Flexible material structure and flexible circuit board

Abstract

The utility model discloses a flexible material structure and a flexible circuit board, the flexible material structure comprises a first metal foil layer, a first AD glue layer, a first waterproof glue layer, a backing paper layer, a second waterproof glue layer, a second AD glue layer and a second metal foil layer, and the first waterproof glue layer and the second waterproof glue layer are respectively coated on the upper end face and the lower end face of the backing paper layer. The first AD adhesive layer and the second AD adhesive layer are respectively coated on the upper end surface of the first waterproof adhesive layer and the lower end surface of the second waterproof adhesive layer, and the first metal foil layer and the second metal foil layer are respectively attached to the upper end surface of the first AD adhesive layer and the lower end surface of the second AD adhesive layer. According to the flexible material structure, the backing paper layer is adopted as a carrier, the structure formed by combining the metal foil layer and the backing paper layer carrier is lighter and thinner, batch production can be achieved, the applicability is wider, and the cost is lower. While the structure is light and thin, the combination of the waterproof adhesive layer and the AD adhesive layer coated on the upper and lower end faces of the bottom paper layer can prevent water stain penetration, and the etching accuracy and water stain pollution resistance of the product are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and particularly relates to a flexible material structure and a flexible circuit board. Background Art

[0002] With the rapid development of electronic circuit technology, more and more products adopt FPC as the circuit carrier in design. With the increasingly fierce production competition in the FPC industry, higher requirements are put forward for the light and thin characteristics of materials, material costs, etching accuracy, and water stain resistance performance of FPC products. The existing PI material structure has gradually been unable to meet the current production requirements. Summary of the Utility Model

[0003] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a flexible material structure, which can make the product lighter, thinner and lower in cost.

[0004] To solve the above problems, the technical solution adopted by the utility model is as follows: a flexible material structure includes a first metal foil layer, a first AD adhesive layer, a first waterproof adhesive layer, a base paper layer, a second waterproof adhesive layer, a second AD adhesive layer and a second metal foil layer. The first waterproof adhesive layer and the second waterproof adhesive layer are respectively coated on the upper end face and the lower end face of the base paper layer. The first AD adhesive layer and the second AD adhesive layer are respectively coated on the upper end face of the first waterproof adhesive layer and the lower end face of the second waterproof adhesive layer. The first metal foil layer and the second metal foil layer are respectively adhered to the upper end face of the first AD adhesive layer and the lower end face of the second AD adhesive layer.

[0005] Compared with the prior art, the beneficial effects of the utility model are as follows: this flexible material structure uses the base paper layer as the carrier. The structure of the metal foil layer plus the base paper layer carrier is lighter, thinner, can be mass-produced, has a wider applicability and lower cost. The upper end face of the base paper layer is successively coated with the first waterproof adhesive layer and the first AD adhesive layer, and the lower end face is successively coated with the second waterproof adhesive layer and the second AD adhesive layer. While realizing the lightness and thinness of the product by adopting the structure of the metal foil layer plus the base paper layer carrier, the combination of the waterproof adhesive layer and the AD adhesive layer can also prevent water stain penetration, improve the etching accuracy of the product and the water stain resistance performance.

[0006] For the above flexible material structure, the first metal foil layer is an aluminum foil layer or a copper foil layer.

[0007] For the above flexible material structure, the second metal foil layer is an aluminum foil layer or a copper foil layer.

[0008] The utility model also provides a flexible circuit board, including the above flexible material structure, which at least has all the beneficial effects that the above flexible material structure can bring.

[0009] The present utility model will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Description of the Drawings

[0010] Figure 1 It is a schematic diagram of the flexible material structure of the embodiment of the present utility model.

[0011] Explanation of the reference numerals in the drawings: 100 First metal foil layer, 200 First AD adhesive layer, 300 First waterproof adhesive layer, 400 Base paper layer, 500 Second waterproof adhesive layer, 600 Second AD adhesive layer, 700 Second metal foil layer. Specific Embodiments

[0012] The following details the embodiments of the present utility model, with reference to Figure 1 , the embodiments of the present utility model provide a flexible material structure, including a first metal foil layer 100, a first AD adhesive layer 200, a first waterproof adhesive layer 300, a base paper layer 400, a second waterproof adhesive layer 500, a second AD adhesive layer 600, and a second metal foil layer 700. The first waterproof adhesive layer 300 and the second waterproof adhesive layer 500 are respectively coated on the upper and lower end faces of the base paper layer 400. The first AD adhesive layer 200 and the second AD adhesive layer 600 are respectively coated on the upper end face of the first waterproof adhesive layer 300 and the lower end face of the second waterproof adhesive layer 500. The first metal foil layer 100 and the second metal foil layer 700 are respectively attached to the upper end face of the first AD adhesive layer 200 and the lower end face of the second AD adhesive layer 600.

[0013] This flexible material structure uses the base paper layer 400 as a carrier. The structure of the metal foil layer combined with the base paper layer 400 carrier is lighter, thinner, can be mass-produced, has a wider applicability, and lower cost. The upper end face of the base paper layer 400 is successively coated with the first waterproof adhesive layer 300 and the first AD adhesive layer 200, and the lower end face is successively coated with the second waterproof adhesive layer 500 and the second AD adhesive layer 600. The waterproof adhesive layer and the AD adhesive layer can not only facilitate the combination of the metal foil layer and the base paper layer 400, but also form a barrier to prevent water stains from penetrating. While realizing the thinning of the product with the structure of the metal foil layer combined with the base paper layer 400 carrier, the base paper layer 400 can also be protected by the protective adhesive layer, not being penetrated by the chemical solution, improving the etching accuracy and water stain resistance of the product, and extending the service life of the product.

[0014] Furthermore, the first metal foil layer 100 is an aluminum foil layer or a copper foil layer, which can achieve the thinning of the structure and reduce the cost. Similarly, the second metal foil layer 700 is an aluminum foil layer or a copper foil layer.

[0015] The embodiments of the present utility model also provide a flexible printed circuit board, including the above flexible material structure, which at least has all the beneficial effects that the above flexible material structure can bring.

[0016] It should be noted that in the description of the present utility model, if there is any reference to the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., it is all based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation to the present utility model.

[0017] In the description of the present utility model, the meaning of "several" is one or more, the meaning of "multiple" is two or more, "greater than", "less than", "exceeding", etc. are understood as not including the present number, and "above", "below", "within", etc. are understood as including the present number. If there is a description of "first" or "second", etc., it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence relationship of the indicated technical features.

[0018] In the description of the present utility model, unless otherwise clearly defined, words such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present utility model in combination with the specific content of the technical solution.

[0019] The above embodiments are only the preferred embodiments of the present utility model and cannot be used to limit the scope of protection of the present utility model. Any non-substantive changes and substitutions made by those skilled in the art on the basis of the present utility model fall within the scope of protection required by the present utility model.

Claims

1. A flexible material structure, characterized in that: The invention comprises a first metal foil layer (100), a first AD adhesive layer (200), a first waterproof adhesive layer (300), a base paper layer (400), a second waterproof adhesive layer (500), a second AD adhesive layer (600) and a second metal foil layer (700); the first waterproof adhesive layer (300) and the second waterproof adhesive layer (500) are respectively coated on the upper end surface and the lower end surface of the base paper layer (400); the first AD adhesive layer (200) and the second AD adhesive layer (600) are respectively coated on the upper end surface of the first waterproof adhesive layer (300) and the lower end surface of the second waterproof adhesive layer (500); the first metal foil layer (100) and the second metal foil layer (700) are respectively adhered to the upper end surface of the first AD adhesive layer (200) and the lower end surface of the second AD adhesive layer (600).

2. The flexible material structure according to claim 1, characterized in that: The first metal foil layer (100) is an aluminum foil layer or a copper foil layer.

3. The flexible material structure according to claim 1, characterized in that: The second metal foil layer (700) is an aluminum foil layer or a copper foil layer.

4. A flexible circuit board, characterized in that: Comprising the flexible material structure as described in any one of claims 1-3.

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