Circuit board component connecting structure

Abstract

The utility model relates to the technical field of circuit board components, and discloses a circuit board component connecting structure, which comprises a copper foil plate. The copper foil plate is provided with a plurality of flexible circuit board parts, the copper foil plate is connected with a plurality of bonding pad parts, the plurality of bonding pad parts are used for connecting components, and the plurality of bonding pad parts are respectively connected with the plurality of flexible circuit board parts and the copper foil plate. The utility model provides a circuit board component connecting structure, which solves the problem that when a circuit board is bent, a connecting end between a welding pad and a copper foil circuit is broken, so that a light-emitting diode welded on the welding pad is disconnected and cannot emit light.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board components, in particular to a connection structure for circuit board components. Background Art

[0002] The basic structure of a flexible printed circuit board is that a single-sided flexible printed circuit board is formed by laminating copper foil on a PET or PI substrate to form a single-sided flexible printed circuit board with single-sided lines, or a double-sided flexible printed circuit board with lines formed on both sides using PI as the substrate. Currently, the product forms of flexible printed circuit boards can generally be divided into single-sided boards, double-sided boards, and multi-layer composite boards. The manufacturing methods of single-sided boards, double-sided boards, and multi-layer composite boards mostly involve etching the substrate to form circuits. The intermediate layer of the multi-layer composite board is composed of single-sided or double-sided boards of any structure stacked together, and an adhesive must be added in the middle to connect them. Whether it is a traditional drilled or stacked multi-layer board, it needs to be bonded with an adhesive before manufacturing.

[0003] Due to the flexibility of the substrate material of the flexible printed circuit board, it is often used in foldable electronic products and is installed at the rotating shaft to smoothly electrically connect the electronic circuit. Since the flexible printed circuit board is installed at the rotating shaft position, when the rotating shaft rotates, the inner and outer diameters of both sides of the circuit board are bent differently, resulting in a strain effect, which may cause the circuit to break or damage the appearance of the flexible circuit board. Electronic components, such as light-emitting diodes, have their leads connected to the pads through solder paste. Due to the bendable material of the flexible circuit board, when bent, the connection end between the pad and the copper foil circuit will break, causing the light-emitting diode soldered on the pad to be open-circuited and unable to emit light.

[0004] To solve the above problems, a connection structure for circuit board components is proposed in this application. Content of the Utility Model

[0005] Based on the technical problems existing in the background art, the utility model proposes a connection structure for circuit board components.

[0006] A connection structure for circuit board components proposed by the utility model includes a copper foil board;

[0007] A number of flexible circuit board components are installed on the copper foil board, and a number of pad components are connected to the copper foil board. The number of pad components is used for connecting components, and the number of pad components is respectively connected to the number of flexible circuit board components and the copper foil board.

[0008] Preferably, the flexible circuit board component includes two single-sided boards, and both ends of the two single-sided boards are bonded by a composite adhesive. A hollow structure is formed between the two single-sided boards and the composite adhesive, and the single-sided boards are installed at corresponding positions on the copper foil board.

[0009] Preferably, the single-sided board includes a PI substrate and a Cu copper plate, the PI substrate is connected to the Cu copper plate, the two composite adhesives are respectively connected between the two ends of the two PI substrates, and the hollow structure is formed between the two PI substrates and the composite adhesive.

[0010] Preferably, the pad component includes a pad body, a plurality of the pad bodies are spaced and installed on the copper foil board, a plurality of leads are connected to the pad body, and the plurality of leads are respectively connected to the copper foil board and the corresponding flexible circuit board component.

[0011] Preferably, solder joints are provided on the pad body, and the solder joints on the pad body are used for connecting light-emitting diodes.

[0012] The above technical solution of the present invention has the following beneficial technical effects:

[0013] 1. By providing the flexible circuit board component, the corresponding flexible circuit board components can be respectively installed at the shaft positions on the copper foil board, and then the light-emitting diodes are soldered to the pad component through solder paste. Since a hollow structure is formed in the flexible circuit board component, when the copper foil board and the flexible circuit board component are bent, the hollow structure formed in the flexible circuit board component can be used to reduce the strain during bending, thereby increasing the number of foldings, effectively preventing the problem that the light-emitting diodes are open-circuited and cannot emit light. This structure reduces the stress concentration caused by material strain during the bending process of the flexible circuit board component by introducing a hollow structure into the flexible circuit board component, enabling the flexible circuit board component to more smoothly adapt to the repeated bending actions at the shaft, thus greatly increasing its number of foldings and durability.

[0014] 2. Since the hollow structure effectively relieves the stress of the flexible circuit board component during bending, it reduces the problem of circuit disconnection caused by material fatigue.

[0015] 3. The light-emitting diodes are soldered to the pad component through solder paste, and the design of the hollow structure reduces the risk of breakage at the connection end between the pad body and the lead during bending. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of a circuit board component connection structure proposed by the present invention.

[0017] Figure 2 For the present invention Figure 1 is a schematic diagram of the structure of the circuit board component.

[0018] Figure 3 For the present invention Figure 1 is a schematic diagram of the structure of the pad component.

[0019] Reference numerals: 1, copper foil board; 2, flexible circuit board component; 21, single-sided board; 211, PI substrate; 212, Cu copper plate; 22, composite adhesive; 23, hollow structure; 3, pad component; 31, pad body; 32, lead wire. Detailed implementation mode

[0020] To make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below in conjunction with the specific implementation modes and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present utility model. In addition, in the following description, the descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present utility model.

[0021] As Figures 1-3 shown, a circuit board component connection structure proposed by the present utility model includes a copper foil board 1;

[0022] In this embodiment, a plurality of flexible circuit board components 2 are mounted on the copper foil board 1. The flexible circuit board component 2 includes two single-sided boards 21, and both ends between the two single-sided boards 21 are bonded by a composite adhesive 22. A hollow structure 23 is formed between the two single-sided boards 21 and the composite adhesive 22, and the single-sided board 21 is mounted at a corresponding position on the copper foil board 1. The single-sided board 21 includes a PI substrate 211 and a Cu copper plate 212, the PI substrate 211 and the Cu copper plate 212 are connected to each other, and two composite adhesives 22 are respectively connected between both ends of the two PI substrates 211, and the hollow structure 23 is formed between the two PI substrates 211 and the composite adhesive 22.

[0023] In this embodiment, a plurality of pad components 3 are connected to the copper foil board 1. The plurality of pad components 3 are used for connecting components, and the plurality of pad components 3 are respectively connected to the plurality of flexible circuit board components 2 and the copper foil board 1. The pad component 3 includes a pad body 31, and a plurality of pad bodies 31 are spaced and mounted on the copper foil board 1. A plurality of lead wires 32 are connected to the pad body 31, and the plurality of lead wires 32 are respectively connected to the copper foil board 1 and the corresponding flexible circuit board component 2.

[0024] In a specific embodiment, solder joints are provided on the pad body 31, and the solder joints on the pad body 31 are used for connecting light-emitting diodes. The provision of the solder joints facilitates the connection of the light-emitting diodes.

[0025] It should be noted that the corresponding flexible circuit board components 2 can be respectively installed at the rotating shaft positions on the copper foil board 1, and then the light-emitting diodes are soldered to the pad bodies 31 through solder paste. Since the two ends of the two PI substrates 211 are bonded through the composite adhesive 22 to form a corresponding hollow structure 23, the overall strain capacity of the flexible circuit board component 2 can be improved. When the copper foil board 1 and the flexible circuit board component 2 are bent, the hollow structure 23 formed in the flexible circuit board component 2 can be used to reduce the strain during bending, thereby increasing the number of flexures and effectively preventing the problem that the light-emitting diodes are open-circuited and cannot emit light. By introducing the hollow structure 23 into the flexible circuit board component 2, the stress concentration caused by material strain during the bending process of the flexible circuit board component 2 is reduced, enabling the flexible circuit board component 2 to more smoothly adapt to the repeated bending actions at the rotating shaft, thus greatly increasing its number of flexures and durability.

[0026] Since the hollow structure 23 effectively alleviates the stress of the flexible circuit board component 2 during bending, it reduces the problem of wire breakage caused by material fatigue.

[0027] The light-emitting diodes are soldered to the pad components 3 through solder paste, and the design of the hollow structure 23 reduces the risk of breakage at the connection end between the pad body 31 and the lead 32 during bending.

[0028] In a specific embodiment, multiple connections are formed between the pad body 31 for connecting the light-emitting diodes and the lead 32, and the solder feet are not easily offset through the pad body 31, thereby effectively reducing the situation of connection breakage of the light-emitting diodes during bending; there is a stepwise width change from wide to narrow between each extension part and the pad body 31. When the solder paste is applied to the pad body 31, the solder feet of the light-emitting diodes are combined with the pad body 31, and the solder feet are not easily offset with the solder paste due to the step difference of this width change, so the position of the solder feet can be accurately controlled.

[0029] It should be understood that the above specific embodiments of the present invention are only used for exemplary illustration or explanation of the principle of the present invention, and do not constitute a limitation to the present invention. Therefore, any modifications, equivalent replacements, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modification examples falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A circuit board component connection structure, comprising a copper foil board (1), characterized in that: A plurality of flexible circuit board components (2) are mounted on the copper foil board (1), a plurality of pad components (3) are connected to the copper foil board (1), the plurality of pad components (3) are used for connecting components, and the plurality of pad components (3) are respectively connected to a plurality of flexible circuit board components (2) and the copper foil board (1); The flexible circuit board component (2) comprises two single-sided boards (21), both ends of the two single-sided boards (21) are bonded together by a composite adhesive (22), a hollow structure (23) is formed between the two single-sided boards (21) and the composite adhesive (22), and the single-sided boards (21) are mounted at corresponding positions on the copper foil board (1).

2. A circuit board component connection structure according to claim 1, characterized in that: The single-sided board (21) comprises a PI substrate (211) and a Cu copper plate (212); the PI substrate (211) and the Cu copper plate (212) are connected to each other; the two composite adhesives (22) are respectively connected between two ends of the two PI substrates (211); and the hollow structure (23) is formed between the two PI substrates (211) and the composite adhesive (22).

3. A circuit board component connection structure according to claim 2, characterized in that: The pad component (3) comprises a pad body (31), a plurality of the pad bodies (31) are installed at intervals on a copper foil board (1), a plurality of leads (32) are connected to the pad body (31), and the plurality of leads (32) are respectively connected to the copper foil board (1) and a corresponding flexible circuit board component (2).

4. A circuit board component connection structure according to claim 3, characterized in that: The pad body (31) is provided with soldering points, and the soldering points on the pad body (31) are used for connecting light-emitting diodes.

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