Grading type heat dissipation liquid crystal display screen

By using a graded heat dissipation mechanism in the liquid crystal display screen and using a heat sink and a fan to form two-stage heat dissipation, the problems of low heat dissipation efficiency and water droplet formation in the prior art are solved, and more efficient heat dissipation and better display protection are achieved.

CN223040400UActive Publication Date: 2025-06-27JIANGXI SIHAI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202421771154.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-25
Publication Date
2025-06-27
Estimated Expiration
2034-07-25

AI Technical Summary

Technical Problem

When the existing LCD screen cools down, the fan directly dissipates heat to the PCB board. The efficiency is average, and in a relatively high humidity environment, it may cause water vapor to condense into water droplets, damaging the display.

Method used

A graded heat dissipation mechanism is adopted, including a heat sink and a heat dissipation fin. The fan blowing air forms a flow rate difference through the vertical hole and the side hole to achieve two-stage heat dissipation, and in this way, the impact of direct fan blowing air on the PCB board is reduced.

Benefits of technology

Improves heat dissipation efficiency, reduces the formation of water droplets on the PCB board, and protects the display screen from damage caused by humidity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a grading type heat dissipation liquid crystal display screen which comprises a display screen shell, a back plate is integrally formed on the side portion of the display screen shell, a plurality of vent holes are formed in the side portion of the back plate, a display screen PCB is installed on the back plate, and a grading type heat dissipation mechanism and a starting fan are installed on one side of the back plate. The fan can directly blow air to the cooling fins and the cooling fins connected with the cooling fins to take away heat to form first-stage heat dissipation, meanwhile, the fan can blow air downwards to the vertical holes formed in the cooling fins, the flow speed in the vertical holes of the cooling fins is high, and the flow speed of air in the side holes communicated with one sides of the vertical holes and the back plate is low, so that the heat dissipation efficiency is improved, and the heat dissipation efficiency is improved. The fan is arranged on the back plate, so that the flow velocity difference is formed, air in the side holes and the back plate is sucked into the vertical holes together and blown out together, secondary heat dissipation is achieved, and due to the fact that the fan of the device does not blow air to the display screen PCB directly, water drops on the PCB are reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of liquid crystal displays, in particular to a hierarchical heat dissipation liquid crystal display screen. Background Technique

[0002] The liquid crystal display screen belongs to a kind of flat panel display, which is used for the screen display of televisions and computers. The advantages of this display screen are low power consumption, small volume, and low radiation. However, in order to pursue extreme performance and experience in specific use, existing liquid crystal display screens often have high refresh rates and high resolutions, which leads to a large amount of heat generated by the internal components of the liquid crystal display screen, especially the PCB board, thus affecting the normal working temperature of the liquid crystal display screen, resulting in the screen reducing frequency and image quality, etc. In order to cool down, existing liquid crystal display screens often install a fan inside the liquid crystal display screen, and the fan is aimed at the PCB board for heat dissipation. This kind of heat dissipation is generally of average efficiency, and when the fan directly dissipates heat to the PCB board;

[0003] If the temperature of the PCB board itself is relatively low, especially in an environment with high humidity, the cold air blown by the fan may further reduce the temperature of the PCB board, resulting in water vapor condensing into water droplets on the surface of the PCB board and causing damage;

[0004] Or when the air humidity is relatively high, the water vapor in the air will be sucked in by the fan and blown onto the PCB board. If the temperature of the PCB board is lower than the dew point temperature of the air (i.e., the temperature at which the water vapor in the air begins to condense), the water vapor will condense into water droplets on the PCB board; resulting in water vapor condensing into water droplets on the surface of the PCB board and causing damage. Content of the Utility Model

[0005] The purpose of the utility model is to solve the problem that in order to cool down, existing liquid crystal display screens often install a fan inside the liquid crystal display screen, and the fan is aimed at the PCB board for heat dissipation. This kind of heat dissipation is generally of average efficiency, and when the fan directly dissipates heat to the PCB board, if the temperature of the PCB board itself is relatively low, especially in an environment with high humidity, the cold air blown by the fan may further reduce the temperature of the PCB board, resulting in water vapor condensing into water droplets on the surface of the PCB board and causing damage. Thus, a hierarchical heat dissipation liquid crystal display screen is proposed, which includes a display screen housing, a back panel is integrally formed on the side of the display screen housing, a plurality of ventilation holes are opened on the side of the back panel, a display screen PCB board is installed on the back panel, and a hierarchical heat dissipation mechanism is installed on one side of the back panel. The hierarchical heat dissipation mechanism conducts away the heat generated by the display screen PCB board.

[0006] Preferably: The hierarchical heat dissipation mechanism includes: a heat sink. There is an opening on one side of the back panel, and a heat sink is hermetically installed on the opening of the back panel. A heat dissipation fin is integrally formed and fixedly connected to one side of the heat sink. A fan is installed on the upper parts of the heat sink and the heat dissipation fin.

[0007] Preferably, a plurality of vertical holes are provided in the heat sink from top to bottom, and a plurality of side holes are provided on one side of the heat sink facing the opening of the back plate. The side holes and the vertical holes communicate with each other.

[0008] Preferably, the shape and structure of the heat dissipation fins are wavy.

[0009] Beneficial effects: When the fan is started, the fan will directly blow air on the heat sink and the heat dissipation fins connected to the heat sink, thereby accelerating the air flow rate on the surface of the heat sink and the heat sink to take away heat, constituting the first-stage heat dissipation. At the same time, since the fan will blow air downward into the vertical holes provided in the heat sink, at this time, the air flow rate inside the vertical holes of the heat sink is relatively large, while the air flow rate of the side holes connected to one side of the vertical holes and the air inside the back plate is relatively small, thus forming a flow rate difference. Therefore, the air inside the side holes and the back plate will be sucked into the vertical holes together and blown out together, thereby realizing the secondary heat dissipation. And since the fan of this device does not directly blow air on the display PCB board, the generation of water droplets on the PCB board is reduced. Description of the Drawings

[0010] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0011] Figure 2 It is an exploded schematic diagram of the overall structure of the present utility model;

[0012] Figure 3 It is a cross-sectional schematic diagram of the heat sink structure of the present utility model;

[0013] Figures 1 to 3 The reference numerals are respectively: display screen housing 1, back plate 2, ventilation hole 201, support seat 3, heat sink 4, heat dissipation fins 401, vertical hole 402, side hole 403, fan 5. Specific Embodiments

[0014] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0015] Refer to Figures 1 to 3 , a hierarchical heat dissipation liquid crystal display screen, including a display screen housing 1, a back plate 2 is integrally formed on the side of the display screen housing 1, a plurality of small side holes 201 are provided on the side of the back plate 2, a display screen PCB board is installed on the back plate 2, a hierarchical heat dissipation mechanism is installed on one side of the back plate 2, the hierarchical heat dissipation mechanism conducts away the heat generated by the display screen PCB board, the ventilation hole 201 can conduct ventilation, when the fan 5 is started, it drives the hot air of the back plate 2 to be discharged, and at this time, the side holes 201 can supplement the gas inside the back plate 2.

[0016] Preferably, the hierarchical heat dissipation mechanism includes: a heat sink 4. There is an opening on one side of the back plate 2, and the heat sink 4 is hermetically installed on the opening of the back plate 2. One side of the heat sink 4 is integrally formed and fixedly connected with heat dissipation fins 401, and a fan 5 is installed on the upper parts of the heat sink 4 and the heat dissipation fins 401.

[0017] Preferably, the heat sink 4 is provided with a plurality of vertically penetrating vertical holes 402 from top to bottom. One side of the heat sink 4 facing the opening of the back plate 2 is provided with a plurality of side holes 403, and the side holes 403 and the vertical holes 402 communicate with each other.

[0018] Preferably, the shape and structure of the heat dissipation fins 401 are wavy

[0019] Working principle: When the liquid crystal display is in use, a large amount of heat will be generated by the PCB board of the liquid crystal display. At this time, the heat will be dissipated into the air inside the back plate 2. Since the heat sink 4 is fixedly connected to one side of the back plate 2, the heat generated by the PCB board of the liquid crystal display will be transferred to the heat sink 4. Then, the fan 5 is started, and the fan 5 will directly blow air to the heat sink 4 and the heat dissipation fins 401 connected to the heat sink 4, so as to accelerate the air flow rate on the surfaces of the heat sink 4 and the heat sink 4 to take away the heat, constituting the first-stage heat dissipation. At the same time, since the fan 5 blows air downward into the vertical holes 402 opened on the heat sink 4, the air flow rate inside the vertical holes 402 of the heat sink 4 is relatively large at this time, while the air flow rates of the side holes 403 communicated with one side of the vertical holes 402 and the air inside the back plate 2 are relatively small, thus forming a flow rate difference. Therefore, the air inside the side holes 403 and the back plate 2 will be sucked into the vertical holes 403 together and discharged together to achieve secondary heat dissipation. The side holes 201 of the back plate 2 can supplement the gas inside the back plate 2, so as to reciprocally dissipate heat and perform hierarchical heat dissipation on the PCB board of the liquid crystal display.

[0020] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A hierarchical heat dissipation liquid crystal display screen, comprising a display screen housing (1), a back plate (2) integrally formed on the side of the display screen housing (1), a plurality of vent holes (201) being provided on the side of the back plate (2), a display screen PCB being mounted inside the back plate (2), characterized in that: A graded heat dissipation mechanism is installed on one side of the back plate (2).

2. The hierarchical heat dissipation liquid crystal display screen according to claim 1, characterized in that: The hierarchical heat dissipation mechanism comprises: a heat sink (4); an opening is provided on one side of the back plate (2); the heat sink (4) is sealed and mounted on the opening of the back plate (2); a heat sink fin (401) is integrally formed and fixedly connected to one side of the heat sink (4); and a fan (5) is mounted on the upper part of the heat sink (4) and the heat sink fin (401).

3. The hierarchical heat dissipation liquid crystal display screen according to claim 2, characterized in that: The heat sink (4) is provided with a plurality of vertical holes (402) extending from top to bottom, and a plurality of side holes (403) are provided on one side of the heat sink (4) facing the opening of the back plate (2), and the side holes (403) and the vertical holes (402) are interconnected.

4. The hierarchical heat dissipation liquid crystal display screen according to claim 3, characterized in that: The heat dissipation fins (401) are wavy in shape.