Adjustable silicon wafer support plate positioning device

Abstract

The utility model discloses an adjustable silicon wafer support plate positioning device. The positioning device comprises a carrier plate and a plurality of positioning pieces, and the positioning pieces are arranged in the carrier plate in a front-back moving mode. One end of the carrier plate is provided with a socket for inserting a silicon wafer into the carrier plate; the welding rod positioning device further comprises a plurality of positioning blocks which are distributed on the upper end face of the positioning piece at intervals in the length direction of the positioning piece, and a positioning groove used for containing a welding rod is formed between every two adjacent positioning blocks. At least one end face of the positioning piece is provided with a second limiting groove, and when the silicon wafer is inserted into the carrier plate, the second limiting groove abuts against the silicon wafer; after a silicon wafer is inserted into the carrier plate through the insertion opening, the second limiting groove is clamped into the edge of the silicon wafer through the sliding positioning piece, and the second limiting groove is tightly matched with the edge of the silicon wafer, so that the silicon wafer is limited, and the fixing effect of the silicon wafer on the carrier plate is enhanced; and the welding rod can be kept at a fixed position in the welding process through the design of the positioning groove, and the welding quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to an adjustable positioning device for a silicon wafer carrier plate. Background Art

[0002] A solar panel is a core component of a photovoltaic system, which mainly consists of solar cells, tempered glass, EVA, a backplane, and an aluminum alloy frame; among them, the solar cell is the core part of photoelectric conversion and can convert the absorbed light energy into electrical energy.

[0003] A silicon wafer is the core material of a solar cell. Through a series of complex technological processes, the silicon wafer is converted into a solar cell that can convert solar energy into electrical energy; in the process of manufacturing solar cells, multiple silicon wafers need to be sequentially placed on a carrier plate, and then solder tapes or conductive materials are placed at the positions on the silicon wafers that need to be welded. Equipment such as a welding machine or an electric iron is used for heating to melt and bond the solder tapes or conductive materials to the surface of the silicon wafers. Multiple silicon wafers are connected end to end to form a whole battery panel.

[0004] The existing carrier plate has no positioning device to position the silicon wafers. When the silicon wafers and the solder tapes are welded, the positions are prone to shift, resulting in the solder tapes being unable to be accurately placed at the predetermined welding positions on the silicon wafers during welding; inaccurate positioning may also lead to welding defects such as poor soldering and de-soldering, thereby increasing the defective rate of the products. Summary of the Utility Model

[0005] In view of the problems existing in the above-mentioned prior art, the utility model provides an adjustable positioning device for a silicon wafer carrier plate, which can effectively solve the problems existing in the above-mentioned prior art.

[0006] The technical solution of the utility model is as follows:

[0007] According to one aspect of the utility model, it includes: a carrier plate and a plurality of positioning members, and the plurality of positioning members are movably arranged in the carrier plate in the front and rear directions; one end of the carrier plate is provided with a socket for inserting a silicon wafer into the carrier plate.

[0008] It further includes a plurality of positioning blocks, and the plurality of positioning blocks are spaced apart along the length direction of the positioning members on the upper end surface of the positioning members. A positioning groove for placing welding rods is formed between two adjacent positioning blocks.

[0009] At least one end surface of the positioning member is provided with a second limiting groove. When the silicon wafer is inserted into the carrier plate, the second limiting groove abuts against the silicon wafer.

[0010] Furthermore, the positioning block extends along the width direction of the positioning member and is provided with a protrusion, and a second limiting groove is formed between the protrusion and the positioning member.

[0011] Further, the carrier board includes a first fixing rod, a second fixing rod, a third fixing rod, a fourth fixing rod and a bottom plate. The first fixing rod, the second fixing rod, the third fixing rod and the fourth fixing rod are connected end to end to form a closed frame; the bottom plate is fixedly arranged at the bottom of the frame.

[0012] Further, the second fixing rod and the third fixing rod are both provided with mounting grooves, and the left and right ends of the positioning member are respectively inserted into the mounting grooves.

[0013] Further, a first sliding groove is arranged in the mounting groove of the second fixing rod. A first fixing plate and a second fixing plate are arranged at the right end of the positioning member and extend towards the first sliding groove. A roller is assembled between the first fixing plate and the second fixing plate, and the roller slides in the first sliding groove.

[0014] Further, at least two second sliding grooves are arranged in the mounting groove of the third fixing rod; at least two balls are assembled at the left end of the positioning member, and the two balls respectively slide in the two second sliding grooves.

[0015] Further, third limiting grooves are respectively arranged at the upper and lower ends of the positioning member located in the second sliding groove, and the two balls are respectively embedded in the two third limiting grooves; at least two limiting plates are further included, and the two limiting plates are respectively fixedly covered at the upper and lower ends of the positioning member. The limiting plates are provided with limiting holes, the balls are clamped between the third limiting grooves and the limiting plates, and one end of the ball is exposed outside the limiting hole.

[0016] Further, a mounting portion is arranged on the lower end surface of the positioning member, and one of the limiting plates is fixedly arranged in the mounting portion.

[0017] Further, a socket is arranged along the length direction of the third fixing rod.

[0018] Adopting the above technical solution, compared with the prior art, the beneficial effects of the present utility model are as follows:

[0019] Firstly, after the silicon wafer is inserted into the carrier board through the socket, the second limiting groove is made to snap into the edge of the silicon wafer by sliding the positioning member. The tight fit between the second limiting groove and the edge of the silicon wafer not only realizes the limitation of the silicon wafer, but also enhances the fixing effect of the silicon wafer on the carrier board; the design of the positioning groove enables the welding rod to maintain a fixed position during the welding process, thereby ensuring the accuracy and consistency of welding, which helps to reduce the deviation and error during the welding process and improve the welding quality.

[0020] Secondly, the roller can reduce the frictional resistance when the positioning member slides in the mounting groove of the second fixing rod. The roller can roll in the first sliding groove, and the friction coefficient can be reduced.

[0021] Thirdly, the ball can reduce the frictional resistance when the positioning member slides in the installation groove of the third fixing rod. Since the ball is spherical, the ball can roll on the second sliding groove, which can reduce the friction coefficient.

[0022] Fourthly, since the positioning member can slide in the carrier plate, the device can adapt to silicon wafers of different sizes. By adjusting the number of positioning members, the positioning requirements for silicon wafers of different specifications can be achieved, improving the versatility and flexibility of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 is a three-dimensional structural diagram of the present invention;

[0025] Figure 2 is a three-dimensional structural diagram of the positioning member in the present invention;

[0026] Figure 3 is an exploded structural diagram of the positioning member in the present invention;

[0027] Figure 4 is a three-dimensional structural diagram of the present invention with the fourth fixing rod removed;

[0028] Figure 5 is a three-dimensional structural diagram of the carrier plate in the present invention;

[0029] In the figure: carrier plate - 1, bottom plate - 11, first fixing rod - 12, first limiting groove - 121, second fixing rod - 13, first sliding groove - 131, third fixing rod - 14, socket - 141, second sliding groove - 142, fourth fixing rod - 15, installation groove - 16, positioning member - 2, second limiting groove - 21, positioning block - 22, positioning groove - 23, first fixing plate - 24, second fixing plate - 25, installation part - 26, third limiting groove - 261, roller - 3, limiting plate - 4, limiting hole - 41, ball - 5. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] The following will further describe the present utility model in detail in conjunction with the accompanying drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate the present utility model, but do not limit the scope of the present utility model. Similarly, the following embodiments are only partial embodiments of the present utility model rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present utility model.

[0031] As shown in Figures 1 to 5 the figure, the present solution provides an adjustable wafer carrier positioning device.

[0032] Please refer to Figures 1 to 5 , including: a carrier plate 1 and a plurality of positioning members 2. The plurality of positioning members 2 are movably arranged back and forth in the carrier plate 1; one end of the carrier plate 1 is provided with a socket 141 for inserting a wafer (not shown in the figure) into the carrier plate 1; the carrier plate 1 includes a first fixing rod 12, a second fixing rod 13, a third fixing rod 14, a fourth fixing rod 15 and a bottom plate 11. The first fixing rod 12, the second fixing rod 13, the third fixing rod 14 and the fourth fixing rod 15 are connected end to end to form a closed frame; the bottom plate 11 is fixedly arranged at the bottom of the frame. Preferably, the second fixing rod 13 and the third fixing rod 14 are both provided with installation grooves 16, and the left and right ends of the positioning member 2 are respectively inserted into the installation grooves 16. At least one end face of the positioning member 2 is provided with a second limiting groove 21. When the wafer is inserted into the carrier plate 1, the second limiting groove 21 abuts against the wafer. Preferably, a protrusion 221 extends along the width direction of the positioning block 22, and a second limiting groove 21 is formed between the protrusion 221 and the positioning member 2. The third fixing rod 14 is provided with a socket 141 along its length direction. The first fixing rod 12 is provided with a first limiting groove 121 for limiting the wafer. After the wafer is inserted into the carrier plate 1 through the socket 141, by sliding the positioning member 2, the second limiting groove 21 is engaged with the edge of the wafer. The tight fit between the second limiting groove 21 and the edge of the wafer not only realizes the limitation of the wafer but also enhances the fixing effect of the wafer on the carrier plate 1.

[0033] Please refer to Figure 2 and Figure 3 , further including a plurality of positioning blocks 22. The plurality of positioning blocks 22 are distributed at intervals along the length direction of the positioning member 2 on the upper end face of the positioning member 2. A positioning groove 23 for placing a welding rod (not shown in the figure) is formed between two adjacent positioning blocks 22; the positioning groove 23 is used for limiting the welding rod. The number and spacing of the plurality of positioning blocks 22 can be adjusted according to actual needs, and the number and spacing thereof are not limited herein. The design of the positioning groove 23 enables the welding rod to maintain a fixed position during the welding process, thereby ensuring the accuracy and consistency of welding. This helps to reduce the deviation and error during the welding process and improve the welding quality.

[0034] Please refer to Figures 1 to 5, a first sliding groove 131 is provided in the installation groove 16 of the second fixing rod 13. The right end of the positioning member 2 extends towards the first sliding groove 131 with a first fixing plate 24 and a second fixing plate 25. A roller 3 is assembled between the first fixing plate 24 and the second fixing plate 25, and the roller 3 slides in the first sliding groove 131. The roller 3 can reduce the frictional resistance when the positioning member 2 slides in the installation groove 16 of the second fixing rod 13. The roller 3 can roll in the first sliding groove 131, which can reduce the friction coefficient.

[0035] Please refer to Figures 1 to 5 , at least two second sliding grooves 142 are provided in the installation groove 16 of the third fixing rod 14; at least two balls 5 are assembled at the left end of the positioning member 2, and the two balls 5 slide in the two second sliding grooves 142 respectively. Third limiting grooves 261 are respectively provided at the upper and lower ends of the positioning member 2 located in the second sliding groove 142, and the two balls 5 are respectively embedded in the two third limiting grooves 261; at least two limiting plates 4 are further included, and the two limiting plates 4 are respectively fixedly covered at the upper and lower ends of the positioning member 2. The limiting plate 4 is provided with a limiting hole 41, and the ball 5 is clamped between the third limiting groove 261 and the limiting plate 4, and one end of the ball 5 is exposed outside the limiting hole 41. An installation portion 26 is provided on the lower end surface of the positioning member 2, and a limiting plate 4 is fixedly arranged in the installation portion 26. The ball 5 can reduce the frictional resistance when the positioning member 2 slides in the installation groove 16 of the third fixing rod 14. Since the ball 5 is spherical, the ball 5 can roll on the second sliding groove 142, which can reduce the friction coefficient. Since the positioning member 2 can slide in the carrier plate 1, the device can adapt to silicon wafers of different sizes. By adjusting the number of positioning members 2, the positioning requirements for silicon wafers of different specifications can be realized, improving the versatility and flexibility of the device.

[0036] Working principle: Insert a plurality of silicon wafers into the carrier plate 1 through the socket 141 in sequence. After inserting the first silicon wafer, move a positioning member 2 close to the first silicon wafer towards the first limiting groove 121, so that both sides of the first silicon wafer are respectively clamped into the first limiting groove 121 and the second limiting groove 21. Then, insert the second silicon wafer and move a positioning member 2 in sequence, so that both sides of the second silicon wafer respectively abut against the second limiting grooves 21 located on both sides; place the silicon wafers in this pattern in sequence;

[0037] After the silicon wafers are placed, place the welding rod in the corresponding positioning groove 23 for welding operation.

[0038] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An adjustable silicon wafer carrier positioning device, characterized in that: include: A carrier (1) and a plurality of positioning members (2), wherein the plurality of positioning members (2) are arranged in the carrier (1) so as to be movable forward and backward; a socket (141) for inserting a silicon wafer into the carrier (1) is arranged at one end of the carrier (1); It also comprises a plurality of positioning blocks (22), wherein the plurality of positioning blocks (22) are spaced apart and distributed on the upper end surface of the positioning member (2) along the length direction of the positioning member (2), and a positioning groove (23) for placing welding rods is formed between two adjacent positioning blocks (22); At least one end surface of the positioning member (2) is provided with a second limiting groove (21), and when the silicon wafer is inserted into the carrier (1), the second limiting groove (21) abuts against the silicon wafer.

2. The adjustable silicon wafer carrier positioning device according to claim 1, characterized in that: The positioning block (22) is provided with a protrusion (221) extending along the width direction of the positioning member (2), and a second limiting groove (21) is formed between the protrusion (221) and the positioning member (2).

3. The adjustable silicon wafer carrier positioning device according to claim 1, characterized in that: The carrier plate (1) comprises a first fixing rod (12), a second fixing rod (13), a third fixing rod (14), a fourth fixing rod (15) and a bottom plate (11); the first fixing rod (12), the second fixing rod (13), the third fixing rod (14) and the fourth fixing rod (15) are connected end to end to form a closed frame; the bottom plate (11) is fixed to the bottom of the frame.

4. The adjustable silicon wafer carrier positioning device according to claim 3, characterized in that: The second fixing rod (13) and the third fixing rod (14) are both provided with mounting grooves (16), and the left and right ends of the positioning member (2) are respectively inserted into the mounting grooves (16).

5. The adjustable silicon wafer carrier positioning device according to claim 4, characterized in that: A first slide groove (131) is arranged in the mounting groove (16) of the second fixing rod (13); a first fixing plate (24) and a second fixing plate (25) are arranged at the right end of the positioning member (2) extending toward the first slide groove (131); a roller (3) is arranged between the first fixing plate (24) and the second fixing plate (25); and the roller (3) slides in the first slide groove (131).

6. The adjustable silicon wafer carrier positioning device according to claim 4, characterized in that: At least two second slide grooves (142) are arranged in the installation groove (16) of the third fixing rod (14); at least two balls (5) are assembled on the left end of the positioning member (2), and the two balls (5) slide in the two second slide grooves (142) respectively.

7. The adjustable silicon wafer carrier positioning device according to claim 6, characterized in that: The positioning member (2) is provided with third limiting grooves (261) at the upper and lower ends of the second slide groove (142), and the two balls (5) are respectively embedded in the two third limiting grooves (261); and at least two limiting plates (4) are also included, and the two limiting plates (4) are respectively fixedly covered at the upper and lower ends of the positioning member (2), and the limiting plates (4) are provided with limiting holes (41), and the balls (5) are clamped between the third limiting grooves (261) and the limiting plates (4), and one end of the balls (5) is exposed outside the limiting holes (41).

8. The adjustable silicon wafer carrier positioning device according to claim 7, characterized in that: The lower end surface of the positioning member (2) is provided with a mounting portion (26), and a limiting plate (4) is fixedly arranged in the mounting portion (26).

9. The adjustable silicon wafer carrier positioning device according to claim 3, characterized in that: The third fixing rod (14) is provided with a socket (141) along the length direction.

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