloy chip resistor with a coating layer on the side of the present utility model. Figure 2 It is the section of the second embodiment of a high-precision alloy chip resistor with a coating layer on the side of the present utility model.

[0026] First embodiment:

[0027] Such as Figure 1 : A high-precision alloy chip resistor with a coating layer on the side, including a resistor layer 1. The top of the resistor layer 1 has an insulating layer 2, and the bottom has an electrode layer. The electrode layer is coated with an external solder layer 6. It further includes: The side of the resistor layer 1 is coated with an isolation layer 7 for insulation and heat insulation.

[0028] In this embodiment, by coating the isolation layer 7 on the side of the resistor layer 1 for heat insulation and insulation from other components in the circuit, the pollution of the resistor layer 1 by the environment and high-temperature oxidation are reduced, thereby improving the long-term reliability and stability of the resistor.

[0029] Furthermore, as a preferred embodiment, the isolation layer 7 is a polymer material.

[0030] Furthermore, as a preferred embodiment, the material of the isolation layer 7 is epoxy resin / acrylic resin / polyurethane.

[0031] In this embodiment, a polymer material with excellent corrosion resistance, chemical resistance, and strong adhesion to metals is used as the isolation layer 7, which has a good effect on preventing oxidation and pollution of the resistance layer 1. At the same time, the polymer material has good heat resistance and electrical insulation, and can block the influence of heat from other components in the circuit on the resistor.

[0032] Further, as a preferred embodiment, the electrode layer includes two electrodes 5, which are respectively arranged on both sides of the bottom of the resistance layer 1. An external solder layer 6 is coated on the outside of each electrode 5 to prevent the electrode 5 from being contaminated or oxidized by the outside.

[0033] Further, as a preferred embodiment, the external solder layer 6 is a single-layer or multi-layer solder layer, such as nickel, tin, or nickel-tin layer.

[0034] Further, as a preferred embodiment, the bottom of the resistance layer 1 and the top of the insulating layer 2 between the two electrodes 5 are both covered with a protective layer 4 for isolating the external environment.

[0035] Further, as a preferred embodiment, the material of the protective layer 4 can be epoxy resin / acrylic resin / polyurethane.

[0036] Further, as a preferred embodiment, the insulating layer 2 and the resistance layer 1 are connected through an adhesive layer 3.

[0037] Further, as a preferred embodiment, the bottom of the resistance layer 1 has a notch 11, and the notch 11 is located between the two electrodes 5.

[0038] Further, as a preferred embodiment, the resistance layer 1 is a copper-manganese alloy mainly composed of copper and manganese, a copper-nickel alloy, a nickel-chromium alloy mainly composed of nickel and chromium, a copper-antimony alloy, or a copper-chromium alloy. In this embodiment, the resistance layer 1 is illustrated by a manganese-copper-nickel alloy sheet with a thickness between 50 and 250 um. The resistance layer 1 can be a complete square sheet or a coil.

[0039] The material of the insulating layer 2 is polyimide, a glass fiber-reinforced thermosetting material, a carbon fiber-reinforced thermosetting material, or a fiber-reinforced thermoplastic material, and its thickness can be between 50 and 300 um.

[0040] The material of the adhesive layer 3 includes epoxy resin, acrylic resin, polyurethane adhesive, or AB glue, and its thickness is about 10 to 110 um.

[0041] Second embodiment:

[0042] As Figure 2 , this embodiment has substantially the same structure as the first embodiment, the difference being that: the isolation layer 7 extends to the sides of the insulating layer 2 and the adhesive layer 3.

[0043] In this embodiment, the production steps of the resistor are as follows:

[0044] 1. Prepare materials:

[0045] S1: Provide an insulating layer 2, on the upper surface of which an enhancing layer is attached;

[0046] S2: Prepare an adhesive layer 3, which is attached to a release film;

[0047] 2. Attach the adhesive layer 3 and remove the release film:

[0048] S3: Attach the adhesive layer 3 to the insulating layer 2 to ensure close contact between the two;

[0049] S4: Remove the release film from the adhesive layer 3 to expose the sticky surface of the adhesive layer 3;

[0050] 3. Thermal lamination process:

[0051] S5: Thermally laminate the insulating layer 2 with the enhancing layer on its upper surface and the resistor layer 1 through the adhesive layer 3 to make them closely adhere to form a combined plate body;

[0052] 4. Form the electrodes 5:

[0053] S6: Form two electrodes 5 with conductive functions below the resistor layer 1; this step determines the basic structure and packaging size of the resistor;

[0054] 5. Adjust the resistance value:

[0055] S7: Form a notch 11 below the resistor layer 1 between the two electrodes 5, and this notch 11 is used to adjust the resistance value of the resistor layer 1 to the required specification;

[0056] 6. Form the protective layer 4:

[0057] S8: Form a protective layer 4 below the resistor layer 1 between the two electrodes 5 to protect the resistor layer 1 from environmental pollution or oxidation;

[0058] S9: Remove the enhancing layer on the upper surface of the insulating layer 2 and form a protective layer 4 on the upper surface of the insulating layer 2 to provide additional protection and insulation;

[0059] 7. Form the external solder layer 6:

[0060] S10: Form external solder layers 6 on the outer parts of the two electrodes 5 respectively to facilitate the soldering and connection of the resistor;

[0061] 8. Cutting and isolation treatment:

[0062] S11: Cut the entire resistor plate body to form single resistors, and coat the exposed part on the side of the resistor layer 1 with an isolation layer 7 to prevent unnecessary contact between the resistor layer 1 and other components or the environment.

[0063] The above are only the preferred embodiments of the present invention, and do not limit the implementation manners and protection scope of the present invention. For those skilled in the art, it should be realized that all the equivalent replacements and obvious changes made by using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-precision alloy chip resistor with a coating layer on the side, comprising a resistor layer, an insulating layer on the top of the resistor layer, an electrode layer on the bottom, and an outer solder layer on the electrode layer, characterized in that: The side surfaces of the resistance layer are coated with an isolation layer for insulation and heat isolation.

2. The high-precision alloy chip resistor with a coating layer on the side according to claim 1, characterized in that: The isolation layer extends to a side surface of the insulating layer.

3. The high-precision alloy chip resistor with a coating layer on the side according to claim 1, characterized in that: The isolation layer is made of polymer material.

4. The high-precision alloy chip resistor with a coating layer on the side according to claim 3, characterized in that: The material of the isolation layer is epoxy resin / acrylic resin / polyurethane.

5. The high-precision alloy chip resistor with a coating layer on the side according to claim 1, characterized in that: The electrode layer comprises two electrodes, which are respectively arranged at two sides of the bottom of the resistor layer, and the outside of each electrode is covered with the outer welding layer.

6. The high-precision alloy chip resistor with a coating layer on the side according to claim 5, characterized in that: The outer solder layer is a single-layer or multi-layer solder layer.

7. The high-precision alloy chip resistor with a coating layer on the side according to claim 5, characterized in that: The bottom of the resistance layer between the two electrodes and the top of the insulating layer are both covered with a protective layer for isolating from the external environment.

8. The high-precision alloy chip resistor with a coating layer on the side according to claim 7, characterized in that: The material of the protective layer can be epoxy resin / acrylic resin / polyurethane.

9. The high-precision alloy chip resistor with a coating layer on the side according to claim 2, characterized in that: The insulating layer and the resistance layer are connected via a glue layer.

10. The high-precision alloy chip resistor with a coating layer on the side according to claim 5, characterized in that: The bottom of the resistance layer has a notch, and the notch is located between the two electrodes.

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