Clamp capable of being used for accurate chip mounting of IC chip
By designing a clamp with a press fit and an electromagnetic sleeve, the problem of warping and deformation of the circuit board during the IC chip patching process is solved, and the higher precision patch processing is achieved, and the needs of different circuit boards are adapted.
Patent Information
- Application Number
- CN202421604094.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-08
AI Technical Summary
During the IC chip patching process, ultra-thin circuit boards are prone to bend and deformed due to high temperatures, making it difficult for IC chips to be accurately welded and affects the quality of the patch.
A clamp including a base plate, a clamp and a clamping column is designed. The clamping column is equipped with a pressing member and an insertion frame. The clamping column includes a lifting rod and an electromagnetic sleeve. Through the repulsive effect of the electromagnetic sleeve and the magnet, the clamping plate is driven to press down and the circuit board is fixed to avoid curved deformation.
The four sides of the circuit board are pressed and fixed by clamping, which effectively avoids warping and deformation caused by high temperature and vibration, achieves higher precision patch processing, and can adapt to patch processing of different circuit boards.
Smart Images

Figure CN223040265U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a circuit board processing device, in particular to a fixture that can be used for accurately pasting IC chips. Background Art
[0002] Surface Mount Technology (SMT) for electronic circuits, also known as surface mounting or surface mounting technology. It is a circuit assembly technology that mounts leadless or short-lead surface-mounted components (referred to as SMC / SMD, also known as chip components in Chinese) such as IC chips on the surface of printed circuit boards (PCBs), IC carriers or other substrates, and is soldered and assembled by methods such as reflow soldering or dip soldering. During the curing and reflow soldering stages of the patch processing of ultra-thin circuit boards, the board body is prone to warping and deformation under the influence of high temperature, which makes it difficult for IC chips to be accurately soldered to the pads, ultimately affecting the quality of the patch. Summary of the Utility Model
[0003] Based on this, it is necessary to provide a fixture that can be used for accurately pasting IC chips in view of the deficiencies in the prior art.
[0004] A fixture that can be used for accurately pasting IC chips includes a bottom plate, a clamping plate and a number of clamping columns. The clamping plate is arranged above the bottom plate, and a number of the clamping columns are respectively inserted through the clamping plate and their lower ends are fixedly connected to the upper end of the bottom plate. The clamping plate includes a lifting frame, an insertion frame and a pressing member. The lifting frame is provided with an insertion slot with an opening on one side. The insertion frame is snap-fitted into the insertion slot. The pressing member is installed in the insertion frame and its lower end extends downward. The clamping column includes a lifting rod and an electromagnetic sleeve. The lifting rod is inserted through the lifting frame and its lower end is fixedly connected to the upper surface of the bottom plate. A magnet is also provided at the upper end of the lifting rod. The electromagnetic sleeve is sleeved on the lifting rod and is located above the lifting frame. The electromagnetic sleeve and the magnet repel each other.
[0005] Further, an adjustment chute is also provided inside the insertion frame. The pressing member includes an adjustment slide rod and a pressing cylinder. The adjustment slide rod is snap-fitted into the adjustment chute and can be adjusted and slid left and right. The pressing cylinder is inserted through the adjustment slide rod and can be adjusted and slid back and forth.
[0006] Further, a limiting component is also provided on the lifting frame. The limiting component includes a limiting block, a locking rod, a first return spring and a second return spring. The limiting block is horizontally fitted into the lifting frame and one end of it extends into the insertion slot. A locking through hole that penetrates up and down is also provided at the other end of the limiting block. The locking rod is vertically fitted into the lifting frame and passes through the locking through hole. The first return spring abuts against one side of the limiting block. The second return spring is inserted through the locking rod.
[0007] Furthermore, the bottom plate includes a bearing plate, a plurality of fixed limit members and movable limit members. A limit chute is provided on the bearing plate. The fixed limit members are fixedly installed above the bearing plate, and the movable limit members are snap-fitted in the limit chute and can slide elastically.
[0008] Furthermore, the movable limit member includes a movable limit plate, a pull rod, a telescopic spring and an adjusting ring. The movable limit plate is snap-fitted in the limit chute and can slide horizontally along the limit chute. The pull rod passes through the limit chute from the outside of the bearing plate, and one end of the pull rod is fixedly connected to the movable limit plate. The telescopic spring is sleeved on the pull rod and is located in the limit chute. The adjusting ring is spirally sleeved on the pull rod and is located outside the bearing plate.
[0009] In summary, the beneficial effects of the fixture for precise chip mounting of IC chips of the present utility model are as follows: By designing the clamping plate with a pressing member and the clamping column, the four sides of the bonding pad of the circuit board can be pressed and fixed, effectively avoiding the warping and deformation problems that may occur to the circuit board due to factors such as high temperature and vibration, and finally achieving higher-precision chip mounting processing; The clamping plate is designed as an inserted combination structure and the position of the pressing cylinder can be adjusted, enabling the fixture to freely replace and adapt to the chip mounting processing of different circuit boards; The present utility model has strong practicability and has strong popularization significance. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 is a schematic structural diagram of a fixture for precise chip mounting of IC chips of the present utility model;
[0011] Figure 2 is Figure 1 the exploded structural diagram of
[0012] Figure 3 is Figure 2 the exploded structural diagram of the bottom plate in
[0013] Figure 4 is Figure 3 the exploded structural diagram of the movable limit member in
[0014] Figure 5 is Figure 2 the exploded structural diagram of the clamping plate in
[0015] Figure 6 is Figure 5 the exploded structural diagram of the limit assembly in
[0016] Figure 7 is Figure 2 the exploded structural diagram of the clamping column in DETAILED DESCRIPTION OF THE EMBODIMENTS
[0017] In order to make the purpose, technical solutions and advantages of the utility model more clear and understandable, the following further details the utility model in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.
[0018] As Figures 1 to 7 shown, the utility model provides a fixture 100 that can be used for precise chip mounting of IC chips, which includes a bottom plate 10, a clamping plate 20 and a plurality of clamping columns 30. The clamping plate 20 is arranged above the bottom plate 10, and the plurality of clamping columns 30 respectively penetrate through the clamping plate 20 and their lower ends are fixedly connected to the upper end of the bottom plate 10. It can be understood that the utility model also includes a plurality of driving devices, electrical connection structures and limit adjustment structures, which are not described in detail herein because they are all conventional technical contents in this technical field.
[0019] The bottom plate 10 includes a bearing plate 11, a plurality of fixed limit members 12 and a movable limit member 13. A limit sliding groove 111 is provided on the bearing plate 11. The fixed limit members 12 are fixedly installed above the bearing plate 11, and the movable limit member 13 is snap-fitted in the limit sliding groove 111 and can slide elastically. The fixed limit members 12 on the bearing plate 11 cooperate with the slidable and adjustable movable limit member 13 to limit and fix circuit boards of different specifications, so that the fixture can match the chip mounting processing of circuit boards of different specifications.
[0020] The movable limit member 13 includes a movable limit plate 131, a pull rod 132, a telescopic spring 133 and an adjustment ring 134. The movable limit plate 131 is snap-fitted in the limit sliding groove 111 and can slide horizontally along the limit sliding groove 111. The pull rod 132 penetrates through the limit sliding groove 111 from the outside of the bearing plate 11 and one end thereof is fixedly connected to the movable limit plate 131. The telescopic spring 133 is sleeved on the pull rod 132 and is located in the limit sliding groove 111. The adjustment ring 134 is spirally sleeved on the pull rod 132 and is located outside the bearing plate 11.
[0021] When limiting and fixing the circuit board, just pull the pull rod 132 to make the movable limit plate 131 slide outward from the bearing plate 11, so as to leave a space for placing the circuit board. After placing the circuit board, release the pull rod 132, and the telescopic spring 133 will reset the movable limit plate 131 by its elastic force, so that the fixed limit member 12 and the movable limit plate 131 limit and fix the opposite side of the circuit board. The adjustment ring 134 on the pull rod 132 will limit the pull rod 132 and the movable limit plate 131 to avoid the problem that the elastic force of the telescopic spring 133 is too large and impacts the circuit board and causes damage.
[0022] The clamping plate 20 includes a lifting frame 21, an insertion frame 22 and a pressing member 23. An insertion slot 211 with an opening on one side is provided on the lifting frame 21. The insertion frame 22 is snap-fitted into the insertion slot 211. The pressing member 23 is installed in the insertion frame 22 and its lower end extends downward. The clamping column 30 includes a lifting rod 31 and an electromagnetic sleeve 32. The lifting rod 31 passes through the lifting frame 21 and its lower end is fixedly connected to the upper surface of the bottom plate 10. A magnet 311 is further provided at the upper end of the lifting rod 31. The electromagnetic sleeve 32 is sleeved on the lifting rod 31 and is located above the lifting frame 21. The electromagnetic sleeve 32 and the magnet 311 repel each other.
[0023] When it is necessary to fix the surface of the circuit board to prevent warping and deformation of the attachment of the patch pads, just start the electromagnetic sleeve 32 to repel the magnet 311 at the upper end of the lifting rod 31, and then the electromagnetic sleeve 32 will drive the lifting frame 21, the insertion frame 22 and the pressing member 23 to press down synchronously. The pressing member 23 that presses against the surface of the circuit board will form a fixation on the surface of the circuit board, effectively preventing the problem of warping and deformation due to factors such as high temperature and vibration during the mounting process. The flat patch pads and the mounting of the IC chips will be more accurate and reliable, greatly improving the mounting quality of the circuit board.
[0024] An adjustment chute 221 is further provided inside the insertion frame 22. The pressing member 23 includes an adjustment slide rod 231 and a pressing cylinder 232. The adjustment slide rod 231 is snap-fitted into the adjustment chute 221 and can be adjusted and slid left and right. The pressing cylinder 232 is sleeved on the adjustment slide rod 231 and can be adjusted and slid back and forth. The pressing cylinder 232 that can slide and adjust its position in the insertion frame 22 can press against the patch pads at any position on the surface of the circuit board, so that the fixture can match multiple patch pads on the circuit board for high-precision mounting processing.
[0025] A limiting component 24 is further provided on the lifting frame 21. The limiting component 24 includes a limiting block 241, a locking rod 242, a first return spring 243 and a second return spring 244. The limiting block 241 is horizontally fitted into the lifting frame 21 and one end of it extends into the insertion slot 211. A locking through hole 241a that penetrates up and down is further provided at the other end of the limiting block 241. The locking rod 242 is vertically fitted into the lifting frame 21 and passes through the locking through hole 241a. The first return spring 243 abuts against one side of the limiting block 241. The second return spring 244 is sleeved on the locking rod 242. The limiting component 24 can limit and lock the insertion frame 22, avoiding the problem of slippage and deviation of the insertion frame 22 and the pressing member 23 during the mounting processing.
[0026] In summary, the beneficial effects of the fixture 100 for precise chip mounting of IC chips according to the present utility model are as follows: By designing the clamping plate 20 with the pressing member 23 and matching it with the clamping column 30, the four sides of the bonding pads of the circuit board can be pressed and fixed, effectively avoiding the problem of warping and deformation of the circuit board that may be caused by factors such as high temperature and vibration, and finally achieving higher-precision chip mounting processing; The clamping plate 20 is designed as an inserted combination structure and the position of the pressing cylinder 232 can be adjusted, enabling the fixture to freely replace and adapt to the chip mounting processing of different circuit boards; The present utility model has strong practicability and has great significance for popularization.
[0027] The above-described embodiments merely represent one implementation manner of the utility model, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.
Claims
1. A fixture that can be used for precise placement of IC chips, characterized by: It includes a base plate, a clamping plate and a plurality of clamping columns, the clamping plate is arranged above the base plate, the plurality of clamping columns are respectively passed through the clamping plate and the lower ends thereof are fixedly connected to the upper end of the base plate; the clamping plate includes a lifting frame, an insertion frame and a pressing piece, the lifting frame is provided with an insertion groove with an opening on one side, the insertion frame is snap-fitted and inserted in the insertion groove, the pressing piece is installed in the insertion frame and the lower end thereof extends downward; the clamping column includes a lifting rod and an electromagnetic sleeve, the lifting rod is passed through the lifting frame and the lower end thereof is fixedly connected to the upper surface of the base plate, the upper end of the lifting rod is also provided with a magnet, the electromagnetic sleeve is sleeved on the lifting rod and is located above the lifting frame, and the electromagnetic sleeve and the magnet repel each other.
2. The fixture for IC chip precision mounting as claimed in claim 1, characterized in that: An adjustment slot is also provided on the inner side of the insertion frame, and the pressing part includes an adjustment slide rod and a pressing cylinder; the adjustment slide rod is clamped and installed in the adjustment slot and can slide left and right, and the pressing cylinder is passed through the adjustment slide rod and can slide back and forth.
3. The fixture for precise IC chip placement according to claim 1, characterized in that: The lifting frame is also provided with a limit assembly, which includes a limit block, a locking rod, a first return spring and a second return spring; the limit block is horizontally embedded in the lifting frame and one end of it extends into the insertion groove, and the other end of the limit block is also provided with a locking through hole passing through from top to bottom, the locking rod is vertically embedded in the lifting frame and penetrated into the locking through hole, the first return spring abuts against one side of the limit block, and the second return spring is penetrated on the locking rod.
4. The fixture for IC chip precision mounting as claimed in claim 1, characterized in that: The bottom plate includes a bearing plate, a plurality of fixed limiting parts and a movable limiting part; a limiting slide groove is arranged on the bearing plate, the fixed limiting part is fixedly installed above the bearing plate, and the movable limiting part is clamped and installed in the limiting slide groove and can slide elastically.
5. The fixture for precise IC chip placement as claimed in claim 4, characterized in that: The movable limiting member includes a movable limiting plate, a pull rod, a telescopic spring and an adjusting ring; the movable limiting plate is clamped and installed in the limiting slide groove and can slide horizontally along the limiting slide groove, the pull rod is passed through the limiting slide groove from the outside of the bearing plate and one end of the pull rod is fixedly connected to the movable limiting plate, the telescopic spring is sleeved on the pull rod and located in the limiting slide groove, and the adjusting ring is spirally sleeved on the pull rod and located outside the bearing plate.