Thin copper-aluminum-based double-layer plate
By adopting a thin copper-aluminum-based double-layer board structure in the aluminum substrate, embedded electrical steel layer and filling thermal conductivity rubber, the problem of high hardness but poor flexibility of the aluminum substrate is solved, and higher flexibility and thermal conductivity are achieved, and the overall strength is enhanced.
Patent Information
- Application Number
- CN202422262093.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-14
AI Technical Summary
The existing aluminum substrate has high hardness, but poor flexibility, easy to break, and easily lead to breakage when the angle is deformed.
A thin copper-aluminum-based double-layer board structure is adopted, including a copper foil composite layer and an aluminum substrate composite layer. An electrical steel layer is embedded in the aluminum substrate composite layer, and thermal rubber is poured into the filling groove to improve thermal conductivity and flexibility.
Through the thin copper-aluminum-based double-layer board structure, the flexibility and thermal conductivity of the aluminum substrate are improved, the overall strength is enhanced, and easy breakage is prevented.
Smart Images
Figure CN223040229U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of aluminum substrates, in particular to a thin copper-aluminum double-layer board. Background Art
[0002] An aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, a single-sided board is composed of three layers, namely a circuit layer (copper foil), an insulating layer and a metal base layer. It is commonly used in LED lighting products. It has two sides, the white side is for welding LED pins, and the other side shows the natural color of aluminum. Generally, a heat-conducting gel is applied and then it contacts with the heat-conducting part.
[0003] At present, the overall hardness of some aluminum substrates is relatively high, but their flexibility is poor. The high hardness makes the aluminum substrate prone to breakage. Once the aluminum substrate is deformed at a certain angle as a whole, it is easy to cause the breakage of the aluminum substrate. Content of the Utility Model
[0004] The purpose of the utility model is to solve the defects existing in the prior art, and to provide a thin copper-aluminum double-layer board.
[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0006] A thin copper-aluminum double-layer board includes a copper foil composite layer. At the bottom of the copper foil composite layer, an aluminum substrate composite layer is horizontally laminated. The aluminum substrate composite layer includes an aluminum plate layer. At the upper surface of the aluminum plate layer, an aluminum thin plate layer is horizontally laminated. At the upper surface of the aluminum thin plate layer, an electrical steel layer is embedded.
[0007] At the upper surface of the aluminum thin plate layer, an embedding groove is formed. The electrical steel layer can be embedded in the embedding groove, and the thickness of the electrical steel layer is consistent with the depth of the embedding groove. The electrical steel layers cross in a cross shape.
[0008] In addition, a preferred structure is that a heat dissipation layer is horizontally laminated at the bottom surface of the aluminum plate layer.
[0009] In addition, a preferred structure is that a perfusion groove is formed at the upper surface of the aluminum plate layer. The perfusion groove is arranged in a material discharging mode of diffusing from the center to the outside, and the perfusion groove is in a shape of a return.
[0010] In addition, a preferred structure is that the copper foil composite layer includes a second insulating material layer. The bottom surface of the second insulating material layer is laminated with the upper surface of the aluminum thin plate layer.
[0011] In addition, a preferred structure is that a silicone rubber sheet layer is horizontally laminated at the upper surface of the second insulating material layer. A first insulating material layer is laminated at the upper surface of the silicone rubber sheet layer.
[0012] In addition, a preferred structure is that a thin copper foil layer is horizontally laminated on the upper surface of the first insulating material layer.
[0013] The beneficial effects of the present utility model are as follows: By laminating the laminated copper foil composite layer on the upper surface of the aluminum substrate composite layer, a complete thin copper-aluminum double-layer board is formed. In this way, the lamination strength is better than that of multi-layer one-time lamination. The electrical steel layer is embedded in the embedded groove, and then a heat-conducting rubber including but not limited to boron nitride is poured into the pouring groove. This can improve the heat conductivity between the aluminum thin plate layer and the aluminum plate layer, and the electrical steel layer can improve the overall flexibility of the aluminum plate. Moreover, under the superposition of two aluminum plate layers, the strength is higher than that of a single layer, which can prevent it from being easily broken. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic structural diagram after the thin copper-aluminum double-layer board is disassembled;
[0015] Figure 2 It is a schematic structural diagram of the copper foil composite layer;
[0016] Figure 3 It is a schematic structural diagram of the aluminum substrate composite layer;
[0017] Figure 4 It is a schematic structural diagram after the aluminum substrate composite layer is disassembled.
[0018] In the figure: 001 copper foil composite layer, 002 aluminum substrate composite layer, 1 thin copper foil layer, 2 first insulating material layer, 3 silicone rubber sheet layer, 4 second insulating material layer, 5 aluminum thin plate layer, 51 embedded groove, 6 aluminum plate layer, 61 pouring groove, 7 heat dissipation layer, 8 electrical steel layer. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.
[0020] Refer to Figures 1-4 , a thin copper-aluminum double-layer board, including a copper foil composite layer 001. The bottom of the copper foil composite layer 001 is horizontally laminated with an aluminum substrate composite layer 002. The aluminum substrate composite layer 002 includes an aluminum plate layer 6. A horizontal aluminum thin plate layer 5 is laminated on the upper surface of the aluminum plate layer 6, and an electrical steel layer 8 is embedded in the upper surface of the aluminum thin plate layer 5;
[0021] Among them, an embedding groove 51 is provided on the upper surface of the aluminum thin plate layer 5. The electrical steel layer 8 can be embedded in the embedding groove 51, and the thickness of the electrical steel layer 8 is consistent with the depth of the embedding groove 51. The electrical steel layer 8 is in a cross shape. By embedding the electrical steel layer 8, the toughness of the aluminum substrate composite layer 002 can be effectively improved, thereby preventing the aluminum substrate composite layer 002 from breaking.
[0022] In addition, a heat dissipation layer 7 is horizontally pressed and arranged on the bottom end surface of the aluminum plate layer 6 for heat dissipation of the aluminum plate layer 6.
[0023] Among them, a perfusion groove 61 is provided on the upper surface of the aluminum plate layer 6. The perfusion groove 61 is arranged in a material discharging manner that diffuses from the center outwards, and the perfusion groove 61 is in a circular shape. A kind of material including but not limited to boron nitride heat-conducting rubber can be poured into the perfusion groove 61, so as to improve the heat conductivity between the aluminum thin plate layer 5 and the aluminum plate layer 6.
[0024] In addition, the copper foil composite layer 001 includes a second insulating material layer 4. The bottom end surface of the second insulating material layer 4 is pressed together with the upper surface of the aluminum thin plate layer 5. A silicone rubber sheet layer 3 is horizontally pressed on the upper surface of the second insulating material layer 4. A first insulating material layer 2 is pressed on the upper surface of the silicone rubber sheet layer 3. The silicone rubber sheet layer 3 can improve the high-temperature resistance of the insulating material layer 2.
[0025] In addition, a thin copper foil layer 1 is horizontally pressed on the upper surface of the first insulating material layer 2.
[0026] In this embodiment, first, the materials of the copper foil composite layer 001 are pressed together, and the thin copper foil layer 1, the first insulating material layer 2, the silicone rubber sheet layer 3, and the second insulating material layer 4 are pressed together in sequence to form a whole copper foil composite layer 001 first. Then, the materials of the aluminum substrate composite layer 002 are pressed together, and the aluminum thin plate layer 5, the aluminum plate layer 6, and the heat dissipation layer 7 are pressed together in sequence to form an aluminum substrate composite layer 002.
[0027] The pressed copper foil composite layer 001 is pressed on the upper surface of the aluminum substrate composite layer 002, and then a complete double-layer aluminum substrate is formed. And when pressing the aluminum substrate composite layer 002, the electrical steel layer 8 is embedded into the embedding groove 51, and then a kind of material including but not limited to boron nitride heat-conducting rubber is poured into the perfusion groove 61, so as to improve the heat conductivity between the aluminum thin plate layer 5 and the aluminum plate layer 6. The electrical steel layer 8 can improve the overall flexibility of the aluminum plate, and under the superposition of two layers of aluminum plates, it has higher strength than a single layer.
[0028] In the present utility model, the well-pressed copper foil composite layer 001 is pressed on the upper surface of the aluminum substrate composite layer 002, and then a complete thin copper-aluminum double-layer board is formed. In this way, the pressing strength is better than that of multi-layer one-time pressing. The electrical steel layer 8 is embedded in the embedding groove 51, and then a kind of heat-conducting rubber including but not limited to boron nitride is poured into the pouring groove 61. In this way, the heat conductivity between the aluminum thin plate layer 5 and the aluminum plate layer 6 can be improved, and the electrical steel layer 8 can improve the flexibility of the overall aluminum plate. Moreover, under the superposition of two aluminum plates, the strength is higher than that of a single layer, and it can prevent it from being easily broken.
[0029] The above is only the preferred specific implementation mode of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present utility model.
Claims
1. A thin copper-aluminum based double-layer board, comprising a copper foil composite layer (001), characterized in that: An aluminum substrate composite layer (002) is horizontally pressed onto the bottom of the copper foil composite layer (001), the aluminum substrate composite layer (002) comprises an aluminum plate layer (6), an aluminum thin plate layer (5) is horizontally pressed onto the upper surface of the aluminum plate layer (6), and an electrical steel layer (8) is embedded onto the upper surface of the aluminum thin plate layer (5); The upper surface of the aluminum sheet layer (5) is provided with an embedding groove (51), and the electrical steel layer (8) can be embedded in the embedding groove (51). The thickness of the electrical steel layer (8) is consistent with the depth of the embedding groove (51), and the electrical steel layer (8) is in a cross shape.
2. A thin copper-aluminum based double-layer plate according to claim 1, characterized in that: A heat dissipation layer (7) is horizontally pressed and arranged on the bottom surface of the aluminum plate layer (6).
3. A thin copper-aluminum based double-layer plate according to claim 2, characterized in that: A pouring groove (61) is provided on the upper surface of the aluminum plate layer (6), and the pouring groove (61) is a center-outward diffusion type of material discharge, and the pouring groove (61) is a circular shape.
4. The thin copper-aluminum based double-layer plate according to claim 1, characterized in that: The copper foil composite layer (001) comprises a second insulating material layer (4), and the bottom surface of the second insulating material layer (4) is pressed together with the upper surface of the aluminum sheet layer (5).
5. A thin copper-aluminum based double-layer plate according to claim 4, characterized in that: A silicone rubber sheet layer (3) is horizontally pressed onto the upper surface of the second insulating material layer (4), and a first insulating material layer (2) is pressed onto the upper surface of the silicone rubber sheet layer (3).
6. A thin copper-aluminum based double-layer plate according to claim 5, characterized in that: A thin copper foil layer (1) is horizontally pressed onto the upper surface of the first insulating material layer (2).