Deformation-resistant silicon wafer carrier plate

Abstract

The utility model provides an anti-deformation silicon wafer carrier plate, which comprises an integrally formed base, the base comprises a bottom plate and side plates arranged around the bottom plate, the bottom of the bottom plate is provided with a first reinforcing strip, a second reinforcing strip and a reinforcing ring, the first reinforcing strip and the second reinforcing strip are respectively connected with the joint positions of the side plates in a staggered manner, and the reinforcing ring is arranged in the middle of the bottom of the bottom plate. When the corner position of the base is impacted by external force, the base is prevented from being deformed through staggered arrangement of the first reinforcing strips and the second reinforcing strips, and when the corner position of the base is impacted by external force, the base is prevented from being deformed through staggered arrangement of the third reinforcing strips and the third reinforcing strips. Stress is conducted through the third reinforcing strips, and acting force is dispersed through the cambered surfaces of the reinforcing rings, so that deformation of the base is prevented, and deformation resistance of the base in all directions is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of carrier plates, and particularly relates to a silicon wafer carrier plate with anti-deformation performance. Background Art

[0002] In the manufacturing process of solar cells (especially silicon-based solar cells), PVD (Physical Vapor Deposition) coating is a key step, which is crucial for improving the photoelectric conversion efficiency of solar cells. In the PVD coating process, silicon wafers need to be placed on a carrier plate. The carrier plate acts as a carrier to hold the silicon wafers, and then a thin film is coated on the silicon wafers through a coating device. For example, Chinese patent document CN205258601U discloses a silicon wafer carrier plate for bottom coating.

[0003] However, when the above-mentioned silicon wafer carrier plate is in use, when the silicon wafer carrier plate is deformed under the action of external forces (such as extrusion, impact, etc.), the deformation is transmitted to the silicon wafers, which will cause the silicon wafers to be damaged, such as chipping or cracking, and become defective products. Summary of the Utility Model

[0004] Aiming at the deficiencies in the prior art, the purpose of the present utility model is to provide a silicon wafer carrier plate with anti-deformation performance to solve the problems mentioned in the above background art section.

[0005] The present utility model is realized through the following technical solutions:

[0006] A silicon wafer carrier plate with anti-deformation performance includes an integrally formed base. The base includes a bottom plate and side plates arranged around the bottom plate. The bottom of the bottom plate is provided with a first reinforcing strip and a second reinforcing strip that are respectively and cross-connected to the intersection positions of the side plates, a reinforcing ring centrally arranged at the bottom of the bottom plate, and a third reinforcing strip vertically connecting the side plates and the reinforcing ring.

[0007] Furthermore, it further includes a number of first clamping strips and second clamping strips arranged alternately. The first clamping strips and the second clamping strips divide the top of the base into a number of coating windows.

[0008] Furthermore, the first clamping strip is provided with a first clamping groove for the second clamping strip to be embedded, the second clamping strip is provided with a second clamping groove for the first clamping strip to be embedded, and the first clamping groove and the second clamping groove are in alignment with each other.

[0009] Furthermore, both the first clamping strip and the second clamping strip are detachably connected to the base.

[0010] Furthermore, the first clamping strip, the second clamping strip, and the side plates are all provided with supporting parts facing the coating windows, and the supporting parts are provided with guiding inclined surfaces.

[0011] The beneficial effects of the utility model are: a deformation-resistant silicon wafer carrier, including an integrally formed base, the base including a bottom plate and a side plate arranged around the bottom plate, the bottom of the bottom plate is provided with a first reinforcement strip and a second reinforcement strip respectively staggered to connect the junction positions of the side plates, a reinforcement ring centrally arranged at the bottom of the bottom plate, and a third reinforcement strip vertically connected to the side plate and the reinforcement ring, when the corner position of the base is impacted by external force, the first reinforcement strip and the second reinforcement strip are staggered to prevent the base from deformation, when the corner position of the base is impacted by external force, the force is transmitted through the third reinforcement strip and the force is dispersed through the arc surface of the reinforcement ring to prevent the base from deformation, thereby achieving deformation resistance of the base in all directions. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional diagram of the utility model.

[0013] Figure 2 It is another three-dimensional diagram of the utility model.

[0014] Figure 3 It is an exploded view of the utility model.

[0015] The above drawings include the following reference numerals:

[0016] 1. Base; 11. Bottom plate; 12. Side plate; 13. First reinforcement strip; 14. Second reinforcement strip; 15. Reinforcement ring; 16. Third reinforcement strip; 2. First clamping strip; 21. First clamping slot; 3. Second clamping strip; 31. Second clamping slot; 4. Support portion; 41. Guide slope; 5. Coating window. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0018] Reference Figures 1 to 3 As shown, a deformation-resistant silicon wafer carrier includes a base 1, which can be integrally formed by injection molding or the like. The base 1 includes a bottom plate 11 and a side plate 12 arranged around the bottom plate 11. The bottom of the bottom plate 11 is provided with a first reinforcement strip 13 and a second reinforcement strip 14 which are respectively staggeredly connected to the junction positions of the side plates 12, a reinforcement ring 15 centrally arranged at the bottom of the bottom plate 11, and a third reinforcement strip 16 vertically connected to the side plates 12 and the reinforcement ring 15.

[0019] When the corner position of the base 1 is subjected to an external force impact, the staggered arrangement of the first reinforcing strip 13 and the second reinforcing strip 14 is adopted to prevent the base 1 from deforming. When the corner position of the base 1 is subjected to an external force impact, the force is conducted through the third reinforcing strip 16 and the acting force is dispersed through the arc surface of the reinforcing ring 15 to prevent the base 1 from deforming, thereby realizing the base 1 in all directions.

[0020] It also includes a number of first clamping strips 2 and second clamping strips 3 arranged in a staggered manner. The first clamping strips 2 and the second clamping strips 3 divide the top of the base 1 into a number of coating windows 5. During use, the silicon wafers are placed in the coating windows 5 to achieve the positioning function of the silicon wafers.

[0021] The first clamping strip 2 is provided with a first clamping groove 21 for the second clamping strip 3 to be embedded. The second clamping strip 3 is provided with a second clamping groove 31 for the first clamping strip 2 to be embedded. The first clamping groove 21 and the second clamping groove 31 are mutually aligned. When subjected to an external force, the first clamping strip 2 and the second clamping strip 3 support each other to prevent deformation.

[0022] Both the first clamping strip 2 and the second clamping strip 3 are detachably connected to the base 1. Therefore, when silicon wafers of different model sizes are used with the silicon wafer carrier of the present invention, the sizes of the formed coating windows 5 can be adjusted by replacing the first clamping strip 2 and the second clamping strip 3, so that the base 1 can be used with silicon wafers of any model size.

[0023] The first clamping strip 2, the second clamping strip 3 and the side plate 12 are all provided with a support portion 4 facing the coating window 5. The support portion 4 is provided with a guiding inclined surface 41. The silicon wafer only has a four-side line contact with the guiding inclined surface 41. When the silicon wafer is inserted into the coating window 5, there is a downward sliding trend, making it lean more stably on the base 1, ensuring the stability during the process transmission and reducing the jitter and fragmentation.

[0024] Refer to Figure 3 As shown, the first clamping strip 2 and the support portion 4, the second clamping strip 3 and the support portion 4, and the side plate 12 and the support portion 4 can be integrally formed by injection molding or the like respectively.

[0025] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0026] In the description of the present utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0027] The above is only the preferred embodiment of the present utility model and is not intended to limit the present utility model. For those skilled in the art, the present utility model may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A deformation-resistant silicon wafer carrier, characterized in that: The invention comprises an integrally formed base (1), wherein the base (1) comprises a bottom plate (11) and a side plate (12) arranged around the bottom plate (11), wherein the bottom of the bottom plate (11) is provided with a first reinforcement strip (13) and a second reinforcement strip (14) respectively connected to the junction positions of the side plates (12) in an interlaced manner, a reinforcement ring (15) centrally arranged at the bottom of the bottom plate (11), and a third reinforcement strip (16) vertically connected to the side plates (12) and the reinforcement ring (15).

2. The anti-deformation silicon wafer carrier according to claim 1, characterized in that: It also comprises a plurality of first card strips (2) and second card strips (3) arranged in a staggered manner, wherein the first card strips (2) and the second card strips (3) separate the top of the base (1) into a plurality of coating windows (5).

3. The anti-deformation silicon wafer carrier according to claim 2, characterized in that: The first card strip (2) is provided with a first card slot (21) for the second card strip (3) to be embedded in, and the second card strip (3) is provided with a second card slot (31) for the first card strip (2) to be embedded in, and the first card slot (21) and the second card slot (31) are aligned with each other.

4. The anti-deformation silicon wafer carrier according to claim 2, characterized in that: The first clamping strip (2) and the second clamping strip (3) are both detachably connected to the base (1).

5. The anti-deformation silicon wafer carrier according to claim 2, characterized in that: The first clamping strip (2), the second clamping strip (3) and the side plate (12) are all provided with a support portion (4) facing the coating window (5), and the support portion (4) is provided with a guiding inclined surface (41).

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