Automatic processing equipment for semiconductor wafer

Abstract

The utility model provides semiconductor wafer automatic processing equipment, and belongs to the technical field of semiconductor wafer processing. Comprising a thinning machine body, a machining area is formed in the middle of the thinning machine body, a side mounting frame is fixed to one side of the machining area, a thinning mechanism is mounted in the middle of the machining area, and a cleaning mechanism is mounted in the side mounting frame. According to the utility model, through the arrangement of the film pressing protection mechanism, a worker can hold and open the pressing frame by utilizing the mobility of a rotating hinge and a rotating frame, then places the dried semiconductor wafer in a cutting ring groove, and then can synchronously start a third motor and a fifth motor, the third motor can drive a second transmission screw rod to rotate, and the fifth motor can drive a second transmission screw rod to rotate; at the moment, a second lead screw sliding sleeve acting with a lead screw can drive a fixed mounting frame and a rotating rod carried in the middle of the fixed mounting frame to be matched with a guide mounting rod for guiding to conduct film drawing treatment, a film belongs to one end of a blue film outside a film mounting roller, and a fifth motor arranged at one end of the film mounting roller needs to be started to be matched with the blue film for loosening.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer processing, and particularly relates to a semiconductor wafer automatic processing device. Background Art

[0002] A semiconductor wafer generally refers to a silicon wafer used for manufacturing semiconductor silicon integrated circuits. Because of its circular shape, it is called a wafer. Due to the requirements of manufacturing processes, there are high requirements for the dimensional accuracy, geometric accuracy, surface cleanliness, etc. of the wafer. In these process flows, wafers of a certain thickness need to be transferred during the process. The specific steps are as follows: the semiconductor wafer is first thinned and then laminated, and then sliced into the required size. Subsequently, the semiconductor wafer can be placed on a semiconductor carrier frame.

[0003] In the existing film laminating mechanism of the automatic processing device, basically, manual pulling of the blue film is relied on to attach the semiconductor wafer. However, manual pulling may cause deformation due to uneven stress on both sides of the blue film end, resulting in wrinkling and damage during the subsequent attachment process. Secondly, after each film pulling and laminating, the operator also needs to cut and discard the used waste film. The process is complex and has a certain damage rate, thus leading to low efficiency of wafer film lamination. Therefore, this application provides a semiconductor wafer automatic processing device to meet the requirements. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a semiconductor wafer automatic processing device to solve the problem that the existing method basically relies on manual pulling of the blue film to attach the semiconductor wafer, but manual pulling may cause deformation due to uneven stress on both sides of the blue film end, resulting in wrinkling and damage during the subsequent attachment process. Secondly, after each film pulling and laminating, the operator also needs to cut and discard the used waste film. The process is complex and has a certain damage rate, thus leading to low efficiency of wafer film lamination.

[0005] To solve the above technical problem, the utility model provides the following technical solutions:

[0006] A semiconductor wafer automatic processing device, including a thinning body, a processing area is provided in the middle of the thinning body, a side mounting frame is fixed on one side of the processing area, a thinning mechanism is installed in the middle of the processing area, a cleaning mechanism is installed inside the side mounting frame, a film pressing body is provided on one side of the thinning body, and a film pressing protection mechanism is installed above the film pressing body. A dicing body is installed on the other side of the film pressing body. The film pressing protection mechanism includes a rotating frame, and the rotating frame is installed on one side of the top of the film pressing body. A rotating hinge is movable around the rotating frame, and a pressing frame is fixed on one side of the rotating hinge. Loading boxes are fixed on both sides of the top of the film pressing body, and a film mounting roller is installed on one side of the top of the film pressing body. A blue film is sleeved around the film mounting roller. Film pressing components are installed inside and outside the two loading boxes. The film pressing component includes a fixed mounting frame, and a jetting frame is fixedly provided at the front end of the fixed mounting frame. A film smoothing component is installed inside the two loading boxes. A reserved ring groove is provided on one side of the top of the film pressing body, and a cutting ring groove is provided around the reserved ring groove. A second electric push rod is installed at the top of the pressing frame, and a cutting ring knife is connected to the extending end of the second electric push rod.

[0007] Optionally, the film pressing component includes a second transmission lead screw, and the second transmission lead screw is installed inside one of the loading boxes. One end of the second transmission lead screw is connected and installed with a third motor, and a second lead screw sliding sleeve is screwed on the periphery of one side of the second transmission lead screw. A fixed mounting frame is fixed inside the second lead screw sliding sleeve, and a fourth motor is installed in the middle of one side of the fixed mounting frame. The output end of the fourth motor is connected with a loading rotating rod. A guiding rod is fixed inside the other loading box, and one end of the film mounting roller is connected and installed with a fifth motor.

[0008] Optionally, the film smoothing component includes guiding grooves, and the guiding grooves are provided inside the two loading boxes. A guide plate is movable inside the two guiding grooves, and telescopic rods are fixedly installed on both sides of the bottom end of the guide plate. A return spring is sleeved around the telescopic rods, and a scraping and smoothing plate is connected to one end of the telescopic rods.

[0009] Optionally, both ends of the return spring are respectively connected with the guide plate and the scraping and smoothing plate.

[0010] Optionally, the thinning mechanism includes a clamping component, and the clamping component is installed at the inner bottom end of the processing area, and a thinning component is installed at the inner top end of the processing area.

[0011] Optionally, the clamping component includes a base frame, and the base frame is fixed at the middle of the bottom end of the processing area. A placement area is preset above the base frame. First electric push rods are installed on the inner walls on both sides above the base frame, and clamping blocks are connected to the tops of the two first electric push rods.

[0012] Optionally, the slicing component includes a hydraulic push rod, and the hydraulic push rod is installed inside the slicing body. The protruding top end of the hydraulic push rod is connected to an assembly frame, and a first motor is installed in the middle of the assembly frame. The output end of the first motor is connected to a transmission rod, and the end of the transmission rod is connected to a grinding wheel.

[0013] Optionally, the cleaning mechanism includes a first transmission lead screw, and the first transmission lead screw is installed above the inside of the side mounting frame. One end of the first transmission lead screw is connected and installed with a second motor, and a first lead screw sliding sleeve is screwed on the periphery of one side of the first transmission lead screw. The lower part of the first lead screw sliding sleeve is connected with a mounting frame, and sliding mounting frames are fixed on both sides of the bottom end of the mounting frame. A cleaning and drying assembly is jointly installed on the upper and lower sides of the mounting frame.

[0014] Optionally, an active guiding connection is formed between the sliding mounting frames fixed on both sides of the bottom end of the mounting frame and the sliding grooves provided at the bottom end of the side mounting frame and the processing area.

[0015] Optionally, the cleaning and drying assembly includes a water tank, and the water tank is installed on one side above the mounting frame. One side of the water tank is communicated with a first connecting pipe, and the end of the first connecting pipe is connected to a water pump. The other port of the water pump is connected to a second connecting pipe, and the end of the second connecting pipe is connected to a spray washing frame. A heater is installed on the other side above the mounting frame, and a heating pipe frame is installed below the mounting frame. Air blowers are installed on both sides below the heating pipe frame.

[0016] Compared with the prior art, the utility model has at least the following beneficial effects:

[0017] In the above solution, by setting up a film pressing protection mechanism, the staff can hold and open the pressing frame by using the mobility of the rotating hinge and the rotating frame. Then, the dried semiconductor wafer is placed in the cutting ring groove. Next, the staff can start the third motor and the fifth motor simultaneously. The third motor can drive the second transmission screw rod to rotate. At this time, the second screw sleeve interacting with the screw rod will drive the fixed frame and the rotating rod mounted in the middle of it to cooperate with the guiding rod to conduct film pulling treatment. The film is one end of the blue film outside the film roller. The fifth motor installed at one end of the film roller needs to be started to cooperate with the relaxation of the blue film. During the process of the rotating rod cooperating with the transmission to stretch the blue film, the air jet frame installed at the front end of the fixed frame can perform secondary cleaning on the dust and impurities that may remain above the semiconductor wafer. When the film pulling length is appropriate, the staff can hold the guide plate and move it along the direction of the pulled film. Since a scraping plate connected by a telescopic rod and a return spring is provided below the guide plate, the scraping plate can further flatten the fit between the blue film and the semiconductor wafer along the surface of the blue film to avoid the appearance of wrinkles and unevenness. Next, the staff closes the pressing frame and starts the second electric push rod to make the cutting knife connected to its bottom end descend to cut the blue film along a part of the cutting ring groove. After cutting, when the fixed frame and the rotating rod return to their original positions, the staff starts the fourth motor connected to one end of the rotating rod, so that the rotating rod can wind up and tighten the blue film that has just been used to avoid the appearance of scattered damage. Subsequently, the staff can take out the semiconductor wafer with the film pasted on it, and the dicing component in the dicing machine body can perform dicing treatment on the semiconductor wafer.

[0018] By setting up a thinning mechanism, the staff first places the semiconductor wafer to be processed in the placement area of the processing area in the middle of the thinning machine body. Then, two first electric push rods are started, so that the clamping blocks connected to the ends of the two push rods can effectively clamp and stabilize the two sides of the semiconductor wafer. Subsequently, the hydraulic push rod is started to lower the assembly frame. During this process, the staff starts the first motor inside the assembly frame, and under the transmission of the transmission rod, the grinding wheel performs surface thinning treatment on the clamped semiconductor wafer.

[0019] By setting up a cleaning mechanism, during the process of the grinding wheel thinning the semiconductor wafer, a large amount of dust and impurities are generated, and some of them will accumulate on the upper surface of the semiconductor wafer. After processing, the staff can start the second motor to make the first transmission screw rod rotate. At this time, the first screw sleeve interacting with the screw rod will drive the mounting frame to perform a lateral displacement in cooperation with the guiding of the sliding mounting frame. Since a water tank is provided above the mounting frame, the staff can start the water pump during the movement of the mounting frame. Under the guidance of the first connecting pipe and the second connecting pipe, the water in the water tank will be sprayed out from the spray washing frame, and the upper surface of the semiconductor wafer can be comprehensively washed in sequence in cooperation with the movement of the mounting frame. Immediately afterwards, the staff starts the heater to transfer the heat to the heating pipe rack, and in cooperation with the two operating blowers, the heat can be led to the surface of the semiconductor wafer that has just been cleaned, so as to achieve the effect of auxiliary drying and provide convenience for subsequent film pasting. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings incorporated herein and constituting a part of this specification illustrate embodiments of the present utility model, and together with the specification are further used to explain the principles of the present utility model and enable those skilled in the relevant art to implement and use the present utility model.

[0021] Figure 1 It is a three-dimensional structure schematic diagram of a semiconductor wafer automatic processing device;

[0022] Figure 2 It is a schematic diagram of the internal structure of the wafer thinning body of a semiconductor wafer automatic processing device;

[0023] Figure 3 It is a schematic diagram of a partial internal structure of the wafer thinning body of a semiconductor wafer automatic processing device;

[0024] Figure 4 It is a schematic diagram of a partial three-dimensional structure of a semiconductor wafer automatic processing device;

[0025] Figure 5 It is a schematic diagram of the top view structure of the film pressing protection mechanism of a semiconductor wafer automatic processing device;

[0026] Figure 6 It is a schematic diagram of a partial structure of the film stroking assembly of a semiconductor wafer automatic processing device;

[0027] Figure 7 It is a schematic diagram of the upper and lower parts of the press-fitting frame of a semiconductor wafer automatic processing device.

[0028] Reference Signs:

[0029] 1. Thin-cutting body; 2. Processing area; 3. Side mounting frame; 4. Thin-cutting mechanism; 41. Clamping assembly; 411. Base frame; 412. Placement area; 413. First electric push rod; 414. Clamping block; 42. Thin-cutting assembly; 421. Hydraulic push rod; 422. Assembly frame; 423. First motor; 424. Transmission rod; 425. Grinding wheel; 5. Cleaning mechanism; 51. First transmission lead screw; 52. Second motor; 53. First lead screw sliding sleeve; 54. Mounting frame; 55. Sliding mounting frame; 56. Cleaning and drying assembly; 561. Water tank; 562. First connecting pipe; 563. Water pump; 564. Second connecting pipe; 565. Spray washing frame; 566. Heater; 567. Heating pipe frame; 568. Fan; 6. Film-pressing body; 7. Film-pressing protection mechanism; 71. Rotating frame; 72. Rotating hinge; 73. Pressing mounting frame; 74. Carrying box; 75. Film mounting roller; 76. Blue film; 77. Film-pressing assembly; 771. Second transmission lead screw; 772. Third motor; 773. Second lead screw sliding sleeve; 774. Fixed mounting frame; 775. Fourth motor; 776. Carrying rotating rod; 777. Guide mounting rod; 778. Fifth motor; 78. Jetting frame; 79. Film-smoothing assembly; 791. Guide slot; 792. Guide plate; 793. Telescopic rod; 794. Return spring; 795. Scraping and smoothing plate; 710. Reserved ring groove; 711. Cutting ring groove; 712. Second electric push rod; 713. Circumferential cutting knife; 8. Scribing body.

[0030] As shown in the figure, in order to clearly implement the structure of the embodiments of the present invention, specific structures and devices are marked in the figure. However, this is only for schematic needs and is not intended to limit the present invention to this specific structure, device and environment. According to specific needs, those of ordinary skill in the art can adjust or modify these devices and environments. Detailed implementation manners

[0031] The following will describe in detail a semiconductor wafer automatic processing device provided by the present invention in conjunction with the accompanying drawings and specific embodiments. At the same time, it should be noted here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments. For some well-known technologies, those skilled in the art can also adopt other alternative methods for implementation; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0032] It should be pointed out that in the specification, it is mentioned that "an embodiment", "embodiment", "exemplary embodiment", "some embodiments", etc. indicate that the described embodiments may include specific features, structures or characteristics, but not every embodiment necessarily includes the specific features, structures or characteristics. In addition, when combining embodiments to describe specific features, structures or characteristics, implementing such features, structures or characteristics in combination with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the relevant art.

[0033] Generally, terms can be understood, at least in part, from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or can be used to describe a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood to not necessarily be intended to convey a set of exclusive factors, but rather, depending at least in part on the context, can alternatively allow for the existence of other factors that are not necessarily expressly described.

[0034] It will be understood that the meanings of "on", "above", and "over" in the present utility model should be construed in the broadest manner, such that "on" not only means "directly on" something, but also includes the meaning of being "on" something with intervening features or layers therebetween, and "above" or "over" not only means "above" or "over" something, but can also include the meaning of being "above" or "over" something with no intervening features or layers therebetween.

[0035] In addition, spatial relative terms such as "under", "below", "lower", "above", "upper", etc. may be used herein for convenience of description to describe the relationship of one element or feature to another or other elements or features, as shown in the drawings. The spatial relative terms are intended to cover different orientations in the use or operation of the device in addition to the orientation depicted in the drawings. The device may be oriented in other ways, and the spatial relative descriptors used herein may be interpreted accordingly.

[0036] As Figures 1 to 4As shown in the figure, an embodiment of the present utility model provides a semiconductor wafer automatic processing device, including a wafer thinning machine body 1. A processing area 2 is provided in the middle of the wafer thinning machine body 1, and a side mounting frame 3 is fixed on one side of the processing area 2. A wafer thinning mechanism 4 is installed in the middle of the processing area 2, and a cleaning mechanism 5 is installed inside the side mounting frame 3. A film pressing machine body 6 is provided on one side of the wafer thinning machine body 1, and a film pressing protection mechanism 7 is installed above the film pressing machine body 6. A dicing machine body 8 is installed on the other side of the film pressing machine body 6. The wafer thinning mechanism 4 includes a clamping assembly 41, and the clamping assembly 41 is installed at the inner bottom end of the processing area 2. The clamping assembly 41 includes a base frame 411, and the base frame 411 is fixed at the middle bottom end of the processing area 2. A placement area 412 is preset above the base frame 411. Inner walls on both sides above the base frame 411 are installed with first electric push rods 413, and the top ends of the two first electric push rods 413 are connected with clamping blocks 414. A wafer thinning assembly 42 is installed at the inner top end of the processing area 2. The wafer thinning assembly 42 includes a hydraulic push rod 421, and the hydraulic push rod 421 is installed inside the wafer thinning machine body 1. The extended top end of the hydraulic push rod 421 is connected with an assembly frame 422, and a first motor 423 is installed in the middle of the assembly frame 422. The output end of the first motor 423 is connected with a transmission rod 424, and the end of the transmission rod 424 is connected with a grinding wheel 425. The staff pre-places the semiconductor wafer to be processed in the placement area 412 of the processing area 2 in the middle of the wafer thinning machine body 1, and then starts the two first electric push rods 413, so that the clamping blocks 414 connected to the ends of the two push rods can effectively clamp and stabilize the two sides of the semiconductor wafer. Then, the hydraulic push rod 421 is started to lower the assembly frame 422. During this process, the staff starts the first motor 423 inside the assembly frame 422, and under the transmission of the transmission rod 424, the grinding wheel 425 performs surface thinning processing on the clamped semiconductor wafer.

[0037] Among them, the cleaning mechanism 5 includes a first driving lead screw 51, and the first driving lead screw 51 is installed above the interior of the side mounting frame 3. One end of the first driving lead screw 51 is connected and installed with a second motor 52. A first lead screw sliding sleeve 53 is screwed on the periphery of one side of the first driving lead screw 51. A mounting frame 54 is connected below the first lead screw sliding sleeve 53. Sliding mounting frames 55 are fixed on both sides of the bottom end of the mounting frame 54. An active guiding connection is formed between the sliding mounting frames 55 fixed on both sides of the bottom end of the mounting frame 54 and the sliding grooves provided at the bottom end of the side mounting frame 3 and the processing area 2. A cleaning and drying assembly 56 is jointly installed on the upper and lower sides of the mounting frame 54. The cleaning and drying assembly 56 includes a water tank 561, and the water tank 561 is installed on one side above the mounting frame 54. A first connecting pipe 562 is communicated on one side of the water tank 561. The end of the first connecting pipe 562 is connected with a water pump 563. The other port of the water pump 563 is connected with a second connecting pipe 564. The end of the second connecting pipe 564 is connected with a spray washing frame 565. A heater 566 is installed on the other side above the mounting frame 54. A heating pipe frame 567 is installed below the mounting frame 54. Air blowers 568 are installed on both sides below the heating pipe frame 567. During the process of slicing the semiconductor wafer by the grinding wheel 425, a large amount of dust and impurities are generated, and some of them will accumulate on the upper surface of the semiconductor wafer. After the processing is completed, the operator can start the second motor 52 to rotate the first driving lead screw 51. At this time, the first lead screw sliding sleeve 53 acting with the lead screw will drive the mounting frame 54 to perform a lateral displacement in cooperation with the guiding of the sliding mounting frame 55. Since the water tank 561 is provided above the mounting frame 54, the operator can start the water pump 563 during the movement of the mounting frame 54. Under the guidance of the first connecting pipe 562 and the second connecting pipe 564, the water in the water tank 561 will be sprayed out from the spray washing frame 565, and the upper surface of the semiconductor wafer can be comprehensively rinsed in sequence in cooperation with the movement of the mounting frame 54. Then the operator starts the heater 566 to transfer its heat to the heating pipe frame 567. In cooperation with the two operating air blowers 568, the heat can be led to the surface of the semiconductor wafer that has just been cleaned, so as to achieve the effect of auxiliary drying and provide convenience for subsequent film sticking.

[0038] Such as Figures 1 to 7As shown in the figure, the film pressing protection mechanism 7 includes a rotating frame 71, and the rotating frame 71 is installed on one side of the top of the film pressing machine body 6. A rotating hinge 72 is movably arranged around the rotating frame 71, and a pressing frame 73 is fixed on one side of the rotating hinge 72. Loading boxes 74 are fixed on both sides of the top of the film pressing machine body 6, and a film loading roller 75 is installed on one side of the top of the film pressing machine body 6. A blue film 76 is sleeved around the film loading roller 75. Film pressing components 77 are installed inside and outside the two loading boxes 74. The film pressing component 77 includes a second transmission screw rod 771, and the second transmission screw rod 771 is installed inside one of the loading boxes 74. One end of the second transmission screw rod 771 is connected and installed with a third motor 772, and a second screw sleeve 773 is screwed on the periphery of one side of the second transmission screw rod 771. A fixed mounting frame 774 is fixed inside the second screw sleeve 773, and a fourth motor 775 is installed in the middle of one side of the fixed mounting frame 774. The output end of the fourth motor 775 is connected with a loading rotating rod 776. A guiding rod 777 is fixed inside the other loading box 74. One end of the film loading roller 75 is connected and installed with a fifth motor 778, and an air jet frame 78 is fixed at the front end of the fixed mounting frame 774. A film smoothing component 79 is installed inside the two loading boxes 74. The film smoothing component 79 includes a guiding groove 791, and the guiding groove 791 is opened inside the two loading boxes 74. A guiding plate 792 is movably arranged inside the two guiding grooves 791, and two telescopic rods 793 are fixedly installed on both sides of the bottom end of the guiding plate 792. A return spring 794 is sleeved around the telescopic rod 793, and one end of the telescopic rod 793 is connected with a scraping and smoothing plate 795. The two ends of the return spring 794 are respectively connected with the guiding plate 792 and the scraping and smoothing plate 795. A reserved ring groove 710 is opened on one side of the top of the film pressing machine body 6, and a cutting ring groove 711 is opened around the reserved ring groove 710. A second electric push rod 712 is installed at the top of the pressing frame 73, and a cutting ring knife 713 is connected to the extending end of the second electric push rod 712. The staff holds and opens the pressing frame 73 by using the mobility of the rotating hinge 72 and the rotating frame 71, and then places the above-mentioned dried semiconductor wafer in the cutting ring groove 711. Then, the staff can start the third motor 772 and the fifth motor 778 synchronously. Among them, the third motor 772 can drive the second transmission screw rod 771 to rotate. At this time, the second screw sleeve 773 interacting with the screw rod will drive the fixed mounting frame 774 and the loading rotating rod 776 in the middle of it to cooperate with the guiding of the guiding rod 777 to perform film pulling treatment. The film belongs to one end of the blue film 76 outside the film loading roller 75. The fifth motor 778 arranged at one end of the film loading roller 75 needs to be started to cooperate with relaxing the blue film 76. During the process of the loading rotating rod 776 cooperating with the transmission to stretch the blue film 76, the air jet frame 78 arranged at the front end of the fixed mounting frame 774 can perform secondary cleaning on the dust and impurities that may be left above the semiconductor wafer. When the film pulling length is appropriate, the staff can hold the guiding plate 792 and make it move along the direction of the pulled film. Since a scraping and smoothing plate 795 connected by a telescopic rod 793 and a return spring 794 is arranged below the guiding plate 792,Therefore, its scraping and smoothing plate 795 can further flatten the fit between it and the semiconductor wafer along the surface of the blue film 76, avoiding the appearance of wrinkles and unevenness. Next, the operator closes the pressing frame 73 and starts the second electric push rod 712 to lower the cutting ring knife 713 connected to its bottom end to cut the blue film 76 along a part of the cutting ring groove 711. After the cutting is completed, when the fixing frame 774 and the carrying rotating rod 776 return to their original positions, the operator starts the fourth motor 775 connected to one end of the carrying rotating rod 776, so that the carrying rotating rod 776 can wind up and tighten the just-used blue film 76 to avoid the phenomenon of scattering and damage. Subsequently, the operator can take out the semiconductor wafer with the film attached, and the dicing component in the dicing machine body 8 can perform dicing on the semiconductor wafer.,

[0039] The working principle of the technical solution provided by the present utility model is as follows:

[0040] The staff pre - places the semiconductor wafer to be processed in the placement area 412 of the processing area 2 in the middle of the wafer thinning machine body 1. Then, two first electric push rods 413 are started, so that the clamping blocks 414 connected to the ends of the two push rods can effectively clamp and stabilize the two sides of the semiconductor wafer. After that, the hydraulic push rod 421 is started to lower the assembly frame 422. During this process, the staff starts the first motor 423 inside the assembly frame 422. Driven by the transmission rod 424, the grinding wheel 425 performs surface thinning treatment on the clamped semiconductor wafer. Secondly, during the thinning process of the grinding wheel 425 on the semiconductor wafer, a large amount of dust and impurities are generated, and some of them will accumulate on the upper surface of the semiconductor wafer. After the processing is completed, the staff can start the second motor 52 to rotate the first transmission lead screw 51. At this time, the first lead screw slider 53 interacting with the lead screw will drive the mounting frame 54 to move horizontally in cooperation with the guidance of the sliding mounting frame 55. Since there is a water tank 561 above the mounting frame 54, the staff can start the water pump 563 during the movement of the mounting frame 54. Under the guidance of the first connecting pipe 562 and the second connecting pipe 564, the water in the water tank 561 will be sprayed out from the spray washing frame 565, and the upper surface of the semiconductor wafer can be washed comprehensively in sequence with the movement of the mounting frame 54. Immediately afterwards, the staff starts the heater 566, so that the heat is transmitted to the heating pipe rack 567. Cooperating with the two operating blowers 568, the heat can be led to the surface of the semiconductor wafer that has just been cleaned, so as to achieve the effect of auxiliary drying, providing convenience for subsequent film sticking. Finally, the staff uses the mobility of the rotating hinge 72 and the rotating frame 71 to manually open the pressing frame 73. Then, the dried - up semiconductor wafer is placed in the cutting ring groove 711. Then, the staff can start the third motor 772 and the fifth motor 778 synchronously. Among them, the third motor 772 can drive the second transmission lead screw 771 to rotate. At this time, the second lead screw slider 773 interacting with the lead screw will drive the fixed mounting frame 774 and the rotating rod 776 in the middle to perform film pulling treatment in cooperation with the guidance of the guiding rod 777. The film belongs to one end of the blue film 76 outside the film loading roller 75. The fifth motor 778 provided at one end of the film loading roller 75 needs to be started to cooperate with the relaxation of the blue film 76. During the process of the rotating rod 776 cooperating with the transmission to stretch the blue film 76, the air jet frame 78 provided at the front end of the fixed mounting frame 774 can perform secondary cleaning on the dust and impurities that may remain above the semiconductor wafer. When the film pulling length is appropriate, the staff can hold the guide plate 792 and move it along the direction of the pulled film. Since there is a scraping plate 795 connected by a telescopic rod 793 and a return spring 794 below the guide plate 792, the scraping plate 795 can further flatten the fit between the blue film 76 and the semiconductor wafer along the surface of the blue film 76, avoiding the appearance of wrinkles and unevenness. Next, the staff closes the pressing frame 73 and starts the second electric push rod 712 to lower the cutting ring knife 713 connected to its bottom end to cut the blue film 76 along a part of the cutting ring groove 711. After the cutting is completed, when the fixed mounting frame 774 and the rotating rod 776 return to their original positions,The operator starts the fourth motor 775 connected to one end of the carrying rod 776, so that the carrying rod 776 can wind and compact the just-used blue film 76 to avoid scattering and damage. Subsequently, the operator can take out the semiconductor wafer with the film pasted on it, and the dicing component in the dicing machine body 8 can perform dicing on the semiconductor wafer.

[0041] The present utility model covers any substitutions, modifications, equivalent methods and solutions made on the essence and scope of the present utility model. In order to enable the public to have a thorough understanding of the present utility model, specific details are described in detail in the following preferred embodiments of the present utility model. However, those skilled in the art can fully understand the present utility model without the description of these details. In addition, well-known methods, processes, procedures, components and circuits are not described in detail to avoid unnecessary confusion to the essence of the present utility model.

[0042] The above are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present utility model.

Claims

1. A semiconductor wafer automatic processing equipment, characterized in that: It comprises a thinning machine body, a processing area is provided in the middle of the thinning machine body, and a side mounting frame is fixed on one side of the processing area, a thinning mechanism is installed in the middle of the processing area, a cleaning mechanism is installed inside the side mounting frame, a film pressing machine body is provided on one side of the thinning machine body, and a film pressing protection mechanism is installed above the film pressing machine body, a dicing machine body is installed on the other side of the film pressing machine body, the film pressing protection mechanism comprises a rotating frame, and the rotating frame is installed on one side of the top of the film pressing machine body, a rotating hinge is movable around the rotating frame, and a pressing frame is fixed on one side of the rotating hinge, Carrying boxes are fixed on both sides of the top of the film pressing body, and a film loading roller is installed on one side of the top of the film pressing body, and a blue film is sleeved around the periphery of the film loading roller. Film pressing assemblies are installed inside and outside the two carrying boxes, and the film pressing assembly includes a fixing frame, and a jet frame is fixed to the front end of the fixing frame, and film caressing assemblies are installed on the inner sides of the two carrying boxes. A reserved annular groove is opened on one side of the top of the film pressing body, and a cutting annular groove is opened around the reserved annular groove. A second electric push rod is installed on the top of the pressing frame, and a ring cutting knife is connected to the protruding end of the second electric push rod.

2. The semiconductor wafer automatic processing equipment according to claim 1, characterized in that: The film pressing assembly includes a second transmission screw, and the second transmission screw is installed inside one of the carrying boxes, one end of the second transmission screw is connected to a third motor, and a second screw sleeve is screwed on one side of the second transmission screw, a fixing frame is fixed on the inner side of the second screw sleeve, and a fourth motor is installed in the middle of one side of the fixing frame, the output end of the fourth motor is connected to a carrying rotating rod, a guide rod is fixed inside the other carrying box, and one end of the film loading roller is connected to a fifth motor.

3. The semiconductor wafer automatic processing equipment according to claim 1, characterized in that: The film-stroking assembly includes a guide groove, and the guide groove is opened on the inner side of the two carrying boxes. A guide plate is movably arranged on the inner side of the two guide grooves, and telescopic rods are fixedly installed on both sides of the bottom end of the guide plate. A reset spring is arranged around the periphery of the telescopic rod, and one end of the telescopic rod is connected to a scraping plate.

4. The semiconductor wafer automatic processing equipment according to claim 3, characterized in that: The two ends of the return spring are respectively connected with a guide plate and a scraping plate.

5. The semiconductor wafer automatic processing equipment according to claim 1, characterized in that: The thinning mechanism comprises a clamping assembly, and the clamping assembly is installed at the inner bottom end of the processing area, and the inner top end of the processing area is installed with a thinning assembly.

6. The semiconductor wafer automatic processing equipment according to claim 5, characterized in that: The clamping assembly includes a base frame, and the base frame is fixed at the middle of the bottom end of the processing area. A placement area is preset above the base frame. First electric push rods are installed on the inner walls on both sides above the base frame, and clamping blocks are connected to the top ends of the two first electric push rods.

7. The semiconductor wafer automatic processing equipment according to claim 5, characterized in that: The thinning assembly includes a hydraulic push rod, and the hydraulic push rod is installed inside the thinning machine body. The extended top end of the hydraulic push rod is connected to an assembly frame, and a first motor is installed in the middle of the assembly frame. The output end of the first motor is connected to a transmission rod, and the end of the transmission rod is connected to a grinding wheel.

8. The semiconductor wafer automatic processing equipment according to claim 1, characterized in that: The cleaning mechanism includes a first transmission screw, and the first transmission screw is installed on the upper inner part of the side mounting frame. One end of the first transmission screw is connected to a second motor, and a first screw sleeve is screwed on one side of the first transmission screw. A mounting frame is connected below the first screw sleeve, and sliding frames are fixed on both sides of the bottom end of the mounting frame. The upper and lower sides of the mounting frame are jointly installed with cleaning and drying components.

9. The semiconductor wafer automatic processing equipment according to claim 8, characterized in that: A movable guiding connection is formed between the sliding mounting frames fixed on both sides of the bottom end of the mounting frame and the side mounting frames and the sliding grooves arranged at the bottom end of the processing area.

10. The semiconductor wafer automatic processing equipment according to claim 8, characterized in that: The cleaning and drying assembly includes a water tank, and the water tank is installed on one side above the mounting frame, one side of the water tank is connected to a first connecting pipe, and the end of the first connecting pipe is connected to a water pump, the other port of the water pump is connected to a second connecting pipe, and the end of the second connecting pipe is connected to a spray rack, a heater is installed on the other side above the mounting frame, and a heating pipe rack is installed below the mounting frame, and fans are installed on both sides below the heating pipe rack.

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