Radiator, radiating assembly and power optimization device

Abstract

The utility model belongs to the technical field of energy storage equipment, and discloses a heat radiator, a heat radiation assembly and a power optimization device, the heat radiator is installed on a power optimization module, the power optimization module comprises an MOS tube and a functional component whose height is greater than that of the MOS tube, the heat radiator comprises a heat radiation substrate, a first side surface and a second side surface, the first side surface is provided with a heat radiation fan, and the second side surface is provided with a heat radiation fan; the MOS tube is in heat conduction connection with the second side surface; the heat dissipation fins are arranged on the first side face, the heat dissipation fins are arranged in the radial direction, a concave part is formed by the heat dissipation fins, and the heat dissipation fan is arranged in the concave part; and the heat dissipation counter bore is formed in the second side surface and is used for avoiding the functional component. The radiator provided by the utility model avoids a functional component with the height larger than that of the MOS tube through the radiating counter bore, reduces the thermal resistance between the MOS tube and the radiating substrate, improves the heat conduction efficiency of the MOS tube to the radiator, and optimizes the radiating effect.

Description

Technical Field

[0001] The utility model relates to the technical field of energy storage devices, in particular to a radiator, a heat dissipation assembly and a power optimization device. Background Art

[0002] Power optimization technologies such as MPPT (Maximum Power Point Tracking) are widely used in solar photovoltaic systems to improve the energy conversion efficiency of photovoltaic panels. The output power of a solar photovoltaic cell varies with environmental conditions such as light intensity and temperature, and MPPT technology can adjust the operating point of the photovoltaic cell in real time to keep it always at the maximum power output state.

[0003] Currently, the heat on power optimization devices such as MPPT controllers is mainly generated by MOS transistors. However, since some components on the controller are significantly higher than the MOS transistors (metal-oxide-semiconductor field effect transistors), it affects the contact between the MOS transistors and the radiator, resulting in poor heat conduction between the MOS transistors and the radiator and thus poor heat dissipation effect.

[0004] Therefore, there is an urgent need for a radiator, a heat dissipation assembly and a power optimization device to solve the above technical problems. Summary of the Utility Model

[0005] The purpose of the utility model is as follows:

[0006] 1. Provide a radiator that avoids functional components with a height greater than that of the MOS transistor through heat dissipation sink holes, reduces the thermal resistance between the MOS transistor and the heat dissipation substrate, improves the heat conduction efficiency from the MOS transistor to the radiator, and optimizes the heat dissipation effect;

[0007] 2. Provide a heat dissipation assembly and a power optimization device that absorb the heat generated by the power optimization module through the radiator, and the heat dissipation fan blows air to drive the heat of the radiator to dissipate, improving the heat dissipation efficiency.

[0008] To achieve the above object, the utility model adopts the following technical solutions:

[0009] In a first aspect, a radiator is provided and installed on a power optimization module. The power optimization module includes a MOS transistor and functional components with a height greater than that of the MOS transistor. The radiator includes:

[0010] A heat dissipation substrate having a first side and a second side. A heat dissipation fan is provided on the first side, and the MOS transistor is thermally connected to the second side;

[0011] A plurality of heat dissipation fins are arranged on the first side surface, and the plurality of heat dissipation fins are arranged radially. The heat dissipation fins form a recess, and the heat dissipation fan is arranged in the recess;

[0012] A heat dissipation counterbore is formed on the second side surface, and the heat dissipation counterbore is used to avoid the functional components.

[0013] Preferably, the radiator further includes:

[0014] A heat dissipation boss is formed on the second side surface, and the heat dissipation boss is thermally connected to the MOS transistor.

[0015] Preferably, the inner wall of the heat dissipation counterbore is thermally connected to the functional components.

[0016] Preferably, the radiator is provided with a central area and a gradient area. The recess is arranged in the central area, the gradient area is wound around the outer periphery of the central area, the height of the heat dissipation fins in the central area is greater than the height of the heat dissipation fins in the gradient area, and in the gradient area, the height of the heat dissipation fins gradually decreases radially from the inside to the outside;

[0017] At least a partial structure of the heat dissipation counterbore corresponds to the central area, and / or, the connection point of the second side surface and the MOS transistor corresponds to the central area.

[0018] Preferably, in the gradient area, a gradient inclined surface is provided at the top of the heat dissipation fins, and the inclination angle θ of the gradient inclined surface is 5° to 15°.

[0019] Preferably, a heat conduction medium is potted between the inner wall of the heat dissipation counterbore and the functional components.

[0020] Preferably, the radiator is made of a heat-conducting metal material.

[0021] In a second aspect, a heat dissipation assembly is provided, including a heat dissipation fan and the radiator as described above. The heat dissipation fan is fixed in the recess, and the air outlet end of the heat dissipation fan faces the heat dissipation substrate.

[0022] Preferably, the heat dissipation assembly further includes a heat dissipation housing, and the heat dissipation housing is hermetically connected to the radiator to form a sealed cavity for accommodating the power optimization module on the side facing the second side surface.

[0023] In a third aspect, a power optimization device is provided, including a power optimization module and the heat dissipation assembly as described above. The power optimization module is fixedly and thermally connected to the radiator.

[0024] Advantages of the present utility model:

[0025] The radiator provided by the present utility model is used to export the heat of the power optimization module. Heat dissipation fins are arranged on the first side of the heat dissipation substrate. The heat dissipation fins form recesses for installing heat dissipation fans, and the heat of the heat dissipation substrate is exported through forced air cooling. The second side of the heat dissipation substrate is thermally connected to the MOS transistors on the power optimization module, and heat dissipation sink holes are arranged on the second side. Function components with a height greater than that of the MOS transistors are avoided through the heat dissipation sink holes, so as to prevent the function components from interfering with the thermal connection between the MOS transistors and the heat dissipation substrate, reduce the thermal resistance between the MOS transistors and the heat dissipation substrate, improve the efficiency of heat conduction from the MOS transistors to the radiator, and optimize the heat dissipation effect.

[0026] For the heat dissipation assembly and the power optimization device provided by the present utility model, the radiator absorbs the heat generated by the power optimization module, and the heat dissipation fan blows external gas to the radiator. The gas flows through the heat dissipation fins, driving the heat of the radiator to dissipate, thereby improving the heat dissipation efficiency. Description of the Drawings

[0027] Figure 1 is a schematic structural diagram of the power optimization device provided by the present utility model;

[0028] Figure 2 is an exploded structural diagram of the power optimization device provided by the present utility model;

[0029] Figure 3 is a schematic structural diagram of the radiator provided by the present utility model;

[0030] Figure 4 is a bottom view of the radiator provided by the present utility model;

[0031] Figure 5 is a schematic diagram of the cooperation between the radiator provided by the present utility model and the MOS transistors and function components;

[0032] Figure 6 is an exploded schematic diagram of the cooperation between the radiator provided by the present utility model and the MOS transistors and function components;

[0033] Figure 7 is a top view of the radiator provided by the present utility model.

[0034] In the figure:

[0035] 10. Radiator; 11. Heat dissipation substrate; 101. First side; 102. Second side; 12. Recess; 13. Heat dissipation fin; 14. Heat dissipation sink hole; 15. Heat dissipation boss; 100. Central area; 200. Gradient area;

[0036] 20. Heat dissipation fan; 21. Fan protective cover; 22. Fastening screw;

[0037] 30. Heat dissipation housing; 31. Sealed cavity;

[0038] 40. Power optimization module; 41. MOS transistor; 42. Functional components. Detailed implementation manners

[0039] The present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the convenience of description, only parts related to the present utility model rather than all structures are shown in the drawings.

[0040] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0041] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0042] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0043] This embodiment provides a power optimization device, as Figure 1 and Figure 2 shown, the power optimization device includes a power optimization module 40 and a heat dissipation assembly. The power optimization module 40 includes a PCB and a MOS transistor 41 and functional components 42 provided thereon. The heat dissipation assembly includes a heat dissipation fan 20 and a radiator 10, and the radiator 10 is connected and installed to the power optimization module 40.

[0044] Further, the height of the functional component 42 is greater than the height of the MOS transistor 41. For example, Figures 1-7 As shown, the heat sink 10 includes a heat dissipation substrate 11, a plurality of heat dissipation fins 13 and heat dissipation sink holes 14. The heat dissipation substrate 11 is provided with a first side surface 101 and a second side surface 102. The first side surface 101 is the top surface, and the second side surface 102 is the bottom surface. A plurality of heat dissipation fins 13 are arranged on the first side surface 101, and the plurality of heat dissipation fins 13 are arranged radially. The heat dissipation fins 13 form a recess 12. The heat dissipation fan 20 is fixedly installed in the recess 12, and the air outlet end of the heat dissipation fan 20 is arranged facing the heat dissipation substrate 11. The MOS transistor 41 is thermally connected to the second side surface 102. The heat dissipation sink hole 14 is formed on the second side surface 102, and the heat dissipation sink hole 14 is used to avoid the functional component 42.

[0045] Specifically, the power optimization device provided in this embodiment absorbs the heat generated by the power optimization module 40 through the heat sink 10. The heat dissipation fan 20 blows external gas to the heat sink 10, and the gas flows through the heat dissipation fins 13, driving the heat of the heat sink 10 to dissipate. The heat dissipation efficiency is higher than that of natural heat dissipation. In addition, heat dissipation sink holes 14 are provided on the second side surface 102 of the heat dissipation substrate 11. By avoiding the functional component 42 with a height greater than that of the MOS transistor 41 through the heat dissipation sink holes 14, it is possible to prevent the functional component 42 from interfering with the thermal connection between the MOS transistor 41 and the heat dissipation substrate 11, shorten the distance between the MOS transistor 41 and the heat dissipation substrate 11, reduce the thermal resistance between the MOS transistor 41 and the heat dissipation substrate 11, improve the heat conduction efficiency of the MOS transistor 41 to the heat sink 10, and further optimize the heat dissipation effect. Adopting an air-cooled heat dissipation solution, compared with the natural heat dissipation solution, the installation position of the heat sink 10 is not restricted, and there is no need to meet the requirement that the heat dissipation fins 13 are arranged vertically along the gravity direction, and the flexibility is higher.

[0046] Exemplarily, as Figures 3-6 shown, the heat sink 10 further includes a heat dissipation boss 15. The heat dissipation boss 15 is formed on the second side surface 102, and the heat dissipation boss 15 is thermally connected to the MOS transistor 41. Specifically, the heat dissipation boss 15 can directly press against the top of the MOS transistor 41 to achieve thermal contact heat conduction. More preferably, a thermal conductive adhesive can be coated on the top of the heat dissipation boss 15 and / or the top of the MOS transistor 41. On the one hand, the thermal conductive adhesive fills the gap between the heat dissipation boss 15 and the MOS transistor 41, improving the heat conduction efficiency. On the other hand, it can also structurally connect the heat dissipation boss 15 and the MOS transistor 41, improving the reliability of the installation structure. In this embodiment, the MOS transistor 41 is attached to the heat dissipation boss 15 by screws, and a relief hole is provided at the position on the PCB corresponding to the MOS transistor 41 for the attachment operation.

[0047] According to the calculation formula of thermal conduction resistance Rth: Rth = L / kA, where: Rth is the thermal conduction resistance (unit: °C / W); L is the length of the heat conduction path (unit: m); k is the thermal conductivity of the material (unit: W / (m·k)); A is the cross-sectional area of the heat conduction path (unit: m 2 2), when the thickness of the heat dissipation boss 15 is smaller, the length L of the heat conduction path is also smaller, the thermal conduction resistance Rth is smaller, and the heat dissipation effect is better. Therefore, by setting the heat dissipation blind hole 14 to avoid the functional component 42, the thickness of the heat dissipation boss 15 can be effectively reduced, and the heat dissipation effect of the MOS transistor 41 can be significantly improved.

[0048] Exemplarily, as Figures 3-6 shown, the power optimization module 40 includes a plurality of MOS transistors 41. The plurality of MOS transistors 41 and the functional components 42 are arranged on the same side of the PCB. Correspondingly, a plurality of heat dissipation bosses 15 are also provided corresponding to the plurality of MOS transistors 41, and the plurality of heat dissipation bosses 15 are arranged in one-to-one correspondence with the plurality of MOS transistors 41.

[0049] Exemplarily, the functional component 42 can be electronic components such as inductors and capacitors. In this embodiment, the functional component 42 is specifically an inductor. When the inductor is working, in addition to the heat loss generated by the ESR (equivalent series resistance), there is also a process of converting magnetic field energy into heat energy. Therefore, its heat generation cannot be ignored. Therefore, in this embodiment, the inner wall of the heat dissipation blind hole 14 is thermally connected to the functional component 42 to direct the heat of the functional component 42 to the radiator 10 and accelerate the heat dissipation of the functional component 42.

[0050] Exemplarily, a thermal conductive medium is potted between the inner wall of the heat dissipation blind hole 14 and the functional component 42. The thermal conductive medium is preferably a thermal conductive material with a thermal conductivity greater than 1.2 W / (m·k), such as a thermal conductive adhesive or thermal conductive silicone added with thermal conductive fillers such as SiO2 and Al2O3. The thermal conductive medium fills the gap between the inner wall of the heat dissipation blind hole 14 and the functional component 42, and plays multiple roles such as heat conduction, insulation, protection, and fixation. Through its excellent thermal conductivity, it helps the functional component 42 effectively dissipate the generated heat, ensuring the stable operation of the power optimization module 40 and extending its service life.

[0051] Exemplarily, as Figures 1-3 、 Figure 6 and Figure 7As shown, the heat sink 10 includes a plurality of heat dissipation fins 13. The plurality of heat dissipation fins 13 are arranged at intervals around the circumference of the heat dissipation fan 20, and a heat dissipation air duct is formed between two adjacent heat dissipation fins 13. Specifically, the recess 12 is arranged at the central position of the heat dissipation substrate 11. Through the arrangement of the recess 12, one end of the plurality of heat dissipation fins 13 penetrates between the heat dissipation fan 20 and the heat dissipation substrate 11, and the other end extends towards the edge of the heat dissipation substrate 11. The plurality of heat dissipation fins 13 cooperate to form a plurality of independent air ducts extending from the center to the edge of the heat dissipation substrate 11. The heat absorbed by the heat sink 10 from the power optimization module 40 is transferred to the heat dissipation fins 13. After absorbing heat from the heat dissipation substrate 11, the heat dissipation fan 20 blows external gas into the heat dissipation air duct, and the heat of the heat dissipation fins 13 dissipates along the direction from the center to the edge of the heat dissipation substrate 11.

[0052] Exemplarily, as Figure 3 and Figure 7 As shown, the heat sink 10 is provided with a central area 100 and a gradient area 200. The recess 12 is arranged in the central area 100. The gradient area 200 is wound around the outer periphery of the central area 100. At least a partial structure of the heat dissipation sink hole 14 corresponds to the central area 100, and / or the connection point of the second side surface 102 and the MOS transistor 41 corresponds to the central area 100. The heat dissipation fins 13 penetrate through the central area 100 and the gradient area 200. The height of the heat dissipation fins 13 in the central area 100 is greater than the height of the heat dissipation fins 13 in the gradient area 200. And within the gradient area 200, the height of the heat dissipation fins 13 gradually decreases radially from the inside to the outside. Specifically, the MOS transistor 41 and the functional component 42 are arranged close to the central area 100. The heat dissipation pressure in the central area 100 is greater than that in the gradient area 200, and the closer to the edge, the smaller the heat dissipation pressure of the heat sink 10. And on the premise that other conditions remain unchanged, the larger the height dimension of the heat dissipation fins 13, the stronger its heat conduction ability. Therefore, the heat dissipation fins 13 are set to a structure with a high middle and low around and the height gradually decreasing within the gradient area 200 to match the actual heat dissipation requirements, reduce the weight of the heat dissipation fins 13, and meet the lightweight design requirements.

[0053] Exemplarily, as Figure 3 As shown, within the gradient area 200, a gradient inclined surface is provided at the top of the heat dissipation fins 13, and the inclination angle θ of the gradient inclined surface is 5° to 15°. The specific size of the inclination angle θ of the gradient inclined surface is determined by the overall heat generation amount, size of the power optimization module 40, and the thickness of the heat dissipation fan 20. In this embodiment, the inclination angle θ of the gradient inclined surface is 10°.

[0054] Exemplarily, the heat sink 10 is made of heat-conducting metal materials such as copper alloy and aluminum alloy. In this embodiment, the heat sink 10 is made of aluminum alloy, which has the advantages of good heat conduction effect and light weight.

[0055] Exemplarily, as Figure 1and Figure 2 As shown in Figure 2 , a plurality of fastening threaded seats are provided on the plurality of concave portions 12. The heat dissipation assembly further includes a fan protective cover 21 and a plurality of fastening screws 22. The fan protective cover 21 is installed on the side of the heat dissipation fan 20 facing away from the radiator 10, and serves to shield the fan blades inside the heat dissipation fan 20. The plurality of fastening screws 22 sequentially pass through the fan protective cover 21 and the heat dissipation fan 20 and are then threadedly connected to the fastening threaded seats to fixedly install the fan protective cover 21 and the heat dissipation fan 20 at the same time.

[0056] Exemplarily, such as Figure 1 and Figure 2 As shown in Figure 2 , the heat dissipation assembly further includes a heat dissipation housing 30. The heat dissipation housing 30 is hermetically connected to the radiator 10 by a sealant to form a sealed cavity 31 for accommodating the power optimization module 40 on the side facing the second side 102. The PCB is fixed to the radiator 10 or the heat dissipation housing 30. The heat dissipation housing 30 mainly serves to hermetically protect the power optimization module 40. The heat dissipation housing 30 can be made of a metal material or a plastic material. The power optimization device provided in this embodiment can reach the protection level of IP65.

[0057] Exemplarily, the heat dissipation fan 20 adopts an axial flow fan. In some embodiments, the heat dissipation fan 20 can also adopt a turbo fan, a centrifugal fan, etc.

[0058] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, and are not limitations on the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A heat sink installed in a power optimization module, wherein the power optimization module includes a MOS tube and a functional component having a height greater than that of the MOS tube, characterized in that: The radiator comprises: A heat dissipation substrate, provided with a first side surface and a second side surface, the first side surface is provided with a heat dissipation fan, and the MOS tube is thermally connected to the second side surface; A plurality of heat dissipation fins are provided on the first side surface, and the plurality of heat dissipation fins are arranged in a radial direction, the heat dissipation fins form a concave portion, and the heat dissipation fan is provided in the concave portion; A heat sink hole is formed on the second side surface, and the heat sink hole is used to avoid the functional components.

2. The heat sink according to claim 1, characterized in that: The radiator further comprises: A heat dissipation boss is formed on the second side surface, and the heat dissipation boss is thermally connected to the MOS tube.

3. The heat sink according to claim 1, characterized in that: The inner wall of the heat dissipation countersunk hole is thermally connected to the functional component.

4. The heat sink according to claim 3, characterized in that: The heat sink is provided with a central area and a gradient area, the recess is provided in the central area, the gradient area is provided around the periphery of the central area, the height of the heat dissipation fin in the central area is greater than the height of the heat dissipation fin in the gradient area, and in the gradient area, the height of the heat dissipation fin gradually decreases from the inside to the outside along the radial direction; At least a partial structure of the heat dissipation countersunk hole is arranged corresponding to the central area, and / or a connection point between the second side surface and the MOS tube is arranged corresponding to the central area.

5. The heat sink according to claim 4, characterized in that: In the gradient zone, a gradient slope is disposed on the top of the heat dissipation fin, and an inclination angle θ of the gradient slope is 5° to 15°.

6. The heat sink according to claim 3, characterized in that: A heat-conducting medium is filled between the inner wall of the heat dissipation countersunk hole and the functional components.

7. The radiator according to any one of claims 1 to 6, characterized in that: The radiator is made of heat-conducting metal material.

8. A heat dissipation component, characterized in that: It comprises a heat dissipation fan and a heat sink as described in any one of claims 1 to 7, wherein the heat dissipation fan is fixed to the recess, and an air outlet end of the heat dissipation fan is arranged toward the heat dissipation substrate.

9. The heat dissipation assembly according to claim 8, characterized in that: The heat dissipation assembly further includes a heat dissipation housing, which is sealedly connected to the radiator to form a sealed cavity for accommodating the power optimization module on the side facing the second side.

10. A power optimization device, characterized in that: It comprises a power optimization module and the heat dissipation assembly as claimed in claim 8 or 9, wherein the power optimization module is fixed to the heat sink and is thermally connected thereto.

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