High-power chip connector

Abstract

The utility model discloses a high-power chip connector, which comprises a first insulating layer (1), a plurality of groups of first terminals (3a), a copper foil layer (4) and a second insulating layer (2), the copper foil layer (4) is positioned between the first insulating layer (1) and the second insulating layer (2); the plurality of groups of first terminals (3a) penetrate through the first insulating layer (1) and the second insulating layer (2); and the plurality of groups of first terminals (3a) are connected with the copper foil layer (4). According to the high-power chip connector provided by the utility model, the plurality of groups of first terminals (3a) are connected in parallel through the copper foil layers (4), the conductive area is increased, and the heat dissipation area is also increased, so that the through-current capability is improved, the power is improved, and the service life is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip connection, and specifically relates to a high-power chip connector. Background Art

[0002] With the development of global intelligent AI computing power, the power requirements for chips are getting higher and higher. Due to the limitation of the CPU space structure, the existing chip terminals are independent in the PIN slots, thus limiting the cross-section of the terminals, resulting in poor current-carrying capacity of the terminals and being unable to meet the requirements of high power and large current. Content of the Utility Model

[0003] The purpose of the utility model is to provide a high-power chip connector.

[0004] The high-power chip connector provided by the utility model includes a first insulating layer (1), multiple groups of first terminals (3a), a copper foil layer (4) and a second insulating layer (2); the copper foil layer (4) is located between the first insulating layer (1) and the second insulating layer (2); multiple groups of the first terminals (3a) penetrate through the first insulating layer (1) and the second insulating layer (2); and multiple groups of the first terminals (3a) are all connected to the copper foil layer (4).

[0005] Preferably, the copper foil layer (4) includes a first sheet body (41); multiple groups of first through holes (43) are provided on the first sheet body (41); the multiple groups of first through holes (43) are distributed in a matrix on the copper foil layer (4); second through holes (11) with corresponding numbers and positions are provided on the first insulating layer (1) corresponding to the first through holes (43); third through holes (22) with corresponding numbers and positions are provided on the second insulating layer (2) corresponding to the first through holes (43); the first terminals (3a) are clamped on the first through holes (43), the second through holes (11) and the third through holes (22), and both ends of the first terminals (3a) extend outwards from the second through holes (11) and the third through holes (22) respectively.

[0006] Preferably, the copper foil layer (4) further includes multiple groups of C-shaped first columns (42a); the multiple groups of first columns (42a) are uniformly fixed on one side of the copper foil layer (4) and are spaced along the first through holes (43) in the horizontal and vertical directions; the first columns (42a) and the first sheet body (41) are of an integrally formed structure; the first columns (42a) clamp the first terminals (3a); and the first columns (42a) are inserted into the second through holes (11).

[0007] Preferably, the copper foil layer (4) further includes a plurality of groups of C-shaped second columns (42b); the plurality of groups of second columns (42b) are fixed on the other side of the first sheet (41) and are symmetrically arranged with the first columns (42a) one by one; the second columns (42b) and the first sheet (41) are of an integrally formed structure; the second columns (42b) are inserted into the third through holes (22).

[0008] Preferably, the second insulating layer (2) includes a first plate body (21); a first groove (24) is provided on one side of the first plate body (21) close to the first insulating layer (1); a plurality of groups of third through holes (22) are all opened at the bottom of the first groove (24); the first sheet (41) is snap-fitted into the first groove (24).

[0009] Preferably, the high-power chip connector provided by the present invention further includes a plurality of groups of second terminals (3b); the second insulating layer (2) further includes a plurality of groups of C-shaped third columns (23); the plurality of groups of third columns (23) are uniformly fixed on the plurality of groups of third through holes (22) and are arranged at intervals along the third through holes (22) in the horizontal and vertical directions; the plurality of groups of third columns (23) and the first plate body (21) are of an integrally formed structure; the third columns (23) are inserted into the corresponding second through holes (11) of the first insulating layer (1) after passing through the first through holes (43) between the two second columns (42b); the second terminals (3b) pass through the third columns (23), and both ends thereof extend outwards from the second through holes (11) and the third through holes (22) respectively.

[0010] Preferably, the first insulating layer (1) and the second insulating layer (2) are made of FR4 plates.

[0011] The high-power chip connector provided by the present invention connects a plurality of groups of first terminals (3a) in parallel through the copper foil layer (4), increasing the conductive area and also increasing the heat dissipation area, thereby improving the current-carrying capacity, enhancing the power, and increasing the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic structural diagram of the high-power chip connector according to the present invention from the first perspective;

[0013] Figure 2 is a schematic structural diagram of the high-power chip connector according to the present invention from the second perspective;

[0014] Figure 3 is a schematic structural diagram of the high-power chip connector according to the present invention from the third perspective;

[0015] Figure 4Explosion structure schematic diagram of the high-power chip connector described in the present utility model;

[0016] Figure 5 is Figure 4 the enlarged structure schematic diagram of part A in

[0017] Figure 6 is Figure 4 the enlarged structure schematic diagram of part B in

[0018] Figure 7 Structure schematic diagram of the assembly of the high-power chip connector described in the present utility model with an external chip and an external PCB board;

[0019] Figure 8 Fourth perspective structure schematic diagram of the high-power chip connector described in the present utility model;

[0020] Figure 9 is Figure 8 the sectional structure schematic diagram cut along A-A in

[0021] Figure 10 Explosion structure schematic diagram of the assembly of the first insulating layer, copper foil layer and second insulating layer provided by the embodiment of the present utility model;

[0022] Figure 11 Arrangement schematic diagram of the first terminal and the second terminal provided by the embodiment of the present utility model; Detailed implementation manners

[0023] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0024] Such as Figures 1 - 11As shown in the figure, the high-power chip connector provided in this embodiment includes a first insulating layer 1, multiple groups of first terminals 3a, a copper foil layer 4, and a second insulating layer 2; the copper foil layer 4 is located between the first insulating layer 1 and the second insulating layer 2; multiple groups of the first terminals 3a penetrate through the first insulating layer 1 and the second insulating layer 2; multiple groups of the first terminals 3a are all connected to the copper foil layer 4. Those skilled in the art can understand that for the high-power chip connector provided in this embodiment, the multiple groups of first terminals 3a are connected in parallel through the copper foil layer 4, increasing the conductive area and also increasing the heat dissipation area, thereby improving the current-carrying capacity, increasing the power, and extending the service life. The first terminal 3a is a power terminal for conducting current, which is prior art in this field and will not be elaborated here.

[0025] Furthermore, the copper foil layer 4 includes a first sheet body 41; multiple groups of first through-holes 43 are provided on the first sheet body 41; the multiple groups of first through-holes 43 are arranged in a matrix on the copper foil layer 4; second through-holes 11 corresponding in number and position to the first through-holes 43 are provided on the first insulating layer 1; third through-holes 22 corresponding in number and position to the first through-holes 43 are provided on the second insulating layer 2; the first terminal 3a is clamped on the first through-holes 43, the second through-holes 11, and the third through-holes 22, and both ends of the first terminal 3a extend outwards from the second through-holes 11 and the third through-holes 22 respectively. Those skilled in the art can understand that both ends of the first terminal 3a extend outwards from the second through-holes 11 and the third through-holes 22 respectively and are connected to an external chip 5 and an external PCB board 6.

[0026] Furthermore, the copper foil layer 4 further includes multiple groups of C-shaped first columns 42a; the multiple groups of first columns 42a are uniformly fixed on one side of the copper foil layer 4 and are spaced apart along the first through-holes 43 in the horizontal and vertical directions; the first columns 42a and the first sheet body 41 are of an integrally formed structure; the first columns 42a clamp the first terminal 3a; the first columns 42a are inserted into the second through-holes 11. Those skilled in the art can understand that the first terminal 3a is inserted into the C-shaped first columns 42a, increasing the contact area between the first terminal 3a and the first columns 42a, that is, increasing the current-carrying area and preventing high temperatures due to too small a contact surface.

[0027] Furthermore, the copper foil layer 4 further includes multiple groups of C-shaped second columns 42b; the multiple groups of second columns 42b are fixed on the other side of the first sheet body 41 and are symmetrical to the first columns 42a one by one; the second columns 42b and the first sheet body 41 are of an integrally formed structure; the second columns 42b are inserted into the third through-holes 22. Those skilled in the art can understand that through the connection of the second columns 42b with the first terminal 3a, the conductive area is further increased, thereby further improving the current-carrying capacity and increasing the power.

[0028] Furthermore, the second insulating layer 2 includes a first plate body 21; a first groove 24 is provided on a side of the first plate body 21 close to the first insulating layer 1; a plurality of the third through holes 22 are all formed at the bottom of the first groove 24; and the first sheet body 41 is snap-fitted in the first groove 24. Those skilled in the art can understand that after the first insulating layer 1 and the second insulating layer 2 are engaged, the copper foil layer 4 can be completely wrapped between the two, thereby improving the safety of the high-power chip connector provided in this embodiment.

[0029] Furthermore, the high-power chip connector provided in this embodiment further includes a plurality of second terminals 3b; the second insulating layer 2 further includes a plurality of C-shaped third columns 23; the plurality of third columns 23 are uniformly fixed on the plurality of third through holes 22, and are arranged at intervals along the third through holes 22 in the transverse and longitudinal directions; the plurality of third columns 23 and the first plate body 21 are of an integrally formed structure; the third columns 23 pass through the first through hole 43 between the two second columns 42b and are inserted into the corresponding second through hole 11 of the first insulating layer 1; the second terminals 3b pass through the third columns 23, and both ends thereof extend outwards from the second through hole 11 and the third through hole 22 respectively. Those skilled in the art can understand that the second terminals 3b are signal terminals, and the signal terminals are protected by the insulating third columns 23. Since there is no direct contact with copper, signal interference can be prevented.

[0030] Furthermore, the first insulating layer 1 and the second insulating layer 2 are made of FR4 board material. Those skilled in the art can understand that FR4 board material is a common composite material and is a kind of substrate material widely used in the electronic and electrical industries.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-power chip connector, characterized in that: The invention comprises a first insulating layer (1), a plurality of groups of first terminals (3a), a copper foil layer (4) and a second insulating layer (2); the copper foil layer (4) is located between the first insulating layer (1) and the second insulating layer (2); the plurality of groups of the first terminals (3a) penetrate the first insulating layer (1) and the second insulating layer (2); and the plurality of groups of the first terminals (3a) are all connected to the copper foil layer (4).

2. The high-power chip connector according to claim 1, characterized in that: The copper foil layer (4) comprises a first sheet (41); a plurality of groups of first through holes (43) are provided on the first sheet (41); the plurality of groups of first through holes (43) are distributed in a matrix on the copper foil layer (4); the first insulating layer (1) is provided with second through holes (11) whose number and positions correspond to the first through holes (43); the second insulating layer (2) is provided with third through holes (22) whose number and positions correspond to the first through holes (43); the first terminal (3a) is clamped on the first through hole (43), the second through hole (11) and the third through hole (22), and two ends of the first terminal (3a) extend outward from the second through hole (11) and the third through hole (22), respectively.

3. The high-power chip connector according to claim 2, characterized in that: The copper foil layer (4) further comprises a plurality of groups of C-shaped first columns (42a); the plurality of groups of the first columns (42a) are evenly fixed on one side of the copper foil layer (4) and are spaced apart along the first through holes (43) in the transverse and longitudinal directions; the first columns (42a) and the first sheet (41) are an integrally formed structure; the first columns (42a) clamp the first terminals (3a); and the first columns (42a) are inserted into the second through holes (11).

4. The high-power chip connector according to claim 3, characterized in that: The copper foil layer (4) further comprises a plurality of groups of C-shaped second columns (42b); the plurality of groups of the second columns (42b) are fixed on the other side of the first sheet (41) and are symmetrical with the first columns (42a); the second columns (42b) and the first sheet (41) are an integrally formed structure; and the second columns (42b) are inserted into the third through holes (22).

5. The high-power chip connector according to claim 4, characterized in that: The second insulating layer (2) comprises a first plate body (21); a first groove (24) is provided on a side of the first plate body (21) close to the first insulating layer (1); a plurality of groups of third through holes (22) are provided at the bottom of the first groove (24); and the first sheet body (41) is clamped in the first groove (24).

6. The high-power chip connector according to claim 5, characterized in that: It also comprises a plurality of groups of second terminals (3b); the second insulating layer (2) further comprises a plurality of groups of C-shaped third columns (23); the plurality of groups of the third columns (23) are evenly fixed on the plurality of groups of the third through holes (22), and are arranged at intervals along the third through holes (22) in the transverse and longitudinal directions; the plurality of groups of the third columns (23) and the first plate (21) are an integrally formed structure; the third column (23) passes through the first through hole (43) between two of the second columns (42b) and is then plugged into the corresponding second through hole (11) of the first insulating layer (1); the second terminal (3b) passes through the third column (23), and its two ends extend outward from the second through hole (11) and the third through hole (22), respectively.

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