Circuit board thin wire etching device
By setting a regulating valve and swinging block on the nozzle of the circuit board thin-width etching device, adjusting the pressure of the discharge liquid agent and achieving swinging of the nozzle, the problem of inconsistent etching rates on the upper and lower plates of the circuit board in the prior art is solved, and the etching uniformity and quality improvement is achieved.
Patent Information
- Application Number
- CN202422255122.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-14
AI Technical Summary
During the etching process of the existing circuit board etching devices, due to the constant position and flow rate of the spray head, the etching rate of the upper and lower plate surfaces is inconsistent and the uniformity is poor, and the edges are prone to have faster etching speed than the center, resulting in side etching, which affects the quality of electroplating etching.
A circuit board thin line etching device is designed. By setting a control valve and a swing block on the nozzle, the nozzle can swing during the etching process, and adjust the pressure of the ejection liquid according to the position, ensuring that the spray pressure at the center of the plate and the edge of the plate is different, and intermittent etching is achieved, thereby achieving etching uniformity of the entire plate surface.
By adjusting the spray pressure and adopting swing nozzle technology, the uniformity of the etchant flow spraying on the circuit board surface is significantly improved, reducing the etching speed of the edges is faster than that in the center, improving the etching uniformity and quality, avoiding the generation of bumps, and improving the reliability of electroplating etching.
Smart Images
Figure CN223040257U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an etching device, in particular to a fine line etching device for a circuit board. Background Art
[0002] The etching uniformity on both the upper and lower surfaces of the circuit board and at various positions on the board surface is determined by the uniformity of the etching agent flow rate on the board surface.
[0003] During the etching process of the existing device, the upper and lower board surfaces are directly sprayed by a spray head with a fixed position and flow rate. A common problem in etching printed circuit boards is that it is difficult to etch the entire board surface clean in the same time. The etching rates of the upper and lower board surfaces are often inconsistent. Generally speaking, the etching rate of the lower board surface is higher than that of the upper board surface because there is a buildup of solution on the upper board surface, which weakens the etching reaction. Usually, the etching speed of the edge of the etched circuit board is faster than that of the central part, and side etching produces a protrusion, resulting in inconsistent uniformity of the etching rate on the surface of the circuit board during etching. Whether the electroplated etching resist is tin-lead alloy, tin, tin-nickel alloy or nickel, excessive protrusion will cause short circuits between conductors.
[0004] In view of this, the utility model provides a fine line etching device for a circuit board that can improve the uniformity of the etching agent flow rate sprayed on the surface of the circuit board during the etching process and reduce the situation where the etching speed of the edge of the circuit board is faster than that of the central part. Content of the Utility Model
[0005] In order to overcome the disadvantages that during etching, affected by the spraying method of the etching liquid agent, the etching rates of the board surfaces are inconsistent, the etching uniformity is poor, and the etching effect is affected, the technical problem is: to provide a fine line etching device for a circuit board that can improve the uniformity of the etching agent flow rate sprayed on the surface of the circuit board during the etching process and reduce the situation where the etching speed of the edge of the circuit board is faster than that of the central part.
[0006] The technical solution is as follows: A fine-line etching device for a circuit board, comprising a base, a top cover, a driving motor, a conveying mechanism, a waste liquid box, a liquid agent box, a liquid pumping pump, a first infusion pipe, a spray head, a transmission group and a swinging block. The top cover is fixedly welded to the upper part of the base. The driving motor is installed at the rear side of the right part of the base. The conveying mechanism is installed inside the upper part of the base. The conveying mechanism consists of two groups of transmission wire wheel groups installed on the front and rear sides of the base and two rotating shafts rotatably installed on the left and right sides. The driving motor is fixedly connected to the rear part of the right rotating shaft. Driven by the driving motor, the conveying line of the conveying mechanism rotates with the wire wheels. The waste liquid box is fixedly connected to the upper part of the base. The liquid agent box is fixedly connected to the front part of the waste liquid box. The liquid pumping pump is installed at the front side of the upper part of the waste liquid box. The transmission group is installed at the rear side of the upper part of the waste liquid box. The transmission group consists of a transmission motor and a lead screw. A swinging block is threadedly connected to the outside of the lead screw. Two spaced first infusion pipes are connected to the front part of the swinging block. The first infusion pipes are frame-shaped pipelines. The first infusion pipes all surround the conveying mechanism. The front parts of the first infusion pipes are connected and communicated with the liquid pumping pump through pipelines. The liquid pumping pump is connected and communicated with the liquid agent box through pipelines. Three spray heads are installed on both the upper and lower sides of the two first infusion pipes. A regulating valve is provided on each spray head. The water outlet of each spray head faces the conveying mechanism. The installation positions of the three spray heads on the upper and lower sides correspond to the middle part and the front and rear sides of the conveying mechanism. The etching liquid agent is pumped out from the liquid agent box by the liquid pumping pump, flows through the first infusion pipes, and is sprayed out through the spray heads provided on both the upper and lower sides.
[0007] Further, it further includes a second infusion pipe. The second infusion pipe is provided on the left side of the upper part of the base. The second infusion pipe has the same shape as the first infusion pipe. A connector for accessing an external cleaning liquid agent is provided at the rear part of the second infusion pipe.
[0008] Further, it further includes a dryer and an air outlet pipe. The dryer is fixedly provided at the lower left part of the base. The air outlet pipes are symmetrically provided at the front and rear sides of the upper left part of the base. The air outlet pipes are all connected and communicated with the dryer through pipelines. The heat flow generated by the dryer is blown outwards through the air outlet pipes.
[0009] Further, it further includes a detector. The detector is connected to the lower left part of the liquid agent box. The detector consists of a detection module and a probe. The probe of the detector penetrates into the inside of the liquid agent box.
[0010] Further, it further includes a limiting plate. The limiting plates are symmetrically provided at the front and rear sides near the air outlet pipe on the left side inside the upper part of the base.
[0011] The beneficial effects are as follows: When the etching process is carried out in the present utility model, while the spray nozzles swing through the swinging block, a regulating valve is provided on the spray nozzles to change the pressure of the liquid agent sprayed by the nozzles at different positions, so that the spraying pressures at the center and the edge of the board are different, reducing the accumulation of the solvent on the board surface of the circuit board, and intermittently etching the left edge and the right end of the circuit board, thereby achieving the etching uniformity of the entire board surface.
[0012] The utility model cleans the residual liquid agent on the surface of the circuit board after etching by setting a cleaning station after etching, avoiding the residue of the etching liquid agent. At the same time, a drying mechanism is set to dry the circuit board after etching and cleaning, reducing the influence of the residual liquid on the subsequent processing and storage of the circuit board.
[0013] The utility model detects the copper dissolution amount, pH value and other values of the etching liquid agent in the liquid agent tank in real time through a detector. Through the timely feedback of data and the timely adjustment of the solvent by workers, it is ensured that the etching liquid agent always maintains the best etching state throughout the whole process. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is a three-dimensional structural schematic diagram of the utility model.
[0015] Figure 2 is a top view of the utility model with the top cover hidden.
[0016] Figure 3 is a three-dimensional structural schematic diagram of the swing mechanism of the etching mechanism of the utility model.
[0017] Figure 4 is a three-dimensional structural schematic diagram of the conveying mechanism, the dryer and the air outlet pipe of the utility model.
[0018] Figure 5 is a three-dimensional structural schematic diagram of components such as the swing mechanism and the drying mechanism of the utility model.
[0019] Figure 6 is a three-dimensional structural schematic diagram of the drying mechanism of the utility model.
[0020] Names and serial numbers of components in the figure: 1 - base, 2 - top cover, 3 - driving motor, 4 - conveying mechanism, 5 - waste liquid box, 6 - liquid agent tank, 61 - liquid pumping pump, 62 - first liquid delivery pipe, 63 - nozzle, 7 - transmission group, 71 - swing block, 8 - second liquid delivery pipe, 9 - detector, 10 - limiting plate, 11 - dryer, 12 - air outlet pipe. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0021] The technical solution of the utility model will be further described below with reference to the accompanying drawings.
[0022] Embodiment 1: A fine line etching device for a circuit board, as Figure 1-6 shown, includes a carrying device and a base 1 for installing all components required for the etching station. A top cover 2 for blocking the splashing liquid agent during spraying is fixedly welded on the upper part of the base 1. A driving motor 3 for providing conveying power is installed at the rear side of the right part of the base 1;
[0023] Inside the upper part of the base 1, a conveying mechanism 4 for conveying the circuit board to one side to the etching station is installed. The conveying mechanism 4 is connected by two groups of transmission line wheel sets and two rotating shafts. The transmission line wheel set consists of two line wheels and a flexible line for conveying support. The flexible line can be a coated wire with a flexible material wrapped outside. The purpose is: for the etching of thin copper foils (such as 1 / 2 or 1 / 4 ounce), it is necessary to ensure that they are not scratched or abraded. Thin copper foils cannot withstand the mechanical drawbacks during the etching of 1-ounce copper foils. Sometimes, relatively violent vibrations may scratch the copper foil. To improve the reliability of transmission, the two transmission line wheel sets are respectively installed on the front and rear sides inside the upper part of the base 1. The two rotating shafts are respectively rotatably installed on the left and right sides of the upper part of the base 1, and the two rotating shafts are respectively fixedly connected to the front and rear two line wheels on the same side. The driving motor 3 is fixedly connected to the rear part of the rotating shaft on the right side. Driven by the driving motor 3, the conveying line of the conveying mechanism 4 rotates leftward with the rotation of the line wheels. When the circuit board to be etched is placed on the conveying mechanism 4, the circuit board will be conveyed leftward. And when the circuit board is conveyed leftward to the spraying station on the conveying mechanism 4, the driving motor 3 will stop according to the preset time required for spraying, controlling the conveying mechanism 4 to stop conveying until the spraying is completed, and then the driving motor 3 rotates again to drive the conveying mechanism 4 to convey leftward.
[0024] A waste liquid frame 5 for receiving the sprayed waste liquid is fixedly connected to the upper part of the base 1. A liquid agent box 6 for storing the etching liquid agent is fixedly connected to the front part of the waste liquid frame 5. A liquid pumping pump 61 for pumping out the etching liquid is installed on the front side of the upper part of the waste liquid frame 5. A transmission group 7 is installed on the rear side of the upper part of the waste liquid frame 5. The transmission group 7 consists of a transmission motor and a lead screw. A swing block 71 is threadedly connected to the outside of the lead screw. The front part of the swing block 71 is connected with two frame-shaped infusion pipes 62. The infusion pipe 62 is a frame-shaped pipeline. The two infusion pipes 62 are both arranged around the conveying mechanism 4. The front part of the infusion pipe 62 is connected and communicated with the liquid pumping pump 61 through a pipeline. The liquid pumping pump 61 is connected and communicated with the liquid agent box 6 through a pipeline. Three spray heads 63 are installed on both the upper and lower sides of the two infusion pipes 62. A regulating valve is provided on each spray head 63. By adjusting the regulating valve, the spraying pressure of the upper and lower nozzles can be adjusted to solve the problem of uneven etching on the upper and lower plate surfaces. The water outlets of the spray heads 63 are all oriented towards the conveying mechanism 4. The conveying mechanism 4 will convey the circuit board between the two frame-shaped infusion pipes 62. The installation positions of the three spray heads 63 on the upper and lower sides correspond to the middle parts and the front and rear sides of the upper and lower plate surfaces of the circuit board on the conveying mechanism 4. The etching liquid agent is pumped out from the liquid agent box 6 by the liquid pumping pump 61, flows through the infusion pipe 62, and is sprayed out through the spray heads 63 arranged on the upper and lower sides. At this time, the transmission group 7 starts to work, driving the infusion pipe 62 on the swing block to swing left and right. While the spray heads 63 are swung by the swing block, the pressure of the liquid agent sprayed by the spray heads 63 at different positions is changed through the regulating valve, so that the spraying pressures at the center and the edge of the plate are different, and the left edge and the right end of the circuit board are etched intermittently, thereby achieving the etching uniformity of the entire plate surface.
[0025] Embodiment 2; on the basis of Embodiment 1, in order to clean the etching agent remaining on the surface of the etched circuit board, as Figure 2 shown, it further includes a second infusion tube 8. The upper left side of the base 1 is provided with the second infusion tube 8. The second infusion tube 8 is located above the left part of the waste liquid frame 5. A number of water outlet holes capable of flowing out the agent are evenly spaced on the pipe walls on the upper and lower sides of the second infusion tube 8 facing the conveying mechanism 4. The second infusion tube 8 is the same in size and shape as the first infusion tube 62. A connector for accessing external cleaning agent is provided at the rear of the second infusion tube 8. When the conveying mechanism 4 transports the circuit board to a position close to the second infusion tube 8, the external cleaning agent is accessed from the connector of the second infusion tube 8. The cleaning agent will flow out through the water outlet holes of the second infusion tube. The flowing-out agent will rush towards the upper and lower sides of the conveying mechanism 4. Under the transportation of the conveying mechanism 4, the circuit board will pass between the second infusion tubes 8. The flowing-out cleaning agent will clean the upper and lower surfaces of the circuit board, removing the remaining etching agent. The cleaned agent will fall into the waste liquid frame 5.
[0026] As Figure 2 , Figure 4 , Figure 5 and Figure 6 shown, it further includes a dryer 11 and an air outlet pipe 12. The dryer 11 is fixedly provided at the lower left side of the base 1. The dryer 11 will generate a hot air flow for drying the remaining agent on the circuit board. The upper left side of the base 1 is symmetrically provided with air outlet pipes 12 at the front and rear. The air outlet pipes 12 are all connected and communicated with the dryer 11 through pipes. The hot air flow generated by the dryer 11 is blown out through the air outlet pipes 12. When the circuit board is transported to the area between the two air outlet pipes 12, the air flow blown out from the air outlet pipes 12 will blow onto the circuit board on the conveying mechanism 4 to dry the circuit board, eliminating the need to add a subsequent drying station to process the circuit board and avoiding the influence of liquid residue on the subsequent transfer and storage of the circuit board.
[0027] In a preferred embodiment: as Figure 1 and Figure 4 shown, it further includes a detector 9. The lower left side of the agent tank 6 is connected with the detector 9. The detector 9 is composed of a detection module and a probe. The probe of the detector 9 penetrates into the interior of the agent tank 6. The functions and quantities of the detector 9 are not limited to one. In the continuous etching of boards, the more consistent the etching rate, the more uniform the etched boards can be obtained. To meet this requirement, it is necessary to ensure that the etching liquid remains in the best etching state throughout the whole process of the etching agent. This requires selecting an etching liquid that is easy to regenerate and compensate and whose etching rate is easy to control. At this time, it is necessary to control the copper dissolution amount, pH value, and concentration of the solution. During the etching spraying process, the detector 9 is used to detect the copper dissolution amount, pH value, and other values of the etching agent in the agent tank 6 in real time. Through the timely feedback of data, the worker can adjust the solvent in a timely manner to ensure that the etching agent remains in the best etching state throughout the whole process.
[0028] In a preferred embodiment: To ensure dry processing, the hot air flow blows towards the circuit board, and the circuit board will not shift or vibrate. As Figure 2 shown, it further includes a limiting plate 10. The limiting plate 10 is symmetrically arranged before and after near the air outlet pipe 12 on the left side inside the upper part of the base 1. The bottom of the limiting plate 10 will be in sliding contact with the upper surface of the circuit board during transmission. The limiting plate 10 is made of a flexible material that is in flexible contact with the circuit board to reduce damage to the circuit board caused by sliding contact.
[0029] Although the present invention has been described in detail with reference to the above embodiments, it is obvious to those skilled in the art through the present disclosure that various changes or modifications can be made to the present invention without departing from the principle and spirit scope of the present invention defined by the claims. Therefore, the detailed description of the embodiments of the present disclosure is only used to explain, rather than to limit the present invention, and the scope of protection is defined by the content of the claims.
Claims
1. A circuit board fine line etching device, comprising a base (1), a top cover (2), a driving motor (3) and a conveying mechanism (4), wherein the top cover (2) is fixedly welded to the upper part of the base (1), the driving motor (3) is installed on the right rear side of the base (1), and the conveying mechanism (4) is installed on the inner side of the upper part of the base (1), and the conveying mechanism (4) is composed of two groups of transmission line wheel groups installed on the front and rear sides of the base (1) and two rotating shafts rotatably installed on the left and right sides, the driving motor (3) is fixedly connected to the rear of the right rotating shaft, and driven by the driving motor (3), the conveying line of the conveying mechanism (4) rotates with the line wheel; Its characteristics are: The invention also comprises a waste liquid frame (5), a liquid agent box (6), a liquid pump (61), an infusion tube (62), a nozzle (63), a transmission group (7) and a swing block (71). The upper part of the base (1) is fixedly connected to the waste liquid frame (5), the front part of the waste liquid frame (5) is fixedly connected to the liquid agent box (6), the front part of the waste liquid frame (5) is equipped with a liquid pump (61), the rear part of the upper part of the waste liquid frame (5) is equipped with a transmission group (7), the transmission group (7) is composed of a transmission motor and a screw rod, the outer side of the screw rod is threadedly connected to the swing block (71), the front part of the swing block (71) is connected to two infusion tubes (62), the infusion tube (62) is a frame-shaped pipeline, and the infusion tube (62) is a frame-shaped pipeline. 2) both surround the conveying mechanism (4), the front part of the infusion tube (62) is connected and communicated with the liquid pump (61) through a pipeline, the liquid pump (61) is connected and communicated with the liquid tank (6) through a pipeline, three nozzles (63) are installed on the upper and lower sides of the two infusion tubes (62), and the nozzles (63) are provided with regulating valves. The water outlets of the nozzles (63) are all facing the conveying mechanism (4), and the three nozzles (63) on the upper and lower sides are arranged at positions corresponding to the middle and front and rear sides of the conveying mechanism (4). The etching liquid is extracted from the liquid tank (6) through the liquid pump (61), flows through the infusion tube (62), and is sprayed out through the nozzles (63) arranged on the upper and lower sides.
2. A circuit board fine line etching device according to claim 1, characterized in that: It also includes an infusion tube 2 (8), which is arranged on the left side of the upper part of the base (1). The infusion tube 2 (8) is consistent in shape with the infusion tube 1 (62), and a connector for connecting to an external cleaning liquid is arranged at the rear of the infusion tube 2 (8).
3. A circuit board fine line etching device according to claim 2, characterized in that: The invention also comprises a dryer (11) and an air outlet pipe (12), wherein the dryer (11) is fixedly arranged at the lower left side of the base (1), and the air outlet pipes (12) are symmetrically arranged at the front and rear sides of the upper left side of the base (1), and the air outlet pipes (12) are connected and communicated with the dryer (11) through pipelines, and the heat flow generated by the dryer (11) is blown outward through the air outlet pipes (12).
4. A circuit board fine line etching device according to claim 3, characterized in that: It also includes a detector (9), which is connected to the left side of the lower part of the liquid agent box (6). The detector (9) is composed of a detection module and a probe, and the probe of the detector (9) penetrates into the interior of the liquid agent box (6).
5. A circuit board fine line etching device according to claim 4, characterized in that: It also comprises a limiting plate (10), and the limiting plate (10) is symmetrically arranged front and back on the left side of the upper part of the base (1) near the air outlet pipe (12).